M264111 四、創作說明（1) 【新型所屬之技術領域】M264111 4. Creation Instructions (1) [Technical Field to which the New Type belongs]
本創作係有關於一種上載帶（Cover Tape)之改良，尤 指提供表面黏著零件SMD封裝，所使用的熱熔性結合覆蓋 材料（非感壓自黏性），其中所採用的熱熔性黏膠，在非熱 熔狀態下為乾性表面，可避免對表面黏著零件SM])的沾黏 ，且免除感壓自黏性的上載帶，中央覆蓋區須貼覆隔離膜 的缺點。其主要係在上載帶結合面二侧邊，被覆足夠厚度 的熱溶性黏膠，而於中央之覆蓋區僅被覆較薄之熱熔性黏 膠’進而使熱熔性黏膠於上載帶結合面上為一凹狀構造， 藉此凹狀的熱熔性黏膠被覆構造，以增加上載帶的透明度 與清晰度，而有利於檢查設備對封裝的表面黏著零件SMD 檢查；又，所被覆的熱熔性黏膠用量，較習用減少一半以 上而可降低製造成本。 【先前技術】 有關表面黏著零件SMD(Surface Mount Device，SMD) 之封裝’係使用如第1A、1B圖所示之上載帶（c〇ver Tape) 10與承載帶（Carrier Tape)20，該上載帶10之材質為pET( Polyethylene Terephthalate，聚乙烯對苯二曱酸脂）， 而該承載帶20之材質可為PS(P〇lystyrene ,聚苯乙、p ET(P〇lyethylene Terephthalate，聚乙烯對苯二曱酸脂） 、PC(P〇lycarb〇nate，聚碳酸酯），有關材質的部份 ^ 封作請求重點茲不贅述。 前述該上載帶10與承載帶20的封裝結合，主要係於上 載帶10之結合面上’全面域被覆厚度約20 #〜35以的熱熔This creation is about the improvement of a cover tape, especially the SMD package that provides surface-adhesive parts. The hot-melt bonding cover material (non-pressure-sensitive self-adhesive) is used. The hot-melt adhesive used in it Adhesive is a dry surface in a non-hot-melt state, which can avoid sticking to surface adhesive parts SM]), and avoid pressure-sensitive self-adhesive carrier tapes. The central coverage area must be covered with the disadvantage of an isolation film. It is mainly on the two sides of the carrier tape bonding surface, covered with hot melt adhesive of sufficient thickness, while the central coverage area is only covered with a thinner hot melt adhesive, so that the hot melt adhesive is applied to the carrier tape bonding surface. The above is a concave structure, whereby the concave hot-melt adhesive coating structure is used to increase the transparency and sharpness of the carrier tape, which is beneficial for the inspection equipment to inspect the surface adhesive parts of the package. SMD inspection; The amount of melt adhesive can be reduced by more than half compared with conventional usage, which can reduce manufacturing costs. [Prior technology] The packaging of the surface mount device SMD (SMD) uses a carrier tape 10 and a carrier tape 20 as shown in Figs. 1A and 1B. The material of the belt 10 is pET (Polyethylene Terephthalate), and the material of the carrier belt 20 may be PS (Polystyrene, polystyrene, p ET (P〇lyethylene Terephthalate) Phthalic acid ester), PC (Polycarbonate, polycarbonate), relevant material parts ^ Sealed as the key point of the request will not be repeated. The aforementioned combination of the carrier tape 10 and the carrier tape 20 is mainly based on The bonding surface of the carrier tape 10 has a full-area coating thickness of about 20 # ~ 35
M264111 四、創作說明（2) 性黏膠30(如第2圖所示），藉熱熔性黏膠3〇而盎 黏著結合，而完成表面黏著零件（SMD)4〇之封裝^如， 所不）。前述之熱熔性黏膠3〇在實施熱熔結合，= 帶10二側邊及承載帶20之二侧邊21，於結合的接面丄f 黏結點A，且熱熔性黏膠在非熱熔之狀態下為乾性=生 可避免對封裝的表面黏著零件（SMD)沾黏。至^感 黏 性的黏膠，須於上載帶之中央覆蓋區貼覆隔離膜:以务 對表面黏著零件（SMD)的沾黏，且也同時增加製造成$兄 又，前述之黏膠其材質可為EVA (聚丙烯）熱熔J、壓克 力、橡膠或矽膠等等，視結合方式（如熱熔性結合、感壓 自黏性結合）、配方比例而適當採用。事實上，黏膠的成 本佔上載帶10製造成本的60%以上，且習用上载帶與承 載帶20採用熱熔性黏著結合之方式有下述之缺點·· 一、上載帶ίο因結合面為全面域被覆厚度約2〇以〜35#的 熱炼性黏膠3 0 ’易使上載帶1 〇產生模糊現象，而影響 (降低）上載帶10的透明度與清晰度（如第3圖所示）， 進而妨礙檢查設備對封裝後的表面黏著零件（smd)4() 檢查。 上載帶10之結合面因加工的便利，而全面域被覆厚度 約20#〜35#的熱熔性黏膠30，其與承載帶2〇僅於二 側邊21熱溶黏著結合，例如以3 7 · 5mm寬度之承載帶2 〇 ’僅於二側邊2 1約6 mm寬度與上載帶1 0熱炫黏著結合 ’而大部份之熱熔性黏膠30未發生黏著結合作用，且 熱炼性黏膠30佔上載帶10百分之六十以上的製造成本M264111 IV. Creation Instructions (2) The adhesive 30 (as shown in Figure 2) is bonded by the hot-melt adhesive 30, and the packaging of the surface-adhesive part (SMD) 40 is completed. Do not). The aforementioned hot-melt adhesive 30 is being subjected to hot-melt bonding, = the second side of the tape 10 and the second side 21 of the carrier tape 20, the bonding point A at the joint interface, and the hot-melt adhesive In the hot-melt state, it is dry = raw, which can avoid sticking to the surface adhesive parts (SMD) of the package. To the viscous adhesive, an isolation film must be applied to the central coverage area of the carrier tape: in order to adhere the surface-adhesive parts (SMD), and also increase the manufacture to $ brother, the aforementioned adhesive is The material can be EVA (polypropylene) hot-melt J, acrylic, rubber, or silicone, etc., depending on the bonding method (such as hot-melt bonding, pressure-sensitive self-adhesive bonding), and the proportion of the formula. In fact, the cost of the adhesive accounts for more than 60% of the manufacturing cost of the carrier tape 10, and the conventional method of using a hot-melt adhesive bonding with the carrier tape 20 has the following disadvantages. 1. The carrier tape is because the bonding surface is The coating thickness of the entire area is about 20 to 35 # of the hot-melt viscose 3 0 ', which may easily cause the carrier tape 10 to blur, and affect (decrease) the transparency and sharpness of the carrier tape 10 (as shown in FIG. 3). ), Which prevents the inspection equipment from inspecting the packaged surface-adhesive parts (smd) 4 (). Due to the convenience of processing, the bonding surface of the carrier tape 10 is covered with a hot-melt adhesive 30 with a thickness of about 20 # ~ 35 #, which is hot-melt and bonded to the carrier tape 20 only on the two sides 21, such as 3 7 · 5mm width of the carrier tape 2 〇 'only on the two sides 2 1 about 6 mm width and the carrier tape 1 0 thermal adhesion bonding' and most of the hot-melt adhesive 30 does not have adhesive bonding, and heat Refinable viscose 30 accounts for over 60% of the manufacturing cost of the carrier tape
M264111 四、創作說明（3) ，而有浪費熱熔性黏膠30與增加製造成本的缺點。 【新型内容】 ' # 本創作之主要目的，在於採用熱熔性結合的方式，主 要在上載帶中央之覆董區僅被覆較薄的熱熔性黏膠^厚度 低於5#以下），可避免上载帶模糊現象的發生，使上載帶 的透明度與清晰度增加’而有利於檢查設備對封裝後的表 面黏著零件SMD檢查。 & 本創作之次要目的，在於被覆上載帶結合面的熱熔性 黏膠，係於二侧邊施以足夠厚度，而於中央之覆蓋區'僅被 覆較薄（厚度低於5 #以下）的熱熔性黏膠，使熱溶性黏膠於 上載帶上為一凹狀構造，而可減少熱熔性黏謬一半以上的 被覆用量，進而降低上載帶的製造成本。 為達述各項目的’本創作主要係在上載帶結合面一 側邊’被覆足夠厚度的熱溶性黏膠，而於中央之覆蓋區僅 被覆較薄之熱熔性黏膠，進而使熱熔性黏膠於上載帶結合 面上為一凹狀構造。 【實施方式】 為使 貴審查委貝瞭解本創作之目的、特徵及功效， 茲藉由下述具體之實施例，並配合所附之圖示，對本創作 做一詳細説明，說明如後： 請參閲第4圖’係為本創作之上載帶被覆黏膠之示意 圖。如圖所示：主要係於上載帶10’（厚度約32//)之結合 面二側邊11’（以37· 5mm寬度為例，二側邊11，各約6mm寬度 )，被覆足夠厚度（約20/z〜35μ)的熱熔性黏膠3〇，，而於 M264111 四、創作說明（4) 中央之覆盖區12僅被籍龄 “以下，此部份為膠3〇’ （厚度低於 沾黏的較微量熱炫性黏m被覆=性黏膠3()’之接面所 Φλ . i.i( Λ^1|έ^30, ^ . ^ ^ ,, a, 馮凹狀構造（為易於瞭解，圖示以 荖ii ；/吏當該上載帶1〇,與承載帶2〇,熱熔黏 黏：：Α:/ι:「之二侧邊u，、21，且產生熱熔結合的 黏結點Α (如第5圖所千·、，而# h壯M264111 Fourth, the creation instructions (3), but there are disadvantages of wasting hot melt adhesive 30 and increasing manufacturing costs. [New content] '# The main purpose of this creation is to use a hot-melt bonding method, mainly covering the thinner hot-melt adhesive in the overlay area of the center of the carrier tape (thickness below 5 #). Avoiding the ambiguity of the carrier tape, which increases the transparency and sharpness of the carrier tape, and facilitates the inspection equipment to inspect the surface adhesive parts of the package after SMD inspection. & The secondary purpose of this creation is to cover the hot-melt adhesive on the bonding surface of the tape, which is applied to the two sides with a sufficient thickness, while the central coverage area is only covered with a thinner (thickness below 5 # The hot-melt adhesive makes the hot-melt adhesive a concave structure on the carrier tape, and can reduce the coating amount of the hot-melt adhesive by more than half, thereby reducing the manufacturing cost of the carrier tape. In order to describe each item, “This creation is mainly on the side of the bonding surface of the carrier tape” covered with hot-melt adhesive of sufficient thickness, and the thinner hot-melt adhesive is covered in the central coverage area, so that the hot-melt The adhesive is a concave structure on the bonding surface of the carrier tape. [Implementation] In order for your review committee to understand the purpose, characteristics and effects of this creation, we will use the following specific examples and the accompanying drawings to make a detailed description of this creation, as explained below: Please Please refer to Figure 4 'is a schematic diagram of the adhesive tape on the tape of this creation. As shown in the figure: It is mainly on the two sides 11 'of the bonding surface 10' (thickness of about 32 //) on the bonding surface (take the width of 37 · 5mm as an example, the two sides of 11, each about 6mm in width), covering enough thickness (Approximately 20 / z ~ 35μ) of hot-melt adhesive 30, and in M264111 IV. Creative Instructions (4) The central coverage area 12 is only under the age ", this part is the glue 3 '(thickness A smaller amount of hot dazzling m coating that is lower than the sticking = the junction of the 3 () 'adhesive Φλ. Ii (Λ ^ 1 | έ ^ 30, ^. ^ ^ ,, a, Feng concave structure ( For easy understanding, the picture is shown with 荖 ii; // When the uploading tape 10, and the carrier tape 20, hot-melt sticking:: A: / ι: "two side edges u ,, 21, and hot melt Combined bond point A (as shown in Figure 5, and #h 壮
χ.Λ, ra ^ 々不）而被封裝之表面黏著零件（SMD 5“以下^埶上Λ帶10’巾央之覆蓋區12’，僅被覆厚度低於 之VV而，Λ黏膠3°，，相較於習用全面域等厚度被覆 如:ί 增加了上載帶10’的透明度與清晰度（ 不），而有利於檢查設備對封裝後的表面黏著 零件（SMD)40，檢查。 恭，本創作之上載帶1〇，熱溶性黏膠30,之使用量，以 =之寬度為37.5111111、二侧邊11，各6111111為例： L^.5mm-(6mm + 6mm)]x 5 ^+(6 m m + 6 m m) x 20 β = 367· 5 // m m。 習用上载帶10之黏膠30使用量為： 37.5mmx 20 // = 750 “ mm。 點膠=而Ϊ創作之熱炼性黏膠3〇,使用量，較習用熱熔性 黏膠30之使用量可減少一半以上。 狀離：Ϊ二本創作採用熱熔性黏膠，係其特性在非熱熔之 沾=〇 ^表面’可避免對封装的表面黏著零件（SMD) 嫌由破壞，且避免使用感壓自黏性的黏膠，須於上載 -中央覆蓋區貼覆隔離膜’而產生成本增加的缺點。χ, Λ, ra ^ 々 not) and the surface of the package is adhered to the surface (SMD 5 "below ^ Λ Λ belt 10 'towel center of the coverage area 12', only the thickness is lower than VV, Λ adhesive 3 ° , Compared with the conventional full-area thickness coating, such as: ί Increases the transparency and clarity of the carrier tape 10 '(no), which is conducive to the inspection of the surface-attached parts (SMD) 40 after inspection by the equipment. Respect, For this creation, the use amount of 10 is hot-melt adhesive 30, and the width of = 37.5111111, the two sides 11 and 6111111 are taken as examples: L ^ .5mm- (6mm + 6mm)] x 5 ^ + (6 mm + 6 mm) x 20 β = 367 · 5 // mm. The amount of adhesive 30 used in the conventional carrier tape 10 is: 37.5mmx 20 // = 750 "mm. Dispensing = and the tempering of creativity The amount of viscose 30, the amount used, can be reduced by more than half compared with the conventional hot-melt viscose 30. State of separation: The second book uses hot-melt viscose, its characteristics are non-hot-melt = 0 ^ The surface 'can avoid the possible damage to the surface-adhesive parts (SMD) of the package, and avoid the use of pressure-sensitive self-adhesive adhesive, which must be produced by placing an isolation film on the upload-central coverage area'. Increase shortcomings.
第8頁 M264111Page 8 M264111
M264111 圖式簡單說明 【圖示簡單說明】 第1A圖係為一般封裝SMD之上載帶與承載帶之示意圖。 弟1B圖係為弟ία圖之成品捲收示意圖。 第2圖係為習用上載帶被覆黏膠之示意圖。 第3圖係為習用上載帶與承載帶封裝SMD之剖面構造示意 圖。 第4圖係為本創作 第5圖係為本創作 示意圖。 之上載帶被覆黏膠之示意圖。 之上載帶與承栽帶封裝SMD之剖面構造 第6圖係為第5圖之外觀示意圖。 【主要元件符號說明】 10 、 10, 20 > 20, 30 > 30,M264111 Schematic illustration [Simplified illustration] Figure 1A is a schematic diagram of the carrier tape and carrier tape of a general package SMD. Figure 1B is a schematic diagram of the finished product's winding. Figure 2 is a schematic diagram of the conventional adhesive tape coated with adhesive. Figure 3 is a schematic cross-sectional structure diagram of a conventional carrier tape and carrier tape package SMD. Figure 4 is a schematic illustration of this creation. Schematic diagram of the adhesive tape on the carrier tape. Cross-section structure of the carrier tape and carrier tape package SMD Figure 6 is a schematic diagram of the appearance of Figure 5. [Description of main component symbols] 10, 10, 20 > 20, 30 > 30,
f載帶U，侧邊〖2，覆蓋區 承載帶 21、2 1，側邊黏膠40、40，表面黏著零件A 、A， 黏結點f Carrier tape U, side 〖2, coverage area Carrier tape 21, 21 1, side adhesive 40, 40, parts A, A on the surface, bonding points