TWM292787U - Chip structure for thermocompression - Google Patents

Chip structure for thermocompression

Info

Publication number
TWM292787U
TWM292787U TW094222224U TW94222224U TWM292787U TW M292787 U TWM292787 U TW M292787U TW 094222224 U TW094222224 U TW 094222224U TW 94222224 U TW94222224 U TW 94222224U TW M292787 U TWM292787 U TW M292787U
Authority
TW
Taiwan
Prior art keywords
thermocompression
chip structure
chip
Prior art date
Application number
TW094222224U
Other languages
Chinese (zh)
Inventor
Hou-Chang Kuo
Yung-Jen Chen
Chin-Tsun Feng
Original Assignee
Internat Semiconductor Technol
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Internat Semiconductor Technol filed Critical Internat Semiconductor Technol
Priority to TW094222224U priority Critical patent/TWM292787U/en
Publication of TWM292787U publication Critical patent/TWM292787U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
TW094222224U 2005-12-20 2005-12-20 Chip structure for thermocompression TWM292787U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094222224U TWM292787U (en) 2005-12-20 2005-12-20 Chip structure for thermocompression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094222224U TWM292787U (en) 2005-12-20 2005-12-20 Chip structure for thermocompression

Publications (1)

Publication Number Publication Date
TWM292787U true TWM292787U (en) 2006-06-21

Family

ID=37704037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094222224U TWM292787U (en) 2005-12-20 2005-12-20 Chip structure for thermocompression

Country Status (1)

Country Link
TW (1) TWM292787U (en)

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees