M286148 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種可冷熱調節之墊體，尤指一種利用 一製冷/製熱裝置，使墊體的溫度可迅速雙向調節在適合 人體的範圍内，而可適用於各種墊體如汽車座墊（包括坐 墊及靠墊）、床墊者。 【先前技術】 目前使用之墊體，雖已有同時兼具冷/熱調節功能之 設計，如中華民國新型專利公告編號418787、大陸之實用 新型ZL98248912.9、ZL00224803.4、ZL00243381.8及發明專利申 請號03104073.X (公開號CN1522628A )等，惟，上述習知M286148 VIII. New description: 【New technical field】 This creation is about a kind of cushion body that can be adjusted by cold and heat, especially a cooling/heating device, so that the temperature of the cushion body can be adjusted in two directions in a suitable range for the human body. It can be applied to all kinds of cushions such as car seat cushions (including seat cushions and cushions) and mattresses. [Prior Art] Although the cushion body currently used has both cold/heat regulation function design, such as the Republic of China new patent announcement No. 418787, the mainland utility model ZL98248912.9, ZL00224803.4, ZL00243381.8 and invention Patent Application No. 03104073.X (Publication No. CN1522628A), etc., but the above-mentioned conventional
墊體或其技術大都具有體積大、噪音大、結構複雜、拆裝 維修麻煩或不易清洗等缺點，尤其針對溫度傳導功能或冷 熱散發功能之結構設計，其組裝型態及達成功效均不甚 巧，如製冷時容易産生水珠而外洩，或製冷/熱速度較 f艾，無法使墊體迅速達到所預期之溫度，致較難達成商品 =之使用價值，尤其以汽車座墊（包括坐墊及靠墊）而°" 言，其要求之條件較高，如體積小和噪音小幾乎是美本 求，致習知具有冷/熱調節功能之墊體無法適用於& 墊領域，此乃美中不足之處。 【新型内容】 本創作主要目的乃在於提供一種可冷熱調節之墊體， 包含-製冷/製熱裝置、連接管及—内部佈設有迴流管路 之墊體’其中’該製冷/製熱裝置係利用溫差半導體晶 以產生製冷/製熱效果’並藉風扇及冷熱散發器組成一風 ::統二使溫差半導體晶片所產生的冷量/熱量可 傳導至流經溫度傳導器之液體，又再藉由液體箱 M286148 泵、連接管及墊體内部所佈設之迴流管路以串聯成一循環 迴路，使液體在該循環迴路中循環運行，使墊體的溫度可 迅速做冷/製雙向之調節，以適合人體的舒適範圍内，藉 以提昇墊體之使用效果及適用範圍者。 ϋ」作再二目的乃在於提供一種可冷熱調節之墊體， ^中1冷/i熱裝置係利用溫差半導體晶片、溫度傳導 風扇:冷熱散發器、液體箱及液壓栗配置組成，並形 ίΐϊί 2連接管而與墊體内部所佈設之迴流管 Ϊ 藉以簡化結構、縮小體積及降低噪 ;於汽者。曰進墊體溫感之舒適性，使本創作能適 下列η更r月確詳實’兹舉一較佳實施例並配合 Tit式『 構及其技術特徵詳述如後： 參考第1圖所示，本創作「可冷熱調節之塾體」包含 一製冷/製熱裝置1、連接管2及墊體3 ;。再參考第 固所示該製冷/製熱裝置1主要係利用可製 冷又能製熱的溫差半導體晶片1Q、溫度傳導器u、風扇 12、冷熱散發|§13、液體箱14、；夜壓果15及電路板以配置 組成，並藉一外殼17包覆住，而外殼17可由上、下二殼體 171、172組成’而該液體箱14、液壓㈣、及溫度傳導 tin係利料接管2而與墊體3内部所佈設之迴流管路31 相互串聯連接成-循環迴路，其中，墊體3内部之迴流管 路31的佈Μ式並不限制；而該溫度傳導器u係一具適當 長度之金>1管體’其内部設有數個液體流道⑴，而各液 體抓道111之間可相互串聯或並聯，使液體可由溫度傳導 M286148 旦之θ端進入，經過該等液體流道πι以傳導足夠之冷 7/熱量’再由同一端或另一端排出；又在該溫度傳導器 =長度向之上、下面分別組裝由半導體材料製成的溫差 .V體晶片10，而在溫差半導體晶片1〇之長度度的外圍緊 始、包覆一冷熱散發器13，該冷熱散發器13上設有平行排列 ，數片散熱片131 ’·又風扇12係設置在冷熱散發器13順著 政…片131方向的—邊’該風扇12可對冷熱散發器13提供 風量γ使所產生風量可吹過各散熱片131之間的間隙，以 達成較佳風冷效果’又藉由電路板16可控制溫差半導體晶 片10液壓泵15及風扇14的啟動；而在該溫度傳導器11上 可《又置/皿度感測器（圖中未示），並與所述的電路板Μ連 接’藉以控制製冷/製熱裝置j的工作，以使墊體3的溫 度可控制在欲期設定的範圍内。 而該冷熱散發器13係可利用一塊或數塊銅材或銘材製 成’而其長度向的外圍上，包括單面或雙面，可設置數片 散熱片131 ，而冷熱散發器13包括其上數片散熱片131可 一體成型。 而該連接管2可採用一體成型的雙層管，或採用帶有 保溫材料的連接管連接形成。 而該溫度傳導器11内設有數條液體流道111 ，而各液 體流道111之間可相互串聯或並聯，又在溫度傳導器^的 一端或兩端上可分別設一進水口 112及一出水口 ns，使 液體可液體箱14藉液壓泵15送出，由進水口 112進入溫度 傳導器11中之液體流道111内，經過該等液體流道丨丨1以 5 M286148 傳導足夠之冷量/熱量，再由屮氽 里丹由出水口 113離開溫度傳導器 11 ° 而4墊體3之製作材料不拘’可視需要而選擇適當材 料，如-般汽車座墊係採用料，又墊體3内部所佈設迴 流管路31的方式不限制，如該迴流管路31可利用—停或多 條軟體導管均句盤繞佈設而形成如第1圖所示，又製作塾 體3如汽車椅墊（包括坐塾及靠墊），該迴流管路31可藉 1包、熱溶、貼合、枯接、縫製等不同方式而與塾體3先 =-體’再外接連接管2使用，以提昇組裝或更換之方 —而，電路板16可在外殼17上設置一控制面板或另設置 I控制器（圖中未示）供使用者方便操控，而操控方式包 =有線或無線遙控溫度回饋顯示藍牙裝置、紅外線遙控 ^手控開關，藉以達成開機、關機、製冷、製熱、溫度 調節^溫度顯示、定時開關機等多功能；或另採用旋紐開 •關、檔位開關等來調節製冷/製熱及功率大小。 g =該製冷/製熱裝置1可依不同墊體3之使用需要， I，單製熱或單製冷功能，如亞熱帶使用之汽車座墊可採 用平製冷功能’藉以降低製作成本；又該墊體3可直接成 !疋整性墊體，如坐墊、床墊、睡墊、座椅、腰墊或頸 塾等’亦可製成獨立的結構體供使用者加裝在原墊體上使 用。 士而該製冷/製熱裝置1可與一墊體3配合使用，亦可 同盼與多個墊體3配合使用，而液體箱14、液壓泵15、溫 M286148 度傳導器11、連接管2及墊體3内部迴流管路31所共同形 成之循環迴路中可容納適足量液體供循環使用。 又’本創作之結構上可配設一溫度感測器（圖中未 不），用以檢測液體溫度，而該溫度感測器或溫度開關可 以設在冷熱散發器13、溫度傳導器11、液體箱14、連接管 2或墊體3之迴流管路31上。Most of the cushion body or its technology has the disadvantages of large volume, high noise, complicated structure, troublesome disassembly and maintenance, or difficulty in cleaning. Especially for the structural design of temperature conduction function or cold and heat dissipation function, the assembly type and the achievement effect are not good. If it is easy to produce water droplets when it is cooled, or the cooling/heating speed is lower than that of f, it can't make the pad body reach the expected temperature quickly, which makes it difficult to achieve the use value of the product, especially the car seat cushion (including the seat cushion). And cushions) and °, "words, the requirements of the higher conditions, such as small size and low noise is almost the United States, to the knowledge of the cold / thermal adjustment of the cushion body can not be applied to the & pad field, this is The shortcomings of the United States. [New content] The main purpose of this creation is to provide a cushion body that can be cooled and cooled, including a cooling/heating device, a connecting pipe, and a cushion body with a return pipe inside. 'The cooling/heating device system Using a temperature difference semiconductor crystal to generate a cooling/heating effect' and forming a wind by a fan and a cold and heat radiator: the cooling/heat generated by the temperature difference semiconductor wafer can be conducted to the liquid flowing through the temperature conductor, and again The liquid tank M286148 pump, the connecting pipe and the return line arranged inside the cushion body are connected in series to form a circulation loop, so that the liquid circulates in the circulation loop, so that the temperature of the cushion body can be quickly adjusted by cold/bidirectional bidirectional. In order to improve the use and application range of the cushion body, it is suitable for the comfort of the human body. The second purpose is to provide a cold and heat adjustable cushion body. The medium 1 cold/i heat device is composed of a temperature difference semiconductor wafer, a temperature conduction fan: a heat and cold radiator, a liquid tank 2 connecting the tube and the return tube 布 arranged inside the pad body to simplify the structure, reduce the volume and reduce the noise; The comfort of the warmth of the cushion body makes the creation of the following η more accurate. The preferred embodiment is combined with the Tit-style structure and its technical features as follows: Refer to Figure 1 The creation of the "hot and cold adjustable carcass" comprises a cooling/heating device 1, a connecting pipe 2 and a mat body 3; Referring again to the first solidification, the refrigeration/heating device 1 mainly utilizes a temperature-stable semiconductor wafer 1Q that can be cooled and heated, a temperature transmitter u, a fan 12, a heat and cold emission|§13, a liquid tank 14, and a night pressure fruit. 15 and the circuit board is configured in a configuration and covered by a casing 17, and the casing 17 can be composed of upper and lower casings 171, 172' and the liquid tank 14, hydraulic (four), and temperature-conducting tin-based material take-over 2 The return line 31 disposed inside the pad body 3 is connected in series to a loop circuit, wherein the cloth type of the return line 31 inside the pad body 3 is not limited; and the temperature transmitter u is suitable The length of the gold > 1 pipe body is internally provided with a plurality of liquid flow paths (1), and the liquid catches 111 can be connected in series or in parallel with each other so that the liquid can enter through the temperature conduction M286148 θ end, through the liquid flow The channel πι is conducted to conduct sufficient cold 7 / heat 'to be discharged from the same end or the other end; and the temperature difference is upwardly and downwardly assembled to the temperature difference of the semiconductor material 10, and the body wafer 10 is assembled. Temperature difference semiconductor wafer 1 长度 length of the periphery tight Covering a cold and heat dissipator 13, the heat and cold dissipator 13 is arranged in parallel, and a plurality of fins 131' and a fan 12 are disposed on the side of the cold and heat dissipator 13 in the direction of the sheet 131. 12, the air-heating device 13 can be supplied with a wind volume γ so that the generated air volume can be blown through the gap between the heat sinks 131 to achieve a better air-cooling effect, and the temperature difference semiconductor wafer 10 hydraulic pump 15 can be controlled by the circuit board 16 and The fan 14 is activated; and the temperature transmitter 11 can be connected to the circuit board ' to control the operation of the cooling/heating device j. So that the temperature of the mat 3 can be controlled within the range to be set. The cold and heat dissipator 13 can be made of one or several pieces of copper or inscriptions on the periphery of the length direction, including one side or two sides, and a plurality of fins 131 can be disposed, and the heat and cold radiator 13 includes The plurality of fins 131 thereon may be integrally formed. The connecting pipe 2 may be formed by integrally forming a double pipe or by connecting a connecting pipe with a heat insulating material. The temperature transmitter 11 is provided with a plurality of liquid flow channels 111, and the liquid flow paths 111 can be connected to each other in series or in parallel, and a water inlet 112 and a water supply port can be respectively disposed at one end or both ends of the temperature transmitter. The water outlet ns causes the liquid liquid tank 14 to be sent out by the hydraulic pump 15, and enters the liquid flow path 111 in the temperature conductor 11 from the water inlet port 112, and conducts sufficient cooling capacity through the liquid flow path 丨丨1 at 5 M286148. /heat, and then by Liridan from the water outlet 113 to leave the temperature conductor 11 ° and the material of the 4 mat body 3 is not limited to the need to select the appropriate material, such as - car seat cushion system, and the body 3 The manner in which the return line 31 is disposed inside is not limited. For example, the return line 31 can be formed by winding or a plurality of soft body conduits, as shown in FIG. 1 , and a carcass 3 such as a car seat cushion is prepared. Including the seat belt and the cushion), the return line 31 can be used with the body 3 first body body and then the external connection tube 2 by means of a package, hot melt, lamination, dry joint, sewing, etc., to improve assembly. Or the replacement side - and the circuit board 16 can be provided on the outer casing 17 The panel or another I controller (not shown) is convenient for the user to control, and the control mode package = wired or wireless remote temperature feedback display Bluetooth device, infrared remote control ^ manual control switch, to achieve boot, shutdown, cooling, Heating, temperature adjustment, temperature display, time switch, etc.; or use the knob on/off, gear switch, etc. to adjust the cooling / heating and power. g = the cooling / heating device 1 can be used according to the different use of the pad body 3, I, single heating or single cooling function, such as the car seat cushion used in the subtropical zone can use the flat cooling function 'to reduce the production cost; and the pad The body 3 can be directly formed into a sturdy body, such as a seat cushion, a mattress, a sleeping pad, a seat, a waist pad or a neck sill, etc., and can also be made into a separate structure for the user to install on the original pad body. The refrigeration/heating device 1 can be used in conjunction with a cushion body 3, and can also be used in conjunction with a plurality of cushion bodies 3, while the liquid tank 14, the hydraulic pump 15, the temperature M286148 degree conductor 11, and the connecting tube 2 And the circulation loop formed by the internal return line 31 of the cushion body 3 can accommodate an appropriate amount of liquid for recycling. In addition, a temperature sensor (not shown) can be disposed on the structure of the present invention for detecting the temperature of the liquid, and the temperature sensor or the temperature switch can be disposed in the heat and cold radiator 13, the temperature conductor 11, The liquid tank 14, the connecting pipe 2 or the return line 31 of the mat 3 is placed.
使用時，利用液壓泵15將液體（即液體導熱介質，如 水）由液體箱14送出，經送出導管141及進水口 H2而進 入溫度傳導器11中，而在溫度傳導器11之液體流道111内 机動日守’藉溫差半導體晶片丨〇製熱或製冷產生的熱量或冷 里傳導給溫度傳導器η及流經溫度傳導器η之液體，使液 體吸收溫度傳導器11内的熱/冷量再由出水口 113離開， 再進入進墊體管線21中並進入墊體3之迴流管路31中，再 由出墊體管線22離開而回流至回入導管142液體箱14中， 形成一循環迴路，從而達成改變墊體3溫度的目的。 卫又製冷/製熱裝置丨在製冷時，必須通過風扇12和冷 ^a以將皿差半導體晶片ίο產生的熱量排出，才能 達到所需的冷量，製熱時，❹須將溫差半導體晶片10產 生的冷源排出。 向该連接管2可採用 、w …… 耻从王π执瓶叉層官虱带有保 :材料的管道連接，藉以提高保溫性能，並在製冷時不會 总f結露（水珠），以達到最佳製冷/製熱效果；又連接 二 包括進墊體管線21及出塾體管線22 ,可分別藉由接 而與製冷/製熱裝置1連接，藉以提昇組裝或更換之 M286148 方便性。 、，酋藉上述結構，可利用況直流電壓正負極的交換使溫差 半導體晶片ίο產生冷量或熱量，並藉溫度傳導器u、風屬 12、冷熱散發器13所形成的風冷系統作用，使製冷/製熱 速度快、，熱和散熱/冷迅速，藉以達成迅速使墊體3溫 度雙向調節在適合人體範圍内之功效；而且該製冷/製熱 裝置1，組合結構簡單，體積小，拆裝方便，使本創作能 適用於汽車座墊，藉以增進汽車座墊之溫感效應，進而增 進乘坐者之舒適性。 ，惟，上述所揭之圖式及說明，僅為本創作之實施例而 已，非為限定本創作之實施例；大凡熟悉該項技藝之人 士 ’其所依本創作之特徵範疇，所作之其它等效變化或修 飾，皆應涵蓋在以下本案之申請專利範圍内。 【圖式簡單說明】 第1圖：係本創作一實施例之結構立體圖。 ，2圖·係第上圖中製冷/製熱裝置之放大圖。 第3圖··係第丨圖中製冷製熱裝置之分解圖。 _ ^4圖·係第3圖中製冷/製熱裝置之細部分解圖。 第5圖·係本創作製冷製熱裝置之局部剖視示意圖。 【主要元件符號說明】 製冷製熱裝置1 i差半導體晶片10 溫度傳導器n 進水口 112 風扇12 散熱片131 送出導管141 流道111 出水口 113 冷熱散發器13 液體箱14 回入導管142 8 M286148 液壓泵15 外殼17 接嘴18 進墊體管線21 墊體3 電路板16 殼體 171、172 連接管2 出墊體管線22 迴流管路31In use, the liquid (i.e., liquid heat transfer medium such as water) is sent out from the liquid tank 14 by the hydraulic pump 15, and enters the temperature conductor 11 through the delivery conduit 141 and the water inlet H2, and the liquid flow path 111 in the temperature conductor 11 The internal motorized day's heat is transferred to the temperature conductor η and the liquid flowing through the temperature conductor η by the heat or cooling generated by the temperature difference semiconductor wafer, so that the liquid absorbs the heat/cooling amount in the temperature conductor 11. Then, it exits from the water outlet 113, enters the inlet body line 21 and enters the return line 31 of the pad body 3, and then exits from the pad body line 22 and flows back into the liquid inlet tube 142 of the return pipe 142 to form a cycle. The circuit is thereby achieved for the purpose of changing the temperature of the pad body 3. When cooling and heating, the cooling/heating device must be cooled by the fan 12 and the cold to discharge the heat generated by the semiconductor wafer to achieve the required amount of cooling. When heating, it is not necessary to heat the semiconductor wafer. 10 The generated cold source is discharged. It can be used for the connecting pipe 2, w... shame from the king π bottle fork layer bureaucratic with: material pipe connection, in order to improve the insulation performance, and does not always f condensation (water drops) when cooling, to The optimal cooling/heating effect is achieved; and the connection 2 includes the inlet body line 21 and the outlet body line 22, which can be respectively connected to the cooling/heating device 1 to improve the convenience of assembling or replacing the M286148. By the above structure, the exchange of positive and negative voltages of the DC voltage can be used to generate a cooling amount or heat of the temperature difference semiconductor wafer, and the air cooling system formed by the temperature conductor u, the wind 12, and the cold heat radiator 13 functions. The cooling/heating speed is fast, the heat and the heat dissipation/cooling are rapid, so as to achieve the effect of quickly adjusting the temperature of the pad body 3 in a suitable range for the human body; and the refrigeration/heating device 1 has a simple combined structure and small volume. Easy to assemble and disassemble, this creation can be applied to the car seat cushion, so as to enhance the warmth effect of the car seat cushion, thereby enhancing the comfort of the occupant. However, the drawings and descriptions disclosed above are only examples of the present invention, and are not intended to limit the embodiments of the present invention; those who are familiar with the art's characteristics of the creations are other Equivalent changes or modifications should be covered in the scope of the patent application in this case below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of an embodiment of the present invention. 2 is an enlarged view of the cooling/heating device in the above figure. Fig. 3 is an exploded view of the cooling and heating device in the figure. _ ^4 Fig. 3 is a detailed diagram of the cooling/heating device in Fig. 3. Fig. 5 is a partial cross-sectional view showing the cooling and heating device of the present invention. [Main component symbol description] Cooling and heating device 1 i difference semiconductor wafer 10 temperature conductor n water inlet 112 fan 12 heat sink 131 delivery pipe 141 flow path 111 water outlet 113 cold heat radiator 13 liquid tank 14 return pipe 142 8 M286148 Hydraulic pump 15 Housing 17 Connector 18 Inlet body line 21 Pad body 3 Circuit board 16 Housing 171, 172 Connecting tube 2 Outer body line 22 Return line 31
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