TWM321581U - Light emitting diode device and the package structure thereof - Google Patents

Description

M321581 曰月曰® 八, New Description: I ~一一~ίϋ ... [New Technology Area] - This new type is related to a light-emitting diode device and its package structure, and especially related to a combined lens Light-emitting diode device and its package [Prior Art] Since the discovery of the diode, various changes have been made with the advancement of the semiconductor industry, especially the light-emitting diode device applied with the characteristics of the semiconductor, and its application range It is very widely used, such as backlight modules, signal lights, etc., so it has become a very popular industry in recent years. A common light-emitting diode device is a light-emitting diode composed of a light-emitting element, that is, a light-emitting semiconductor, which is wire-wrapped in a package structure. In the package structure, the lead frame is connected to the wire on the light-emitting diode, and the light-emitting diode device is fixed on the substrate through the lead frame, so that the substrate can input a control signal to control the light-emitting diode device. Finally, the optical plastic is used to form a lens on the package structure, so that the light emitted by the light-emitting diode can be received through the lens and a suitable light path is generated. However, in the conventional packaging process, the lens formed is mostly a convex lens, which leads to too much space occupied by the light-emitting diode device; and the too complicated lens shape is difficult to integrate in the packaging process during the manufacturing process, resulting in a change in the lens type. Big. In addition, in the package structure, the waste heat emitted by the plurality of light-emitting diodes at one time may also affect the overall luminous efficiency. Therefore, there is a need to improve the existing light-emitting diode device, so that the type of the lens can be more varied, and the flexibility of its application is increased. And improve the light two M321581 δ. δ. Years of the polar device cooling method, increase the heat dissipation speed, and then improve efficiency, is still the desire of the LED manufacturers. [New content] Therefore, the object of the present invention is to provide a light-emitting diode device, which can make the lens selection of the light-emitting diode device have higher elasticity, increase the application range, and have better heat dissipation speed, and further Improve luminous efficiency and product reliability. According to the above object of the present invention, a light-emitting diode device includes at least one light-emitting diode, at least one wire, a base carrying the light-emitting diode, a heat-dissipating block, at least one lead frame, a plastic injection body, and Lens object. The wire is connected to the light-emitting diode and the lead frame, and the heat-dissipating block is disposed on the other side of the base opposite to the light-emitting diode. The plastic injection body is used for fixing the relative position of the base and the lead frame, and has an open end on one side of the base carrying the light-emitting diode, and the plastic injection body does not cover the heat-dissipating block. The lens object is assembled over the open end of the plastic injection body. The light-emitting diode device of the present invention mounts the lens object above the open end of the plastic injection body by means of assembly. Since the lens object is not integrally formed during the entire packaging process, the elasticity of the overall design is improved. The type of lens of the object increases the range of application of the light-emitting diode device. Further, the heat dissipation block is disposed on the other side of the base relative to the light-emitting diode, and is not covered by the plastic injection body, so that the heat dissipation speed of the light-emitting diode device can be improved, and the luminous efficiency and product reliability can be increased. [Embodiment]

M321581 The embodiment of the present invention utilizes a packaged light-emitting diode in a package structure, and then the lens object is placed on the assembly. Since the lens object is fabricated using another process, there is a greater flexibility in selecting the lens type. Without prejudice to the characteristics of the present invention, those having ordinary knowledge in the art can consider the requirements, change different materials, lens types, and assembly methods to meet design and cost considerations. Referring to Figures 1 and 1B together, Figure 1A shows an exploded view in accordance with an embodiment of the present invention. FIG. 1B illustrates a method in accordance with an embodiment of the present invention

Stereo picture. As can be seen from Figures 1A and 1B, the light-emitting diode device has a lens object 102, a lens 108, a plastic injection body 104, and a lead frame 106 in appearance. And the lens object is assembled on the plastic injection body 104. For the internal components of the entire LED device, please refer to Figure 2A. FIG. 2A is an exploded perspective view of the embodiment of the present invention. This figure removes the plastic injection body 104, so that it can be seen that the center of the inner portion of the light-emitting diode device has a base 202, as well as components such as the light-emitting diode 206, the wires 208, and the lead frame 106. The pedestal 202 carries a plurality of LEDs 206. The number of the wires 208 is corresponding to the number of the LEDs 206. Since the lead frame 106 needs to be electrically connected to the wires 208, the number of the lead frames 106 corresponds to each other. Set for the wire. The wire 208 is connected to the LED 206 and the lead frame 106 to provide a bias voltage to the LED 206 for the LED 201 to operate normally. In the present embodiment, the number of the light-emitting diodes 206 is four, so that the number of the corresponding wires 208 and the lead frame 106 is eight, and the wires 208 are gold wires. Other embodiments may have corresponding changes depending on the number of LEDs 206, and the material of the wires 208 may be other conductive.

Metal wire for M321581. In addition, in this embodiment, a heat sink block is disposed at the bottom of the light emitting diode device. Fig. 2B is an exploded bottom perspective view of the embodiment of the present invention. In this figure, the heat dissipating block 204 is disposed on the other side of the pedestal 202 relative to the illuminating diode 206, and the heat dissipating block 204 and the pedestal 202 are made of the same metal material. In other embodiments, the heat dissipating block 204 can be utilized. It is assembled on the base 202 by bonding or snapping, and replaced with a material with better heat conduction efficiency.

After the relationship between the internal components of the LED device of the present embodiment is introduced, please return to FIG. 1A. The exterior of the LED device is formed by the plastic injection body 104, and the base 202 and the lead frame 106 are fixed. relative position. In addition, please refer to FIG. 3, which shows a bottom view of the embodiment. The plastic injection body 104 does not cover the heat dissipation block 204, but one of the exposed heat dissipation blocks 204 faces the external environment, so that the waste heat generated by the light-emitting diodes 206 carried on the base 202 is quickly transmitted through the heat dissipation block 204. In the outside world. Next, please refer to FIG. 4, which is a cross-sectional view of the embodiment. The plastic injection body 104 carries a light-emitting diode 206 on the pedestal 202. The mask has an open end 404. The open end 404 is a recessed recessed area, so that the light emitted by the LED 206 can be directed to the lens object. Pass in the direction of 102. The open end 404 is finally filled with an optical plastic material such as epoxy (Epoxy) or silicone (Silicon) to prevent external dust or particles from damaging the LED 206. The lens object 102 is assembled on the open end 404 of the plastic injection body 104, but the lens 108 of the lens object 102 is not directly - M321581 96. 6 · Ο 7 Niang, 丨匕

Year, month, day WI

- H - covers the open end 404, but is spaced apart by a gap space 402 which can be filled directly into the general air or filled with silicone in the space 402. The method of assembling the lens object 102 and the plastic injection body 104 can be designed to be assembled by an adhesive. Please refer to Fig. 5. This figure shows the face where the edge of the plastic injection body 104 and the lens object 102 are to be joined, the adhesive 502 is applied in advance, and the lens object 102 is bonded thereto. Alternatively, referring to Fig. 6, a corresponding engaging member 602 can be formed on the plastic injection body 104 and the lens object 102 to be engaged with each other. Of course, the assembly method of the two is not limited to the two types, and the manners such as locking and magnetic attraction can also be implemented in other embodiments. In this embodiment, the lens 108 disposed on the lens object 102 is a Fresnel lens, which is a planar lens to reduce the volume required for the LED device. In other embodiments, Can be replaced with a convex lens, or other designed lens to meet various needs. It can be seen from the above preferred embodiment of the present invention that the type of the lens can be easily changed by using the light-emitting diode device of the present invention, so that the design of the light-emitting diode device is more flexible, thereby increasing the application range thereof, and the base is provided with The heat sink block can have a better heat dissipation speed, thereby improving the luminous efficiency and product reliability of the light emitting diode. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the present invention, and it is to be understood that those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of the new protection is subject to the definition of the scope of the patent application. 9 M321581 __铜无无 [Simple description of the drawings] • In order to make the above and other objects, features, advantages and embodiments of the present invention - more obvious and easy to understand, the detailed description of the drawings is as follows: Figure 1A An exploded view in accordance with an embodiment of the present invention is illustrated. Figure 1B is a perspective view of an embodiment in accordance with the present invention. 2A is a schematic exploded view of an embodiment of the present invention. 2B is an exploded bottom perspective view of the embodiment of the present invention. Figure 3 is a bottom view of an embodiment in accordance with the present invention. Figure 4 is a cross-sectional view showing an embodiment in accordance with the present invention. Figure 5 is a schematic view showing the combination mode according to the embodiment of the present invention. Fig. 6 is a schematic view showing another combination mode in accordance with an embodiment of the present invention. [Description of main component symbols] 102: lens object 104: plastic injection body 100: lead frame 108 · lens 202 · pedestal 204 : heat sink 206 : light emitting diode 208 : wire 402 : spacing space 404 : open end 502 : Adhesive 602 : Engaging member 1〇

Claims (1)

96UT revision year and month ^ Side especially! -----1------J • M321581 IX. Patent application scope: 1 · A light-emitting diode device, comprising at least: at least one light-emitting diode; a wire disposed corresponding to the light emitting diodes for supplying a bias voltage to the light emitting diodes; a base for carrying the light emitting diodes; a heat dissipating block disposed on the base The housing is opposite to the other side of the light-emitting diodes; at least one lead frame is disposed corresponding to the wires and electrically connected to the wires; a plastic injection body for molding the light-emitting diode And a fixed position of the pedestal and the lead frames, wherein the pedestal carries an open end of the light-emitting diode, wherein the plastic injection body does not cover the heat-dissipating filling; and a lens object, The assembly is assembled on the open end of the plastic injection body. 2. The light emitting diode device of claim 2, wherein the wire is a gold wire. The light-emitting diode device according to the above aspect of the invention, wherein the base and the heat-dissipating block are made of the same metal material. 4. The light-emitting diode device according to claim 1, wherein: M321581 The light-emitting diode device of the first aspect of the invention is the light-emitting diode device according to the first aspect of the invention, wherein the lens object is assembled to the plastic by an adhesive. The open end of the body. The light-emitting diode device of claim 1, wherein the lens object is assembled to the open end of the plastic injection body by means of an engaging member. 7. The light-emitting diode device of claim 1, wherein the lens object has a lens and the lens is a Fresnel lens. 8) a cover structure for encapsulating a light-emitting diode, comprising at least: a base for carrying the light-emitting diodes; a heat-dissipating block disposed on the base opposite to the light-emitting diodes The other side of the body; at least one lead frame corresponding to the light emitting diodes and electrically connected to the light emitting diodes; a plastic injection body for molding the light emitting diode device, and Fixing the relative position of the pedestal and the lead frames, the pedestal carrying one of the light-emitting diodes has an open end, wherein the plastic injection body does not cover the heat-dissipating block; and a lens object is assembled The plastic is projected onto the open end of the body. 12 The package structure of claim 8, wherein the wire frame is electrically connected to the light emitting diodes via at least one wire. 10. The package structure of claim 8, wherein the base and the heat sink are of the same metal material. The package structure according to claim 8, wherein the open end is a recessed portion having a slope. /, according to the package structure described in claim 8 of the patent scope, 1 = the mirror object is assembled with the adhesive on the plastic injection body: knowing 0 on 0, as in the eighth item of the patent scope The packaged lens object has a lens and the lens is a Philippine lens. 13 M321581 VII. Designated representative map (1) The representative representative of the case is: (1A) (2), the symbol of the representative figure of the case is simple: 102: lens object 104: plastic injection body 106: lead frame 108: lens