TWM292163U - Improved structure of the LED frame - Google Patents

Improved structure of the LED frame

Info

Publication number
TWM292163U
TWM292163U TW094222114U TW94222114U TWM292163U TW M292163 U TWM292163 U TW M292163U TW 094222114 U TW094222114 U TW 094222114U TW 94222114 U TW94222114 U TW 94222114U TW M292163 U TWM292163 U TW M292163U
Authority
TW
Taiwan
Prior art keywords
improved structure
led frame
led
frame
improved
Prior art date
Application number
TW094222114U
Other languages
Chinese (zh)
Inventor
Ching-Huei Wu
Dung-Jing Wu
Original Assignee
Unity Opto Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unity Opto Technology Co Ltd filed Critical Unity Opto Technology Co Ltd
Priority to TW094222114U priority Critical patent/TWM292163U/en
Publication of TWM292163U publication Critical patent/TWM292163U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
TW094222114U 2005-12-19 2005-12-19 Improved structure of the LED frame TWM292163U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094222114U TWM292163U (en) 2005-12-19 2005-12-19 Improved structure of the LED frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094222114U TWM292163U (en) 2005-12-19 2005-12-19 Improved structure of the LED frame

Publications (1)

Publication Number Publication Date
TWM292163U true TWM292163U (en) 2006-06-11

Family

ID=37615279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094222114U TWM292163U (en) 2005-12-19 2005-12-19 Improved structure of the LED frame

Country Status (1)

Country Link
TW (1) TWM292163U (en)

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model