M300870 • ' _ v 10〗年2月24日更正替換頁 使兩内傾面之最小寬度小於記憶體寬度，其Wks記憶片_ 接觸的内傾面形成凸塊，配合記憶體具有面積較其他晶片較大的主 晶片’而可覆蓋主晶片。 8 ·依據申請專利範圍第γ項所述之記憶體散熱夾，其中散熱夾之 凸塊兩侧開設多數透孔。 9 ·依據申請專利範圍第7項所述之記憶體散熱夹，其中散熱央兩 侧面，配合記憶體兩側緣開設的方槽，而形成有扣片。 1 0 ·依射料纖群7項所述之記鐘散熱夾，其中散熱夹 之凸塊係為可分離式。 11依據申5月專利範圍第工◦項所述之記憶體散熱夾，其中散執 夹與晶片接觸蚊與主⑼接置軸細，並在該缺口兩側設 有執道；而凸塊係為U型凸塊，正好夾持於缺口位置；凸塊與 主晶片接朗前__成有凸條，其係與缺口兩織道相配合， ^抑型凸塊之㈣可顧“細扣輕並與主晶絲面接 觸。 M300870 101年2月24日更正替換頁 1 3 ·依射請專利範圍第i丨項所述之記憶體散減，其中散熱 夾的兩側分設有-固定用的夾體；該夾體具有一頂面及前面、後 面’並在頂面外側緣向下延伸一扣片，該扣片向内形成一半箭頭狀 扣塊，該扣塊在組合後恰可扣入記憶體侧緣的方槽内。 14 .依據申請專利範圍第13項所述之記憶體散熱夾，其中夾體 别面及後面上開設有孔.，其係與散熱夾内傾面兩側旁分別的一凸點 配合’而可將夾持的夾體定位。 1 5 · -種組裝散熱爽於記憶！|之治具，該散触係以一頂面連接 兩側内傾面，頂面之寬度約等於上述記憶體之寬度，而兩侧内傾面 向下縮小，使兩内傾面之最小寬度小於記憶體寬度；其係包括： 一記憶體插槽，係可一記憶體垂直向插入， 一尖狀體，位於上述插槽一側，其尖銳端係反插槽方向延伸， 可將滑入的散熱夾的兩内傾面撐開； 一操作桿.，及 一昇降台，設於上述插槽底部，會以操作桿之操作而控制上昇 或下降； 其中記憶體被固定於插槽後’散熱夾自尖狀體的尖銳端滑入並 將散熱夾的兩内傾面樓開，使散熱夾之内傾面寬度大於記情體之寬 度，使散熱夾滑向記憶體以覆蓋晶片；並經由操作桿被操作，使昇 M300870 降台上昇將記憶體及散熱夾推出。M300870 • ' _ v 10〗 On February 24th, the replacement page was corrected so that the minimum width of the two introversion faces is smaller than the memory width, and the Wks memory sheet _ contacted introversion surface forms a bump, and the memory has a larger area than the other wafers. The larger main wafer' can cover the main wafer. 8) According to the memory heat sink of claim γ, the plurality of through holes are formed on both sides of the bump of the heat sink. 9. The memory heat sink clip according to item 7 of the patent application scope, wherein the heat dissipating central side faces are formed with a square groove formed on both sides of the memory, and a buckle piece is formed. 1 0 · The bell heat sink according to item 7 of the projectile group, wherein the bumps of the heat sink clip are separable. 11 According to the memory heat sink clip described in the application of the patent scope in May, wherein the loose clip and the wafer are in contact with the mosquito and the main (9) connecting shaft is thin, and there are obstructions on both sides of the notch; and the bump system The U-shaped bump is just clamped to the notch position; the bump is connected to the main wafer __ into a rib, which is matched with the notch of the notch, and the (4) of the suppression bump can be considered as a fine buckle Light and in contact with the main crystal surface. M300870 February 24, 2011 Correction Replacement Page 1 3 · According to the patent, please refer to the memory range described in item i of the patent range, where the sides of the heat sink clip are separately fixed-fixed a clamping body; the clamping body has a top surface and a front surface and a rear surface and a downwardly extending piece on the outer edge of the top surface, the buckle piece forming a half arrow-shaped buckle piece inwardly, the buckle piece being combined after being assembled The memory heat sink clip according to the thirteenth item of the patent application scope, wherein the clip body has a hole on the other side and the back side, and the heat sink clip is inclined inside. A separate bump fits on the side to position the clamped body. 1 5 · -Assembly heat dissipation is good for memory!|The fixture, the dispersion The top surface is connected by a top surface, the width of the top surface is approximately equal to the width of the memory body, and the inner side of the two sides is reduced downward, so that the minimum width of the two introversion surfaces is smaller than the width of the memory; A memory slot can be vertically inserted into a memory, a pointed body located on one side of the slot, and a sharp end extending in the direction of the reverse slot, which can extend the two inwardly facing supports of the sliding heat sink Open; an operating lever., and a lifting platform, located at the bottom of the slot, will be controlled to rise or fall by the operation of the operating lever; wherein the memory is fixed in the slot after the 'heating clip from the sharp end of the pointed body Slide in and open the two introversion planes of the heat sink, so that the width of the inner surface of the heat sink is larger than the width of the body, so that the heat sink slides to the memory to cover the wafer; and is operated by the operating lever to raise the M300870. The rise of the platform will push the memory and the heat sink.
101年2月24日更正替換頁Corrected replacement page on February 24, 101
16 ·依據申請專利範圍s15項所述之治具，其中操作桿是以機 械式的控制昇降台上昇或下降。 17.依據申請專利範圍第15項所述之治具，其中操作桿是以電 子式的控制昇降台上昇或下降。 18 ·—種組裴散熱夾於記憶體之治具，該散熱夾係以一頂面連接 兩侧内傾Φ，頂面之寬度鱗於上述記髓之寬度，而兩侧内傾面 向下縮小，使兩内傾面之最小寬度小於記憶體寬度；其係包括： 一 s己憶體插槽，係可一記憶體垂直向插入， 一尖狀體，位於上述插槽一侧，其尖銳端係反插槽方向延伸， 可將滑入的散熱夾的兩内傾面撐開； 一按把’係安裝於治具侧面，連接一伸入組裝治具内部的滑塊； 該滑塊在按把被按壓時，會推動插槽下方的一月頂板上昇，使得插 入插槽内的記憶體在沿著尖狀體將散熱夾裝置後，被向上推頂。 19 ·一種組裝散熱夾於記憶體之治具，該散熱夾係以一頂面連接 兩侧内傾面’頂面之寬度約等於上述記憶體之寬度，而兩侧内傾面 向下縮小，使兩内傾面之最小寬度小於記憶體寬度；該治具具有一 底片’在其表面上形成一尖狀體，並於尖狀體内開設了一可供記憶 20 101年2月24日更正替換頁' ，入插槽；該尖狀體__成—下凹自莉-前緣貫穿後緣而構成可供散熱夾通過的滑道；當散熱夹自上述尖狀 體的災銳刖緣沿著下凹部滑人插立於插槽上的記憶體賴，經尖銳 刖緣將政熱片之兩内傾面分開，而可順利覆蓋記憶體兩側。 s'·'16. The jig according to the scope of application for patent application s15, wherein the operating lever is mechanically controlled to raise or lower the lifting platform. 17. The jig according to claim 15, wherein the operating lever is raised or lowered by an electronically controlled lifting platform. 18 ·--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The minimum width of the two introversion planes is smaller than the width of the memory; the system includes: a s-recovery slot, which can be vertically inserted into a memory, a pointed body located on one side of the slot, and the sharp end thereof Extending in the direction of the reverse slot, the two introversion faces of the sliding heat sink can be opened; a button is attached to the side of the fixture, and a slider extending into the interior of the assembly fixture is connected; When pressed, it pushes the top plate of the month below the slot, so that the memory inserted into the slot is pushed up after the heat sink device is installed along the pointed body. 19) A fixture for assembling a heat sink clip to a memory, the heat sink clip connecting a top surface of the inner side with a top surface, wherein a width of the top surface is approximately equal to a width of the memory body, and both sides are inclined downward to reduce the width of the memory. The minimum width of the two introversion faces is smaller than the width of the memory; the jig has a negative film forming a pointed body on the surface thereof, and a replacement for the memory in the pointed body 20 February 24, 2011 correction Page ', into the slot; the pointed body __ into - the concave self-living - the leading edge through the trailing edge to form a slide for the heat sink to pass; when the heat sink clip from the sharp edge of the pointed body The memory of the lower recessed person is inserted into the memory of the slot, and the two inner inclined surfaces of the political heat sheet are separated by the sharp edge, and the sides of the memory can be smoothly covered. s'·'
21twenty one