M285788 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種電容隔熱裝置及應用該裝置之電容裝置。 【先前技術】 電容是電子設備中大量使用的電子元件之一，廣泛應用于隔 離直流電，合、舰等方面。然、，f容的壽命受溫度的影響报 大’尤其7C電解電容’當電解電容之溫度每提高職，其使用壽 口P成乎就减少-半。另外，隨溫度的升高，電解電容的絕緣電阻 Ik之降低’從畴致電容的漏電流增大，電解電容會在短時間内 迅速發熱，導致電解電容内部的電解液因高溫變成氣體致使電容 内部的壓力增大，容易產生鼓泡，甚至爆裝問題。 且如今之電子設備運行速度及功率消耗持續提高，其產生 之熱里也骑提高且不纽畴除，使其顺之電子零部件，如 電容等零件之工作溫度也隨之提高。 惟^現有之電容通常以裸露之方式焊接在電路板上，其周圍 之電子=器件產生之大量熱量使得電容之工作溫度迅速提高。 故而要提供-種電容隔熱裝置，其可將電容與其周圍之熱量 隔開，以提高電容的使用壽命及質量。 【新型内容】 本創作之-主要目的係在於提供一種電容隔熱裝置，利用該 電容隔熱裝置來_電容裝置觸之熱量，從祕高電容裝置之 使用壽命及質量。 6 M285788 本創作之另-主要目⑽在於提供—觀賴電容隔熱裝置 之電容褒置，藉由該電容隔絲£來_電容裝置顯之熱量， 從而提高其使用壽命及質量。 為實現本創作之上述目的，本發明提供一電容隔熱裝置及應 用該裝置之電容裝置’其包括—電容本體；及—套合電容本體之 電容隔熱裝置’該電容隔齡置具有—底座，沿該底座之壁向延 伸出-隔熱板’在該底座之_連接有—水平支架，該底座、該 隔熱板及該水平支架所圍的内部空間形成一可套合一電容本體之 空腔。 【實施方式】 請參閱第一圖及第二圖，因電容本體1〇附近存在較多熱源， 故需提供一電容隔熱裝置20以隔開電容本體1〇附近之熱源。電容 隔熱裝置20可由塑料等隔熱材料一體成型而成，其包括一底座 3〇，該底座30係一中空圓柱體。在該底座3〇之底部開有複數通風 槽22 ’在該底座3〇之一侧沿其壁向延伸出一隔熱板27，因電容本 體10通常僅在其一侧存在較多熱源，故在本實施方式中，隔熱板 27僅向一側延伸，然隔熱板27之形狀並不受限於此，其可依據具 體應用環境之不同做適當改變，如電容本體1〇四周皆存在較多熱 源時，隔熱板27可沿整個底座30壁向延伸。 在該底座30之内壁離其底部一定距離處連接有一水平支架 24 ’該水平支架24與底座30及隔熱板27所圍之内部空間形成一可 套合一電容本體1〇之空腔28。離水平支架24上表面一定距離處， M285788 在$亥隔熱板27之内壁上设有複數隔板21，而在底座3〇之内壁設有 複數彈性卡扣23，該彈性卡扣23處於隔板21之相對一側。在該彈 性卡扣23之外侧，底座30之内壁上開有與彈性卡扣23相應數目之 卡扣槽26。 在a亥水平支架24上開有複數通孔25，該通孔25之孔徑略大於 電容引腳14之孔徑，使電容引腳14可穿過該通孔25。該隔板21在 水平方向上固定該電容本體10，並將電容本體1〇與隔熱板27隔 開，以利於電容本體10之隔熱、通風及散熱。該彈性卡扣23之大 小形狀與電容本體10之環形凹槽12相配合，用於在豎直方向上固 疋戎電容本體1〇。此外，該彈性卡扣23具有導向面29，用於導引 電容本體10之組裝(詳細内容請參見後面描述）。該卡扣槽26之寬 度略大於彈性卡扣23之寬度，當電容本體10插入底座3〇時，以利 於彈性卡扣23向外侧延展。 請一併參閱第三圖，組裝時，先將電容本體1〇放入電容隔熱 裝置20之空腔28，使電容引腳14穿過水平支架24之通孔25，電容 本體10沿著隔板21之内壁自由滑入空腔28内。當電容本體1〇之底 面16滑至彈性卡扣23導向面29時，壓按電容本體10使其沿著隔板 21與彈性卡扣23之内壁繼續下滑，直到電容本體1〇之底面16接觸 到水平支架24之上表面，此時彈性卡扣23完全進入電容本體1〇之 環形凹槽12，因此，隔板21與彈性卡扣23同時從水平和豎直方向 固定住電容本體1〇。 藉由該電容隔熱裝置2〇，可將電容本體1〇與其周圍之熱源隔 8 M285788 開 ，因水平趣卿隔熱板27之 電容與電路板之間的距離，以做/疋距離韻运可增加 ^ W離Μ利於電容本體⑴之散熱。 ‘上所述’本創作符合新型專利要件，菱依法提出專利申請。 准以上所述者僅為本創作之較佳實施例，舉凡熟悉本案技藝之 人士’在纽本創作精神所作之等效修飾或變化，皆應涵蓋於以 下之申請專利範圍内。 【圖式簡單說明】 第一圖係本新型之一實施方式中電容隔熱裝置與該電容裝置 之立體分解圖。 第二圖係本新型之一實施方式中電容隔熱裝置沿第一圖U 方向之剖視圖。 第三圖係本新型之一實施方式中電容隔熱裝置與該電容裝置 之立體組裝圖。 【主要元件符號說明】 電容本體 10 環形凹槽 12 電容引腳 14 底面 16 電容隔熱裝置 20 隔板 21 通風槽 22 彈性卡扣 23 水平支架 24 通孔 25 卡扣槽 26 隔熱板 27 空腔 28 導向面 29M285788 VIII. New description: [New technical field] This creation is about a capacitor insulation device and a capacitor device using the same. [Prior Art] Capacitance is one of the most widely used electronic components in electronic equipment, and is widely used in isolation of direct current, combined, and ship. However, the life of the f-capacity is affected by the temperature. In particular, the 7C electrolytic capacitor is reduced by half the temperature of the electrolytic capacitor. In addition, as the temperature increases, the insulation resistance Ik of the electrolytic capacitor decreases. 'The leakage current from the domain capacitance increases, and the electrolytic capacitor rapidly heats up in a short time, causing the electrolyte inside the electrolytic capacitor to become a gas due to the high temperature. The internal pressure is increased, and it is easy to cause bubbling or even explosion problems. Nowadays, the operating speed and power consumption of electronic equipment continue to increase, and the heat generated by it is also increased and not removed, so that the operating temperature of electronic components such as capacitors is also increased. However, the existing capacitors are usually soldered to the board in a bare manner, and the electrons around them = the large amount of heat generated by the device causes the operating temperature of the capacitor to increase rapidly. Therefore, a capacitive thermal insulation device is provided which separates the capacitance from the heat surrounding it to improve the service life and quality of the capacitor. [New Content] The main purpose of this creation is to provide a capacitive thermal insulation device that utilizes the capacitive thermal insulation device to sense the heat of the capacitive device and the service life and quality of the high capacitance device. 6 M285788 Another object of this creation, the main purpose (10), is to provide a capacitor device that relies on the capacitive thermal insulation device. The capacitance of the capacitor is used to increase the service life and quality of the capacitor device. In order to achieve the above object of the present invention, the present invention provides a capacitor thermal insulation device and a capacitor device using the same, which includes a capacitor body; and a capacitor thermal insulation device that fits the capacitor body. a horizontal bracket extending along the wall of the base - the heat shield is connected to the base, and the base, the heat shield and the inner space surrounded by the horizontal bracket form a capacitor body Cavity. [Embodiment] Please refer to the first figure and the second figure. Since there are many heat sources in the vicinity of the capacitor body 1〇, it is necessary to provide a capacitor heat insulating device 20 to separate the heat source near the capacitor body 1〇. The capacitor heat insulating device 20 may be integrally formed of a heat insulating material such as plastic, and includes a base 3, which is a hollow cylinder. A plurality of ventilation slots 22 are formed at the bottom of the base 3', and a heat shield 27 extends along one side of the base 3's side. Since the capacitor body 10 usually has more heat sources on one side thereof, In the present embodiment, the heat insulating plate 27 extends only to one side, and the shape of the heat insulating plate 27 is not limited thereto, and may be appropriately changed depending on the specific application environment, such as the capacitor body 1 is surrounded by When there are more heat sources, the heat shield 27 can extend along the entire wall of the base 30. A horizontal bracket 24 is attached to the inner wall of the base 30 at a distance from the bottom thereof. The horizontal bracket 24 forms a cavity 28 for enclosing a capacitor body 1 with the inner space surrounded by the base 30 and the heat shield 27. A certain distance from the upper surface of the horizontal bracket 24, the M285788 is provided with a plurality of partitions 21 on the inner wall of the heat shield 27, and a plurality of elastic buckles 23 are disposed on the inner wall of the base 3, and the elastic buckles 23 are separated. The opposite side of the plate 21. On the outer side of the elastic buckle 23, the inner wall of the base 30 is provided with a corresponding number of snap grooves 26 corresponding to the elastic buckles 23. A plurality of through holes 25 are formed in the horizontal bracket 24, and the aperture of the through hole 25 is slightly larger than the aperture of the capacitor pin 14, so that the capacitor pin 14 can pass through the through hole 25. The spacer 21 fixes the capacitor body 10 in a horizontal direction and isolates the capacitor body 1 from the heat shield 27 to facilitate heat insulation, ventilation and heat dissipation of the capacitor body 10. The small shape of the elastic buckle 23 cooperates with the annular groove 12 of the capacitor body 10 for fixing the capacitor body 1 竖 in the vertical direction. Further, the elastic buckle 23 has a guide surface 29 for guiding the assembly of the capacitor body 10 (for details, see description below). The width of the snap groove 26 is slightly larger than the width of the elastic buckle 23. When the capacitor body 10 is inserted into the base 3, the elastic buckle 23 is extended to the outside. Please refer to the third figure. When assembling, first place the capacitor body 1 into the cavity 28 of the capacitor thermal insulation device 20, so that the capacitor pin 14 passes through the through hole 25 of the horizontal bracket 24, and the capacitor body 10 is separated. The inner wall of the plate 21 is free to slide into the cavity 28. When the bottom surface 16 of the capacitor body 1 is slid to the guiding surface 29 of the elastic buckle 23, the capacitor body 10 is pressed to continue to slide along the inner wall of the diaphragm 21 and the elastic buckle 23 until the bottom surface 16 of the capacitor body 1 contacts Up to the upper surface of the horizontal bracket 24, the elastic buckle 23 completely enters the annular groove 12 of the capacitor body 1 . Therefore, the partition 21 and the elastic buckle 23 simultaneously fix the capacitor body 1 水平 from the horizontal and vertical directions. With the capacitor thermal insulation device 2, the capacitor body 1〇 can be separated from the surrounding heat source by 8 M285788, because the distance between the capacitance of the horizontal insulation board 27 and the circuit board is used to make the distance It can increase the heat dissipation of the capacitor body (1). The above-mentioned creation is in line with the new patent requirements, and Ling applied for a patent. The above-mentioned ones are only preferred embodiments of the present invention, and equivalent modifications or changes made by those who are familiar with the skill of the present invention in the spirit of Newbie's creation should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective view of a capacitor heat insulating device and a capacitor device in one embodiment of the present invention. The second figure is a cross-sectional view of the capacitor thermal insulation device in the U direction of the first figure in an embodiment of the present invention. The third figure is an assembled view of the capacitor thermal insulation device and the capacitor device in one embodiment of the present invention. [Main component symbol description] Capacitor body 10 Ring groove 12 Capacitor pin 14 Bottom surface 16 Capacitor insulation device 20 Separator 21 Ventilation slot 22 Elastic snap 23 Horizontal bracket 24 Through hole 25 Buckle groove 26 Heat shield 27 Cavity 28 guide surface 29