TWM272227U - Packaging structure for thermal-electrical IR sensor device - Google Patents

Description

M272227 V. Creation instructions (1) 1. [Technical field to which the creation belongs] This creation relates to the packaging structure of a thermopile infrared sensing element, and in particular to a technology that uses silicon microelectromechanical processing technology to make components and caps' This type of packaging structure can be made into a thermopile infrared sensing surface-adhesive component to match the potential for automated production of surface-attachment technology (SMT). 0. [Previous technology] As far as the existing technology is concerned, the use of heat sensing is quite extensive. When the different kinds of metals (conductors) form different loops, the electric Beck effect will occur in the loop (the small Seebeck effect can be known that the temperature of the thermocouple at the two ends of the thermocouple passing through the special element junction causes the temperature difference between the cold and hot junction points. Early thermocouples often used metal (Constantan), but later discovered that semi-strongly developed semiconductor thermocouples, thermocouple voltage provided by a single thermocouple, thermocouples' constitute the so-called thermoelectric thermoelectric voltage signal. The thermoelectric voltage coefficient, the temperature difference between the hot and cold junctions, etc. In recent years, silicon micro-electro-mechanical thermocouples have been used as temperature technology. The principle of a thermocouple is to use the thermoelectric characteristic of the temperature and pressure of the junction between the hot and cold junctions when the two circuits are used. By measuring the large difference between the Seebeck voltages, the temperature can be measured and corrected. Structured, hunting is made of sensing elementary filaments that can absorb heat and light, and can also be used as a measure of thermal radiation, such as copper-constantan (Cu-conductor material has a higher thermoelectric coefficient, as a weak thermal radiation Detection; however, it is limited, so dozens or hundreds of thermopi 1 e are connected in series, and ν is bound to be proportional to the product of the number of thermocouples and the value of materials. Popularization of engineering technology and development of low heat

M272227 V. Creation Note (2) High-performance thermopile structure with insulation characteristics, which uses semiconductor production technology "for example, polycrystalline silicon and aluminum as thermocouples, and then cooperates with semiconductor quantity reactor red i-line = high quality and low price thermoelectric Heap and other applications. Thermoelectric furnaces, automobiles 1 ::: are mainly used in ear temperature detectors, hair dryers, microwaves, and lice detectors that use infrared light to absorb the heat. They are widely used. το-18 m @ 热 0 电 斗 Red wire sensing element mainly adopts the standard το-5 or two gold / two body Λ package, as shown in Figure-. This packaging structure is in material, this penetrating material ί :: ΐ: Fill the metal penetrating band of the appropriate infrared penetrating material with a metal-transistor package. 'However, in this kind of printed circuit production, J J Benang 5' is also used, and it is not conducive to volume in advance = rule = process ... It will increase the production cost of board size materials, labor and time. In view of this, this creation follows the mountain ^ ^, the package structure of the stack infrared sensor.彳, thermoelectricity of the packaging method III. [Creation content] $ ϋ: Main ::: Provides a kind of thermopile infrared sensor, and this cover has the function of a sealing element, and it also has eight sensors. Frequency, a, and the law of the size of the line of sight function. Another purpose of this creation is to provide a thermopile infrared sensor

Page 6 M272227 V. Creation instructions (3) Packaging structure, which can be combined with a substrate to form a surface mount device (SMD) to facilitate mass production and reduce component manufacturing processes, materials, volume and weight . Another purpose of this creation is to provide a sealing structure of a thermopile infrared sensor element, which can be configured as a kind of thermopile infrared sensor & p-adhesive elements, which is in line with the existing automated production technology. The matching of electronic component types helps manufacturers to adopt automated production equipment, reduce production time and reduce the cost of system manufacturing, so it is conducive to mass production and can effectively solve the lack of previous technologies. In order to achieve the above-mentioned purpose, the present invention proposes a new type of thermopile infrared ^ test-package structure, which includes a sensor, which is in one of the following categories: Beauty: Ϊ Thermoelectricity: components and other structures; Then, a cover is mounted on the second plate of the sensor to seal the thermoelectric element thereon, and the 4 ′, 蚀刻 is formed by etching a cavity with a silicon substrate. More exhibitions 2 Xibu 'this creation can also be set on the inside and outside of the cover-anti-repellent = layer film; then the outside surface of the cover is plated with a metal, = cover thickness and metal shielding layer to control The vision of the sensor is "surround =). In addition, you can also use the cover size and the button to adjust the line of sight of the sensor. Technical control and adjustment thinking Add note 1®; easy to understand the purpose, technical content, characteristics and implementation of the fourth embodiment, page 7 M272227 V. Creation Instructions (4) This creation proposes a new packaging structure of thermopile infrared sensing element 'its It uses a micro-electro-mechanical process to cut a $ η # β into the electrical processing technology to seal the sensor 'and also cooperates with the carrier substrate to form a surface adhesive (SMD). This packaging structure is not only conducive to The quantity can reduce the component manufacturing process, materials, and volume. "Knowledge technology will be published." The size and weight are sufficient, which is enough to replace the conventional TO-5 or TO-18 packaging method. < & The second picture is a schematic diagram of the packaging structure of the creation. As shown in the figure, the package structure of a stack of infrared rays is mainly sensed by a thermopile; the device 12 and the cover 30 composition. The sensor i 2 includes a single-crystal silicon substrate 14, which is etched into a cavity portion 16 on the substrate 14 by a chemical etching process. A thin-film floating plate 18 covers the cavity portion 16, and the thin film The floating plate 18 is composed of one or more insulating films, preferably silicon oxide and silicon nitride structural layers; and one or more thermoelectric elements 20 ′ are provided on the thin film floating plate 丨 8 and the thermoelectricity is utilized. The component 20 forms a thermal junction and a cold junction. The thermal junction is located at the center of the thin film floating plate, and the cold junction is located on the substrate 14 side. When the thin film floating plate 18 is irradiated with light, it The temperature distribution is highest at the center, and then decreases toward the surroundings; and a blackbody radiation absorbing layer 22 for absorbing infrared rays is provided on the uppermost layer of the thermoelectric element 20 through an insulating layer 24 of silicon oxide or silicon nitride, and the blackbody radiation The cover area of the absorbing layer 22 must cover the thermal junction, while the periphery is bounded by not covering the cold junction. In addition, a plurality of metal cymbals 26 are provided on the substrate 14 around the thermoelectric element 20 to provide contact pads for subsequent wire bonding processes. Next, an encapsulating layer 28 is used to mount a cover 30 made of a silicon substrate by etching a cavity on the insulating layer of the substrate 14 of the sensor 12.

Page 8 M272227 V. Creative Instructions (5) 24 surface to seal the thermoelectric element 20 and so on; the inner and outer surfaces of this cover 30 are respectively provided with an anti-reflective multilayer film 32, 34, so that is A preliminary thermopile infrared sensing element 10 Fengshang Yugou can be completed. 70 Among them, the above-mentioned silicon substrate etching a cavity is completed by using silicon anisotropic etching technology or square-shaped epitaxial technology such as Shi Xi. The cap shape of the two is the same, but the functional phase is the same except that the sealing gel is used. 28. Seal the cover 30 and the sensor 12 in addition to soldering or low temperature glass breaking. This creation uses a suitable silicon substrate thickness to make the cover 30. The infrared rays entering the beveled side of the cover 30 cannot be connected by the sensor 12 due to total reflection, forming a natural shielding of incident light, so the sensing element The angle of view of 丨 〇 is mainly determined by the size of the thin plate area of the cover 30 and the distance from the thin plate to the sensor. The distance from the plate to the sensor 12 is mainly controlled by the etching depth. In addition to the design effect of the corner of the second corner, a metal shielding layer 36 can also be plated on the surface of the anti-reflection multilayer film 3-4 on the outer surface of the cover 30, as shown in the third figure, in order to make use of the thickness of ^ 盍 30 and The metal shielding layer 36 is used to regulate the sight line of the sensing element 10. Fan Liyi ▲ ▼ 丨 The short Λ1 and Cheng Cheng of electrical appliances, the current circuit board parts, whether it is active or passive components, its sealing, ( SMD) 5 Easy structure == surface: the exposed thermopile infrared sensing element can be operated in different forms of surface adhesive components, in accordance with the prior art, as shown in the fourth figure, the thermopile infrared sensing element 10 is installed and fixed On a carrier substrate 40 that has been wired and has solder 38 on it, it is usually oxidized

Page 9 M272227 V. Creative Instructions (6) Inscription board or printed circuit board (PCB), I solder 38 conductive contacts; then use the plural number 4 2 to make the 4 green 枝 sentences above the outside, the most ethical Up-sealing to the carrier substrate is then completed.-Leadless chip carrier package (Leadles = degree's such as Career, LCC) in the form of surface adhesion components. The foot 46 is then used to replace the welding test on the carrier substrate 4 (), that is, the surface adhesion shown in the form of a small outline t (S0IC) is shown in the previous figure. This creation can also be packaged as a ball grid, as shown in As shown in FIG. 6, a solid% solder ball 48 ′ is provided on the bottom surface of the carrier substrate 40 to use the solder balls 48 as the u point of the sensing element. In addition, the sensing element i can also be used. Directly constructing the two-junction component 10 is electrically connected to the circuit board 5 with a wire 42, and it is made of a Chi-Pon board circuit board, which is fabricated into a "⑽" (ChiPon board) circuit board. Can be equipped with difficult resistance or diode 'as the body temperature measurement. Measure the cover made of 4 invasive electromechanical processing technology to seal the sense of it ^ PP-A side is plated with an anti-reflective multilayer film to increase wear

= Limit the sensing spectrum of the sensor; then design the appropriate cover sheet J Fan Yedong ΓΓ degree and the size of the metal shielding layer to control the surface of the stack of the infrared sensor of the sensor; the design 'is constructed into -Thermal materials, volume fish weight to reduce component manufacturing process, backup) production process and time schedule, reduce system manufacturing costs, so there is page M272227

Conducive to mass production. The above-mentioned embodiment is only a point, the purpose of which is to familiarize yourself with the technical ideas and features of this creation and implement it accordingly. Those who cannot = can understand the contents of this creation that are disclosed in this creation. The "3 1 search for yoke encirclement, that is, Dao is within the scope of the patent of this creation. ≫ Decoration, should still contain the drawing number description: 10 12 Thermopile infrared sensor sensor element 14 substrate 16 cavity Part 18 Thin film floating plate 20 Thermoelectric element 22 Black body light emission absorption @ Metal pad 24 Insulation layer 26 28 Encapsulating gel 30 Cap 32 Anti-reflective multilayer film 34 Anti-reflective multilayer film 36 Metal shielding layer 38 Solder 40 Carrier substrate 42 Wire bonding 44 Sealant 46 solder pins 48 solder balls 50 circuit boards

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Brief description of the diagram The first diagram is a schematic diagram of the structure of the conventional thermopile infrared 磕 18 all electric external line sensing element using a standard TO-5 or T0-18 metal electric solar body package.示意图 ίί The schematic diagram of the packaging structure. The first picture is the addition of winter phoenix to the creation. The fourth picture is the schematic diagram of the packaging structure of the masking layer of the creation. The structure diagram. , Cheng ..., Leaded Chip Carrier Packaging (LCC) form The sixth figure is the schematic diagram of the creative package. The seventh picture is the composition of Pei

Structure shown in the form of a small outline package (SO I C) Structure shown in the form of a ball book array package (BGA) Structure of a COB circuit board manufacturing method

Page 12

Claims (1)

M272227 6. Scope of patent application 1. A sealing structure of a thermopile infrared sensing element, including: a sensor, which is formed with a thermoelectric element on a substrate; and V: a cover, which uses a silicon base Material is formed by etching—the cavity is mounted on the substrate of the sensor to seal the thermoelectric element 2 thereon, and the thermopile infrared sensing element described in item 丨 of the scope of the patent application The package structure, wherein the sensor system includes the substrate, which has a thin-film floating plate located on the plurality of thermoelectric elements to form an insulating layer located on the black body radiation absorbing layer. The second package structure, in which the thin film edge structure, is preferably silicon oxide, such as the first package structure in the scope of patent application, where in the package 5, the first package structure in the scope of patent application, where in the package 6, For example, the fifth seal structure in the scope of patent application, among them, is the sight range of the detector. 7. As the first cavity in the scope of patent application; the floating plate covered by the thin-film thermoelectric element on the cavity is covered by the inside and outside of the cover described by the chemical and Shixi item. The item described above uses the metal as well. A thermopile infrared sensing element consisting of more than one thin film. The surface of the thermopile infrared sensing element is further provided with an anti-reflective multilayer thermopile surface coated with a thermopile shielding layer. A metal shielding layer of the infrared sensing element. The size of the infrared sensing element is used to control the thermopile infrared sensing element described in this sensing item. Page 13 M272227 VI. Patent application package structure 'where' can use the size of the cover plate and the etching depth to control the The line of sight of the sensor. 8. The package structure of the infrared sensor of the thermopile as described in item 1 of the scope of the patent application, wherein the silicon substrate is etched with a cavity by using silicon anisotropic etching technology. X 9. The package structure of the infrared sensor of the thermopile as described in item 1 of the scope of the patent application, wherein the silicon substrate is etched with a cavity by a square etching technique such as silicon. X 1 0. The packaging structure of the infrared sensor of the thermopile as described in item 1 of the scope of the patent application, wherein the cover is sealed with a sealing gel, solder or low temperature glass. 1 1. The packaging structure of the thermopile infrared sensing element described in item 1 of the scope of the patent application, wherein a load bearing substrate is further provided below the substrate of the sensor, and a plurality of external conductive contacts are formed to Forms a surface adhesion element. 1 2. The packaging structure of the thermopile infrared sensing element according to item 11 of the scope of the patent application, wherein the carrier substrate is selected from an alumina substrate and a printed circuit board. 1 3. The package structure of the infrared sensor of the thermopile as described in item 11 or 12 of the scope of the patent application, wherein the carrier substrate can further be provided with a thermoelectric P and a diode as the body. Measurement of temperature. 14. The package structure of the thermopile infrared sensing element according to item 11 of the scope of the patent application, wherein the external conductive contact is selected from the group consisting of solder, solder pins, and solder balls. Page 14 M272227 Page 15