M295875 八、新型說明： 【新型所屬之技術領域】 本創作提供一種PCB油墨塗佈裝置，特別是涉及一種 利用轉印滚筒在基板上轉印塗佈油墨及進行整平作業的技 術。 【先前技術】 备’基板[即印刷電路基板（printe(j circuit b〇ar(j5 PCB )]M295875 VIII. New Description: [New Technology Field] This creation provides a PCB ink coating device, and more particularly to a technique for transferring a coating ink on a substrate by a transfer roller and performing a leveling operation. [Prior Art] Prepare 'substrate [ie printed circuit board (print circuit (j circuit b〇ar (j5 PCB)]
的生產製程中，必須經過一道表面絕緣作業，主要是在基 板表面塗佈一層油墨且加以烘烤，致使基板表面的油墨乾 燥形成-絕緣層，以便於後續產品組裝製程中之雙内線封裝 (DUal ln-line package，Dlp)作業及表面黏著裝置（s她⑶⑽恤 Device，SMD)作業的進行。 一且知，坊間習用之基板表面的油墨塗佈裝置，係利用 二支轉印滚筒組成-轉印單元，使該等二支轉印滾筒的筒 』之間^成有轉印端，能使基板經由轉印端捲入轉印單 一藉由a等一支轉印滾筒而將油墨轉印塗佈在基板上，· 匕卜為防止基板塗佈過多油墨而造成油墨不平整、 時及其他種種製程上的困擾，傳統上是在該等各轉 形成複數條油墨溝槽，並利用適當的溝槽深度以 = 墨的多寡’進而控制油墨之塗佈量在適當的範 准’《見利用_組轉印單元的油墨塗佈裝置，僅適 過程中=生產之高阻抗基板的製造 里具有假性露銅」現象的不良品； M295875 假若增加上述油赌叙深度以提⑼ 防止假性露銅現象不再發生，卻也= ^能 上述油墨不平整等各種問題，已造成業界一大困難、。生 有鑑於此’本創作人特以其專門從事pcB生 二:研究及產製經驗，不斷地研發及改良， 創作，以改善上述之問題。 呵刎出本 【新型内容】 本創作之目的旨在提供一種PCB油墨塗 是一種能將油墨充分及平整塗佈於基板上的裝置\ ，尤其In the production process, a surface insulation operation must be carried out, mainly by coating a layer of ink on the surface of the substrate and baking it, so that the ink on the surface of the substrate is dried to form an insulating layer, so as to facilitate the double inner package in the subsequent product assembly process (DUal) Ln-line package, Dlp) operation and surface adhesion device (s (3) (10) (Device), SMD). It is also known that the ink coating device on the surface of the substrate used in the workshop uses a two-transfer roller to form a transfer unit, so that the transfer ends of the two transfer rollers can be formed with a transfer end. The substrate is transferred onto the transfer sheet via the transfer end, and the ink is transferred onto the substrate by a transfer roller such as a. In order to prevent the substrate from being coated with too much ink, the ink is uneven, and various other types are caused. The troubles in the process are traditionally to form a plurality of ink grooves in these turns, and to use appropriate groove depth to control the amount of ink in the ink groove to control the amount of ink applied in the appropriate standard. The ink coating device of the group transfer unit is only suitable for the defective product in the process of manufacturing high-impedance substrate; M295875 If the above-mentioned oil gambling depth is increased, (9) Preventing false copper The phenomenon no longer occurs, but it also = ^ can be a variety of problems such as the above ink unevenness, has caused a lot of difficulties in the industry. In view of the fact that this creator specializes in pcB students 2: research and production experience, continuous research and development, improvement, creation, to improve the above problems.刎 刎 【 [New content] The purpose of this creation is to provide a PCB ink coating is a device that can fully and evenly apply the ink on the substrate\
㈣上述之目的，本創作包含在—前 ，-後段轉印單元’該前段轉印單元係由= 及一前段下層滾筒所組成，且該前段上層滚筒輿前 ^同的筒壁之間形成有一人料端，同時該前段上層^ 丽段下層滚筒上均具有複數條前段油墨溝槽 墨，並能在進入該入料端的基板上轉印塗佈油墨。/ W .^職段轉印單元係由-後段上層滾筒及1段下層滾 筒所組成，且該後段上層滾筒與後段下層滾筒的筒壁^間 形成有一出料端，使該入料端與出料端位於同—輸送軸^ 上，能使基板經由入料端進入，再經由出料端輪出；、、 、該後段上層滾筒及後段下層滾筒上均具^复數條後段 油墨溝槽，用以沾附油墨，且該等後段油墨溝槽之溝槽深 度係小於前段油墨溝槽的溝槽深度，並能對進入該出 之基板上的油墨進行整平作業。 ’ 為促使貴審查委員更加瞭解本創作，請參閱圖式 施方式之說明如後： 、 6 M295875 【實施方式】 配置=圖本創作PCB油墨塗佈裝置之 單元2^巾—别段轉印單元1旁側設-後段轉印 11 1 (如圖一所示）係由一前段上層滚筒 11及一刖段下層滾筒U0 # M 所組成，該前段上層滾筒11與前 12 ΐ4:二：層滚筒110均具有自動旋轉的能力， 係月b將基板3捲進入料端〗） ^叶麵12中；該前段上層滚筒11及前段 二之筒，側均具有-括刀14·且該前 5，曰ϋ1的同壁與其括刀14之間形成有-油墨槽 -二TJg Γ11㈣筒壁與其括刀⑽之間亦形成有 上及別容置該等括刀14、140在前段 4门筒110之筒壁上刮落的多餘油墨 4，同時该前段上層滚筒u (如圖二、圖三所示）及前段下 ηΓ均具有複數條前段油墨溝槽i3、i3G，用以沾(4) For the above purpose, the present invention comprises a front-back, a rear-stage transfer unit, wherein the front-stage transfer unit is composed of = and a front-stage lower-layer drum, and the front-stage upper drum is formed between the front and the same cylinder wall. At the same time, the upper layer of the upper layer of the front layer has a plurality of front ink groove inks, and the coating ink can be transferred on the substrate entering the feeding end. / W. The job transfer unit is composed of a rear stage upper drum and a lower stage drum, and a discharge end is formed between the upper stage upper drum and the lower stage lower stage cylinder, so that the feeding end is out The material end is located on the same conveying shaft, so that the substrate can enter through the feeding end and then rotate through the discharging end; and, the rear upper roller and the lower lower roller have a plurality of rear ink grooves, The ink is adhered, and the groove depth of the rear ink grooves is smaller than the groove depth of the front ink groove, and the ink entering the discharged substrate can be leveled. In order to make your reviewer more aware of the creation, please refer to the description of the pattern as follows: , 6 M295875 [Embodiment] Configuration = drawing unit of PCB ink coating device 2 2 towel - other transfer unit 1 Side setting - Rear section transfer 11 1 (shown in Figure 1) is composed of a front upper layer drum 11 and a lower stage lower layer drum U0 # M, the front section upper layer drum 11 and the front 12 ΐ 4: two: layer drum Each of the 110s has the ability to automatically rotate, and the bottom b of the substrate 3 is fed into the material end 〖) the leaf surface 12; the front upper layer drum 11 and the front section two cylinders each have a - knife 14 and the front 5, Between the same wall of the crucible 1 and the knives 14 are formed with - ink trough - two TJg Γ 11 (four) cylinder wall and its knives (10) are also formed with and can accommodate the knives 14, 140 in the front section 4 The excess ink 4 scraped off on the wall of the cylinder, and the upper stage upper drum u (shown in FIG. 2 and FIG. 3) and the front stage lower ηΓ each have a plurality of front section ink grooves i3 and i3G for dip
Hi’ -使基板3 (如圖—所示）能經由人料端12捲進 滅轉印早轉特佈油墨4 (如圖四所示）。 該t轉印單元2(如圖—所示）係由—後段上層滾筒 筒21G軸成，賴段上層滾筒21與後 壁之間形成有—㈣端22，使該入料 m 位__輪送軸線上，能使基板3經由 汽：二再經由出料端22輸出，且該後段上層滾 从山下層滾筒210均具有自動旋轉的能力，係能將 基板3捲進出料端22中；該後段上層滾筒21及後段下層 M295875 滾筒210之筒壁的端側均具有一括刀24、240,且該後段上 層滾筒21的筒壁與其括刀24之間形成有一油墨槽25，該 後段下層滾筒210的筒壁與其括刀240之間亦形成有 墨槽250,均能用以分別容置該等括刀24、240在後段上層 滾筒21及後段下層滾筒210之筒壁上刮落的多餘油墨4 : 同時該後段上層滾筒21及後段下層滾筒210上均具有複數 條後段油墨溝槽23、230 (如圖五所示），用以沾附油墨， 且該等後段油墨溝槽23、230之溝槽深度係小於前段二墨 ⑩ 溝槽U及130的溝槽深度（如圖三所示），因此該等後段 油墨溝槽23、230沾附的油墨較少於前段油墨溝槽13及 130，致使上述已塗佈油墨4 (如圖四所示）之基板3再經 由出料端22 (如圖六所示）輸出而對基板3上的油墨4進 行整平作業。 依據上述，在實施上更加能將該前段轉印單元丨（如圖 七、圖八所示）及後段轉印單元2設置在一架台5上，並 於前段轉印單元1之另-側架設一由複數滾輪所組成的 鲁輸6’使輸送台6與該人料端12位於同—輸送軸線上， ^亥等複數滾輪61均具有自動旋轉能力，係能移載基板3 前進ΐ入料端12 ;據此，將基板3置放於複數滾輪61上， =稷數滾輪61移载而捲進入料端12,並利用該前段上層 :袞'11及丽段下層滾筒11〇以轉印塗佈油墨在基板3上， 進!^防止假性露銅現象發生，再藉由該後段上層滾筒21 及Η又下層滾筒210進行整平作業，致使基板3上的油墨 進V形成平整均勻的狀態，以便於後序產品組裝製程中 之DIP及SMD的進行。 8 M295875 此外，該前段轉印單A 1及後段轉印單元2(如圖九所 示）亦能設置在—斜背式架台5〇上，係能防止基板3邊 轉印塗佈不良之現象的發生’並在複數滾輪61 (如圖八所 不）上架設一承架62，用以推持複數滚輪61上 進而能防止基板3自複數滾輪61上滑落。 綜合上述之說明，相信已詳加揭示本 利用性’但本創作之技術並不局限於此，舉 及后述申請專利範圍等内容而作出簡略 應隸屬於捕作u料，奸陳明。料放技術均 【圖式簡單說明】 圖-··揭示出本創作之PCB油墨塗 圖，說_前段轉印單元㈣設有—彳_==。置^ …圖二：揭示出本創作之前段上層滾筒 邊剛段上層滾筒上具有複數條前段油墨溝槽。_θ ° “ u示出本創作之前段上層滚筒 说明该等前段油墨溝槽大於後段油墨溝槽。° ° °不田 圖四：揭示出本創作之前段轉印單元 板能經由入料端進入‘:二 說明=::=:¾部=圖’ 溝槽深度。 〗於別段油墨溝槽的 圖六：揭示出本創作之後段轉印單 剖示圖’說明該已塗佈油墨的基板能經由出=局: M295875 而對基板上的油墨進行整平作業。 圖七：揭示出本創作之PCB油墨塗佈裝置的側視圖， 說明該前段轉印單元及後段轉印單元設置在一架台上。 圖八：揭示出本創作之PCB油墨塗佈裝置的俯視圖， 說明該前段轉印單元之另一側架設一由複數滾輪所組成的 輸送台。 圖九：揭示出本創作之PCB油墨塗佈裝置的另一側視 圖，說明該前段轉印單元及後段轉印單元設置在一斜背式 •架台上。 【主要元件符號說明】 1 -----------前段轉印單元 11 ----------前段上層滾筒 110---------前段下層滾筒 12 ----------入料端 13、 130-----前段油墨溝槽 14、 140-----括刀 15、 150-----油墨槽 2 -----------後段轉印單元 21 ----------後段上層滾筒 210---------後段下層滾筒 22 ----------出料端 23、 230-----後段油墨溝槽 24、 240-----括刀 25、 250-----油墨槽 M295875 3-------- -基板 4-------- -油墨 5、50—— 架台 6-------- 輸送台 61------- 滾輪 62------- -承架Hi' - enables the substrate 3 (shown in the figure) to be wound up through the human end 12 to transfer the early transfer cloth 4 (as shown in Figure 4). The t-transfer unit 2 (shown in the figure) is formed by the rear stage upper drum tube 21G, and the - (four) end 22 is formed between the upper layer drum 21 and the rear wall, so that the input m-position _ wheel On the sending axis, the substrate 3 can be output via the steam: two through the discharge end 22, and the rear upper layer roll has the ability to automatically rotate from the mountain lower roller 210, and the substrate 3 can be wound into the discharge end 22; The rear side upper drum 21 and the rear lower layer M295875 have the end faces of the cylinder wall of the drum 210 each having a cutter 24, 240, and an ink groove 25 is formed between the cylinder wall of the rear upper drum 21 and the cutter 24, and the rear lower cylinder 210 is formed. An ink tank 250 is also formed between the wall of the cylinder and the bracket 240, and can be used to respectively accommodate the excess ink scraped off by the blades 24 and 240 on the wall of the upper stage upper drum 21 and the lower stage lower stage 210. At the same time, the rear upper roller 21 and the lower lower roller 210 have a plurality of rear ink grooves 23 and 230 (shown in FIG. 5) for adhering the ink, and the grooves of the rear ink grooves 23 and 230 are grooved. The groove depth is smaller than the groove depth of the front two inks 10 grooves U and 130 (as shown in the figure) As shown, therefore, the inks adhered by the rear ink grooves 23, 230 are less than the ink grooves 13 and 130 of the front stage, so that the substrate 3 of the coated ink 4 (shown in FIG. 4) is discharged again. The end 22 (shown in Figure 6) is output to level the ink 4 on the substrate 3. According to the above, in the implementation, the front transfer unit 丨 (as shown in FIG. 7 and FIG. 8 ) and the rear transfer unit 2 can be disposed on a table 5 and erected on the other side of the front transfer unit 1 . A Luan 6' consisting of a plurality of rollers causes the transport table 6 to be located on the same transport axis as the human end 12, and the plurality of rollers 61 have automatic rotation capability, and are capable of transferring the substrate 3 to advance the feed. End 12; according to this, the substrate 3 is placed on the plurality of rollers 61, the number of rollers 61 is transferred and wound into the material end 12, and the upper layer of the front section is used: 衮'11 and the lower stage roller 11〇 for transfer The coating ink is applied to the substrate 3 to prevent the occurrence of false copper exposure, and the leveling operation is performed by the upper stage upper roller 21 and the lower layer lower roller 210, so that the ink in the substrate 3 is formed into a flat and uniform shape. Status, in order to facilitate the DIP and SMD in the subsequent product assembly process. 8 M295875 In addition, the front transfer sheet A 1 and the rear transfer unit 2 (shown in FIG. 9 ) can also be disposed on the slanting back frame 5 , to prevent the substrate from being poorly transferred and coated. The occurrence of 'and a shelf 62 on the plurality of rollers 61 (not shown in FIG. 8) is used to push the plurality of rollers 61 to prevent the substrate 3 from slipping off the plurality of rollers 61. In view of the above description, it is believed that the use of the present invention has been disclosed in detail. However, the technique of the present invention is not limited thereto, and the description of the scope of the patent application to be described later should be briefly referred to as the arresting material, and the rape of Chen Ming. Material discharge technology [Simplified description of the diagram] Figure-·· reveals the PCB ink coating of this creation, saying that the front transfer unit (4) is equipped with 彳_==. Fig. 2: Fig. 2: reveals that there are a plurality of front ink grooves on the upper roller of the upper layer of the upper layer before the creation. _θ ° “u shows that the upper roller in the previous stage of the creation indicates that the front ink groove is larger than the rear ink groove. ° ° ° 不田图四: reveals that the transfer unit plate can enter through the feed end before the creation : 二说明=::=:3⁄4部=图' Groove depth. 〗 〖In other ink grooves Figure 6: revealing the post-transfer single-section diagram 'Describes that the coated substrate can pass Out = Bureau: M295875 The ink on the substrate is leveled. Figure 7: A side view of the PCB ink coating device of the present invention is disclosed, illustrating that the front transfer unit and the rear transfer unit are disposed on a table. Figure 8: A plan view showing the PCB ink coating device of the present invention, illustrating that the other side of the front transfer unit is provided with a transporting platform composed of a plurality of rollers. Figure 9: revealing the PCB ink coating device of the present invention Another side view shows that the front transfer unit and the rear transfer unit are disposed on a hatchback type. [Main component symbol description] 1 ----------- Front transfer unit 11 ----------The upper stage upper roller 110--------- Segment lower roller 12 ----------feed end 13, 130-----front ink groove 14, 140-----blade 15, 150-----ink tank 2 ----------- Rear section transfer unit 21 ---------- Rear section upper drum 210--------- Rear section lower drum 22 ------- --- discharge end 23, 230-----rear ink groove 24, 240-----blade 25, 250-----ink slot M295875 3-------- - substrate 4-------- -Ink 5,50 - Stand 6-------- Conveyor 61------- Roller 62------- - Shelf
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