M248190 五、創作說明（1) ---------—- 【新型所屬之技術領域】 ☆創作所要採纣的軟性印刷電路板早期是由美國杜邦公 5汗务AKapton的材料之後才開始發展的。由於當時 口ap:〇n疋非常昂貴的材料，因此只應用在航太及軍規產 I Κ # 9〇年代後，軟性電路板除了製造技術的進步之外， :0 Γ也越來越發達。使用軟性電路板的設計與傳統印 i ^ ,反有所不同’雖然軟性電路板的單價較高，但由於 ς莖溥、可曲撓的特性，在產品設計輕薄短小的趨勢 piu’使a用軟性電路板是不得不然的作法，例如數位相機、 ^ "己型電腦、液晶顯示器、行動電話等電子產品，都 !可見對軟性電路板的使用需求。 【先前技 軟性印 環境已經 具備的電 絕緣電阻 高頻特性 這些特 電路板本 的特性， 態，以決 望導體的 配線很顯 術】 刷電路 南級化 氣特性 ，交流 、電磁 性與印 身的構 選擇適 定其製 配線電 然的細 板是一 ，成為 也跟著 特性的 封閉性 刷電路 造有極 當的材 造的程 阻儘量 微化而 種電氣而速、 担古 · 攸冋 ， 特性阻 等。 板的構 '大的關 料和構 序。如 降低， 導致電 零件，在所應 高性能的產品 包括直流特性 抗、信號傳輸 成材料、配線 聯，設計者必 造，並規劃出 第一圖所示， 惟線路在高密 阻增大的不利 用之電子設備 時，其被要求 的導體電阻與 速度、串訊、 規劃、及印刷 須依照所指定 較佳的線路狀 例如設計者希 度規劃時，因 情況；又，信M248190 V. Creation Instructions (1) -------------- [Technical Field to which the New Type belongs] ☆ The flexible printed circuit board to be used in the creation was only after the materials of the American DuPont 5 Khan service AKapton. Began to develop. Since the mouth ap: 〇n 的 was a very expensive material at that time, it was only used in aerospace and military regulations. After the 1990s, in addition to advances in manufacturing technology for flexible circuit boards,: 0 Γ also became more and more developed. The design of the flexible circuit board is different from the traditional printed circuit board. ^ Although the unit price of the flexible circuit board is higher, due to the characteristics of flexible stems and flexibility, the trend of thin and light product design is piu '. Flexible circuit boards are obligatory, such as digital cameras, electronic computers, LCD monitors, mobile phones and other electronic products. All of them show the demand for the use of flexible circuit boards. [The high-frequency characteristics of electrical insulation resistance already possessed by the prior art flexible printed environment are the characteristics of these special circuit boards. In order to determine the wiring of the conductor is very obvious.] Brush circuit south-level gas characteristics, AC, electromagnetic and printed body The choice of structure is suitable for making the wiring. The thin plate is a closed brush circuit that also follows the characteristics. The process resistance is made as small as possible, and it is electrically and quickly. Characteristic resistance and so on. The structure of the board's big material and structure. If it is reduced, it will cause electrical parts. The products with high performance should include DC characteristic impedance, signal transmission materials, and wiring connections. The designer must make it, and plan out the first picture. When using electronic equipment, the required conductor resistance and speed, crosstalk, planning, and printing must be in accordance with the specified better circuit shape. For example, when the designer intends to plan, due to circumstances;
第4頁 M248190 五、創作說明（2) 號線路的走 側，則在另 (一般稱為 時會變得特 線之間的間 線路中，有 到整合特性 為使高密 與限制，一 空間分散線 程，使製造 【内容】 創作人特 軟性印刷電 線防焊層， 這些預定的 置印刷線路 的電氣特性 設計的製造 產品競爭力 至於本創 供較佳實施 別設計 路板， 再於防 導線成 ，用以 在標準 流程減 ，為本 作之詳 例之圖 的軟性印刷 成型後以二 佈設銀漿， 態，藉跳接 線路的佈局 内’而又比 使這類型的 要目的。 其他之功能 即可以完全 施加電壓 會感應出 )，這種 種串訊的 間的間隙 難，且接 處理。 少以上諸 板設計為 ，這樣的 於產品的 向愈趨複雜化，若 —側的鄰接導線上 串訊，cross talk 別明顯。要減少這 隙及縮小與接地之 加大導線間隙的困 限抗的限制而難以 度化的線路規劃減 般的作法是將電路 路規劃的密度；惟 的成本提兩而不利 一種新穎 是在單面 焊層表面 為導通狀 降低單面 的範圍以 化許多， 創作之主 細構造及 式及說明 在平行信號線的一 電壓，而變成雜音 現象在高密度配線 發生，就要加大導 ’但在高密度化的 地間隙的調節又受 多不利因素的干擾 雙面板，藉雙面的 作法勢必要增加製 市場競爭。 電路板構造，這種 次鑽孔於預定的導 使銀漿滲入孔内與 f路而可以靈活配 :f，維持電路板 上述習用之餡& 4 更具有低價的 ’請參閱以下所提 明瞭。 T私Page 4 M248190 V. Creation Note (2) The side of the line, in the other (commonly referred to as the special line when it becomes a special line), there are integrated characteristics to make high density and restrictions, a space scattered Thread to make [content] the creator of special soft printed wire solder mask, the electrical characteristics of these predetermined printed circuit design manufacturing products competitive It is used to reduce the standard process. This is a detailed example of the figure. After the flexible printing is formed, the silver paste is arranged in two states. By using the jumper circuit, it is more important than this type of purpose. Other functions are It can be induced by fully applying the voltage), the gap between such crosstalk is difficult, and it is connected. The design of the above boards is less, so that the product orientation becomes more and more complicated. If there is cross talk on the adjacent wires on the-side, the cross talk is not obvious. In order to reduce this gap and reduce the grounding and increase the gap between the wires, it is difficult to reduce the circuit planning. The general method of reducing the circuit planning is to reduce the density of the circuit plan; The surface of the surface solder layer is conductive to reduce the range of the single surface. The main structure and formula of the creation and the description of a voltage on the parallel signal lines, and the noise phenomenon occurs in high-density wiring. The adjustment of the high-density ground clearance is also disturbed by multiple unfavorable factors, and the double-sided board is bound to increase market competition. Circuit board structure, this secondary drilling can be flexibly matched with the f channel to allow the silver paste to penetrate into the hole: f, to maintain the conventional filling of the circuit board & 4 has a lower price 'see below Clear. T private
第5頁 M248190 五、創作說明（3) 【實施方式】 如第二圖所揭露者 面板（1 )成型後以二 焊層表面佈設銀聚（ 定的導線成為跳接導 )而達到減化印刷線 效。 第三〜五圖係本創 作之軟性印刷電路板 )，其防焊層（11 ) 線路（1 2 )的圖案上 )方式覆蓋這些導電 第四圖，在這個已成 )至預定的導電線路 銀漿（2 )，使銀漿 線（1 4 )成為跳接導 線路方面，藉這樣的 刷線路與節省製造成 覆蓋第二防焊層（1 5 上述中，銀漿（2 ) 耐曲撓的特性。 以上之實施例僅是 較佳狀態，並非用以 構、材質或簡易之設 ’本創作之軟性印刷電路板，是在單 二次鑽孔於預定的導線防焊層，再於防 2 ) ’使銀漿（2 )滲入孔内與這些預 通狀態，藉銀漿的導通來跳接線路（3 路的配置與節省製造成本的使用功 ，之製作流程。如第三圖所示，本創 ^以P I (聚亞醯氨薄膜）為基材㈠〇 是在該電路板基材（1 0 )佈設有導電 ，預先以LPI (或ΡΙ(])塗佈（或感光 線路2 ) |其得到保護與絕緣；見 型的單面電路板上施以二次鑽孔（1 3 (14)，再於防焊層（11 )表面佈設 甬孔（13)内與這些預定的導 通狀態（如第五圖）’特別是在接地 ΪΪ:路可以達到靈活、減化配置印 f的使用功效；最後再於外表面另行 的佈設以網狀為主，用 用Μ維持電路板 利用本創作之技術特徵所 限制本創作，舉凡其他 而出之 計變更，均應為本創作之類似結 卜之專利範圍所 M248190Page 5 M248190 5. Creation instructions (3) [Embodiment] As shown in the second figure, the panel (1) is formed with silver poly on the surface of the second solder layer (the fixed wire becomes the jumper lead) to reduce printing. Line effect. The third to fifth pictures are the flexible printed circuit boards of this creation). The solder resist (11) and the pattern of the circuit (1 2) are covered with these conductive fourth pictures. Paste (2), so that the silver paste line (1 4) becomes a jumper guide line, and by using such a brush circuit and saving to manufacture to cover the second solder resist layer (1 5 of the above, the silver paste (2) is resistant to flexion) The above embodiment is only a good state, and is not used to construct, material or simple design. The flexible printed circuit board of this creation is drilled in a single or a second time to a predetermined wire solder mask, ) 'Make the silver paste (2) infiltrate into the hole and these pre-connected states, and use the conduction of the silver paste to jumper the line (the 3-way configuration and the use of work to save manufacturing costs. The manufacturing process. As shown in the third figure, This invention uses PI (polyurethane film) as the substrate. 〇 is conductive on the circuit board substrate (1 0), pre-coated with LPI (or PI (]) (or photosensitive circuit 2) | It is protected and insulated; see the single-sided circuit board for a second drilling (1 3 (14), and then the solder mask (11 ) The surface is provided with the predetermined continuity in the hole (13) (such as the fifth figure), especially in the ground connection: the road can achieve a flexible and reduced use of the configuration f; finally, another route on the outer surface Mainly mesh, using M to maintain the circuit board, using the technical features of this creation to limit this creation, and all other changes, should be covered by the similar scope of the creation of the patent M248190
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