TWM292163U - Improved structure of the LED frame - Google Patents
Improved structure of the LED frameInfo
- Publication number
- TWM292163U TWM292163U TW094222114U TW94222114U TWM292163U TW M292163 U TWM292163 U TW M292163U TW 094222114 U TW094222114 U TW 094222114U TW 94222114 U TW94222114 U TW 94222114U TW M292163 U TWM292163 U TW M292163U
- Authority
- TW
- Taiwan
- Prior art keywords
- improved structure
- led frame
- led
- frame
- improved
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094222114U TWM292163U (en) | 2005-12-19 | 2005-12-19 | Improved structure of the LED frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094222114U TWM292163U (en) | 2005-12-19 | 2005-12-19 | Improved structure of the LED frame |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM292163U true TWM292163U (en) | 2006-06-11 |
Family
ID=37615279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094222114U TWM292163U (en) | 2005-12-19 | 2005-12-19 | Improved structure of the LED frame |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM292163U (en) |
-
2005
- 2005-12-19 TW TW094222114U patent/TWM292163U/en not_active IP Right Cessation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |