M254770 五、創作說明（1) 【新型所屬之技術領域】 可用—種平面栅格陣列電連接器，尤指-種 器。 曰曰片杈組與電路板之平面柵格陣列電連接 【先前技術】 平面柵格陣列電連接器廣泛應用於電子領域，1 於兩”設^之高密度、高速率之信號了用 模组rm—圖’該種平面栅格陣列電連接器可將晶片 絕緣本體路板9，該平面柵格陣列電連接器設有 侧辟fn其^ 該絕緣本體6設有基體65及四個 ^之收Λ 四個側壁61共同圍成一用於收容晶片模 、、、7之收奋工間63，基體65設有導電區，該導 數呈矩陣排列之踹+跄六描β η 、蓄+ -又有複 壯夕⑽I *槽 導電端子5形成有—"C”形 ί ϋ 且所有導電端子5之彎折之開口均朝向相同， ¥電如子5之上、下兩端分別延伸設有導接臂51及接觸臂 (未圖不），導接臂51及接觸臂分別伸出絕緣本體Μ之上 下表面。組合時，需藉一下壓力使導電端子5發生 變，使導電端子5之導接臂51及接觸臂52分別抵靠於曰/ 权組7及電路板之導電部位，從而將晶片模組7電性連Β接於 電路板9。 、 惟，此種平面栅袼陣列電連接器之導電端子密度較大 ，且在與晶片模組及電路板相導接時，導電端子二^ ^臂 及接觸臂均將因受壓而發生形變，這就使得導電端子之 接臂及接觸臂受壓時因缺乏保護而發生較大之永久變形、， ΙΗΪ 第5頁 M254770M254770 V. Creative Instructions (1) [Technical Field to which the New Type belongs] Available—A kind of planar grid array electrical connector, especially—A kind of device. The electrical connection between the chipset group and the planar grid array of the circuit board [prior art] The planar grid array electrical connector is widely used in the electronic field. The high-density, high-speed signal module is used in the 1 "to 2" setting. rm—Figure 'This type of planar grid array electrical connector can insulate the circuit board 9 of the wafer. The planar grid array electrical connector is provided with a side shield fn. The insulating body 6 is provided with a base 65 and four ^ of them. The four side walls 61 collectively form a receiving room 63 for accommodating wafer molds 7 and 7. The base 65 is provided with a conductive region, and the derivatives are arranged in a matrix of 踹 + 跄 六 描 β η, storage +- There is also a rejuvenation ⑽I * The grooved conductive terminal 5 is formed with a " C "shape, and all the bending openings of the conductive terminals 5 are facing the same direction. The lead arm 51 and the contact arm (not shown), the lead arm 51 and the contact arm protrude from the upper and lower surfaces of the insulating body M, respectively. When assembling, it is necessary to change the conductive terminal 5 by a pressure, so that the conductive arm 51 and the contact arm 52 of the conductive terminal 5 abut against the conductive portion of the right / right group 7 and the circuit board, respectively, so that the chip module 7 is electrically connected.性 连 β is connected to the circuit board 9. However, the density of the conductive terminals of such a planar grid array electrical connector is relatively large, and when it is connected to the chip module and the circuit board, the conductive terminal two arms and the contact arms will be deformed due to pressure. This results in a large permanent deformation of the conductive arm and contact arm due to the lack of protection when pressed. ΙΗΪ Page 5 M254770
甚至導致相鄰兩導電端子間相互 有必要設計一種新型之電連接器 從而影響導接之穩定性 接觸而造成短路。因此 以克服上述缺失。 【内容】 碧’J 4乍曰 pt , 該種電連接器可用重平面栅格陣列電連接器， 本創作提供— 片杈組電性連接至電路板。 導接晶片模組至電路面：3列電連接器，#用以電性 複數導電端子，；Ϊ;太=絕緣本體及收容於其中之 部設有第一安壯=、、、巴Ϊ本體包括一設有導電區之基部，基 排係之嫂早价衣及第二安裝面，導電區設有複數呈矩陣 容槽，自第一零：’ ¥ 收容於對應之端子收 壯 女衣面向上凸出形成有第一凸台，自第二安 ΐ μ ° It出形成有第二凸台，各凸台均處於端子收容槽 、 /了、子收各槽呈交叉排佈。凸台能限制導電端子之 過度形變，從而保證電子設備間之高密度、高速率之传 傳輸之穩定可靠性。 儿 與驾之技術相比，本創作具有以下優點：通過於導電 端^間新增凸台，當導電端子受壓時，該凸台可以抵住導 電端子之自由端，以防止導電端子因過度受 恢復之形變。 …、忐 【實施方式】 帝 f結合參閱第二圖至第五圖，本創作是關於一種用於 電性導接晶片模組4與電路板5之平面柵格陣列電連接器J ’该平面栅格陣列電連接器1包括絕緣本體1 〇及容置於絕 M254770 五、創作說明（3) 緣本體10内之導電端子20。 絕緣本體1 0為一方形板狀結構，其包括基部丨3及基部 1 3周圍之四個側壁1 2，基部丨3之上、下面分別為第一安裝 面130及第一安裝面132，基部13之中央設有導電區，該導 電區設有複數呈矩陣排列之端子收容槽丨丨〇用以收容導電 端子20 ’兩相鄰端子收容槽n〇間之間設有第一凸台134及 第二凸台135，整體上看端子收容槽11()與凸台係呈交又排 佈，且第一凸台134向上凸出而高出第〆安裝面13〇，第二 凸台135向下凸出而低於第二安裝面132。四個側壁12及基 部1 3共同圍成一容置晶片模組4之容置空間1 5。相鄰之側 壁1 2各設有一彈性臂1 2 0用以抵緊晶片模組4。 導電端子2 0大致呈一” c ’，形狀之彎折，且所有導電端 子2 0彎折之開口均朝向相同，該導電端子2 〇之上、下端分 別延伸設有導接臂2 2及接觸臂24，以及自導接臂2 2及接觸 臂24之自由端延伸設置之導接部222及接觸部242，導電端 子2 0係收容於相應之端子收容槽丨丨〇中，其導接部2 2 2向上 延伸出基部13之第一安裝面130且進一步高出第一凸台134 之上端以與晶片模組4上對應設置之導接體4 1 2相導接，導 電端子20之接觸部242向下延伸出基部13之第二安裝面132 並進一步低出第二凸台1 3 5以與印刷電路板5上所設之對應 墊片5 1 2相導接。 從上而下將晶片模組4組裝於電連接器1時，晶片模組 4之側邊將擠壓兩彈性臂丨2 〇，並迫使兩彈性臂1 2 0發生彈 性變形而向靠近側壁丨2方向移動，從而將晶片模組4放入It even leads to the need to design a new type of electrical connector between two adjacent conductive terminals, which affects the stability of the conductive contact, resulting in a short circuit caused by contact. So to overcome the above-mentioned shortcomings. [Content] Bi'J 4 At the beginning, pt, this type of electrical connector can be a heavy-plane grid array electrical connector. This creation provides — a chip set electrically connected to a circuit board. Leading the chip module to the circuit surface: 3 rows of electrical connectors, # for electrically multiple conductive terminals; Ϊ; too = insulating body and the part housed therein is provided with the first security = ,,, and BaΪ body Including a base with a conductive area, a long-early clothes and a second mounting surface of the base row, the conductive area is provided with a plurality of matrix receptacles, from the first zero: '¥ Contained in the corresponding terminal to receive the strong women's clothing facing The first protrusion is formed on the upper protrusion, and the second protrusion is formed from the second safety plate. Each of the protrusions is located in the terminal receiving groove, and the sub-receiving grooves are arranged in a cross arrangement. The boss can limit the excessive deformation of the conductive terminals, thereby ensuring the high-density and high-speed transmission and stability of electronic equipment. Compared with the driving technology, this creation has the following advantages: By adding a boss between the conductive terminals, when the conductive terminal is pressed, the boss can resist the free end of the conductive terminal to prevent the conductive terminal from being excessive. Deformed by recovery. …, [Embodiment] Refer to the second to fifth figures in combination with the f. This creation is about a planar grid array electrical connector J 'for electrically connecting the chip module 4 and the circuit board 5 The grid array electrical connector 1 includes an insulating body 10 and a conductive terminal 20 accommodated in the insulation body M254770. 5. Creation instructions (3) The edge body 10. The insulating body 10 is a square plate-shaped structure, which includes a base portion 3 and four side walls 12 around the base portion 13. Above and below the base portion 3 are a first mounting surface 130 and a first mounting surface 132, respectively. 13 is provided with a conductive region in the center, and the conductive region is provided with a plurality of terminal receiving grooves arranged in a matrix 丨 丨 for receiving conductive terminals 20 'There are first projections 134 between two adjacent terminal receiving grooves n0 and The second boss 135, as a whole, is arranged and arranged in a manner that the terminal receiving groove 11 () intersects with the boss system, and the first boss 134 projects upward to rise above the first mounting surface 13o, and the second boss 135 faces It protrudes downward and is lower than the second mounting surface 132. The four side walls 12 and the base portion 13 together form an accommodation space 15 for accommodating the chip module 4. Each of the adjacent side walls 12 is provided with an elastic arm 12 for abutting the chip module 4. The conductive terminal 20 is approximately a "c ', the shape of which is bent, and the openings of all conductive terminals 20 are oriented in the same direction. The conductive terminal 20 is provided with a guide arm 22 and a contact respectively at the upper and lower ends. The arm 24, and the lead-in portion 222 and the contact portion 242 extending from the free ends of the lead-in arm 22 and the contact arm 24, and the conductive terminal 20 is housed in the corresponding terminal-receiving slot. 2 2 2 extends the first mounting surface 130 of the base 13 upward and further above the upper end of the first boss 134 to be in contact with the corresponding conductive body 4 1 2 provided on the chip module 4, and the contact of the conductive terminal 20 The portion 242 extends downward from the second mounting surface 132 of the base portion 13 and further lowers the second boss 1 3 5 to be in contact with the corresponding pad 5 1 2 provided on the printed circuit board 5. From top to bottom, When the chip module 4 is assembled on the electrical connector 1, the sides of the chip module 4 will squeeze the two elastic arms 丨 2 0 and force the two elastic arms 1 2 0 to deform elastically and move toward the side wall 2, thereby Place chip module 4 in
M254770M254770
電連接器1之收容空間15内，並使電端子2()之導接部m及 接觸邛242分別抵罪於晶片模組4之對應導接體Μ〗及電路 板5之對應墊片5 1 2，從而達到晶片模組4與電路板5之電性 導通。由於兩彈性臂120發生變形將產生一彈性恢複力， 該彈性恢複力將擠壓晶片模組4之侧壁從而將晶片模組4可 靠固持於電連接器1之容置空間丨5中。 從上而下安裝晶片模組4之同時，晶片模組4之導電體 412將同時擠壓導電端子2〇，而促使電端子2〇之導接臂22 及接觸臂24發生形變，並使導接部222及接觸部242將產生 一水平位移’該水平位移促使導接部2 2 2及接觸部2 4 2朝向 其鄰近之一導電端子20運動，此時由於端子收容槽2〇之間 設有凸台，當導接部222及接觸部2 42之水平位移達到一定 程度時，導接臂22及接觸臂2 4之自由末端將分別抵靠於第 一凸台134及第二凸台135之側面，從而防止導接臂22及接 觸臂2 4因受壓而產生過大之無法恢復之水平形變，且因兩 相鄰之導電端子2 0被凸台隔開，亦有效防止了因導接臂2 2 及接觸臂24之水平形變過大而使兩相鄰之導電端子2〇相互 接觸並最終造成短路之問題。 第六圖及第七圖揭示了本創作之第二實施方式，在第 二實施方式中，導電端子20’之導接臂22,及接觸臂24,設 計得相對較短，而第一凸台134’及第二凸台135,設計得相 對較長，導接臂22,所設之導接部2 22’向上延伸出第一安 裝面1 3 0 ’且進一步高出第一凸台1 3 4 ’以便於與晶片模組4， 上對應設置之導接體4 12,相導接，接觸臂24,所設之接觸In the housing space 15 of the electrical connector 1, the lead m and the contact 邛 242 of the electrical terminal 2 () are in contravention of the corresponding lead M of the chip module 4 and the corresponding pad 5 of the circuit board 5 1 2 to achieve electrical conduction between the chip module 4 and the circuit board 5. Since the two elastic arms 120 are deformed, an elastic restoring force will be generated. The elastic restoring force will squeeze the side wall of the wafer module 4 so that the wafer module 4 can be held in the accommodation space of the electrical connector 1 reliably. When the chip module 4 is installed from top to bottom, the conductor 412 of the chip module 4 will simultaneously squeeze the conductive terminal 20, thereby causing the conductive arm 22 and the contact arm 24 of the electrical terminal 20 to deform, and the conductive The contact portion 222 and the contact portion 242 will generate a horizontal displacement. The horizontal displacement causes the lead connection portion 2 2 2 and the contact portion 2 42 to move toward one of the conductive terminals 20 adjacent thereto. There are bosses. When the horizontal displacement of the guide portion 222 and the contact portion 2 42 reaches a certain level, the free ends of the guide arm 22 and the contact arm 24 will abut against the first boss 134 and the second boss 135, respectively. Side surface, thereby preventing the guide arm 22 and the contact arm 24 from being excessively deformed due to pressure and causing horizontal deformation, and two adjacent conductive terminals 20 are separated by the boss, which also effectively prevents The horizontal deformation of the arm 2 2 and the contact arm 24 is too large, so that two adjacent conductive terminals 20 contact each other and eventually cause a short circuit problem. The sixth and seventh figures disclose the second embodiment of the present creation. In the second embodiment, the conductive arm 22 and the contact arm 24 of the conductive terminal 20 'are designed to be relatively short, and the first boss 134 'and the second boss 135 are designed to be relatively long, the guide arm 22, and the provided connecting part 2 22' extend upward from the first mounting surface 1 3 0 'and further higher than the first boss 1 3 4 'to facilitate the corresponding connection with the lead body 4 12, which is provided on the chip module 4, and the contact arm 24, the set contact
第8頁 M254770 五、創作說明（5) 部2 42 ’向下延伸出第二安裝面132,並進一步低出第二凸台 1 3 5以便於與印刷電路板5 ’上所設之對應塾片5 1 2，相導接 ，當晶片模組4擠壓導電端子2 〇 ’時，導電端子2 〇，將發生 形變而使接觸部242’及導接部222，互相靠攏，同時導接臂 22,及接觸臂24之末端將向端子收容槽中收縮。當導電端 子20,受壓至一定程度時，第一凸台丨34,及第二凸台35，將 分別抵靠與晶片模組4’及電路板5，而阻止導電端子2〇，因 進一步受壓而損壞。Page 8 M254770 V. Creative Instructions (5) Section 2 42 'Extends the second mounting surface 132 downward, and further lowers the second boss 1 3 5 so as to correspond to the setting on the printed circuit board 5' The pieces 5 1 2 are in phase connection. When the chip module 4 presses the conductive terminal 2 0 ′, the conductive terminal 2 0 will be deformed to bring the contact portion 242 ′ and the conductive portion 222 closer to each other, and at the same time guide the arm. 22, and the end of the contact arm 24 will shrink into the terminal receiving groove. When the conductive terminal 20 is pressed to a certain extent, the first boss 34 and the second boss 35 will abut against the chip module 4 'and the circuit board 5, respectively, and prevent the conductive terminal 20, because further Damaged by compression.
上所述’本創作確已符合新型專利要件，爰依法 專利申請。惟，以上所述僅為本創作之較佳實施例，舉凡 熟悉本創作技術之人士爰依本創作之精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。The above-mentioned 'this creation has indeed met the requirements for new patents, and has applied for a patent in accordance with the law. However, the above is only a preferred embodiment of this creation. For example, those who are familiar with this creation technology and make equivalent modifications or changes based on the spirit of this creation should be covered by the following patent applications.
M254770 圖式簡單說明 【圖式間單說明】 第一圖係習知平 珂之 .^ 十面栅袼陣列電連 立體圖。 運接杰與晶片模組組合莉 第 ” 創作之平面拇格 口口 前之立體圖。 連接為與晶片模組組合 !三圖係第二圖沿瓜-瓜方向之剖視圖。 弟四圖係本創作之平面栅格陣列電連接器與晶片模組組合 後之立體圖。 ϋ 第五圖係第四圖沿ν — ν方向之剖視圖。 第六圖係本創作之第二實施例之平面栅袼陣列電連接器與 晶片模組組合前之示意圖。 第七圖係本創作之第二實施例之平面栅格陣列電連接器與 晶片模組組合後之示意圖。 【主要元件符號說明】 晶片模組 絕緣本體 側壁 基部 弟二安裝面 弟二凸台 導電端子 導接部 接觸部 電路板 4 平面柵格陣列電連接器 1 端子收容槽 彈性臂 第一安裝面 第一凸台 容置空間 導接臂 接觸臂 導電體 墊片M254770 Brief description of the drawing [Description of the drawing between the drawings] The first drawing is a three-dimensional view of the electrical connection of the tens-face grid array. Yun Jiejie and the chip module combination Lidi "created a three-dimensional view in front of the plane thumb. Connected to the chip module combination! The third figure is a cross-sectional view of the second figure along the direction of the melon-melon. A perspective view of the planar grid array electrical connector combined with the chip module. Ϋ The fifth figure is a cross-sectional view taken along the ν-ν direction of the fourth figure. The sixth figure is a planar grid 袼 array of the second embodiment of this creation. The schematic diagram before the connector and the chip module are combined. The seventh diagram is the schematic diagram of the planar grid array electrical connector and the chip module in the second embodiment of this creation. [Description of the main component symbols] Insulating body of the chip module The base of the side wall, the second mounting surface, the second boss, the conductive terminal, the conductive portion, the contact portion, and the circuit board. The planar grid array electrical connector. The terminal receiving groove. The elastic arm. The first mounting surface. The first receiving space. Body gasket