TWM253907U - Light emitting diode - Google Patents

Description

4. Description of Creation (1) [Technical Field] This creation relates to the structural design of a light-emitting diode; in particular, an improved new type that can significantly improve the heat dissipation effect of the light-emitting diode [previous technology] f 'Light-emitting diodes (LEDs) have been widely used in various electrical products and systems; from indicators with weak light-emitting efficiency to high-intensity LED lighting, outdoor signage, and traffic signs .. .... and other lighting fixtures. The basic dagger uses a kind of operation at the forward biased PN interface. When the forward bias is often injected into a large number of holes in the P-type region, a large number of holes and electrons are injected in the N-type region. In each case, a small amount of injection is made into another region, so at the moment when it is combined with a large number of carriers there, the radial path is equivalent to the photon of the energy gap energy, and a luminous effect is produced. The conventional polar body is a metal suitable for conducting electricity through a plurality of equidistantly-connected metals. The surface of the bracket is plated with silver. The semiconductor wafer is fixed to the support. The light source is a light emitting diode. The ends are respectively connected to the bracket. Note: Γ and the anode and cathode are respectively formed; and the epoxy resin is casted + ^ on ° to make it a light-transmitting body, and the energy equal to the sealing wafer and the wire is equal to 程This artist knows that most of the light-emitting diodes are damaged by heat: = Failure to eliminate the heat will cause a part of the heat of the wafers passing through the holder to accumulate in the light-transmitting body, and a part of the fat is processed into Ξ: & The second pin radiates. However, because the light-transmitting system uses epoxy resins with a low rate, the heat generated by the wafer is mostly stored in M253907.

In the translucent body, heat cannot be efficiently dissipated, and there is a problem that the heat dissipation efficiency is low. / 、 This crime stent conductive heat dissipation can improve the problem discussed above. It is disclosed in the 9200i 3 Diode stent system. In the patent case, the stent has been designed in a diode stent. Butt pin, * 1 produced by the demon II of the chip: The second pin is increased outside, and in practical use, it is scattered; the support pin is emitted ... in a more ideal and perfect use case. In terms of non-existent devices, transparent bodies are sealed on the upper end of all known conventional UD UMp brackets', and are covered with a thickness of about ^ =) in all areas of the cup bottom of the cathode bowl to attach the LED chip, but also because of this The two cause the main cause of hindering the emission and heat dissipation of the heat, because no matter whether the LED chip of high or low power is in the conduction point shell, the different proportional heat sources are generated due to the different power, and whether the heat source can be quickly conducted and radiated It affects the light-emitting effect or lighting efficiency that the light-emitting diode can produce. In the above reference materials, for example, Patent No. 8 2 1 8 3 9 4 "Structure Modification of Light-Emitting Diode Bracket", No. 90201308 "Light-Emitting Diode Bracket" Patent Case, etc., have been disclosed to increase the connection The concept of the importance of the feet to improve the high-heat emission problem of the light-emitting diode; however, these references do not disclose the special improvement or design of the light-emitting diode structure. If the design of the light-emitting diode structure is reconsidered, and its structure is different from that of the user, it will change its use pattern and be different from the old method; in fact, it will significantly increase its heat dissipation efficiency; for example, How to add packaging without adding brackets

iviz ^ jyu7 IV. Creation instructions (3) Volume conditions y: k ^, thermal area or structural design or “models with large divergences have not been suggested as a good way. These issues are in the aforementioned patent case [ Contents] Structural changes ^ This = the main purpose of the purpose is to provide a light-emitting diode for the purpose of the light-emitting diode to form a significantly increased heat dissipation area of the fixed wafer configuration of the df type, typically including useful The joints are defined as 22: r, which are connected to each other and contain at least two pin units, respectively: ί: f is connected to the wafer and the joints in the central portion, and is arranged sideways; the model body is along the central portion. The outwardly rigid wall contains a continuous arrangement of ridges and valleys; the wall defines a trough or chamber; the adjacent rows have at least Least's with a set distance to jointly build the model hT W is combined with a groove structure with a heat dissipation mechanism. Therefore, the space between the two feet of the model body includes the grooves or chambers and a larger heat dissipation area per isomorphism r Those who produce heat during the work.-上 ： ί ί f As an improvement of the structure of the light-emitting diode, the model system is equipped with a & 卩 module combined with the stamping of a conductive metal flat blank, and the rigid walls of the continuous arrangement of the grooves at a set distance and the above effects have The new nature, characteristics, and other purposes and functions are illustrated in detail in the drawings, and tend to be understood; page M253907 code, creation instructions (4) [Implementation, Department: 2 and Fig. 3 The improved structure 10 of the light-emitting diode in this creation includes Ϊ Γ, which is generally referred to by reference number 10; this model body. ^ ^ Is used to fix the middle of the cup X of the cup holder 1 1 of the wafer X 〇 3 terminals, and a pin unit 14 with an anode terminal, a circuit board, built to fit in this creation i: 'The imaginary line part of it is shown at the same time-a bond fixed to the central part 1 2 = ΐι piece The X series can be contained in the cup holder 1 1 of the central port 丄 丄 2 and allow wires :: Do not connect the wafer x and the joint 丄 4; then, the device: a light transmitting body z made of a fat material is The upper part of the model body 10: the piece X, the lead y, and the central part! 2 and the top end 2 of the bonding material 4 are in a better embodiment. In the example, the model body i 0 has a plurality of layers of rigid walls 15, 1, 1, and 15 defined by the rigid wall 15, which are arranged along the portion 12 toward the outside. 5, t package and connecting two adjacent arrays "Sexual wall 5, 丄 5, 邛 圏 number system is marked in Figure 4) · Rigidity of the neighbours 璧 1 5, 1 5, between, with the right one # As a result, the mold body 10 is formed to form a groove structure at least 18 inches apart. Please refer to Figures 2 and 3 for the formation of the heat-dissipating path. In the example of the green too, it is selected-with better extension = = M253907 IV. Creation instructions (5) The blank 20 passes through an upper and lower part The module (not shown in the figure) cooperates with the stamping operation P ′ to form the model body 10 including the rigid walls 15 and 15 of the connection arrangement of the ridge 16 and the valley 17, for example, as shown in FIG. 4 The situation shown. Figure 4 also reveals that the flat blank 2 〇 can form the grille structure 2 2 on both sides or the periphery 2 1 ′ of the central portion 12; the lattice group f 2 2 is the model body 1 〇 The conduction distance to the outside is short. Therefore, the working heat emission rate of the light-emitting diode wafer x will be relatively increased. Therefore, in Figures 4 and 5, it is revealed that the model body 10 is designed to increase the heat dissipation surface area. It can have the following structural features at the same time: 1. Each of the rigid walls 15 and 15 has an interval of 18 to form an adjacent and continuously arranged organization. 2. The adjacently arranged rigid walls i5 and 丄 5 include a ridge portion 丄 β and a valley portion 17 and a connected state is formed in a region of the valley portion i7. 3. Each of the rigid walls 15 and 15 makes at least one end of the ridge 1 β or the valley 7 form a conductive state with the outside world. 4. The lower part of the cup holder 11 of the central part 12 of the model body forms a groove or chamber 19 which is in a conductive state with the outside, and is bounded by the rigid wall 15. 5. The rigid body 15, 15 of the model body, the ridge portion 16 or the valley portion 17 and the tank or cavity 19 are in communication with the outside world, and the model body 10 forms a grid. Organization 22 is based on an increase in convective heat dissipation with the outside air.

M253907 IV. Creation instructions (6) Therefore, the heat dissipation mechanism of the model body 10 is shown in this creation except foot 14, material == Including each-rigid wall i 5, i 5, "inner end face And the outer end surface = the sum of the products, and the hollow part chambers 19 of the central part 12 and the lower part in an open form. It also reflects that it will have better heat dissipation efficiency than the old method of adding pins.故 Therefore, in the above description, the improvement of the structure of the light-emitting diode has increased the surface area of heat dissipation as much as possible. The design of the space type is different from that of the conventional one, and it is incomparable with the old method The advantages have indeed shown considerable progress.

Page 10 M253907 Brief Description of Drawings Figure 1 is the appearance diagram of this creation; of which, the imaginary line part shows the chip mounting position and the status of the packaged light body. Figure 2 is a schematic plan view of a model body stamped on a flat metal blank. FIG. 3 is a schematic cross-sectional sectional view of FIG. 2. Figure 4 is a three-dimensional cross-sectional view of the rigid body and the central part of the model body after the stamping operation. FIG. 5 is a schematic cross-sectional view of FIG. 1. Drawing number comparison description:

1 0 model body 1 1 cup holder 1 2 central portion 1 4 joint portion 1 4 ′ pin unit 1 5、1 5 ′ rigid wall 1 6 ridge portion 1 7 valley portion 1 8 pitch

1 9 tank or cavity 2 0 flat blank 2 1 on both sides or periphery 2 2 grid structure X wafer y wire

P.11 M253907 Brief description of drawings

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Claims (1)

M253907 V. Scope of Patent Application 1. An improvement of the structure of a light-emitting diode, which has a model body. The system includes a central part for fixing a cup holder of a wafer, and an interconnected unit including at least two pin units. The joint portion and a wire connected to the wafer and the joint portion are respectively defined as a cathode and an anode end guide. The improvement includes: a plurality of layers of rigid walls arranged along the center of the model body toward the outer side and the rigid wall definition A trough or cavity; each rigid wall has a set spacing to form a continuous array of organizers. 2. The improvement of the light-emitting diode structure as described in item 1 of the scope of patent application; wherein each of the rigid wall systems includes a ridge portion and a valley portion. 3. The improvement of the light-emitting diode structure described in item 2 of the scope of patent application; among them, the valley region of each rigid wall is formed in a connected state. 4. The improvement of the structure of the light-emitting diode as described in item 1 of the scope of the patent application; wherein the groove or cavity of the model body is formed in the lower part of the cup holder of the central part; . 5. The improvement of the light-emitting diode structure as described in item 4 of the scope of the patent application; wherein the tank or cavity is defined by a rigid wall (1 5). 6. The improvement of the light-emitting diode structure as described in item 2 of the scope of the patent application; wherein each of the rigid walls makes at least one end of the ridge or the valley to be in a conductive state with the outside. 7. The improvement of the structure of the light-emitting diode as described in item 1 of the scope of the patent application; wherein ‘two sides or the periphery of the central part of the model body forms a grid structure. 0 Page 13