M268737 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種表面黏著型電阻，尤指一種至少小 方、1區人姆阻抗的表面黏著型電阻。 【先前技術】 由於電路板製程及半導體製程技術的進步，早期電路 “及電子元件的體積都很大，而由目前小型化或薄型化的 2子或電器產品可知，目前的電路板及電子元件尺寸都相M268737 8. Description of the new type: [Technical field to which the new type belongs] This creation is about a surface-adhesive resistor, especially a surface-adhesive resistor with at least a small, 1-zone impedance. [Previous technology] Due to advances in circuit board manufacturing and semiconductor manufacturing technology, the early circuits and electronic components are very large. From the current miniaturization or thinning of two sub- or electrical products, we can know that the current circuit boards and electronic components Size
所謂的表面黏著型電阻（5 〇 )其結構不外乎包含 請配合參閱第七圖所示： 一基板（5 1 ); 一電阻層（5 2 )， 兩接觸層（53)， 兩側，以分別與基板（5 接；及 係塗佈於基板（5 1 )的上端面； 係塗佈於基板（5 1 )上端面的 1)上電阻層（52)的兩端連 4 )，係分別設置於該基板（5工The structure of the so-called surface-adhesive resistor (50) is nothing more than that, please refer to the seventh figure: a substrate (5 1); a resistance layer (5 2), two contact layers (53), both sides, Connected to the substrate (5; and the upper end surface coated on the substrate (5 1); 1) the two ends of the resistive layer (52) coated on the upper end surface of the substrate (5 1) are connected to 4); Set on the substrate (5 workers
延伸至該基板上端面的接觸層（ 及 面狀，特別η a 伐』Q b 4 )係呈平 疋位於該基板（5 1 )下端而沾立 銲接於電跟紅, T而面的部位，乃用以 w , 板（圖中未不）的對應線路，由於# # 既有針腳式的電阻不同 “干接方式與 目么φ 文％為表面黏著式電阻（5 π、 …黏著式電阻大多製造方法係以網印或二)方 3 M268737 式將電阻層形成在基板上，& @ 而電阻的歐姆值即取決於該兩 阻層的材料及體積上，因此，若要歐姆值的誤： 在很小的比例時1電阻層的材料㈣性及其定形後的1 積將非常重要。就目前以絪e + 月』以網印或塗佈製法來說，若要求相 當小的誤差值時，礙於製程的限制，僅能生產在Μ 上的電阻。若勉強生產1歐姆以下的電阻器，則其電阻值 的块差比例會提高，相對降低製品良率。而目前低The contact layer (and the planar shape, especially η aval ′ Q b 4) extending to the upper end surface of the substrate is flat and is located at the lower end of the substrate (5 1) and is soldered to the electric red, T surface. It is the corresponding line of the w, board (not shown in the figure). Because # # has the different resistance of the pin type, "Dry connection method and purpose? Φ %% is surface adhesion resistance (5 π,… most of the adhesion resistance) The manufacturing method is to use screen printing or 2) square 3 M268737 to form the resistance layer on the substrate, and the ohmic value of the resistance depends on the material and volume of the two resistance layers. Therefore, if the ohmic value is wrong, : At a small proportion, the material properties of the 1 resistance layer and the 1 product after shaping will be very important. As far as 絪 e + month ”is used for screen printing or coating, if a relatively small error value is required Due to the limitation of the manufacturing process, only resistors on M can be produced. If the resistors of 1 ohm or less are produced barely, the block difference ratio of the resistance value will increase, and the yield of the product will be relatively reduced. At present, it is low.
姆電阻仍有其市場雲戈，lL / ，如何提供一種具有低誤差 比例的低歐姆值之電阻，仍有其必要性。 【新型内容】 ^本1j作的主要創作目的係提供—種低阻抗表面 *者里電阻’其具有低誤差比例的低歐姆纟（至少小於i 歐姆），並且容易製造生產。 2達上述目的所使用的主要技術手段係、令該低阻抗表 亡者5L電阻’主要於一基板的相對兩側分別設置有兩接 A子’再基板上將至少一條電阻線橫跨並連接於該基板 上的接點端子，其中電阻線的直徑係介於umii〜1〇mil之 二控制本創作電阻的歐姆值低於1歐姆，最後，再將 保蠖層盍合於該基板上的電阻線，以保護該電阻線。 上述電阻主要採用直徑小、高阻抗的電阻線，因此， 本創作電阻的歐姆值可控制在低於1歐姆值之下，而且可 :便凋生產不同歐姆值的電阻，，可藉由調整電阻線的 上，直彳工或者將複數電阻線並排設置於兩接點端子 由方、電阻線的材料具有均勻的良好特性，因此， M268737 可有效減V衫響電阻歐姆值的變數，有效控制本創作電阻 的.吳差比例在-定庫巳圍内，令電阻製造良率有效提高。 【實施方式】 百先凊參閱第-圖、第二圖及第三圖所示，係為本創 作電阻（1 0 )的第一較佳實施例，其包含有： 基板（1 1 )，係可為玻璃纖維板或陶瓷基板； 兩接點端子（12)，各接點端子（12)的縱剖面 〔字形，並設置於該基板（1 1 )的兩相對側邊（i 二匕其兩水平部分（121) (122)分別位 於该基板（11)上、下端面（ιιι) (ιι 而其垂直部（i 2 3 )則 13)上； j、占口方、基板（1U兩側邊（1 條電阻線（i 3 )，係橫跨並連接於 1)上端面（1H)近兩側邊的接點 J1 鎳等；及之而其材質為高阻抗的金屬材料，如鎢、 兩側邊=3()1 04广係橫跨於基板㈠"上端面近 板二H 點端子（12)上，以蓋合該基 俜可、 ’ “且線（1 3 ) ’其中該保護層（1 4 ) 對可:黏合方式結合於接點端子上， 對應接點端子（i 2 )仞¥^ ( 1 4 ^ 1丄J )位置形成有黏著層（i 4 ]) =作由於採用直徑小、高阻抗的電。 “電阻（10)時，可藉由調整電阻線（"二長 5 M268737 度及直徑，改變電阻的歐姆值，本創作係主要用以產生低 於1歐姆值的電阻。又，由於電阻線（丄3)㈣料具有 均勾的良好特!生，因此’可有效減少影響電阻（丄〇 )歐 姆值的變數’ ϋ有效控制本創作電阻的誤差比例在一定範 圍内’令電阻（i 〇 )製造良率有效提高。 請配合參閱第四圖所示，係為本創作的第二較佳實施 例，其相較於第-較佳實施例主要是一種容易實施更低歐 姆值的電阻（1〇a)，即，電阻包含有複數條電阻線（ι 3 ) ’各電線（丄3 )同樣橫跨並連接於該基板（1 1 ) 上兩接點端子（12)，以電路學理論複數並排連 接於基板（1!)上的電阻線（13)，即是等效於複數 個電阻並聯，因此，該電阻的歐姆 _ %徂θ軏弟一較佳實施例 八有更低的電阻值（兩實施例係使用相同長 料的電阻線）。 置彳二及材 由上述二個較佳實施例可知，本創作確實可生產低歐 姆值的電⑯，並且因為該等結構的設計，令本創作可配入 現有+導體封|製程中打線機台進行電阻線與接點端子的 連接。由於電阻線及打線機台的配合使用，並不需如同既 有以網印或塗佈製程，需要事前準備電阻層液料， :罔印或塗佈後還要有洪乾的繁雜製程…，本創作不僅 構設計上，能生產出具高精度的低歐姆電P且，相較於 既有電阻的製程流程具有簡化製程的功效 丈 降低製造成本。 此有效 而本創作製作低於1歐姆的不同歐姆值的電阻方式 6 M268737 有： 式及=p·^可知，本創作電阻線材料的勹 ^"、、、复電阻值的公 ^ +勺勻，其中電阻係p數可 視為常數，故而決定姆歐值的轡赵0 +Ohm resistor still has its market yunge, lL /, how to provide a low ohmic value resistor with a low error ratio is still necessary. [New content] ^ The main creative purpose of this 1j is to provide a low-impedance surface. * Resistor ’has a low ohmic ratio (at least less than i ohm) with a low error ratio, and it is easy to manufacture. 2 The main technical means used to achieve the above purpose is to make the 5L resistor of the low-impedance watch dead 'mainly provided with two A's on opposite sides of a substrate, and then at least one resistance line is crossed and connected to For the contact terminals on the substrate, the diameter of the resistance wire is between umii and 10 mil to control the ohmic value of the original resistance below 1 ohm. Finally, the protective layer is combined with the resistance on the substrate. Wire to protect the resistor wire. The above resistance mainly uses a small-diameter, high-impedance resistance wire. Therefore, the ohmic value of this creative resistance can be controlled below 1 ohm, and it can: produce different ohmic resistances. You can adjust the resistance by On the line, straight or multiple resistance wires are arranged side by side at the two contact terminals. The material of the resistance wire has uniform and good characteristics. Therefore, M268737 can effectively reduce the ohmic value of the V-shirt resistance and effectively control the cost. The ratio of the Wu difference of the created resistance is within the range of Dingkuo, which effectively improves the yield of resistance manufacturing. [Embodiment] Bai Xianyu refers to the first, second, and third figures, which are the first preferred embodiment of the creative resistor (1 0), which includes: a substrate (1 1), It can be a glass fiber board or a ceramic substrate; two contact terminals (12), a longitudinal section of each contact terminal (12) [shaped, and arranged on two opposite sides of the substrate (1 1) Parts (121) (122) are respectively located on the upper and lower end faces (ιιι) (ιι) of the substrate (11) and the vertical part (i 2 3) is 13); j. Occupant, substrate (1U sides ( 1 resistance line (i 3), which is across and connected to 1) the contacts J1 nickel on the near sides of the upper end surface (1H); and its material is a high-resistance metal material, such as tungsten, on both sides Edge = 3 () 1 04 Guangxi straddles the substrate ㈠ " The upper end is near the second H-point terminal (12) of the plate to cover the base, "" And the line (1 3) "where the protective layer ( 1 4) Yes: Adhesive method is combined with the contact terminal, and an adhesive layer (i 4) is formed at the position corresponding to the contact terminal (i 2) 仞 ¥ ^ (1 4 ^ 1 丄 J) = due to the small diameter , High-impedance electricity "In the case of resistance (10), you can change the ohmic value of the resistance by adjusting the resistance wire (" two lengths 5 M268737 degrees and diameter. This creation is mainly used to generate resistance lower than 1 ohm. Also, because the resistance wire (丄 3) The material has good characteristics of uniform hooking, so 'can effectively reduce the variable that affects the resistance (丄 〇) ohmic value' 控制 Effectively control the error ratio of the original resistance within a certain range, so that the resistance (i 〇 ) The manufacturing yield is effectively improved. Please refer to the fourth figure for reference. This is the second preferred embodiment of this creation. Compared with the first preferred embodiment, it is mainly a resistor with a lower ohmic value ( 1〇a), that is, the resistor includes a plurality of resistance wires (ι 3) 'each wire (丄 3) also crosses and is connected to two contact terminals (12) on the substrate (1 1), based on circuit theory The plurality of resistance lines (13) connected side by side to the substrate (1!) Is equivalent to the parallel connection of a plurality of resistances. Therefore, the ohmic resistance of the resistance _% 徂 θ 軏 the first preferred embodiment has a lower resistance Value (both examples use resistance wires of the same length). It can be known from the above two preferred embodiments that this creation can indeed produce electric ohms with low ohmic value, and because of the design of these structures, this creation can be incorporated into the existing + conductor seal | The connection between the wire and the contact terminal. Due to the cooperation of the resistance wire and the wire bonding machine, it is not necessary to use the screen printing or coating process as before, and it is necessary to prepare the resistance layer liquid material in advance. There are complicated and complicated manufacturing processes ... This design not only can be designed to produce low-ohmic P with high precision, but also has the effect of simplifying the manufacturing process and reducing the manufacturing cost compared with the existing resistance manufacturing process. This is valid and the resistance method 6 with different ohmic values below 1 ohm is produced in this creation. 6 M268737 has: formula and = p · ^ It can be seen that 创作 ^ " ,,, and common resistance values of the complex resistance value of this creative resistance wire material. Uniform, in which the p-number of the resistance system can be regarded as a constant.
,^ θ 又数/、有電阻線的截面積J 及長度/，是以： s Ζ a :欲設計較高歐姆值電阻時， 』蝻紐電阻線的長度， 或是使用直徑較小的電阻線； b ·欲設計較低歐姆值電阻時， r f加長電阻線的長产, ^ θ counts /, the cross-sectional area of the resistance line J, and the length /, which is: s Z a: when you want to design a higher ohmic resistance, 蝻 蝻 the length of the resistance wire, or use a smaller diameter resistor B; When designing a lower ohmic resistance, rf lengthens the long output of the resistance line.
或是使用直徑較小的電阻線。 X 2 ·選擇並排於基板上兩接點 、、 牧”5文而之間的電阻線數量： 由於並排複數電阻線，會電阻的讓 J喊人姆值下降，故可藉由 此方式調整生產電阻的歐姆值。 請配合參閱第六圖所示，係為本創作的一電路應用實 施例，該電路係為一具有過電流保護的控制電路，其主要 ° 3有1 C ( 2 0 )及-電流檢知器’該電流檢知器（2 0 )係可使用本創作的表面黏著型電阻（丄〇 )，其串接 於該I C ( 2 〇 )的電壓輸入端（v + )與電源端（+ ) 之間’當電源提供電流至j㈡夺，該電流檢知器會有一壓 :牛此蚪°亥I C ( 2 Q )的電壓輸入端的電壓值會隨著 電μ大小而改交，若電壓過大代表前電路呈過電流狀態， 而该1 C會不再輸出控制信號至負載（2 1 )，以保護整 體電路的安全。 由上述Α明可知，本創作確實可提供低於1歐姆值且 具高精度的電阻，h . 1 相較於既有電阻的結構、製程及製造成 M268737 本均具有顯著的改良及進步。 【圖式簡單說明] 第一圖：係本創作第—私 — 車父佳貫施例的立體圖。 第二圖：係本創作第一 車又佳實施例的分解圖。 弟二圖·係本創作第~較佳實施例的縱剖面圖 第四圖··係本創作第二較佳實施例的立體圖。 第五圖：係本創作第二較佳實施例的分解圖。 第六圖：係本創作實際應用的一電路圖。 第七圖·係既有採塗佈製程製造的電阻立體圖 【主要元件符號說明】 (l〇)(10a)電阻 (11) ( 1 1 a )基板 (1 1 1 )上端面 (1 1 3 )側面 (121)水平部 (1 2 3 )垂直部 (14)保護層 (20) 1C (5 0 )電阻 (5 2 )電阻層 (5 4 )端接點 (1 1 2 )下端面 (1 2 )接點端子 (1 2 2 )水平部 (1 3 )電阻線 (1 4 1 )黏著層 (2 1 )負載 (51)基板 (5 3 )接觸層Or use a smaller resistance wire. X 2 · Select the number of resistance wires side by side on the substrate with two contacts, and “5”: Because of the multiple resistance wires side by side, the resistance will decrease the value of J, so you can adjust the production in this way. The ohmic value of the resistor. Please refer to the sixth figure for an example of a circuit application of this creation. The circuit is a control circuit with overcurrent protection. Its main ° 3 has 1 C (2 0) and -Current Detector 'The current detector (20) can use the surface-adhesive resistor (丄 〇) created by this creation, which is connected in series with the voltage input terminal (v +) of the IC (20) and the power supply. Between terminals (+) 'When the power source supplies current to j, the current detector will have a voltage: the voltage value of the voltage input terminal of the IC (2 Q) will change with the size of electricity μ, If the voltage is too large, the front circuit is in an overcurrent state, and the 1 C will no longer output a control signal to the load (2 1) to protect the overall circuit safety. As can be seen from the above A, this creation can indeed provide less than 1 ohm. Value and high precision resistance, h. 1 Compared with the existing resistance structure and manufacturing process Manufactured into M268737, all of which have significant improvements and improvements. [Simplified illustration of the drawing] The first picture: is a three-dimensional view of the first-private-car father Jiaguan ’s example. The second picture: the first car of the book is even better. An exploded view of the embodiment. The second figure is a longitudinal sectional view of the first preferred embodiment of the present invention. The fourth figure is a perspective view of the second preferred embodiment of the present invention. The fifth picture is the second comparison of the present invention. An exploded view of the preferred embodiment. Figure 6: A circuit diagram of the practical application of this creation. Figure 7: A perspective view of a resistor manufactured by an existing coating process [Description of the main component symbols] (10) (10a) Resistance ( 11) (1 1 a) substrate (1 1 1) upper end surface (1 1 3) side surface (121) horizontal portion (1 2 3) vertical portion (14) protective layer (20) 1C (50) resistance (5 2 ) Resistance layer (5 4) Termination point (1 1 2) Lower end surface (1 2) Contact terminal (1 2 2) Horizontal part (1 3) Resistance wire (1 4 1) Adhesive layer (2 1) Load ( 51) Substrate (5 3) contact layer