TWM308131U - Improved laser positioning device - Google Patents

Improved laser positioning device Download PDF

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Publication number
TWM308131U
TWM308131U TW95217535U TW95217535U TWM308131U TW M308131 U TWM308131 U TW M308131U TW 95217535 U TW95217535 U TW 95217535U TW 95217535 U TW95217535 U TW 95217535U TW M308131 U TWM308131 U TW M308131U
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Taiwan
Prior art keywords
laser
module
positioning device
light
laser positioning
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Application number
TW95217535U
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Chinese (zh)
Inventor
Shin-Jr Dung
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Lecc Technology Co Ltd
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Application filed by Lecc Technology Co Ltd filed Critical Lecc Technology Co Ltd
Priority to TW95217535U priority Critical patent/TWM308131U/en
Publication of TWM308131U publication Critical patent/TWM308131U/en

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Description

M308131 八、新型說明: 【新型所屬之技術領域】 本創作係有關於一種雷射定位穿 、 安裝於圓鋸機上,並可發射兩條雷射 ^尤私種可 上’使欲切削線對準於兩條雷射至切削材料 定位裝置。 1以辅助切削之雷射 【先前技術】 請參閱第一圖及第二圖所示, 構成包括—本^ a知的雷較位裝置其 應單元3a。 田、、、、a及一電源控制及供 -太:if 1 “系由一上蓋1 1 3及-底蓋1 2 a利用 a貫穿該上蓋1 i a及該底^可糟—固定螺栓1 4 固定於_機上該上蓋底ΓΛ2二=本以a鎖附 該本H内2 a㈣^制及供應單元h固設於 及❼單元且㈣純組2 a謹連接於該電源控制 該雷射模組2 a内設有-雷射二極體2 以内=片22a,該内部鏡片22a將該雷射二極 3h的先束向外散射’並經該雷射孔丄5 a朝外投射 使用時,該雷射模組2 a 射於切削材料(圖略)上,…亥田射孔15 3投 大的先束投射至切削材料時係呈較 削材料^圓鑛轉動切削時,光束係形成帶狀,並將切 則材抖的物騎對準呈帶狀之光束以辅助切削。 投射^的雷射定位I置中,該雷射模組2 3所 、、〃束莧度較切削材料的欲切削線寬度大上許 M308131 多,使得光束在對準錄+ 機刀刀的鑛路無法準讀的時易偏左或偏右’導致圓鑛 的尺寸產生誤差。 、對準於欲切削線,而造成切削後 研究ί:合感:上述缺失之可改善’乃特潛心 善上述缺失之本=用,終於提出—種料合理且有效改 【新型内容】 本創作之主要目的,係 蚀+ 一 使其可在物體上投射出兩身=置改良’ 不會產生誤差。九束間以辅助切削,使切削後的尺寸 置改I,包ί t ϋ乍係提供一種雷射定位裝 光有一發光元件、-分光鏡及-波浪鏡,該發 於該八^ 對應於該分光鏡,該波浪鏡呈一角度對應 該°雷:模Γ。以及一電源控制及供應單元,其電性連接於 將4 = 有益的絲:本創作主要湘分光鏡 物 77化為兩遏光束,並經折射通過波浪鏡後,在 =上投射出兩道平行帶狀的雷射光束,藉由欲切削線對 兩迢光束之間,使圓鋸機刀刃的鋸路準確的對準於欲 切削線’使切削後的尺寸不會產生誤差。 為使能更進一步了解本創作之特徵及技術内容,請參 下有關於本創作之詳細說明與附圖,然而所附圖式僅 供苓考與說明用,並非用來對本創作加以限制者。 【實施方式】 M308131 明茶閱第三圖、第四圖及第五圖所示,本創作係提供 一種雷射定位裝置改良,其可安裝於圓鋸機等工具機上^ 亚可發出兩道雷射光束供切削材料的欲切削線對準,以輔 助=具機進行切削,該雷射定位裝置包括一本體1、一雷 射模組2及一電源控制及供應單元3。 一該本體1具有一上蓋1 1及一底蓋1 2,該上蓋1工 蓋t於該底蓋1 2,並利用二本體螺栓i 3鎖固組合。該 上盍1 1設有一穿孔1 1 ;[及一雷射孔工工2,該穿孔工 土 1貫穿該上蓋1 1中央處,該雷射孔丄丄2設置於該上 盍1 1周緣處。該底蓋1 2設有一凸柱1 2 1及一中心孔 1 2 2 ’邊凸柱1 2 1凸設於該底蓋1 2内部中央處,並 穿設於該穿孔1 1 1。該中心孔1 2 2貫穿該凸柱1 2 1,並藉一固定螺栓1 4穿設於該中心孔1 2 2,將該本 體1固定於圓鋸機(圖略)。 該雷射模組2固設於該本體1之上蓋1 1内部,該雷 射模組2前端對應於該上蓋1 1之雷射孔1 1 2,使該雷 射模組2所產生的雷射光束2 6可經該雷射孔1 1 2朝 外投射。該雷射模組2具有一模組座2 1、一發光元件2 2、一電路板2 3、一分光鏡2 4及一波浪鏡2 5。該發 光元件2 2、該分光鏡2 4及該波浪鏡2 5固設於該模組 座2 1内。 該發光元件2 2係為一呈柱狀之雷射二極體,該發光 元件2 2前端呈一角度對應於該分光鏡2 4,使該發光元 件2 2發出的雷射光束2 6能以一角度直接投射於該分 光鏡2 4。該電路板2 3設置於該模組座2 1外部,且該 電路板2 3電性連接於該發光元件2 2及該電源控制及 M308131 供應單7L 3,以便利用該電源控制及供應單元3控制該發 光元件2 2發射雷射光束2 6。 該分光鏡2 4係為一具有兩面鍍膜之光學玻璃,該分 光鏡2 4内側之鍍膜係為一分光層2 4丄,該分光鏡2 4 外侧之鍍膜係為一反射層2 4 2。當雷射光束2 6由内側 如射於该分光層2 4 1時,該分光層2 4 1可將部分的雷 射光束2 6折射往該波浪鏡2 5,另一部分的雷射光束2 6穿過該+分光層2 4 1由該反射層2 4 2折射往該波浪 鏡2 5,藉以將一道雷射光束2 6分化為兩道雷射光束2 6並朝该波浪鏡2 5投射。在本實施例中,最佳的分光比 例為5 0 %。 該波浪鏡2 5係為一表面設有波浪面之鏡片,其可將 點狀投射的雷射光束2 6轉化為帶狀投射的雷射光束2 6。該波浪鏡2 5嵌設於該模組座21前端,並呈一角度 對應於該分光鏡2 4,使雷射光束2 6經該分光鏡2 4折 射後,可投射於該波浪鏡2 5,再將轉化後的雷射光束2 6經該上蓋χ 雷射孔i i 2向外投射。再者,在該分 2鏡2 4、該發光元件2 2及該波浪鏡2 5之間形成有一 二間2 1 1 ’使雷射光束2 6可在該空間2 1 1中前進, 以減少光能損耗。 該電源控制及供應單元3固設於該本體1之上蓋1 1内部,該電源控制及供應單元3包括有電池3 i、震動 開關3 2和電路板3 3等,該電源控制及供應單元3電性 連接於該雷射模組2,以控制該雷射模組2發射雷射光束 2 6,藉由上述之組成以形成本創作之雷射定位裝置改 良。 M308131 請參閱第六圖所示,使用時,將該雷射定位裝置安装M308131 VIII, new description: [New technology field] This creation department is about a kind of laser positioning, installed on a circular saw machine, and can launch two lasers, especially private species can be used to make the cutting line pair Appropriate two lasers to the cutting material positioning device. 1Auxiliary cutting laser [Prior Art] Please refer to the first figure and the second figure, and constitute a unit 3a of the lightning aligning device including the present invention. Tian,,,, a, and a power supply control and supply - too: if 1 "from a cover 1 1 3 and - bottom cover 1 2 a through a through the upper cover 1 ia and the bottom can be bad - fixing bolts 1 4 Fixed on the _ machine, the upper cover bottom ΓΛ 2 2 = this lock is attached to the H 2 a (4) system and the supply unit h is fixed to the ❼ unit and (4) the pure group 2 a is connected to the power supply to control the laser mode The group 2a is provided with a laser diode 2 or less = a piece 22a, and the inner lens 22a scatters the first beam of the laser diode 3h outwardly and projects outward through the laser hole 5a. The laser module 2 a is shot on the cutting material (not shown), ... the Hetian perforation 15 3 is the first beam that is projected to the cutting material and is turned into a material. When the ore is rotated, the beam system is formed. The strip shape, and the object of the shattering material is aligned with the beam of the strip to assist the cutting. The laser positioning of the projection ^ is centered, and the laser module is more than the cutting material. The width of the cutting line is too large for M308131, so that the beam is easy to be left or right when the mine road of the recording + machine knife cannot be read. This leads to errors in the size of the ore. Cutting the line, and causing post-cutting research ί: Sense: The above-mentioned lack can improve 'the special lack of the above-mentioned lack of the original = use, finally proposed - the material is reasonable and effective change [new content] The main purpose of this creation, Eclipse + one makes it possible to project two bodies on the object = set improved 'no error. Between the nine bundles to assist the cutting, so that the size after cutting is changed I, the package provides a laser positioning device The light has a light-emitting element, a beam splitter and a wave mirror, wherein the light is corresponding to the beam splitter, and the wave mirror is at an angle corresponding to the Ray: module, and a power control and supply unit, the electrical Connected to the wire that will be 4 = beneficial: this creation of the main Xiangguangguangguang 77 into two containment beams, and after refracting through the wave mirror, cast two parallel strips of laser beam on =, by cutting Between the two pairs of beams, the sawing path of the circular saw blade is accurately aligned with the cutting line' so that the size after cutting does not cause errors. To enable a better understanding of the characteristics and technical content of this creation, please I have detailed information about this creation. The drawings and the drawings are only for reference and explanation, and are not intended to limit the creation. [Embodiment] M308131 Ming tea is shown in the third, fourth and fifth figures. The creation department provides an improved laser positioning device that can be mounted on a machine tool such as a circular saw machine. Two laser beams can be emitted for the cutting line of the cutting material to be aligned to assist the cutting machine. The locating device includes a body 1, a laser module 2, and a power control and supply unit 3. The body 1 has an upper cover 1 1 and a bottom cover 12, and the upper cover 1 is covered by the bottom cover 1 2, and using two body bolts i 3 locking combination. The upper jaw 1 1 is provided with a perforation 1 1; [and a laser hole 2, the perforated soil 1 runs through the center of the upper cover 1 1 , the laser The aperture 2 is disposed at the periphery of the upper jaw 1 1 . The bottom cover 12 is provided with a protrusion 1 1 1 and a center hole 1 2 2 ′. The protrusion 1 2 1 is protruded from the center of the bottom cover 12 and is disposed through the through hole 11 1 . The center hole 12 2 extends through the boss 1 2 1 and is fastened to the center hole 12 2 by a fixing bolt 14 to fix the body 1 to the circular saw (not shown). The laser module 2 is fixed on the inner cover 1 of the main body 1. The front end of the laser module 2 corresponds to the laser hole 1 1 2 of the upper cover 1 1 to make the lightning generated by the laser module 2 The beam 26 can be projected outward through the laser aperture 112. The laser module 2 has a module base 2 1 , a light-emitting element 2 2 , a circuit board 23 , a beam splitter 24 and a wave mirror 25 . The light-emitting element 2 2, the beam splitter 24 and the wave mirror 25 are fixed in the module holder 2 1 . The light-emitting element 2 2 is a columnar laser diode, and the front end of the light-emitting element 2 2 corresponds to the beam splitter 24 at an angle, so that the laser beam 26 emitted by the light-emitting element 22 can An angle is directly projected onto the beam splitter 24 . The circuit board 23 is disposed outside the module base 21, and the circuit board 23 is electrically connected to the light emitting element 22 and the power control and M308131 supply unit 7L 3 to utilize the power control and supply unit 3 The light-emitting element 22 is controlled to emit a laser beam 26. The beam splitter 24 is an optical glass having a double-sided coating. The coating on the inner side of the beam splitter 24 is a light splitting layer 24, and the coating on the outer side of the beam splitter 24 is a reflective layer 242. When the laser beam 26 is incident on the beam splitting layer 24 1 from the inner side, the beam splitting layer 24 1 refracts part of the laser beam 26 to the wave mirror 25, and the other portion of the laser beam 26 The light splitting layer 2 4 1 is refracted by the reflective layer 242 to the wave mirror 25, whereby a laser beam 26 is split into two laser beams 26 and projected toward the wave mirror 25. In the present embodiment, the optimum split ratio is 50%. The wave mirror 25 is a lens having a wavy surface on its surface, which converts the point-projected laser beam 26 into a strip-shaped projected laser beam 26. The wave mirror 25 is embedded in the front end of the module holder 21 and corresponds to the beam splitter 24 at an angle. After the laser beam 26 is refracted by the beam splitter 24, the wave mirror 25 can be projected onto the wave mirror 25 Then, the converted laser beam 26 is projected outward through the upper cover χ laser hole ii 2 . Furthermore, a two 2 1 1 ' is formed between the sub-mirror 24, the light-emitting element 2 2 and the wave mirror 25, so that the laser beam 26 can advance in the space 2 1 1 to Reduce light energy loss. The power control and supply unit 3 is fixed inside the cover 1 of the main body 1. The power control and supply unit 3 includes a battery 3 i, a vibration switch 32 and a circuit board 33, and the like. The power control and supply unit 3 Electrically connected to the laser module 2 to control the laser module 2 to emit the laser beam 2, by the above composition to form the laser positioning device of the present invention. M308131 Please refer to the figure in the sixth figure. When using, install the laser positioning device.

於圓鋸機,且該雷射模組2經該上蓋1 1之雷^孔i T 2,在切削材料(圖略)上投射出兩道平行帶1投射的雷 射光束2 6,並將切削材料上的欲切削線對準於兩道雷^ 光束2 6之間,以輔助圓鋸機刀刃的鋸路對準切的 欲切削線。 寸的In the circular sawing machine, and the laser module 2 projects two laser beams 2 6 projected by the parallel belt 1 on the cutting material (not shown) through the lightning hole i T 2 of the upper cover 1 The cutting line on the cutting material is aligned between the two beams 26 to assist the sawing of the circular saw blade in alignment with the cutting line. Inch

^創作之雷射定位裝置,其可產生兩道平行相鄰的雷 射先束2 6,讓❹者⑽切削材料上的欲切難對準於 射光束2 6之間’使圓鑛機刀刃的鑛路能準確地對 準刀削材料的欲㈣線,進而使切削後的尺寸不會產生誤 差。 一、 偏Fp 士 A 钩尽剠作之較佳可行實施例,非因此 内容ΙΓΐ專利範圍’故舉凡運財創作說明書及圖 内,合ΐί曰 1效結構變化’均同理包含於本創作之範 【圖式簡單說明】 二_圖# *知的雷射定位裝置之立體分解目。 ::::係習知的雷射定位裝置之使用狀態示意圖 解圖。-圖.係本創作雷較位裝置改良實施例之立體; 2圖:係本創作雷射模組之剖面示意圖。 第丄係本創作雷射模組之立體示意圖。 態示意圖Y係本創作雷射定位裝置改良實施例之使用狀 【主要元件符號說明】 M308131 [習知] la 本體 11a 上蓋 12a 底蓋 13a 本體螺栓 14a 固定螺栓 15a 雷射孔 2 a 雷射模組^The created laser positioning device, which can produce two parallel adjacent laser beams 2, 6 6 to make the cuttings on the cutting material (10) difficult to align between the beam 26 'to make the round mining machine blade The mine road can accurately align the desired (four) line of the material being cut, so that the size after cutting will not cause errors. First, the Fp Shi A is a better and feasible embodiment of the work, not the content of the patent scope 'in the case of the Yun Yun creation manual and the map, the combination of the structure and the structure of the structure' are included in this creation. Fan [Simple description of the diagram] Two_图# * The stereoscopic decomposition of the known laser positioning device. :::: Schematic diagram of the state of use of the conventional laser positioning device. - Figure. This is a three-dimensional diagram of the modified embodiment of the mine-like device; 2: a schematic cross-sectional view of the laser module. Dijon is a three-dimensional schematic diagram of the laser module. State diagram Y is the use of the improved embodiment of the laser positioning device. [Main component symbol description] M308131 [Authentic] la body 11a upper cover 12a bottom cover 13a body bolt 14a fixing bolt 15a laser hole 2 a laser module

2! 1 a 雷射二極體 2 2a 内部鏡片 3 a 電源控制及供應單元 [本創作] 本體 上蓋2! 1 a Laser diode 2 2a Internal lens 3 a Power control and supply unit [This creation] Body cover

1 1 1 穿孔 1 1 2 雷射孔 底 蓋 1 2 1 凸柱 1 2 2 中心孔 13 14 2 2 1 本體螺栓 固定螺栓 雷射模組 模組座 2 11 空間 10 M308131 2 2 發光元件 . 23 電路板 2 4 分光鏡 241 分光層 242 反射層 2 5 波浪鏡 26 雷射光束 3 電源控制及供應單元 • 3 1電池 3 2 震動開關 3 3 電路板 111 1 1 Perforation 1 1 2 Laser hole bottom cover 1 2 1 Post 1 2 2 Center hole 13 14 2 2 1 Body bolt fixing bolt Laser module module holder 2 11 Space 10 M308131 2 2 Light-emitting element. 23 Circuit Board 2 4 Beam splitter 241 Beam splitting layer 242 Reflecting layer 2 5 Wave mirror 26 Laser beam 3 Power control and supply unit • 3 1 Battery 3 2 Vibration switch 3 3 Circuit board 11

Claims (1)

M308131 九、申請專利範圍: 1 一種雷射定位裝置改良,包括: 一本體; · 發光元;射ί:光置:該本體内’該雷射模組具有-應於該分光鏡,=:鏡,該發光元件呈-角度斐 一電心/ 肖度對齡該分缝;以; =制及供應單元,其電性連接於該雷射模組 良,其中 蓋。 皿 4上盍盍合於該;I 良,其3中二:m第1項所述之雷射定位裝㈣ 應於該雷體進一步設有一雷射孔,該雷射模組前㈣ 4、如申請專利範圍第丄項 良’其中該雷射模組包括有—模組座及置改 ^該發光元件及該波浪鏡固設於該模組座,該電ς = 性連接於该發光元件及該電源控制及供應單元。 电 良 5士如中請專利範圍第丄項所述之雷射定位穿置 中该分光鏡設有一分光層及一反射層。、 良 6、 如中請專利範圍第!項所述θ 其中該發光元件係為-雷射二極體模組。疋位衣置改 7、 如申請專利範圍第:項所述之 :間其中該分光鏡'該發光元件及該波浪鏡之間形= 8、 如中請專利範圍第!韻述之雷射定位襄置改 12 M308131 良,其中該波浪鏡為一表面設有波浪面之鏡片。 ’ 9、如申請專利範圍第1項所述之雷射定位裝置改 良,其中該電源控制及供應單元設置於該本體内。M308131 Nine, the scope of application for patents: 1 A laser positioning device improvement, including: a body; · illuminating element; shooting ί: light setting: the body of the body 'the laser module has - should be in the beam splitter, =: mirror The illuminating element is at an angle of one centimeter/electrode angle to the slit joint; the system is electrically connected to the laser module, wherein the illuminating element is electrically connected to the laser module. The dish 4 is coupled to the same; I, 3, 2: m, the laser positioning device (4) according to item 1 is further provided with a laser hole in the lightning body, and the laser module is front (4). For example, in the patent application, the third component of the patent application, wherein the laser module includes a module holder and a modification, the light-emitting component and the wave mirror are fixed to the module holder, and the electrical connection is electrically connected to the light-emitting component. And the power control and supply unit. The laser beam is provided with a light splitting layer and a reflective layer as described in the scope of the patent application. , good 6, such as the scope of patents! The θ is wherein the illuminating element is a laser diode module.疋 衣 置 7 、 、 、 、 、 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The laser positioning of the rhyme is changed to 12 M308131. The wave mirror is a lens with a wave surface on one surface. 9. The laser positioning device of claim 1, wherein the power control and supply unit is disposed within the body. 1313
TW95217535U 2006-09-29 2006-09-29 Improved laser positioning device TWM308131U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113385737A (en) * 2021-05-25 2021-09-14 佛山市南海简佳铝业有限公司 High accuracy aluminium alloy cutting machine
TWI754977B (en) * 2019-06-28 2022-02-11 美商微林股份有限公司 Optomechanical tool and system for machining workpiece, and method of light beam toward workpiece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI754977B (en) * 2019-06-28 2022-02-11 美商微林股份有限公司 Optomechanical tool and system for machining workpiece, and method of light beam toward workpiece
CN113385737A (en) * 2021-05-25 2021-09-14 佛山市南海简佳铝业有限公司 High accuracy aluminium alloy cutting machine

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