TWM318206U - Electrical socket contact - Google Patents

Electrical socket contact Download PDF

Info

Publication number
TWM318206U
TWM318206U TW95221302U TW95221302U TWM318206U TW M318206 U TWM318206 U TW M318206U TW 95221302 U TW95221302 U TW 95221302U TW 95221302 U TW95221302 U TW 95221302U TW M318206 U TWM318206 U TW M318206U
Authority
TW
Taiwan
Prior art keywords
electrical connector
representative
connector terminal
ball
recess
Prior art date
Application number
TW95221302U
Other languages
Chinese (zh)
Inventor
Fang-Jun Liao
Wen-Chun Chen
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW95221302U priority Critical patent/TWM318206U/en
Publication of TWM318206U publication Critical patent/TWM318206U/en

Links

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Description

M318206 八、新型說明: 【新型所屬之技術領域】 電性連接芯片模組至主 本創作涉及一種電連接器端子,尤指_種用於實現 電路板之電連接器端子。 、 【先前技術】 目前’業界廣泛採用球狀陣列封裝方式 接器與電路板之連接,其所用植球技術也在業界得到普及町=成電^ US6,267,615 ^ US6,220,884 中使用之習知表面黏著型端子如第—圖、第二圖所示,宜包括 、二M318206 VIII. New description: [New technical field] Electrical connection chip module to main The present invention relates to an electrical connector terminal, especially an electrical connector terminal for implementing a circuit board. [Prior Art] At present, the industry is widely used in the connection of the ball array package connector and the circuit board, and the ball-carrying technology used in the industry is also widely used in the industry. It is known in the industry that it is used in the US^26,615,615^ US6,220,884. Surface-adhesive terminals, as shown in the first figure and the second figure, should include and

狀固持部11、由固持部兩端分別延伸出娜, ί電ί 接^端子上部並可與晶片模組之相應觸點接觸傳 =電4 13 .於軒底部且_表_著技術通過财靠 板相焊接,焊接部中央位置設有用絲著定位踢球2〇之凹陷⑼,节凹^ 之0形輪賴财20舰姆應。具舰絲軒 ^ 預^㈣,輸細之綱先於端子末端w 13^布=^ 性觸球2〇财位,織伽賴加熱至—定溫度賴球2G部 3固胁舒雜部13,雜料接賊可轉電職之減妙進行職 然而,在上述加熱錫球20部分炫化而固接於端子焊接部13之過程中 錫球20和_13()之狀鱗朗較轉發,由於凹陷⑽之 破 20形狀相f細餅·,於是導致—部錢财人部= 化之錫球20體中而形成空洞21。錫球空洞21將降低電路導電與導熱性能 洞21可能降低錫球抗㈣度,尤其在後面之環境測試巾容減生錫觀象。二 寥於此’實有必要提供—種改進之電連接器端子,以克服上述電連接器之 缺陷。 σ 【新型内容】 ,本創作所解決之技術_係提供—種電連接器端子,尤指—種可以減 球加熱過程中産生鍚球空洞之電連接器端子。 爲解決上賴制題,摘作涉狀該電連接器端子底部之轉部底面中 6 M318206 央位置設有凹陷用以收容定位錫球,且該凹陷輪廓與錫球形狀並不完全對應, 凹之内表面由夕個側面組成,内側面與錫球表面構成一定空間,該空間在預 植時爲凹陷内之助焊劑受熱産生之氣體揮發提供通道,得以順利逸出,有效減 少植球後錫球内產生空洞。 與習知技術相比,本創作電連接器具有以下優點:於本創作電連接器端子 丈干接部底面设置之凹陷内表面由多個側面組成,由此凹陷輪廓與錫球形狀並不 完全對應,使助焊劑産生之氣體從球面與凹陷_面所炎空間順利逸出,從而 有效避免了凹陷輪廓觸球形狀相對應使氣體不能糊逸出而導致—部分氣體 進入部分雜之錫球體内而形成空洞,能防止在後面之環境測試中産生锡裂現 象提高電路導電可靠性與導熱性。 【實施方式】 請參閱第三圖及第四圖,本創作電連接器端子3設置有收容於電連接器絕 =體(未圖示)内起狀侧之固持部31,由麟部兩端分別延伸出連接晶 杈組(未圖不)之接觸部32及連接電路板(未冑示)之焊接部幻 广33爲其底端垂直曾折形成之一片狀結構。在該電連接器端子底部之焊接部% 央位置設有凹陷33〇用以收容定位錫球4,且該實施例中凹陷33〇外輪靡 細乍用之助焊劑後該輪廓四邊所在侧面與財面之四個 用。凹陷33G由底部至外㈣其截面逐漸增大,本例中 陷330 ^形狀類2外兩個輪廊之間是四個等腰梯形侧面,整體上凹 备, 广t ,孟子蝽。凹陷33〇之内表面每兩相鄰側面之間成一定夾 劑受熱産在讎時爲凹陷33G内之助焊 ;::,Γ I30 子焊接部33即完舰球。> 盧加”,、至—心度賴球4部細Wil接於端 复底構’赠接部33具有較蚊齡面積可賴球何靠地固定在 了 錫寺爲凹陷330内之助焊劑受熱産生之氣=出= 産生錫裂躲提高魏職如,進而防止 在上述實施例中凹陷330外輪廓爲正四邊形,相應之側面也是四個,.三 7 M318206 邊形、五邊形或者更多邊和側面也 只要為非_不觸球雜大小相她效果,並且也不限於正多邊形 如-段向凹陷中心突出之弧線,相應内。形之邊也可以爲非直線 通凹陷330内外之通道即可,側面爲 阡面和球面能構成連 暢程度。 巾岭料®鱗之技賴it之大小及順 綜上所述,本創作符合新型專利要 皆應涵蓋於以下 述者僅為本創作之較佳實施例,本創=範=====惟,以上所 =專案2圍之内人士援依本創作之精神所作之等效修飾或=舉凡熟 【圖式簡單說明】 第一圖係一種習知之電連接器端子立體圖; 二圖係第-®所示電連接H端子植球時焊接部剖 三圖係本創作電連接器端子之立體圖 第四圖係第三圖所示電連接H端子植球時焊接部立體圖 【主要元件符號說明】 電連接器端子 3 固持部 接觸部 32 焊接部 凹陷 330 錫球 空間 40The retaining portion 11 is extended from the two ends of the holding portion, respectively, and is connected to the upper part of the terminal and can be in contact with the corresponding contact of the wafer module. By the plate phase welding, the center of the welded part is provided with a depression (9) which is positioned by kicking the ball and 2 feet, and the 0-shaped wheel of the concave section is the 20th. With the ship silk Xuan ^ pre-^ (four), the fine-grained outline before the terminal end w 13 ^ cloth = ^ sexual touch ball 2 〇 financial position, weaving gamma heating to - fixed temperature Lai ball 2G part 3 solid threat Shu Department 13 The miscellaneous materials can be transferred to the thief for the purpose of reducing the power. However, in the process of the above-mentioned heated solder ball 20 being stenciled and fixed to the terminal soldering portion 13, the shape of the solder balls 20 and _13() is forwarded. Since the depression (10) breaks through the 20-shaped phase f-cake, the cavity 21 is formed in the body of the tin ball. The solder ball void 21 will reduce the electrical and thermal conductivity of the circuit. Hole 21 may reduce the resistance of the solder ball (four degrees), especially in the back environment test towel capacity reduction tin view. Second, it is necessary to provide an improved electrical connector terminal to overcome the above-mentioned electrical connector defects. σ [New content], the technology solved by this creation _ provides a kind of electrical connector terminals, especially the electrical connector terminals that can generate 钖 ball voids during the ball heating process. In order to solve the problem, it is referred to as 6 M318206 in the bottom surface of the bottom of the terminal of the electrical connector terminal. The central position is provided with a recess for receiving the positioning tin ball, and the concave contour does not completely correspond to the shape of the solder ball. The inner surface is composed of a side surface, and the inner side surface and the surface of the solder ball form a certain space, and the space provides a channel for the volatilization of the gas generated by the heat in the recess during the pre-planting, thereby smoothly escapes, effectively reducing the tin after the ball is implanted. A void is created in the ball. Compared with the prior art, the present invention has the following advantages: the concave inner surface provided on the bottom surface of the terminal of the artificial connector of the present invention is composed of a plurality of sides, whereby the concave contour and the shape of the solder ball are not completely Correspondingly, the gas generated by the flux is smoothly escaped from the space of the spherical surface and the concave surface, thereby effectively avoiding the shape of the concave contour of the contact ball corresponding to the gas not being able to escape the paste - part of the gas enters the partially tinned spheroid The formation of voids prevents the occurrence of tin cracking in subsequent environmental tests and improves the electrical conductivity and thermal conductivity of the circuit. [Embodiment] Referring to the third and fourth figures, the present electrical connector terminal 3 is provided with a holding portion 31 housed in the inner side of the electrical connector (not shown), and the two ends of the collar The contact portion 32 extending from the connection group (not shown) and the solder portion 33 connected to the circuit board (not shown) are respectively folded to form a sheet-like structure in which the bottom end is vertically folded. A recess 33 is provided at a bottom portion of the soldering portion at the bottom of the electrical connector terminal for receiving the positioning solder ball 4. In this embodiment, the recess 33 is used for the outer rim and the flux is used for the side of the contour. The four sides are used. The recess 33G gradually increases in cross section from the bottom to the outer (four). In this example, there are four isosceles trapezoidal sides between the two corridors of the 330^ shape class 2, and the whole is concave, wide t, and Mencius. The inner surface of each of the two adjacent sides of the recess 33 is heated by the adhesive in the recess 33G when the adhesive is produced;::, Γ I30 sub-welding portion 33 is the ball. > Luga", to - heart degree Lai ball 4 pieces of fine Wil connected to the end of the bottom of the structure of the 'best connection part 33 has a mosquito-age area can be relied on the ball fixed in the Xi Temple for the depression 330 The gas generated by the heat of the solder is out = the tin crack is generated to improve the position of the solder, thereby preventing the outer contour of the recess 330 from being a regular quadrangle in the above embodiment, and the corresponding side is also four, .3, 7 M318206, a pentagon or More sides and sides are also as long as they are not _ balls, and are not limited to the regular polygons such as - the arcs protruding toward the center of the depression, correspondingly inside. The sides of the shape may also be non-linear through holes 330 inside and outside The channel can be used, and the sides of the face and the spherical surface can form a smooth degree. The size of the toweling material® scales and its size, as described above, the creation of the new patent should be covered by the following: The preferred embodiment of the present invention, the original = nor ===== only, the above = the equivalent of the person within the scope of the project 2 according to the spirit of the creation of the equivalent modification or = familiar with the simple [schematic description] Figure 1 is a perspective view of a conventional electrical connector terminal; The three-figure diagram of the welded part of the electro-connected H-terminal ball is the perspective view of the terminal of the electric connector of the present invention. The third figure is the perspective view of the welded part when the H-terminal ball is electrically connected. [Main component symbol description] Electrical connector terminal 3 holding portion contact portion 32 welding portion recess 330 solder ball space 40

31 33 4 831 33 4 8

Claims (1)

M318206 九、申請專利範園·· 1.一種電遠拉被工 •部及由固持部分別延 =的=接於電路板上並電性連通晶片模組,其包括固持 ,陷内放置錫球,M 丨卩和f接部,在焊接部底面中央設置凹陷,凹 構,由直線段或曲線構成。 凹卩曰外輪廓爲非圓形結 3·如申請專利範圍第1項所述之電連接器端子,复 面組成,側面爲平面或西面。 、叫之内表面由複數側 4·如申請專利範圍第1項所述之電連接器端子,其中 逐漸放大設置。 中叫自底部向外大致至 M318206 七、指定代表圖·· (一) 本案指定代表圖為:第(三)圖。 (二) 本代表圖之元件符號簡單說明: 電連接器端子 3 固持部 31 接觸部 32 焊接部 33 凹陷 330M318206 IX. Application for Patent Fan Park·· 1. A device that is electrically connected and supported by the holding unit is connected to the circuit board and electrically connected to the chip module, which includes holding and placing the solder ball inside the trap. , M 丨卩 and f joints, a recess is formed in the center of the bottom surface of the welded portion, and the concave portion is composed of a straight line segment or a curved line. The outer contour of the concave ridge is a non-circular knot. 3. The electrical connector terminal of the first aspect of the patent application is composed of a composite surface having a flat surface or a west surface. The inner surface is called the plural side. 4. The electrical connector terminal as described in claim 1 of the patent application, wherein the setting is gradually enlarged. The middle name is from the bottom to the outside to M318206. 7. The designated representative figure (1) The representative representative of the case is: (3). (2) A brief description of the component symbols of this representative diagram: Electrical connector terminal 3 Holding portion 31 Contact portion 32 Weld portion 33 Depression 330 55
TW95221302U 2006-12-04 2006-12-04 Electrical socket contact TWM318206U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95221302U TWM318206U (en) 2006-12-04 2006-12-04 Electrical socket contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95221302U TWM318206U (en) 2006-12-04 2006-12-04 Electrical socket contact

Publications (1)

Publication Number Publication Date
TWM318206U true TWM318206U (en) 2007-09-01

Family

ID=39458461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95221302U TWM318206U (en) 2006-12-04 2006-12-04 Electrical socket contact

Country Status (1)

Country Link
TW (1) TWM318206U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142932B2 (en) 2010-04-20 2015-09-22 Hon Hai Precision Industry Co., Ltd. Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142932B2 (en) 2010-04-20 2015-09-22 Hon Hai Precision Industry Co., Ltd. Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint

Similar Documents

Publication Publication Date Title
TWI338929B (en)
TW546693B (en) Hollow solder structure having improved reliability and method of manufacturing the same
JP5920454B2 (en) Semiconductor device and manufacturing method thereof
JP4686300B2 (en) Device support structure and manufacturing method thereof
TWI603446B (en) Solder in cavity interconnection structures
WO2002037616A1 (en) Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance
TW200540425A (en) Test probe and manufacturing method of same
TW200818360A (en) Semiconductor package and fabricating method thereof
TWM318206U (en) Electrical socket contact
TWI304253B (en) Flip chip bga process and package with stiffener ring
TW200415973A (en) Improving solder joint reliability by changing solder pad surface from flat to convex shape
JP4309948B2 (en) Wiring board with lead pins and lead pins
TW200924586A (en) Circuit board module with surface mount conductive pin and circuit boards assembly having same
JP2715793B2 (en) Semiconductor device and manufacturing method thereof
TW200400575A (en) Initial ball forming method of wire bonding lead and wire bonding apparatus
TWI259755B (en) Heat sink fixing device
TWM373598U (en) Surface-mounted terminal
TWI345839B (en) Method of testing integrated circuit (ic) package
TWM307876U (en) Electrical contact
Zhao et al. The numerical investigation of influence for shape-parameters to the current carrying capacity of solder joints in the CuCGA
JP2010266248A (en) Probe mounted on probe card, and the probe card mounted with plural probes
TW200834849A (en) Land GRID array package
TW531462B (en) Laser welded leadframe with hole
JP2005030790A (en) Probe card
JP2007027700A (en) Wiring board and manufacturing method thereof

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees