TWM273108U - Adaptor structure - Google Patents

Description

M273108

[Technical field to which the new type belongs] Especially used for two-phase can achieve the structure of a connector provided in the original creation system, the connector is electrically connected to the electrical module, and the edge seat is fixed on Or for detection purposes. [Previous technology] It is produced on the basis of the perfect technology of manufacture and production, all of which are electronic products with polar connectors. The circuit is connected by the front. Therefore, the production in science or technology must be borrowed from the realm. The product can be loaded on a high level, and the connector and the configurable detection chip are used to connect with the plug to achieve an era of continuous innovation and progress in the two mutual plug-in technology. Many new era products are used in electronic technology. Related to learning, there are also more and more innovations and superb techniques of electronic technology to achieve more. Therefore, there will be many items related to electricity in the surroundings of the living environment, and the advent of the technology era will not only be in the surrounding electronic products. 'And various electronic products are using chips to handle the execution and operation of various electronic signals in order to make ::: effective. For this reason, most of the chips in electronic products are crystal chips in electronic products. It is installed on the circuit board of electronic products, so that the crystal 3 circuit board is electrically connected, so that the design of various electronic parts and chips on the circuit board For; said operation, and also by the wafer produces electrical connector ^ property sheet is correct. The board-to-board connector of the two opposite circuit boards is connected with a socket connector and a plug connector on the board, and the plug and the socket connector are combined with each other to form the purpose of electrically connecting the circuit board. However, this type of connector requires a relatively large distance between the opposite circuit boards.

Page 5 M273108 3. Creation instructions (2), which cannot meet the requirements of modern times by installing solder balls in the sockets of the current crystal to generate electrical connections. No. 4666 is attached to the 89th case of the Republic of China No. 8922. Bayi said patent terminal A head A 1 the elastic pressing piece A partition A 2, and the socket C 2 at the bottom of the sliding cover C, when the elastic pressing piece A i 2 pin D can transmit signals with the terminal, However, the columns are missing, such as

Electronic products are connected with metal materials to achieve "zero embedding force May 27, 1974," Qing Dynasty also includes a crimping 1 2 upper end and a terminal A mounting surface with a convex rod slide The cover C is pushed to the head A of the body A. The conventional CP, thin, short, and small connectors, and most of the terminals, are used to transfer the power of the signal cable. The PU connector is new and announced on the Republic of China. When the body A 1 1 and the crimp body A 1 shown in the figure 9 enter C 1 of the connector B and can be slid C, the convex A 1 1 moves in the direction of 1 to contact, so that the design of the U connector is The use of terminal energy, for example, "new patent application for 90 years," its special elastic pressure 1 space slot BP u needle bar C 1 movement "to make electricity use, demand. In the case of the published patent of the connector and the chip, the application for September 20 is based on the following: the sheet A 1 2 is formed into a room 1, and the CPU pin connection can be pushed by pin D. The pins of Pu are relatively small and are arranged in a close arrangement. There is only a small space between the adjacent pins. To insert the cf U pins into the space between the terminals of the connector, you must use precision instruments for alignment. When plugged in, if there is a slight deviation and skew, CP ττ々II will bend or break, making c PU unusable. 2. The terminals of the connector are made of hard metal material. When assembling and plugging with the CPU pins, the terminals can easily rub the C P U pins, so that

M273108 IV. Creation instructions (3) CPU 3. Connectors are connected, but it is known that they are connected together and the industry and the connector are inserted into the guide pads at the bottom of the U, so that the electrical connection pins are formed and fixed to the electrical connection. The device industry is quite sleepy, leading to time-consuming and labor-intensive work to improve the lack of electrical film (steel balls or connections). If the board is worn, it is difficult to install it on the board. There is a little connector end. CP u 'Then improved the box.' Surface contact pads and even the use of CP affect its terminals. Many terminals must be inadvertently generated and short pin C c u will be generated by the solder connector. The terminals that must be arranged in a soldering joint with the circuit board make the adjacent terminals soldered and the welding is arranged in a tight fork, which is not easy to encapsulate the process. The c P method is used to form solder balls or contact the terminals. There are many Defects such as 1, the mechanical strength of the solder ball surface is very poor, both soft and high in plastic. When in contact with the terminal, the solder ball is easily deformed after being clamped by the terminal, and the CPU cannot be connected with it during the reinstallation process. The conductive terminals provided by the device form a good electrical connection, and this kind of problem is most likely to occur during the CP u test. Often, C p U is good when the test is completed, but in fact the CUP solder ball has been deformed. However, if the user has a bad situation when using I, it will cause the user to replace Cu P with the manufacturer again, and the c PU deformed with the solder ball must be re-packed for use before it can be used, which increases the cost. 2. When the CPU is connected with the connector, the solder ball of the CPU is easily caused by the lateral force caused by the slight deviation when inserted, so that the hard terminal can remove the solder ball from the CPU, which makes cp U unusable and makes good Rate

Page 7 M273108 Fourth, the creation instructions (4) reduction, rising costs. Therefore, how to solve the shortcomings and shortcomings caused by the use of the above-mentioned conventional CPU and connectors, is the goal and direction of the creators and industry professionals who want to improve. < [new content] Therefore, in view of the above-mentioned shortcomings, the creator collects relevant information, and your five parties evaluate and consider 'and have accumulated many years of experience in this industry: after continuous trial and modification, we began to design this kind of provision. The new patenter of the structure of the connector that is not subject to abrasion during the two-phase assembly = 'rolling, rolling, and aerodynamics' main purpose is that the connector is provided with ϊϊ on the insulating seat: 座 and the two opposite surfaces and The inside of the plurality of through-holes is provided with a pad with elastic forces, and each of the pads has a protruding portion at the plurality of through-holes, and then the surface force of the lining at the plurality of through-holes takes two ^ / jx You can use tin balls or circuit boards on the bottom of the metal sheet protruding from the top surface of the through holes to make electrical connections to avoid tin ^ ^^ or fall off, and can greatly reduce the connector's ancient mouth. Light mouth, thin, short, small design requirements. Electronic Product [Embodiment] In order to achieve the above-mentioned purpose and effect, the structure of this creative planting field, hereby drawing on the technical means of this creative work and the metal layer of 2 functions, the connector can be placed on the circuit board :: The metal layer on the surface of the protruding portion at the bottom of the plurality of through holes is electrically connected. The functions on the board are as follows, and the features are fully explained. See the first and the fifth. One rnltSle — as shown in the second and fourth pictures, it is the three-dimensional of this creation

Page 8 M273108 IV. Creative Instructions (5) Appearance drawing, enlarged view of Part A of the first figure, exploded perspective view of the embodiment, and side sectional view of the embodiment. The connector has an insulating base 1, and a receiving portion 1 1 ′ is provided on one side surface of the insulating base 1, and a plurality of through holes 12 are formed in the receiving portion 1 1. Two opposite surfaces and the through-hole 12 are provided with a spring-like force profile 1 3, and the pad 13 is processed with a protruding portion 1 3 1 at the top and bottom of the through-hole 12, and A groove 1 3 2 is formed on each of the protruding portions 1 3 1, and then a metal layer 2 is formed on the surface of the plurality of through-holes 12 at the gasket 1 3, so that the metal layer 2 is arranged on the through-hole i # 卜 和 Projection on the bottom 1 3 1 surface. The aforementioned connector can be combined with a two-phase electrical module. The connector can be a board-to-board connector, a chip connector, etc., and the connector is used as a c PU connector. solid? After the combination, the chip 4 and the circuit board 3 form an electrical transmission of type 2 = 2; or the aforementioned connector may be a burn-in socket; the shell =: = 'is used for the chip 4 to test the connector on the connector, and = The connector can also be assembled in various ways for the chip 4 to be assembled: the insulation base of the f connector of the sheet 4 is made of plastic, and the elastic pad can be made of elastic plastic. ： 欢 果 ’$ The convex part 131 at the bottom is provided with a groove 132 = the top has space for elastic deformation. There are 13 relatives, and each pad 13 can be processed by injection, on the edge seat 1, and each pad i 3 can also be formed and made of absolute. Elastic material

Page 9 Creation Note (6) On the body 1 on the through-hole road board 3 of the above-mentioned insulation body 1, and 1 'and the use of a number of solder balls 4 2 protrusions 1 3 4 and insulation #' is possible It is good for the gasket 1 3 Please refer to the cross-sectional view of part A in the figure. When the wafer 4 is placed 2 it is placed on the insulation ball 4 2 When it is inserted, it is with the groove 1 ^ The layer 2 is made of the material of the plate 3 When in contact with each of the pads 1, the bottom edge of the convex wafer 4 is a base. 1 2 The circuit at the bottom forms an electric radiator on the wafer 4 1 1 The gold heat source protruding into the groove 1 is quickly arranged on the surface of the wafer 1 For the surface of plating or money, see the second, third enlarged view, and the fourth part of the real figure. Part B of the insulator 1 on the edge of the insulating body 1 3 3 2 is transmitted on the surface of the wafer 4 and the electrical number, and cut A plurality of solder balls provided with 3 protruding portions 1 3 1 can be fixedly provided with protruding portions connected to the metal layer 2 except for pressing crystal 3 2. Holes 1 2 can be plated, etc. can be achieved. Fourth, the magnification of the embodiment 1 is on the lining 1 1 of the concave metal layer circuit board 3 and the lining of the groove 113 1 is 4 2 circuit board 3 1 3 1 table. Then, the crystal can be pressed into a sheet 4, and the through hole 1 2 is used, and then the conductive work is exploded according to the five-dimensional diagram shown in Figure 5. The through-hole groove 1 3 2 2 of the chip 4 3 To form electrical conduction, the pad 1 3 is 32, that is, the groove 1 is contracted inwardly on the pad 1, and the metal layer 2 and the electric sheet 4 of the insulating seat surface are placed on the heat sink 4 for the production of the insulating seat. The bottom of the wafer 4 is placed inside and tightly abuts against the heat sink 41. A metal layer can be provided at the wafer 3. It is a picture. In reality, it can be within 12 places at the bottom, then the connection can be made. It can be elastic and can be placed on the elastic 3 of the complex 3 2 table with a metal layer. 2 The side of the first embodiment of this creation It can be clearly seen that the plurality of solder balls 4 and the solder balls 4 2 of each tin can use the wafer 4 and the flexible solder balls 4 2 of the electric force to deform the metal layer 2 on the surface, and the supply portion 1 3 1

Page 10 M273108 Creative instructions (7) Make a flat connection 'no ball 4 2 or 4 solder balls 4 excellent transmission (shown), straight or conductive film) and the effect of the metal layer However, the above-mentioned because of each CU, it is not because of the insulating base 1 and the use of the metal plate 3 to protect it. As shown in the figure, it can be applied to the board, the upper and lower circuit boards 3 to electrically connect the insulating base. The body 1 touches the circuit board 3, so that the wafer is uneven and contacts the integrity of the extrusion or the support 2, a signal function. The chip 4 can also be connected to the pad 2 formed on the surface of the pad 1 3 4 3 to form an electrical connection to the solder ball 4 2. The P manufacturer restricts the use of the elastic layer 2 to conduct insulation and protection. . As shown in Figure 8, it is shown that the protrusions 1 to 3 of the board-to-board connector can be cleared and bonded, so that the two phases can be connected to the board-to-board height, and the bottom surface can be used for connection. The special pad base produced by the transmission conductive film] 4 flat, stable placed on the insulating base or lifted and shaken, can avoid being abraded or removed, it can maintain and make the wafer 4 plural The conductive film 43 of the solder ball 4 2 (such as the second metal layer 2 forms an electrical contact pad 44 (as shown in the seventh figure, the chip 4 and the circuit board 043 and the contact pad 44 are different, the CPU form is different and the range is increased. The top and bottom wafers 4 are coated with a metal layer on the surface 1 and the side view of the preferred embodiment of this creation. It can be seen that the insulation base of this creation is used, and the metal layer 2 on the surface of the insulation base 1 can be used. For the communication between the two-phase two-phase circuit board 3 and the metal layer-paired circuit board 3, the use of connectors can effectively reduce the lightness and thinness of modern electronic products. Each tin chip has six connections, as shown in the figure Guide 3 is for the purpose of saying 2, circuit section 1 is also hole 1 2 of the two-phase type, short

The structure of M273108 on page 11 can have the following advantages in the following 3, creative description (8), and small design (1) the backing ball connected by (-) the top twist of the chip 3) connection Using gold as a concise, it is possible to limit the creation of original creative content to the creation of a comprehensive post-creation, which is indeed able to achieve-creation, as the Fu Jury Committee earlier said that the Fishing Bureau Jury has cooperation, a sense of reality and a connector for creative creation, such as ： The inside of the through hole is plastically deformed when the crystal is worn out or held by a solder ball, and the layer of the through hole of the protector is easy to reach and fast. The above is just a simple example of a patent. Within the scope of the modification, it is stated that the effectiveness of this creation and the purpose of conforming to the new patent grant this case, any suspicion and convenience. The top and bottom of the piece are removed with the solder ball. The shape at the through-holes does not hold a very good guide to line the surface of the circuit board and the crystal to save time and cost. Therefore, Fan Fan and equivalent structures are combined to Chen Ming. The above-mentioned connection, so the original application requirements to protect the creation please do not hesitate when the bottom of the letter is provided with an elastic pad contact, will not make the tin pad, the pad can be held by the ball by the tin ball to make the tin The ball does not call function. The metal layer is processed and formed, and the electrical connection of the chips is effective for assembling the power. It is just the best embodiment, but not the use of this creative description and the drawings should be similarly included in the structure of the device when it is used, to apply for the sake of sincerity for a practical and excellent 'conversion according to law, and hope that the hard work of people, if Instructions, the creator must do his best

Brother 12 Page M273108 Schematic description [Schematic description] Schematic diagram Schematic diagram Schematic diagram Schematic diagram 1 2 3 4 5 6 7 8 9 # 第 第 第 第 ^^ 第 #. The first work of the body of the figure A outside of the drawing part JUJ rnj was originally written as the example B of the side part of the body part of the body of the drawing. The first work is 1HW ΊΊ JU. The book is an example of a side view of the system diagram. The cross-sectional view of the side view is a good example. The example of the side view of the separated body is better to connect 1 U and P as C. This study is for the system 1J. Ming said -lgb # The element element is the hole between the main body seat and the hole. ± Partially grooved convex-concave layer belongs to gold plated electric plate crystal 4

Page 13 M273108

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Claims (1)

M273108 V. Application for Patent Scope 1. One connection 4 5 6 7 8 The application of this force profile is such as a pad, such as a pad, such as a pad, such as a pad, such as a pad, and a pad with an insulating seat. Can apply for a special application can be applied for a special application department can apply for a special through hole layer. Apply for a dedicated through hole layer. The structure of the application for the special seat system on the application application molding application unit has a plurality of continuous bodies in two phases, and each lining portion is in the range of the metal profit range of the elastic force, the profit range of the elastic force, and the profit range of the elastic force. Formed on the pad table of the first range, the through holes of the connector pass through to the surface and the multiple through holes of the multiple pads. Item 1 even with elastic plastic. Item 1 is made of rubber. The connection surface of item 1 of the above-mentioned insulation base is an insulation base which can be used, and the improvement is as follows: the surface of the pad is processed with a top and a bottom with elastic holes inside the through holes. The structure of the connector is molded, wherein the structure of the connector, wherein the structure of the connector, wherein the structure of the connector, and wherein the sputter plating process is formed with the connector described in the item 1 of the gold scope. In the structure, the surface of the compound pad is a structure in which the connector described in the item 1 of the Jinli range can be formed by an evaporation process, and the protrusion of the liner is provided with a groove. The structure of the connector according to item 1 of the utility model, wherein the micro-unit is provided with a heat sink capable of generating a pressing effect. The structure of the connector according to the first item of the invention, wherein the connector is a connector that can be fixed by a chip. Page 15