M260968M260968
【先前技術】 別是： 使其： 干擾防ϊ隻之送話器者。 按’隨著無線通訊科技的發達，現代人的溝通方式有 了長足的進步，而送話器更是通訊器材中不可或缺的元件 之一’送話器話質的穩定與體積的縮減亦是業界開發研究 的重點； 請參閱台灣專利公告第5 2 2 7 4 5號，『製造電容 式麥克風的方法』，由該案第一圖所示可知，習用電容式 送話器主要係以鋁或其它金屬形成一具有音孔的外殼，配 ^ 木座間隔出適當的空間’並將隔膜、隔膜環、塾圈斑 背孔板置入其中形成電容器，最後以設有晶體之印刷電路 板做為底盍’與外殼娜合’令送話器内部各元件封入殼體 中，藉由上述之結構，使聲波可由音孔傳入，當隔膜受到 聲波拍擊時便產生電壓變化，以電壓訊號傳輸至晶體，經 由晶體將該訊號放大，而傳輸至外部的聲音訊號端。 然，此種習用之電容式送話器無法避免地會有以下缺 失： 1 、以金屬材質做為送話為之设體者，由於金屬普遍 隔熱效果差，故送話器内部之元件容易受溫度變化之影響 ’而降低送話器之靈敏性。[Prior art] Don't: Make it: Interfere with the microphone of the microphone. According to 'With the development of wireless communication technology, modern people's communication methods have made great progress, and the microphone is one of the indispensable components in communication equipment.' The stability of the microphone quality and the reduction in volume have also It is the focus of research and development in the industry; please refer to Taiwan Patent Bulletin No. 5 2 2 7 4 5 "Method of Manufacturing Condenser Microphone". As shown in the first picture of the case, the conventional condenser microphone is mainly made of aluminum. Or other metal to form a shell with a sound hole, with a wooden seat to separate the appropriate space ', and insert the diaphragm, diaphragm ring, and ring-shaped back hole plate into the capacitor, and finally use a printed circuit board with crystals For the bottom of the case, the inner components of the microphone are sealed in the housing. With the above structure, the sound waves can be transmitted through the sound hole. When the diaphragm is struck by the sound waves, a voltage change is generated. The signal is transmitted to the crystal, the signal is amplified through the crystal, and transmitted to the external sound signal terminal. However, this conventional condenser microphone will inevitably have the following defects: 1. For those who use a metal material as the microphone, the components inside the microphone are easy due to the generally poor thermal insulation effect of metal. Affected by temperature changes', reducing the sensitivity of the microphone.
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2、在送話器等無線通訊哭姑说、心 代為材逐漸朝向高頻、高霤斂 度、高整合度發展的同時，電磁μ 用回Α敏 丁 电磁干擾的問題亦逐漸受到重 視，習用之送話器並無法對電磁+掉^ + 刊又巧垔 ^ J电磁干擾做有效的防護，因此 勢必無法滿足使用者之需求。 3、習用之送話器受限於結構，故多採用單一組裝之 方式，如此不僅需要較多的人工操作，且良率亦較低，再 者，以鉚合方式組裝之送話器，會使殼體結構略為變形， 導致表面電荷不穩定，因此習用送話器在出廠之前必須再 多經過一道老化程序，使其表面電荷穩定。 、 因此就整體而言’其可說是相當地不具有實用性，實 有加以改良之必要。 【新型内容】 本創作之主要目的在於提供一種電容式陶瓷基板送話 器’其可改善習用電容式送話器之結構不易生產，且易受 溫度影響送話器靈敏度及電磁干擾防護效果不佳等缺失。 為達成前述之創作目的，本創作係利用陶瓷製成上基板、 定位基板及下基板’並將其貼合做為送話器之架構及殼體 ’利用聲波拍擊振動膜而使振動膜與極板所形成之電壓值 產生變化’並將電壓訊號輪出至晶體，放大訊號後並傳輸 至外部的聲音訊號端。 如下就本創作電容式陶瓷基板送話器，作一整理論述 ’俾使審查委員對本創作獲致更進一步之瞭解： 1 、利用陶瓷隔熱耐熱之特性，使送話器内部之電特 性不易文到影響，故可維持送話器之靈敏性。2. While wireless communication such as microphones cried, the mind generation gradually developed towards high frequency, high degree of convergence, and high integration. At the same time, the problem of electromagnetic interference from the use of electromagnetic μ back to Amin Ding gradually received attention. The microphone can't effectively protect against electromagnetic interference, ^ + journals and ^ J electromagnetic interference, so it is bound to fail to meet the needs of users. 3. Conventional microphones are limited in structure, so they are mostly assembled in a single way. This not only requires more manual operations, but also has a low yield. Furthermore, microphones assembled by riveting will The shell structure is slightly deformed, causing the surface charge to be unstable. Therefore, the conventional microphone must undergo an additional aging process before it leaves the factory to stabilize its surface charge. Therefore, as a whole, it can be said that it is not very practical and it is necessary to improve it. [New content] The main purpose of this creation is to provide a capacitive ceramic substrate microphone, which can improve the structure of conventional capacitive microphones, is difficult to produce, and is easily affected by temperature. Microphone sensitivity and electromagnetic interference protection are poor. Etc. Missing. In order to achieve the above-mentioned creative purpose, this creative work uses ceramics to make the upper substrate, positioning substrate and lower substrate, and attaches them to the structure and housing of a microphone. The voltage value formed by the electrode plate changes, and the voltage signal is output to the crystal, and the signal is amplified and transmitted to the external sound signal terminal. The following is a compilation and discussion on the creation of the capacitive ceramic substrate microphone. 'This will enable the review committee to gain a better understanding of this creation: 1. Use the characteristics of ceramic heat insulation and heat resistance to make the electrical characteristics inside the microphone difficult to understand. Effect, it can maintain the sensitivity of the microphone.
M260968 創作說明（3) 2、陶瓷基板 通訊器材日益發展 自然更具市場競爭 3 、有別於習 陶瓷基板送話器更 生產製造’如此可 容易維持產品品質 因此本創作實 ’相當值得產業界 有關 圖所 成三 1 0 有才蛋 定環 (1 孔（ 板（ (2 2 ) 音孔 (3 3 1 佳的電磁干 ，電磁干擾 鉚合方式所 S Μ 丁技術 減製造時所 本 第一圖 要係以 其係上 )，其 (43 該 該 而在定 第二容 基板（ 該 設有 創作係 至第三 陶瓷製 基板（ 間並容 )與固 上基板 ，該音 定位基 位基板 室（2 10) 下基板 晶體（ 具有較 的今日 力。 用以殼 適合以 大幅縮 〇 是一種 來推廣 【實 於一種 示，本 塊高頻 )、定 板（4 (44 〇 )上 1 1 ) 2 0 ) 0 )其 ’該第 (11 〇 )係 )，該 相當具 ，並公 施方式 電容式 創作之 基板做 位基板 1 )、 )’其 下表面 係供聲 上則形 餘面g 一容室 )之孔 為陶I 晶體（ 有實 諸於 ] 陶瓷 電容 為送 (2 絕緣 中： 適當 波傳 擾防護效果，在無線 防護效果好的產品， 製造出來之送話器， ，採取大排版的方式 需之人力與時間，並 用性及進步性之創作 社會大眾。 基板送話器，請參閱 式陶瓷基板送話器主 話器之架構與殼體， 0 )與下基板（3 0 環（4 2 )、振動膜 處係穿設有一音孔（ 入之用； 成有第一容室（21)， 之一部份則另外形成有一 )之孔徑係大於上 (2 徑； 材質 3 1 之印刷電路板，其上 )之閘極（圖未示）M260968 Creation instructions (3) 2. The ceramic substrate communication equipment is increasingly developed and naturally more competitive in the market 3. It is different from Xi ceramic speaker and it is more produced and manufactured 'so it is easy to maintain product quality, so this creative reality' is worthy of the industry The picture shows three 1 0 talented egg fixing rings (1 hole (plate ((2 2) sound hole (3 3 1 best electromagnetic stem, electromagnetic interference riveting method), MEMS technology, reduced manufacturing technology, the first picture when manufacturing It should be tied to it), (43 should be set in the second volume substrate (there is a creative system to the third ceramic substrate (capacity) and fixed substrate, the sound positioning base substrate room ( 2 10) Lower substrate crystal (has relatively strong power today. It is suitable for the shell to shrink substantially. It is a kind of promotion [actually, this high frequency), fixed plate (4 (44 〇) on 1 1) 2 0) 0) Its 'this (11 〇) series), which is quite, and uses the capacitive method to create a substrate for the substrate 1),)' its lower surface is for sound, and there is a residual surface g. The hole of the chamber is a ceramic I crystal. In order to send (2 Insulation: Appropriate wave-transmission protection effects, microphones that are manufactured in products with good wireless protection effects, and the manpower and time required for large typography, and use the progressive and creative creation of the public The substrate microphone, please refer to the structure and housing of the ceramic microphone microphone, 0) and the lower substrate (30 ring (4 2), the diaphragm is provided with a sound hole (for use) The first chamber (21) is formed, and a part of it is additionally formed. The diameter of the aperture is larger than that of the upper (2 diameter; printed circuit board of material 3 1 on it) (not shown).
第8頁 M260968 四、創作說明（4) 係與下基板（3 0 )表面之連結環（3 2 )呈電性導 該連結環（3 2 )之大小則與固定環（4 4 )相近； 體（3 1 )之源極（圖未示）、沒極（圖未示）則與 板（3 0 )底面的輸出端（3 3 )連結，以便與外部 音訊號端接合； 該極板（4 1 )係經過極化而帶有靜電性，極板 1 )係大於上基板（1 〇 )之音孔（1 1 )，而略小 位基板（20)之第一容室（21)，且極板（41 設有數個穿孔（4 1 0 )，該穿孔（4 1 0 )係供聲 入之用； 該絕緣環（4 2 )係與極板（4 1 )等大，其月 動膜（4 3 )與極板（4 1 )分隔出一小段距離； 該振動 定環（4 4 請參閱 將上基板（ 1 0 )之音 2 1 )相連 送話器之殼 環（4 2 ) 環（4 2 ) 電容器，而 )上，並使 3 2 )呈電 膜（4 )係為 第四圖 10) 孔（1 通，以 體與架 、振動 將極板 後再將 固定環 性導通 3 )係 導電材 至第十 與定位 1 )與 上基板 構；而 膜（4 (41 下基板(44 ，且下 與固 質所 一圖 基板 定位(1 後依 3 ) )與 (3 )與 基板 定環 製成 所示 (2 基板 〇 ) 序置 與固 振動 (4 4 )貼合，而 ，本創作於組裝時 0 )貼合，令上基 (2 0 )之第一容 與下基板（3 0 ) 入極板（4 1 )、 定環（4 4 )，以 膜（4 3 )隔開而 貼合於定位基板（ 〇 ) 下基板（3 0 )之連結 通， 而晶 下基 的聲(4 於定 )上 波傳 將振 該固 係先 板（ 室（ 形成 絕緣 絕緣 形成 2 0 環（(3Page 8 M260968 IV. Creative Instructions (4) The connection ring (3 2) on the surface of the lower substrate (30) is electrically conductive. The size of the connection ring (3 2) is similar to the fixed ring (4 4); The source (not shown) and the pole (not shown) of the body (3 1) are connected to the output end (3 3) on the bottom surface of the plate (30) so as to be connected with the external audio signal end; 4 1) is polarized and has electrostatic properties, the electrode plate 1) is larger than the sound hole (1 1) of the upper substrate (10), and the first chamber (21) of the substrate (20) is slightly smaller, And the electrode plate (41 is provided with several perforations (4 1 0), the perforations (4 1 0) are used for sound input; the insulation ring (4 2) is as large as the electrode plate (4 1)), and its monthly movement The membrane (4 3) is separated from the electrode plate (4 1) by a short distance; the vibration fixing ring (4 4 please refer to connecting the upper substrate (1 0) sound 2 1) to the shell ring (4 2) of the microphone Ring (4 2) capacitor, and), and make 3 2) an electric film (4) is the fourth figure 10) hole (1 pass, the body and the frame, the vibration will be polarized, and then the fixed ring conductive conduction 3) the conductive material to the tenth and positioning 1) and the upper substrate structure; The membrane (4 (41 lower substrate (44, and lower and solid) as shown in the substrate positioning (1 followed by 3)) and (3) with the substrate retaining ring are made as shown (2 substrate 0) sequence and solid vibration (4 4) Lamination, and this creation is 0) at the time of assembly, so that the first volume of the upper base (2 0) and the lower substrate (3 0) enter the electrode plate (4 1) and the fixed ring (4 4 ), Separated by a film (4 3) and attached to the connection substrate of the positioning substrate (〇) and the lower substrate (30), and the upper wave transmission of the sound of the crystal base (4) will vibrate the solid system front plate (Chamber (form insulation 2 0 ring ((3
M260968 四、創作說明（5) 1 )係可容 ，如此便完 本創作 音孔（1 1 聲波將拍擊 膜（4 3 ) 距離將會有 (4 3 )貼 結環（3 2 極，以控制 >及極則連結 由晶體（3 大，並經由 由上所 企圖據以對 同之創作精 應包括在本 綜上所 、使用實用 所需，且所 ，所以其具 結構更具功 合我國專利 起專利申請 置於定位基板（20)之第二容室（ 成本創作電容式陶瓷基板送話器之組 於使用時’當聲音訊號經由上基板（ )與極板（4 1 )之穿孔（4 1 〇 ) ，動膜而使振動膜（43)產生震動 震動時’振動膜（43)與極板（4 所改變，而使電壓值產生變化，此時 口之固定壞（44)將會輸出電壓訊 )曰而傳導至下基板（3 〇 )晶體（3 晶體（3 1 )源極對汲極之輸出，而 於下基板（3 〇)之輸出端（3 1 ) ’將原本聲波在電容器上所產生 輸出端（3 3 )輸出至外部的聲音訊 述者僅為用以解釋本創作之較佳實施 本創作作任何形式上之限制，是以， 神下所作有關本創作之任何修飾 創作意圖保護之範轉。 / 述，本創作電容式陶瓷基板送話器在 性及成本效益上，確實是完全符合產 揭露之結構創作亦是具有前所未有的 有「新穎性」應無疑慮，又本創作可 效之增進，因此亦具有「進步性」， 法有關新型專利之申請要件的規^， ，並敬請鈞局早日審查，並給予肯 2 2 )内 裝。 1 0 )之 傳入時， ，當振動 1 )間的 與振動膜 號，經連 1 )之閘 該源極與 ，故可經 的訊號放 號端。 例，並非 凡有在相 更，皆仍 結構設計 業上發展 創新構造 較之習知 其完全符 乃依法提 定0 M260968 圖式簡單說明 第一圖係本創作電容式陶瓷基板送話器之立體分解圖。 第二圖係本創作電容式陶瓷基板送話器之下基板之俯視圖 〇 第三圖係本創作電容式陶瓷基板送話器之下基板之仰視圖 〇 第四圖至第八圖係本創作電容式陶瓷基板送話器組裝過程 之立體剖視圖。 第九圖係本創作電容式陶瓷基板送話器局部放大剖視圖。 第十圖係本創作電容式陶瓷基板送話器組裝完成外觀立體 圖。 第十一圖係本創作電容式陶瓷基板送話器另一角度之外觀 立體圖。 【圖式符號說明】 1 — 一一一送話器 11---音孔 2 0---定位基板 2 2---第二容室 3 0---下基板 3 2---連結環 4 1 —— 一極板 4 2 — 一 一絕緣環 44---固定環 1 0 — 一一上基板 21—一_第一容室 3 1 ———晶體 3 3 —――輸出端 4 10——穿孔 4 3 —――振動膜M260968 Fourth, the creation instructions (5) 1) are tolerable, so this is the completion of the creation of the sound hole (1 1 the sound wave will hit the film (4 3), the distance will be (4 3) a knot ring (3 2 poles, to Control > and poles are connected by crystals (3 majors, and through the above attempts to rely on the same creative essence should be included in this comprehensive research institute, use practical needs, and research institute, so its structure is more functional The Chinese patent filed a patent application and placed in the second chamber of the positioning substrate (20) (the cost of creating a group of capacitive ceramic substrate microphones is in use when the sound signal passes through the perforation of the upper substrate () and the electrode plate (4 1) (4 1 〇), when the diaphragm is moved to cause the diaphragm (43) to vibrate, the diaphragm (43) and the plate (4 are changed to change the voltage value. At this time, the mouth fixation (44) will be broken. Will output the voltage signal) and then be conducted to the lower substrate (30) crystal (3 crystal (3 1) source to drain output, and at the output (3 1) of the lower substrate (30)) the original sound wave The output of the output terminal (3 3) on the capacitor to the external voice announcer is only used to explain the comparison of this creation. Restrictions on the implementation of this creation in any form are based on the paradigm shift of God ’s intention to protect any modification of the creation. / It is stated that the condenser ceramic substrate microphone of this creation is indeed sexual and cost-effective. The structural creation that fully conforms to the production disclosure is also unprecedented and should be considered with “newness”, and this creation can be effectively improved, so it is also “progressive”. It also has the requirements of the new patent application requirements. Kindly ask the Bureau to review as soon as possible and give Ken 2 2) the interior. When 1 0) is introduced, when the vibration 1) and the diaphragm number, the source and the gate of 1) can be passed. For example, not everyone who has made changes in the structural design industry still develops innovative structures compared to the conventional ones. It is based on law. M260968 The diagram is a simple illustration. The first diagram is the creation of capacitive ceramics. The three-dimensional exploded view of the substrate microphone. The second image is a top view of the substrate below the capacitor ceramic microphone of the original creation. The third image is a bottom view of the substrate below the capacitor ceramic microphone of the original creation. Figures 4 to 8 are three-dimensional sectional views of the assembly process of the condenser ceramic substrate microphone. Figure 9 is a partial enlarged sectional view of the condenser ceramic substrate microphone of the creation. The stereoscopic view of the appearance of the completed microphone. The eleventh figure is a perspective view of the appearance of the condenser ceramic substrate microphone at another angle. [Illustration of Symbols] 1 — One by one 11 —Sound hole 2 0 --- Positioning substrate 2 2 --- Second container 3 0 --- Lower substrate 3 2 --- Connecting ring 4 1 ——One pole plate 4 2 —One-one insulating ring 44 --- Fixing ring 1 0 — One on the substrate 21 — one _ first chamber 3 1 ——— crystal 3 3 ——— output 4 4—perforation 4 3 ——— vibration membrane
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