TWM267623U - Point test structure improvement for chip after dicing - Google Patents

Description

M267623 IV. Creation Instructions α) [Technical Field to which the New Type belongs] This creation is about a "improvement of grain spot measurement structure after cutting", especially a kind of grain spot measurement structure creation that performs error compensation at the same time as grain spot measurement. . [Previous technology] According to 'the wafers of conventional wafers have no problems before dicing, however, after dicing, most of the crystals on the wafer will have a displacement phenomenon, which will cause subsequent spot measurement deviations' or even out of position. As a result, the accuracy of the crystal grains cannot be accurately checked;

In the past, when the testing mechanism of the crystal grains was operated, they often failed to operate accurately and smoothly, especially the relative position of the crystal grains after cutting would change, and the accuracy of the product was lost. The production efficiency cannot be improved, and it is easy to produce defective products;

Therefore, in response to the aforementioned conventional problem, an industry has created a method for spot measurement of grains. Please refer to Figures 3 and 4 for reference. This is to first use a photographic lens 60 to scan and position a wafer 80, and then The wafer 80 enters the spot measurement area, and then uses the integrating sphere 70 to perform spot measurement on the wafer 80. Although it has the effect of spot measurement, this operation method needs to go through twice. The operation is not only cumbersome and inconvenient, but also affects the overall mass production operation. Moreover, these operation modes cannot perform error compensation synchronously, making it impossible to make immediate effect of error correction, so its accuracy is still extremely limited. Therefore, due to the lack of the conventional method of spot measurement after the conventional cutting, it is necessary to further improve it. In view of the fact that the current conventional grain spotting method still has an improvement

M267623

Fourth, creation instructions (2)

After the second improvement test, we have finally created—many years of experience in production and sales of related equipment. ’Thinking about the improvement method, the structure of the spot measurement of the grain is improved after one more cut. [New content] For this reason, the main purpose of this creation is to provide a kind of spot measurement of grains, while simultaneously monitoring the image of the spot measurement area, so as to achieve the purpose of real-time compensation for the improvement of the structure of the grain measurement after cutting. In order to achieve the above purpose, the present invention proposes an improved grain spotting structure after cutting, which has a base, a probe module is fixed on the bottom surface of the base, and a fixing base is provided on the top surface of the base. A camera is fixed; the camera has a microscope head; an integrating sphere is fixed between the base and the fixed base; an opening portion is provided on the top surface of the integrating sphere, and the opening portion is the same as the microscope head. The sleeve is advantageous in that the opening portion is approximately inversely tapered. The following is further explained in conjunction with the drawings of the preferred embodiment of this creation in order to enable persons familiar with the relevant technology of this creation to implement it in accordance with the statements in this specification. [Embodiment] First, please refer to the first figure and the second figure. This creation is an improved structure of spot measurement after cutting, which has a base 10, and a probe is fixed on the bottom surface of the base 10. The module 2 0 ′ is provided with a fixed base 11 on the top surface of the base 10. The fixed base 11 is fixed with a camera 30.

Page 6 M267623

The projector 30 has a microscope head 3 i; in addition, an integrating sphere 40 is fixed between the base 10 and the fixed base 11, and an approximately cone-shaped opening portion is provided on the top surface of the integrating sphere 40. 41. The opening 41 is in the same axis as the microscope head 3 i (as shown in the first and second figures). Generally, the grains are fine before cutting. However, after the cutting, the grains usually shift slightly, causing the phenomenon of spot deviation or even dislocation. Therefore, it is impossible to accurately check the accuracy of the grains. The combined composition, please continue to refer to the first and second figures, this creation is using the integrating sphere 4 〇 after the wafer 50 dicing of the wafer 're-search for a new positioning, determine its single iXY axis coordinate value At the same time, since the top surface of the integrating sphere 40 has an opening 41, the camera can use the micro lens 31 of the camera 30 to transmit the coordinate values into the system, so that it can directly move the wafer 50 'and fall on the accurate The test position of the probe module 2 0 is based on this to complete the work of detection and error compensation. The overall operation method is simple and convenient; since this creation is based on the die cutting, the microscope head 31 can be used to check the die simultaneously. Position 'and compensate for its deviation, in order to complete the correct spot measurement position, make it operate smoothly and stably, improve production accuracy, and ensure the quality of the product, thereby increasing the production volume, which is extremely practical. To sum up, the structure of the spot measurement of the grain after cutting is improved. Not only the spot measurement of the grains, but also the image of the spot measurement area can be monitored synchronously, and the errors can be compensated in real time, and all kinds of existing knowledge can be effectively improved. Disadvantages, and the main technical means of this creation have not been found in any related publications, which is in line with the new

Page 7 M267623 IV. Creation Instructions (4) The application requirements of the patent shall be filed in accordance with the law.

Page 8 M267623 Simple illustration of the diagram [Simplified illustration of the diagram] The first picture is a schematic side view of the composition of this creation. The second figure is a schematic diagram of spot measurement of the embodiment of this creation. The third figure is a schematic side view of a conventional combination.

The fourth figure is a conventional example of unintended grain spot measurement. [Explanation of main component symbols: I (this creative part) base 1 0 fixed base 1 1 probe module 2 0 camera 3 0 microscope head 3 1 integrating sphere 4 0 opening 4 4 wafer 5 0 (conventional part) photography Lens 6 0 Integrating sphere 7 0 Wafer 8 0

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Claims (1)

M267623 V. Applying for a patent fan garden 1. An improved structure for spot measurement after cutting, which has a base, a probe module is fixed on the bottom surface of the base, and a fixing base is provided on the top surface of the base. A camera is fixedly installed, the camera has a microscope head; and an integrating sphere is fixed between the base and the fixing seat, and an opening part is provided on the top surface of the integrating sphere, and the opening part is the same as the microscope head. Axis. 2. The structure of the spot measurement after cutting is improved as described in item 1 of the scope of the patent application, wherein the opening portion is in the shape of an inverted cone. Page 10