M288726 八、新型說明： . 【新型所屬之技術領域】 . 本_做關—麵於辨純之邊射型《慎讀賴裝，特 別指-種可以II集所在位置與-制物體間姆位移資訊的微型感測器。 【先前技術】 光學滑鼠是現今電腦使用上非常重要的人機介面工具，自從早先被發展 出來科天，市面上主要產品的猶方式錢用的光縣分，大致可以分為 • 雜’第一種為發光二極體式光學滑鼠如第四圖所示，其主要利用-個發光 二極體作為光源，經獨立的光學組件將光線導引到—制平面，紐利用一 個影像感測器，高速地攝取該待測平面之影像，並比較影像内容的相對位 移，來獲取滑鼠移動的相關訊息，並進而移動銀幕上的指標，來執行控制的 功能。第二種則為雷射光學滑鼠如第五圖所示，其係以單獨設置的面射型半 導體雷射作為光源，經獨立的光學鏡頭照射到待測平面，並以一影像感測琴 南速地攝取制平面之影像，並比細__對位移，來獲取滑鼠移動 的相關訊息，進而移動銀幕上的指標來遂行控制的功能，而使用雷射作為光 • 源的優點是利用雷射光的高度平行及單一波長的特性，可以獲得較清晰的影 像，因此可以大幅提昇影像内容相對位移的精確性，或利用雷射光斑之相對 位移，進而提升滑鼠的控制準確度。 财鼠有—蚁將發光二減無像_元件分別 、衣4在某鍾品上，是將發光二極體與影像制“封餘同一封 =用雷射光學滑鼠則是將雷射晶片與影像感測晶片分別封裝，而且、 所使用的疋波長奈米的面射型雷射，是屬於不可見光細，昭射入 日二察覺，因此有潛在的安全顧慮。另外它們都要使用-組外加的光學鏡 八中―部份將絲指向特定輯，另—部分導狀射_光線，1隹 5 M288726 後在影像感測晶片上形成清晰的影像 ，以便加以辨識處理。 但外加的光學鏡頭會增加感測器建構時的成本，在組裝時也常有中心對 正的問題’最嚴重的是它將使感測器組成的整體高度以及體積變大，使得整 、、且感測為無法進一步微型化，從而限制了它的使用範圍。 干因此，要從被測物體反射光將所要荒集的資訊回射至感測器作運算，利 用田射光源的單—波長與絲平行轉性絲得制物之資訊是一較佳的 么選擇’但是如何獅雷射光源誠·«使用的形式最佳化、封裝體積的 縮小、降低成本及如何比較容易細，則是本創作所要解決課題。M288726 VIII. New description: . [New technical field] _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Information micro sensor. [Prior Art] Optical mouse is a very important human-machine interface tool used in today's computer use. Since the development of Ketian, the light source of the main products in the market, can be divided into: A light-emitting diode optical mouse, as shown in the fourth figure, mainly uses a light-emitting diode as a light source, and directs light to a plane through an independent optical component, and an image sensor is used. The image of the plane to be tested is taken at a high speed, and the relative displacement of the image content is compared to obtain a related message of the movement of the mouse, and then the indicator on the screen is moved to perform the control function. The second type is a laser optical mouse, as shown in the fifth figure, which uses a separately arranged surface-emitting semiconductor laser as a light source, which is irradiated to the plane to be measured through a separate optical lens, and senses the sound of the image with an image. Quickly ingest the image of the plane, and obtain the related information of the movement of the mouse, and then move the indicators on the screen to control the function. The advantage of using the laser as the source of light is to use the mine. The highly parallel and single wavelength characteristics of the light can be used to obtain a clearer image, so the accuracy of the relative displacement of the image content can be greatly improved, or the relative displacement of the laser spot can be utilized, thereby improving the control accuracy of the mouse. The squirrel has - the ant will reduce the illuminance without the _ component separately, the clothing 4 on a certain clock, the light-emitting diode and the image system "the same seal = the laser optical mouse is the laser chip It is packaged separately from the image sensing wafer, and the surface-emitting laser of the 疋 wavelength nanometer used is invisible light, which is detected by the second shot, so there are potential safety concerns. In addition, they must be used - The set of additional optical mirrors in the eighth part of the wire points to the specific series, and the other part of the guided light_ray, 1隹5 M288726, then form a clear image on the image sensing wafer for identification processing. The lens will increase the cost of sensor construction, and there is often a problem of center alignment during assembly. The most serious problem is that it will make the overall height and volume of the sensor composition larger, so that the whole and the sense are It can't be further miniaturized, which limits its scope of use. Therefore, it is necessary to reflect the light to be reflected from the measured object to the sensor for calculation, and use the single-wavelength of the field source to parallel the wire. Sexual silk The news is a better choice. But how to optimize the form of use, reduce the size of the package, reduce the cost and how easy it is to make it easier to solve the problem.
【新型内容】 、，依據上述，本創作之主要目的在於，提供__於光學滑鼠之邊射型可 就田射作為絲影像❹制為接收器，而具有封裝製程簡化、封裝體積 縮小及降低成本之微型位移感測器者。 、 職是’為達上述之目的，本創作之邊射型雷射與感測器之積體封裝係包 括-封U、-雷射發光晶；：；、—具有折光功能的副置體或—副置體盘一具 有折光功能的光學元件、-影像感測；、—阻隔光柵、—極納偽㈣二極 體及選娜設置_脳肢運算；域，其巾該封裝體储有一基座， 於基座上設-結構聽，於驢敎纽置透絲，柯設置鮮透鏡；今 雷射發光；係與財折射絲魏_置贿合雜座上，或該雷射發光 晶片係與副置體結合於基座上而另一具有折光功能的光學元件置於並旁，將 雷射光線折射後誠簡到-制平稱，影像感測晶片用喊應光線反射 所產生的圖形，當此___有水平位料，即可提供相對位移之輸出 如此’可藉由影像感測晶片與雷射發光晶片設於相鄰之處所形成的最短 先程，可碰得較制反射賴，整傭構喊度刊此崎低。而本創作 6 M288726 射：射與感測_體封裝所_ 【實施方式】“間化、縣體積縮小及降低成本等效果。 較佳的技術手段及其功效，舉- 請參閱「第一、二;5莖二m 一 測器積_彻_==，齡戦縣__雷射與感 後斷面示意本創作另-實施例之„彳_ _tr 裝 係包括-封裝髀！ J之封衣後斷面不意圖。如圖所示，本創作 、蛋握雷射發光晶片2、—副置體3、-影像感測晶片4、- ^ , 5又的運异晶片5、—阻隔光柵6及一極納(Zener)二極體7、 性設置的測光晶片8。 胃/選擇 2所提之«體i係為—基座„及—中空狀封蓋12所組成的封裝構 以土座11可為印刷電路板或導線架等，於選定處設有可與其他功能性 電辦反等設備作電性連接的外導接部⑴，於基座U上設置-封蓋12，該 封盖12可為-組合成一體的中空狀透光體，於底部構成一腔室⑵，以封 罩住基座11上，於腔1121頂部構成一折光透鏡122，使腔室i2i内部光 源經由折光透鏡Π2投射於料被測物體6〇，再反射經過透光鏡窗⑵進 入L至。其中’該基座n之對外導接部m可為金屬導線或導接端子等構 成’又該封蓋12之頂端係可設有一· 124，使折光透鏡122、透光鏡窗 123之外面位在開孔124内，用以保護折光透鏡122、透光鏡窗123。 该雷射發光晶片2係為波長介於630奈米至690奈米之可見光邊射型雷 射發光晶片（Edge-Emitting Laser，EELD)，且該雷射發光晶片2該與一個 或多個具有折光功能之副置體3結合後組合於該封裝體1之基座n上呈電 性連接，並被封蓋12的腔室121罩設密封，其發光端（面）對應於副置體 7 M288726 3的入射端’經折射後的光線投射到折光透鏡122内面。 忒衫像感測晶片4係一種用以接收、感測影像的晶片（Image[New content] According to the above, the main purpose of this creation is to provide a side-by-side optical lens that can be used as a receiver for the field image, and has a simplified packaging process and a reduced package size. A miniature displacement sensor that reduces costs. , for the purpose of the above, the integrated package of the side-projecting laser and sensor of the present invention includes - seal U, - laser illuminating crystal;:;, sub-body with refractive function or - a sub-disc disk, an optical element having a refractive function, - image sensing; - a barrier grating, a polar nano (diode) diode, and a selection of 脳 limb operation; a domain, the package has a base Block, set on the pedestal - structure to listen, 驴敎 驴敎 驴敎 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The optical element with the sub-mount is coupled to the pedestal and the other optical element having the refractive function is placed next to it, and the laser light is refracted and then reduced to a flat scale, and the image sensing wafer is shattered by a light reflection. When the ___ has a horizontal level of material, the output of the relative displacement can be provided. The shortest path formed by the image sensing wafer and the laser emitting chip adjacent to each other can be touched. The whole commission structure is called this low. And this creation 6 M288726 shooting: shooting and sensing _ body packaging _ [Embodiment] "intergeneration, county size reduction and cost reduction. Better technical means and its efficacy, - see "first, 2; 5 stem two m a detector product _ _ _ = =, 戦 戦 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Tr The section after the seal of J is not intended. As shown in the figure, the present invention, the egg holding laser emitting chip 2, the sub-mount 3, the image sensing wafer 4, the -, 5, and the different wafer 5, the barrier grating 6 and the Zener (Zener) The diode 7 is provided with a photometric wafer 8 of a nature. The package structure consisting of the body/selection 2 is a body pedestal and a hollow cover 12, and the earth seat 11 can be a printed circuit board or a lead frame, etc., and is selected at the selected place. The outer guiding portion (1) for electrically connecting the functional electrical equipment, and the cover 12 is disposed on the base U. The cover 12 can be a hollow transparent body that is combined into one body, and a bottom is formed at the bottom. a chamber (2) for covering the base 11 and forming a refractive lens 122 on the top of the cavity 1121, so that the internal light source of the chamber i2i is projected onto the object to be measured 6〇 via the refractive lens Π2, and then reflected through the transparent window (2) In the case of L to , the external guiding portion m of the base n may be a metal wire or a conductive terminal, and the top end of the cover 12 may be provided with a 124 for the refractive lens 122 and the light-transmissive window The outer surface of the 123 is located in the opening 124 for protecting the refracting lens 122 and the light transmissive window 123. The laser illuminating wafer 2 is a visible light emitting laser emitting chip having a wavelength of 630 nm to 690 nm. (Edge-Emitting Laser, EELD), and the laser emitting chip 2 is associated with one or more sub-distribution functions 3 is combined and electrically connected to the base n of the package 1 and sealed by the chamber 121 of the cover 12, and the light emitting end (face) corresponds to the incident end of the sub-mount 7 M288726 3 The refracted light is projected onto the inner surface of the refractive lens 122. The smear image sensing chip 4 is a wafer for receiving and sensing images (Image)
SensorSensor
Chip)，係依據上述透光鏡窗123接受反射光線所投射的位置結合於封裝體 1之基座11上呈電性連接，並被封蓋12的腔室121罩設密封，影像感測晶 片4上方的適當位置裝設有一阻隔光柵6，其開設有適當的孔徑而僅容許信 號光束通過以避免雜訊進入。 如上所述，該雷射發光晶片2及影像感測晶片4並不一定要設在該基座The chip is electrically connected to the pedestal 11 of the package 1 according to the position where the light-transmitting window 123 receives the reflected light, and is sealed by the cavity 121 of the cover 12, and the image sensing chip is sealed. A barrier grating 6 is mounted at an appropriate position above the 4, which is provided with a suitable aperture to allow only the signal beam to pass through to avoid noise ingress. As described above, the laser emitting chip 2 and the image sensing wafer 4 are not necessarily provided on the pedestal.
η同-平面或光平面上，且該發光晶片2及影像感測晶片4的接地平面在 電（緣)上亦了為相接或絕緣，端視使用需求可變更實施。另者，亦可選擇 性地於該基座u上設置—個或多個所述運算晶片5，用以接收影像感測晶 片4所讀取的資訊信號作運算，俾作進一步的應用，藉此組成本創作之邊射 型雷射與感測器之積體封裝。 〜於實施時，係由雷射發光晶片2發出探測光源，投射到具有折射光線功 ^ j置體3的折射鏡面’經折射後的光源再經由折光透鏡I〕〕使雷射光擴 展後折㈣封A 12 ’此探測光源投射於被測物體的後，部份將再反射到透 光鏡窗1Z3 ’透過该透光鏡窗123將含有被測物體6〇絲型態資訊的反射 "射心像感叫曰曰片4，光程中經過阻隔光栅6阻撞雜訊後即能由影像感 =片：讀取該資訊，整體可微型化以節省空間，因此應將影像感測晶片： '、一 H片2《置在貫施時可行的最短距離，以利於製造及解析所獲得 〜最她離應〃於2至2G鮮之間以將雌之體積微型化。為調 雷射發光晶片2所射出光束投射到被測物體6〇而設的具折光功能的副置 體3，應能將f射光束偏折2Q _度_，以配合縮小組件以及調整 ^則物體6G位置的需求。另—實施例是使用單獨的副置體與單獨的折光結 目的’如第三騎示。 因此照射到待測平面 由於雷射光束是-種單_波長且高度平行的波束， 8 M288726 時’僅有符合相對於可見光邊射型雷射光源2與影像感測晶片4呈入射角等 '於反射肖的平©區域才能將光線反射關設在特定位置的影佩測晶片4 並加以感測如第二圖所示，因此影像感測晶片4上所感測到的圖像應綠被 田射光束職、射到的區勒，所有符合前述反射條件的平面所反射回來之光 能量的對應分佈，為具有部分亮區與部分暗區的影像圖形，此圖形含有被照 射區域之表面聽的躲，與被f射光束賴射的區域有完全的相關聯性， 因此’虽此圖形被侧到有水平位移時，即可由運算晶片$計算後提供相對 位移之輸出域，由於影像感·片4制的是騎範_符合反射條件的 ► 平面區域之總成並據以應用，在某些使用時不需要形成影像，可以省略習知 之成像光學鏡頭，當然亦可使用成像鏡頭以讀取影像。 在應用上，影像感測晶片4與雷射發光晶片2設於相鄰之處所形成的光 程最短’可以獲得較強的反射信號，實際使用時，為調整影像感測晶片績 待測平面距離及待測點的相對位置，可使用折光透鏡122將雷射光偏折投射 到待測點，所以整個結構的高度也可因此而降低。 由於雷射發光晶片2對靜電的耐受程度較差，因此可加裝一顆極納 (Zener)二極體7在雷射發光晶片附近，並與雷射發光晶片2的極性呈反相連 > 結，以整組構件在使用時可能產生的靜電電荷，以避免雷射發光晶片損 壞。 使用雷射在民生日常用品時，驅動線路一定有一些安全設計，以避免高 能量光束對使用者的眼睛造成傷害，因此如果能限制雷射光束的輸出，可以 對使用者的眼睛作進-步的保護，因此使用電能轉換效率小於㈣毫瓦/毫 安培（mW/mA)的雷射，較能精確的控制雷射功率的輸出，以達到使用安全 的目標。另外由於邊射型雷射有兩個輸出端面，其中一個端面用於照明用的 輸出’另-個端面的光能輸出，可投射到-測光晶片8，用來監測雷射送出 的功率，提供一個回授資訊，以加強對雷射能量的輸出掌控，提昇使用安全。 9 M288726 p由於本創作『用於光學減之邊射型訪與感測器之積體封裝』的雷射 、 卷光曰曰片2及影像感測晶片4及折光透鏡122，透明鏡窗123等，可應用一 ^體構裝而為單-元件，故可簡化其封裝製程，在應科可以省略外加之 鏡頭’因此可以將整組結構的高度從8到12鮮的目前結構縮小到$ 厘米以下，特別在現今電子產品精巧化設計趨勢下，係能達成縮小封裝體積 效果，擴大這種結構的應用範圍，確實符合產業需求。 士綜合二上所述，本創作『用於光學滑鼠之邊射型雷射舆感測器之積體封 裝』’確能藉由上述構造，達到預期之功效，对請前未見於刊物亦未公開 使用，符合新型專利之新穎、進步及符合產業利用性等要件，爰依法申請專 利之。㈣上所述僅為本創作之實施例而已，凡依本創作之精神所作之簡易 修飾及等效變彳tmt，應涵蓋於以下之帽糊範圍内。 【圖式簡單說明】 第-圖穌__型雷射減㈣韻雜之触實糊封裝後之斷 面立體圖。 第二圖係本創作較佳實施例之封裝後斷面示意圖。 第三圖係本創作另一實施例之封裝後斷面示意圖。 第四圖係習用發光二極體光學滑鼠之光學引擎示意圖。 第五圖係習用雷射光學滑鼠之光學引擎示意圖。 M288726 【主要元件符號說明】η is in the same plane or in the light plane, and the ground planes of the light-emitting chip 2 and the image sensing wafer 4 are also connected or insulated on the electric (edge), and can be changed depending on the use requirements. Alternatively, one or more of the computing chips 5 may be selectively disposed on the susceptor u for receiving the information signals read by the image sensing chip 4 for further application. This is the integrated package of the side-projecting laser and sensor of this creation. In the implementation, the laser light source 2 emits a detection light source, which is projected onto the refracting mirror surface having the refracting light function 3, and the refracted light source is then expanded by the refractive lens I] to expand the laser light (4). Seal A 12 'This detection light source is projected on the object to be measured, and part of it will be reflected to the light-transmitting window 1Z3'. Through the light-transmitting window 123, the reflection containing the information of the object 6 is detected. The image of the heart is called the cymbal 4, and after the blocking grating 6 blocks the noise in the optical path, the image can be read by the image: the information can be miniaturized to save space, so the image sensing chip should be: , H piece 2 "The shortest distance that can be set at the time of the application, in order to facilitate the manufacture and analysis of the obtained ~ most of her should be between 2 to 2G fresh to miniaturize the size of the female. The sub-body 3 having a refractive function for projecting the beam emitted from the laser light-emitting chip 2 onto the object to be measured 6 should be capable of deflecting the f-beam by 2Q _ degrees _ to match the reduction component and the adjustment The need for the location of the object 6G. Alternatively - a separate sub-mount and a separate refraction result are used as in the third ride. Therefore, the laser beam is irradiated to the plane to be measured. Since the laser beam is a single-wavelength and highly parallel beam, at 8 M288726, it only meets the angle of incidence with respect to the visible-light-emitting laser source 2 and the image sensing wafer 4. In the flat area of the reflection visor, the light reflection is fixed at a specific position of the shadow-detecting wafer 4 and sensed as shown in the second figure, so that the image sensed on the image sensing wafer 4 should be green The corresponding distribution of the light energy reflected by the planes of the beam and the beam, which are reflected by the planes that meet the aforementioned reflection conditions, are image patterns with partial bright areas and partial dark areas, and the patterns contain the surface of the illuminated area. The hiding is completely related to the area that is reflected by the f-beam. Therefore, although the pattern is horizontally displaced, the output field of the relative displacement can be calculated by the arithmetic wafer $, because of the image sense. 4 is the riding range _ compliant with the reflection conditions ► the assembly of the flat area and according to the application, in some uses do not need to form an image, you can omit the conventional imaging optical lens, of course, can also use the imaging lens To read the image. In application, the shortest optical path formed by the image sensing chip 4 and the laser emitting chip 2 disposed adjacent to each other can obtain a strong reflected signal. In actual use, the distance of the image to be measured is adjusted for the image sensing wafer. And the relative position of the point to be measured, the deflection lens 122 can be used to deflect the laser light to the point to be measured, so the height of the entire structure can also be reduced. Since the laser light-emitting chip 2 is less resistant to static electricity, a Zener diode 7 can be added in the vicinity of the laser light-emitting chip and is inversely connected to the polarity of the laser light-emitting chip 2. Junction, the electrostatic charge that may be generated by the entire set of components during use to avoid damage to the laser emitting wafer. When using lasers in daily life of the people's livelihood, the drive line must have some safety design to avoid high-energy beam damage to the user's eyes, so if you can limit the output of the laser beam, you can make progress to the user's eyes. The protection, therefore, uses a laser with an electrical energy conversion efficiency of less than (four) milliwatts per milliamperes (mW/mA) to more accurately control the output of the laser power to achieve safe use. In addition, since the edge-emitting type laser has two output end faces, one of the end faces is used for the output of the illumination, and the light output of the other end face can be projected onto the photometric chip 8 for monitoring the power of the laser to be delivered. A feedback information to strengthen the control of the output of laser energy and improve the safety of use. 9 M288726 p Because of the creation of the laser, the aperture film 2 and the image sensing wafer 4 and the refractive lens 122, the transparent mirror window 123, is used for the "integrated package for optical subtraction side-beam type access and sensor". Etc., it can be applied as a single-element, so the encapsulation process can be simplified, and the additional lens can be omitted in the application section. Therefore, the current structure of the entire structure can be reduced from 8 to 12 fresh to $ Below the centimeter, especially in the current trend of compact design of electronic products, it is possible to achieve the effect of reducing the volume of the package and expanding the application range of this structure, which is indeed in line with industrial needs. As described in the comprehensive introduction of the second, the creation of the "integrated package for the edge-type laser 舆 sensor for optical mouse" can indeed achieve the expected effect by the above structure, and it has not been seen in the publication before. Undisclosed use, in line with the novelty, progress and conformity of industrial patents of new patents, and apply for patents according to law. (4) The above description is only for the embodiment of this creation. Any simple modification and equivalent variation tmt made in accordance with the spirit of this creation shall be covered in the following range. [Simple description of the figure] The first-graph of the ____ type of laser minus (four) rhyme of the touch of the paste after the package perspective. The second drawing is a schematic cross-sectional view of the package of the preferred embodiment of the present invention. The third figure is a schematic cross-sectional view of another embodiment of the present invention. The fourth figure is a schematic diagram of an optical engine of a conventional light-emitting diode optical mouse. The fifth picture is a schematic diagram of an optical engine of a conventional laser optical mouse. M288726 [Main component symbol description]
1 封裝體 11 基座 111 對外導接部 12 封蓋 121 腔室 122 折光透鏡 123 透光鏡窗 124 開孔； 2 雷射發光晶片 3 副置體 4 影像感測晶片 5 運算晶片 60 被測物體 6 阻隔光柵 7 極納二極體 8 測光晶片1 package 11 pedestal 111 external guiding portion 12 cover 121 chamber 122 refractive lens 123 light transmissive window 124 opening; 2 laser illuminating wafer 3 sub-mount 4 image sensing wafer 5 arithmetic wafer 60 measured object 6 barrier grating 7 polar nano diode 8 photometric wafer