M305859 八、新型說明： 【新型所屬之技術領域】 本新型係關於-_線束帶，特別是關於—種射頻識別(Radi〇 frequency identification)纜線束帶(wristband)。 【先前技術】 ’ 自動辨識(Aut0丨de_cat_技術是近年來所發展出用來對特定 •對象包含人、事、物等進行_的技術，而_所依據的通常是與該 •特定對象相關的資訊比對及確認。自動辨識技術大抵包含了接觸式及 非接觸式。早期以接觸式的辨識為主例如是接觸式|c卡的使用，而有 鑑於接觸式1C卡與讀卡機之_接觸不良、接點容易磨損及^卡内 部電路易受破壞制題，最近遂有非細式丨C卡的發展。 利用非接觸式1C卡進行通訊時，不需把卡片插入讀卡機，只要把 鲁卡片的天線面靠近讀卡機即可進行資料的傳輸、讀取甚至於寫入。依 -非接觸幻C卡所能被遙控(remote)的通信距離而區分，非接觸式|c -卡可分為緊貼型(dosed侧p|ed)、近接型(proximity)、近傍型(Vid_ 及遠方型。f貼型的國際標準化規格有|s〇/|EC 1〇5236，近接型的國 際標準化規财ISO/IEC 14443’近傍獅目際標準化規财丨s〇/丨EC 15693。 在此’非接觸S IC卡的技術原理係以射頻辨識(RF|D ; Radj〇 Frequency Identification)為主。換言之，也就是將一個『石夕晶片 5 M305859 _C0n chip)及將電塗料印刷而成的天線(antenna)所構成的電職 置包覆起來而以標籤(tag)或卡片(card)或轉發器恤叩_^⑽其他 的形式呈現’並以-無線射頻收發器(transceiver)發送無線射頻訊號至 該電路裝置’而電路裝置在接收該無線射頻收發器所發送之無線射頻 訊號之後依需求回傳另-無線射頻訊號，俾操作者可細傳的無線射 頻訊號讀取到與該物體有_#訊，而達到自動辨識該物體的目的。 . 然而，由於自動辨識應用的場合相當廣泛，僅僅是以卡片形式存 •在的射頻辨識裝置並無法符合各種場合的需求及其便利性。因此:本 .創作提出了-種射頻識職線束帶，其適用於例如是電話線、網路線 .及電線之埋設安裝管理等線材管理，亦適用於例如是電職統内部之 信號線管理之系統信號線管理。 【新型内容】 本創作之-目的在於提供—觀頻識纖線束帶，適肖於線材管 •理’例如是電話線、網路線及電線之埋設安裝管理。 . 本創作之另—目的在於提供-種射頻識職線束帶，翻於系統 内部之信號線管理，例如是電齡統内部之信號線管理。 本創作之射頻識別纜線束帶，包含有一晶片载體及—束帶。晶片 載體褒設有-可接收及發送一射頻訊號之石夕晶片，而束帶則與晶片載 體連接在—起，束帶具有—第-端及m-端設有^ 口， 第二端可穿過開口而形成任意尺寸之束環。 6 M305859 一實施例中，晶片載體上設有位於同一直線上且相隔一距離之一 第一通孔及一第二通孔，束帶係穿過第一通孔及第二通孔，束帶之第 一端及第二端分別位於晶片載體之兩側。晶片載體之形狀係橢圓形戋 矩形。 另-實施例中’晶片載體與束帶係一體成形而成，束帶之第1 及第二端分別位於晶片載體之兩側。 Φ 又一實施例中，晶片載體與束帶係一體成形而成，束帶之第一端 及第二端位於晶片載體之同一側。 另一方面，本創作之射頻識別纜線束帶之晶片載體的材料係聚氯 乙烯(PVC)或尼龍-66其中之一。 又方面，本創作之射頻識別纜線束帶之射頻訊號的操作頻率為 13.56MHZ或125KHZ。石夕晶片例如是GK4〇〇1或H41 〇2或丨c〇de SL| 或 Temic E5557 或 Hitag 1 或 Hitag 2。 _ *本創作的優點在於，第―、_具有射頻識別功能之·束帶讓 —束▼的應用更有功能性，而能對於線材進行數量、品質、料號、曰期 等資訊的資訊管理。第二、藉由使用與束帶之相同材料作為晶片載體 的材料除了可保濩晶片載體内含的IC晶片外，可讓纜線束帶具有即用 即丢的特性，而適用於其他有需求的場合。 【實施方式】 本新型創作揭露一鋪頻識別纔線束帶(Radio frequency 7 M305859 伽cab丨e tie)，其包含有一晶片载體及—束帶。晶片載體係 裝設有-可接收及發出-射頻訊號之石夕晶片，束帶係與該晶片載體連 接在-起，束帶具有-第-端及—第二端，第—端設有—開口，第二 端可穿過該開口而形成任意尺寸之束環。 請參見圖1及圖2A及圖2B ’ 一第一實施例中，一橢圓形晶片載 、體H ’其上置有-殼體12，殼體12包覆—可接收及發送一射頻訊號 之碎晶片（未顯示）。此外，-束帶13，與橢圓形晶片載體彳彳連接在一 起’束帶13具有一第一端131及一第二端132，第一端131設有一 •開口 ’第二端132可穿過開口而形成任意尺寸之束環。尤其，擴圓形 晶片載體11上設有位於同-直線上且相隔—距離之右通孔川及左通 孔112,束帶13穿過右通孔Ή1及左通孔112，束帶13之第一端131 及第二端132分別位於橢圓形晶片載體糾之兩侧。 在本實施例中，橢圓形晶片載體Ή的材料係聚氯乙稀(pvc)，且 •束帶13之材料係尼龍-66，而整個射頻識別纜線束帶1〇之工作溫度 、 為-40°C 至 70°C。 、 另一方面，射頻訊號的通信距離較佳為50mm，而射頻訊號之操 作頻率可以是13.56MHZ或者125KHZ。晶片載體Ή之内含石夕晶片 符合ISO/旧C 15693國際化標準規格’其可以是GK4〇〇1或Η41〇2 或丨-Code SLI或Temlc Ε5557或Hitag 1或Hitag 2。以下針對這些 ic晶片稍作說明。 首先，GK4001是凌航科技股份有限公司(G〇|dKeyTechn〇丨〇gy 8 M305859 _啦_所開發的唯言賣lc晶片，操作頻率為i25khz、記憶容量 為64位兀。Η·2係-互補式金屬氧化半導體(cm⑹式的唯读I。曰 片’由EM MiCr〇electronic_Marin从這家公司所開發操^曰曰 125KHZ、記憶容量為64位元。 、干两 丨-Code SLI是飛利浦半導體所發展的智慧標藏丨c晶片，可接受全 球任何付合丨SO/旧C 15693國際化標準規格的閱讀器進行讀取和寫入 的功能，操作頻率為13.56MHZ、記憶容量為1〇24位元’主要應用 •於航空行李的管理、自動化圖書館和郵政系統管理等。 心'M305859 VIII. New description: [New technical field] The new type relates to the -_ wire harness, especially the radial frequency identification (wristband). [Prior Art] 'Automatic identification (Aut0丨de_cat_ technology is a technology developed in recent years to perform specific objects, people, things, etc., and _ is usually based on the specific object Information comparison and confirmation. Automatic identification technology mainly includes contact and non-contact. Early contact-based identification is mainly used for contact type | c card, and in view of contact type 1C card and card reader _ Poor contact, easy to wear contacts and the internal circuit of the card are vulnerable to damage. Recently, there is a development of non-fine C card. When using non-contact 1C card for communication, it is not necessary to insert the card into the card reader. As long as the antenna surface of the Lu card is close to the card reader, data can be transmitted, read, and even written. The non-contact magic C card can be distinguished by the remote communication distance, non-contact |c - Cards can be divided into close-fitting type (dosed side p|ed), proximity type (proximity), near-type type (Vid_ and remote type. The international standardization of f-type type is |s〇/|EC 1〇5236, proximity type International Standardization Regulation ISO/IEC 14443'丨s〇/丨EC 15693. The technical principle of the 'non-contact S IC card is based on radio frequency identification (RF|D; Radj〇Frequency Identification). In other words, it is a "Xi Xi wafer 5 M305859 _C0n chip" And the electric position formed by the antenna printed by the electric paint is wrapped and presented in the form of a tag or a card or a transponder _^(10). The transceiver transmits a wireless RF signal to the circuit device, and the circuit device returns another wireless RF signal according to the requirement after receiving the wireless RF signal sent by the wireless transceiver, and the operator can finely transmit the wireless signal. The RF signal is read to the object and has the purpose of automatically recognizing the object. However, since the automatic identification application is quite extensive, the RF identification device stored in the form of a card cannot meet various types. The needs of the occasion and its convenience. Therefore: Ben. has proposed a kind of radio frequency identification harness, which is suitable for wire management such as telephone line, network route, and wire installation management. It is also applicable to system signal line management such as signal line management within the electric service system. [New content] The purpose of this creation is to provide - the observation frequency fiber harness belt, suitable for the wire tube management, such as the telephone Line, network route and wire burial installation management. . The other purpose of this creation is to provide a kind of radio frequency identification harness, which is turned into the signal line management inside the system, for example, the signal line management inside the battery system. The radio frequency identification cable harness includes a wafer carrier and a strap. The wafer carrier is provided with a rock chip capable of receiving and transmitting an RF signal, and the strap is connected to the wafer carrier, and the strap has - The first end and the m-end are provided with a mouth, and the second end can pass through the opening to form a collar of any size. 6 M305859 In one embodiment, the wafer carrier is provided with a first through hole and a second through hole which are located on the same straight line and separated by a distance, and the strap passes through the first through hole and the second through hole, and the strap The first end and the second end are respectively located on opposite sides of the wafer carrier. The shape of the wafer carrier is an elliptical 戋 rectangle. In another embodiment, the wafer carrier and the strap are integrally formed, and the first and second ends of the strap are respectively located on both sides of the wafer carrier. Φ In still another embodiment, the wafer carrier and the strap are integrally formed, and the first end and the second end of the strap are on the same side of the wafer carrier. On the other hand, the material of the wafer carrier of the radio frequency identification cable harness of the present invention is one of polyvinyl chloride (PVC) or nylon-66. In addition, the frequency of the RF signal of the RFID band of the present invention is 13.56 MHz or 125 kHz. The Shixi wafer is, for example, GK4〇〇1 or H41 〇2 or 丨c〇de SL| or Temic E5557 or Hitag 1 or Hitag 2. _ * The advantage of this creation is that the application of the first and the _ band with the radio frequency identification function is more functional, and the information management of the quantity, quality, material number, and flood time of the wire can be performed. . Secondly, by using the same material as the ribbon as the material of the wafer carrier, in addition to protecting the IC wafer contained in the wafer carrier, the cable harness can be used as a ready-to-use feature, and is suitable for other needs. occasion. [Embodiment] The present invention discloses a broadcast frequency identification band (Radio frequency 7 M305859 gamma cab丨e tie), which comprises a wafer carrier and a strap. The wafer carrier is provided with a - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - An opening through which the second end can form a collar of any size. Referring to FIG. 1 and FIG. 2A and FIG. 2B'. In a first embodiment, an elliptical wafer carrier, body H' is provided with a housing 12, and the housing 12 is covered to receive and transmit an RF signal. Broken wafer (not shown). In addition, the strap 13 is coupled to the elliptical wafer carrier '. The strap 13 has a first end 131 and a second end 132. The first end 131 is provided with an opening. The second end 132 is traversable. Opening to form a bundle of any size. In particular, the expanded circular wafer carrier 11 is provided with a right through hole and a left through hole 112 which are located on the same-line and spaced apart from each other, and the band 13 passes through the right through hole Ή1 and the left through hole 112, and the band 13 The first end 131 and the second end 132 are respectively located on opposite sides of the elliptical wafer carrier. In this embodiment, the material of the elliptical wafer carrier is polyvinyl chloride (pvc), and the material of the band 13 is nylon-66, and the operating temperature of the entire radio frequency identification cable harness is -40. °C to 70 °C. On the other hand, the communication distance of the RF signal is preferably 50 mm, and the operating frequency of the RF signal can be 13.56 MHz or 125 kHz. The wafer carrier has a stone wafer in accordance with the ISO/old C 15693 international standard specification' which may be GK4〇〇1 or Η41〇2 or 丨-Code SLI or Temlc Ε5557 or Hitag 1 or Hitag 2. These ic wafers are briefly described below. First of all, GK4001 is a licensed lc chip developed by Linghang Technology Co., Ltd. (G〇|dKeyTechn〇丨〇gy 8 M305859 _啦_, operating frequency is i25khz, memory capacity is 64-bit 兀. Η·2 series- Complementary metal oxide semiconductor (cm(6) type of read-only I. 曰片' developed by EM MiCr〇electronic_Marin from this company 曰曰 125KHZ, memory capacity is 64 bits. 干 丨 - Code SLI is Philips Semiconductors The developed wisdom standard 丨c chip can accept reading and writing functions of any readers of the world's standard SO/old C 15693 international standard. The operating frequency is 13.56MHZ and the memory capacity is 1〇24. Bit 'main application · in the management of air baggage, automated library and postal system management, etc.
Temic E5557疋Atmel公司所開發的可讀寫射頻識別丨c晶片， -操作頻率在125KHZ、記憶容量為33〇位元。Temic E5557疋Atmel developed a readable and writable RFID chip, operating at 125 kHz and a memory capacity of 33 。.
Hitag 1 IC晶片係適用於125 KHZ近接型(__系統之可配 置且具撓性之讀-寫資料記憶卡，記憶容量為2〇48位元。㈠丨tag 1丨〇 晶片的操作頻率顧為彳㈤至15_ζ且提供了在惡劣環境下(例如在 % 、友的範圍内有金屬罪近或濕氣過多)得以健全的優點。如此一來，便 -可確保*料傳輸的安全而不會受到電子干擾的影響。咖g n曰曰片 .^著熟為人知的防衝突特性而能在讀卡機的領域内同時操作數個標 織。相當低功率駐EPR0M設計可在同樣長的操作距離上讀取及寫 入Hitag 2 IC晶片則具有多模態的功能而能在不同的讀取及傳輸速 。中進行操作，且支援各種不同的協定而能應用在不同領域，其操作 頻率為125 KHZ、記憶容量為256位元。 明參見圖3及目4A及圖4B，-第二實施例中，射賴別規線束 9 M305859 帶20,包含一矩形晶片載體21及一束帶23。矩形晶片載體21内包 覆有了接收及啦送一射頻成號之石夕晶片（未顯示），而束帶23與矩形 曰曰片載體21連接在一起’束帶23具有一第一端231及一第二端232, 第-端231設有-開口’第二端232可穿過開口而形成任意尺寸之束 環。尤其’矩形晶片載體21上設有位於同一直線上且相隔一距離之上 通孔211及下通孔212，束帶23係穿過上通孔211及下通孔212， 束帶23之第-端231及第二端232分別位於矩形晶片載體21之兩侧。 在本實施例中，晶片載體21的材料係聚氯乙烯(pvc)，且束帶 23之材料係尼龍-66，而整個射頻識別纜線束帶2〇之工作温度為_4〇 °C 至 70°C。 另-方面’射頻訊號的通信距離較佳為5〇_，而射頻訊號之操 作頻率可以是13.56MHZ或者125KHZ。晶片載體21 β含石夕晶片符 合ISO/IEC 15693國際化標準規格，其可以是GM〇〇1或H4i〇2或 l_C〇de SLI 或 Temic E5557 或 Hitag !或 Hitag 2。這些 |c 晶片的說 明如前所述。 請參見圖5及圖6，-第三實施例中’本創作之射頻識別繞線束 帶30，包含-矩形晶片載體31及一束帶33。矩形晶片載體31内包 覆有-可接收及發送-射頻訊號之㈣片（未顯示），而束帶33與矩形 晶片載體31連接在-起，束帶33具有—第—端331及一第二端泊2, 第-端331設有-開口，第二端332可穿過開口而形成任意尺寸之束 環。尤其’矩形晶片載體31與束帶33係—體成形而成，束帶於之 弟一端331及弟一端分別位於矩形晶片載體Μ之兩侧 M305859 在本實施例中，晶片載體31及束帶33的材料係尼龍_66,而整 個射頻識別纜線束帶30之工作溫度為-40°C至85。(：。 另一方面，射頻訊號的通信距離較佳為50mm，而射頻訊號之操 作頻率可以是13.56MHZ或者125KHZ。晶片載體31内含矽晶片符 合ISO/IEC 15693國際化標準規格’其可以是GK4001或H4102或 卜Code SU 或 Temic E5557 或 Hitag 1 或 Hitag 2。這些 ic 晶片的說 明如前所述。 • 請參見圖7及圖8 ’ 一第四實施例中，本創作之射頻識別繞線束 帶40，包含一矩形晶片載體41及一束帶43。矩形晶片載體41内包 覆有一可接收及發送一射頻訊號之矽晶片（未顯示），而束帶43與矩形 晶片載體41連接在一起’束帶43具有一第一端431及一第二端432, 第一端431設有一開口，第二端432可穿過開口而形成任意尺寸之束 環。尤其，矩形晶片載體41與束帶43係一體成形而成，束帶43之 • 弟一端431及第一端432位於矩形晶片載體41之同側，如圖8所示 為右側。 - 在本實施例中’晶片載體41及束帶43的材料係尼龍_66，而整 個射頻識別纜線束帶40之工作溫度為-4〇t：至85。〇。 另一方面，射頻訊號的通信距離較佳為50mm，而射頻訊號之操 作頻率可以S13.56MHZ或者125KHZ。曰曰曰片載體41时石夕晶片符 合丨S0/IEC 15693國際化標準規格’其可以是gk4〇〇i或H4102或 丨-Code SLI或Temic E5557或Hitag 1或Hitag 2。這些丨c晶片的說 11 M305859 明如前所述。 ▲以上，本創作已藉由各個實施例及其相關圖式而清楚載明。然而， 熟習該項麟者當了解的是，賴作之各情關在祕為例示性而 非為限制性’亦即，在不脫離本創作實質精神及範圍之内，上述所述 2各70件的變化例及修正例均為本創作所涵蓋，本創作係由後附之 申請專利範圍所加以界定。 【圖式簡單說明】 第1 _-示意圖’顯示本解第—實施例之射賴職線束帶。 第2A圖及第2B圖分別係-上視圖及一側剖面圖，顯示第^圖之 射頻識別纜線束帶之晶片載體。 第3圖係-示賴’顯示本創作第二實施例之射頻識观線束帶。 第4A圖及第4B圖分別係一上視圖及侧剖面圖，顯示第3圖之射 頻識別纜線束帶之晶片載體。 鲁第5圖係-示意圖，顯示本_第三實關之射賴職線束帶。 第6圖係一上視圖，顯示第5圖之射頻識別纜線束帶。 第7圖係-示意圖，顯示本創作第四實施例之射頻識職線束帶。 第8圖係一上視圖，顯示第7圖之射頻識別纜線束帶。 【主要元件符號說明】 10〜射頻識別纔線束帶 11〜晶片載體 111〜右通孔 12 M305859 112〜左通孔 12〜殼體 13〜束帶 131〜第一端 132〜第二端 20〜射頻識別纜線束帶 21〜晶片載體 # 211〜上通孔 212〜下通孔 23〜束帶 231〜第一端 232〜第二端 30〜射頻識別纜線束帶 • 31〜晶片載體 33〜束帶 331〜第一端 332〜第二端 40〜射頻識別纜線束帶 41〜晶片載體 43〜朿帶 M305859 431〜第一端 432〜第二端Hitag 1 IC chip series is suitable for 125 KHZ proximity type (__ system configurable and flexible read-write data memory card, memory capacity is 2〇48 bits. (1) 丨tag 1丨〇 wafer operation frequency For 彳(5) to 15_ζ, it provides the advantage of being able to be sound in harsh environments (for example, in the case of %, friends, metal sin or excessive moisture). In this way, it ensures the safety of the material transmission without It will be affected by electronic interference. It is a well-known anti-collision feature that can operate several standard woven fabrics simultaneously in the field of card readers. The relatively low power EPR0M design can be used at the same long operating distance. The read and write Hitag 2 IC chip has multi-mode function and can operate in different reading and transmission speeds, and supports various protocols and can be applied in different fields. Its operating frequency is 125. KHZ, memory capacity is 256 bits. See Fig. 3 and Fig. 4A and Fig. 4B, in the second embodiment, the ray harness 9 M305859 tape 20 includes a rectangular wafer carrier 21 and a bundle 23. The wafer carrier 21 is covered with a receiving and sending RF No. of the stone wafer (not shown), and the strap 23 is coupled to the rectangular cymbal carrier 21. The strap 23 has a first end 231 and a second end 232, and the first end 231 is provided with an opening. The second end 232 can pass through the opening to form a bundle ring of any size. In particular, the rectangular wafer carrier 21 is provided with the through holes 211 and the lower through holes 212 on the same straight line and separated by a distance, and the band 23 is passed through. The upper end hole 211 and the lower through hole 212, the first end 231 and the second end 232 of the strap 23 are respectively located on both sides of the rectangular wafer carrier 21. In the embodiment, the material of the wafer carrier 21 is polyvinyl chloride (pvc). ), and the material of the strap 23 is nylon-66, and the entire radio frequency identification cable harness has an operating temperature of _4 〇 ° C to 70 ° C. The communication distance of the RF signal is preferably 5 另. _, and the operating frequency of the RF signal can be 13.56MHZ or 125KHZ. The wafer carrier 21β contains the Shihua wafer in accordance with the ISO/IEC 15693 international standard specification, which can be GM〇〇1 or H4i〇2 or l_C〇de SLI or Temic E5557 or Hitag! or Hitag 2. The description of these |c wafers is as described above. See Figure 5 and Figure 6, - In the third embodiment, the RF recognition winding strap 30 of the present invention comprises a rectangular wafer carrier 31 and a strap 33. The rectangular wafer carrier 31 is covered with a (four) piece capable of receiving and transmitting - RF signals (not Shown), while the strap 33 is connected to the rectangular wafer carrier 31, the strap 33 has a first end 331 and a second end mooring 2, the first end 331 is provided with an opening, and the second end 332 is traversable. Opening to form a bundle of any size. In particular, the 'rectangular wafer carrier 31 and the strap 33 are formed by a body, and the end of the strap 331 and the other end are respectively located on the sides of the rectangular wafer carrier M M305859. In this embodiment, the wafer carrier 31 and the strap 33 The material is nylon _66 and the entire RFID cable harness 30 operates from -40 ° C to 85 ° C. (: On the other hand, the communication distance of the RF signal is preferably 50mm, and the operating frequency of the RF signal can be 13.56MHZ or 125KHZ. The wafer carrier 31 contains the germanium wafer in accordance with the ISO/IEC 15693 international standard specification 'which can be GK4001 or H4102 or Code SU or Temic E5557 or Hitag 1 or Hitag 2. The description of these ic chips is as described above. • Refer to Figure 7 and Figure 8 'A fourth embodiment, the radio frequency identification winding harness of the present invention The strip 40 includes a rectangular wafer carrier 41 and a bundle of strips 43. The rectangular wafer carrier 41 is covered with a wafer (not shown) for receiving and transmitting an RF signal, and the ribbon 43 is coupled to the rectangular wafer carrier 41. The strap 43 has a first end 431 and a second end 432. The first end 431 is provided with an opening, and the second end 432 can pass through the opening to form a collar of any size. In particular, the rectangular wafer carrier 41 and the strap The 43 series is integrally formed, and the one end 431 of the strap 43 and the first end 432 are located on the same side of the rectangular wafer carrier 41, as shown on the right side in Fig. 8. - In the present embodiment, the wafer carrier 41 and the strap 43 material is nylon _6 6. The operating temperature of the entire RFID cable harness 40 is -4 〇t: to 85. 另一方面 On the other hand, the communication distance of the RF signal is preferably 50 mm, and the operating frequency of the RF signal can be S13.56 MHz or 125 kHz. When the wafer carrier 41 is used, the Shixi wafer conforms to the 丨S0/IEC 15693 international standard specification 'which may be gk4〇〇i or H4102 or 丨-Code SLI or Temic E5557 or Hitag 1 or Hitag 2. These 丨c wafers 11 M305859 is as described above. ▲ Above, this creation has been clearly stated by the various embodiments and related diagrams. However, those who are familiar with the syllabus understand that the affair is related to The secrets are illustrative and not restrictive', that is, without departing from the spirit and scope of the present invention, the above-mentioned two 70 variations and amendments are covered by this creation. The scope of the patent application is defined. [Simplified description of the drawings] The first _-schematic diagram shows the rifling harness of the first embodiment. The 2A and 2B diagrams are respectively - top view and side Sectional view showing the crystal of the RFID cable harness of Fig. Fig. 3 is a view showing the radio frequency observation harness of the second embodiment of the present invention. Figs. 4A and 4B are a top view and a side cross-sectional view, respectively, showing the radio frequency identification cable of Fig. 3. The wafer carrier of the wire harness. Figure 5 is a schematic diagram showing the ray belt of this _ third real off. The sixth figure is a top view showing the RFID cable harness of Figure 5. The system-schematic diagram shows the radio frequency identification harness of the fourth embodiment of the present invention. Figure 8 is a top view showing the RFID cable harness of Figure 7. [Main component symbol description] 10~ Radio frequency identification cable harness 11~ wafer carrier 111~ right through hole 12 M305859 112~left through hole 12~ casing 13~ strap 131~ first end 132~ second end 20~RF Identification cable strap 21 to wafer carrier #211 to upper through hole 212 to lower through hole 23 to strap 231 to first end 232 to second end 30 to radio frequency identification cable harness 31 to wafer carrier 33 to strap 331 ~ first end 332 ~ second end 40 ~ radio frequency identification cable strap 41 ~ wafer carrier 43 ~ strap M305859 431 ~ first end 432 ~ second end