TWM244587U - LED with compound reflection structure - Google Patents

LED with compound reflection structure Download PDF

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Publication number
TWM244587U
TWM244587U TW92215841U TW92215841U TWM244587U TW M244587 U TWM244587 U TW M244587U TW 92215841 U TW92215841 U TW 92215841U TW 92215841 U TW92215841 U TW 92215841U TW M244587 U TWM244587 U TW M244587U
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Taiwan
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light
emitting diode
layer
reflective
type semiconductor
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TW92215841U
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Chinese (zh)
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Wei-Tai Jeng
Ruei-Hung Ye
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Ite Compound Semiconductor Cor
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Publication of TWM244587U publication Critical patent/TWM244587U/en

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M244587 五、創作說明(l) 一、 【新型所屬之技術領域 本創作係一種具化合物反射結構之發光二極體,尤彳t 一 可使發光二極體於發出光源時,藉由各反射層分別^ j種^射入之光源,使達到減少發光二極體之光源散 逸,k幵該發光二極體於使用上之亮度,而適用於 不看板、賣場、展示照明、廣告看板七"颍 品之結構者。 ⑽及…、月具專或類似物 二、 【先前技術】 按,一習用之發光二極體(如第6圖所示),苴 明基板5、一N型半導體層6、一發光 二:由一透 =7所構成,而其中該N型半導體“係層疊於H導 5上’而該發井屏a 9总麻田 λτ 運月基相 刑主i μ 層6 2係層豐於Ν型半導體層6上,而 L型丰Λ7係層疊於發光層6 2上,且型半導:^ 及巧+導體層7上係分別具有一電 :2層6 N型電極6 X及?型電極使違電極被定義為 而當該習用之發光二極體於發光:構::發光二極體。 侧半導體層6及P型半導體:7寺之有-部分由 分之光源則由透明基板5之: 表面射出,而另—部 6及P型半導體層7之表面僅;面射出’而使灣半導體層 部分之光源則由透明基板 b $出一部分光源,至於另— 逸之現象,進而導致該笋二面射出,而使該光源形成散 故無法提供該發光二體:極體於使用時之亮度減弱, 度。 體於發光時所實際發出之光源亮 另有—習用之發光二極體 (如弟7圖所示),其係由—反 第5頁 M244587 五、創作說明(2) :層2 (或-金屬層)、-透明基板5、-N型半導體:N 型半暮^光層6 2及一 P型半導體層7所構成’而其中⑨於n 刑坐、曾體層6係層疊於透明基板5 ,而該發光層.廣貪9 上,體層6上,而該P型半導體層7係層疊於發光廣 剞φ ί 型半導體層6及P型半導體層7上係分別具有*者 &電極6 1 u 。^ /目1丨設$ 而於透明基板5底面則 . 於遂明基 型電極b 1只 n # e 6 丄及一p型電極7丄 該反射層β 4c;〔 — σ ,如是構成一發光二極體。而藉由設π — 0 面夕 口口 — n-t: *^rM244587 V. Creation instructions (l) 1. [Technical field to which the new type belongs This invention is a light-emitting diode with a reflective structure of a compound, especially a light-emitting diode that can emit light through a reflective layer Respectively ^ j kinds of irradiated light sources, so as to reduce the dissipation of the light source of the light emitting diode, k 幵 the brightness of the light emitting diode in use, and is suitable for non-kanban, store, display lighting, advertising kanban " The structure of fakes. (2) [Previous technology] According to a conventional light-emitting diode (as shown in FIG. 6), the substrate 5, an N-type semiconductor layer 6, and a light-emitting diode: It consists of a transparent = 7, and the N-type semiconductor is "stacked on the H-conductor 5" and the hairwell screen a 9 total Asada λτ Yunyue phase punishment main i μ layer 6 2 series layer is richer than the N-type On the semiconductor layer 6, the L-shaped Λ7 series is stacked on the light-emitting layer 62, and the type semiconductors: ^ and Q + conductor layer 7 respectively have an electric: 2 layers 6 N-type electrodes 6 X and? -Type electrodes Let the illegal electrode be defined as when the conventional light-emitting diode is used to emit light: structure :: light-emitting diode. Side semiconductor layer 6 and P-type semiconductor: 7 temples have-part of the light source is made of transparent substrate 5 It is: the surface is emitted, and the surface of the other-portion 6 and the P-type semiconductor layer 7 is only; the surface is emitted, and the light source of the semiconductor layer portion is part of the light source from the transparent substrate b. As for the other—the phenomenon of escape, which leads to The bamboo shoots are emitted from two sides, so that the light source is scattered, so the light-emitting two-body cannot be provided: the brightness of the polar body when used is weakened, and the degree. The light source actually emitted when it emits light is another—the conventional light-emitting diode (as shown in Figure 7), which is based on—Reverse Page 5 M244587 V. Creative Instructions (2): Layer 2 (or-metal layer) ), -Transparent substrate 5, -N-type semiconductor: N-type semi-Twilight ^ light layer 6 2 and a P-type semiconductor layer 7 ', and the n-type semiconductor layer, the body layer 6 is laminated on the transparent substrate 5, and The light-emitting layer 9 is on the body layer 6 and the P-type semiconductor layer 7 is laminated on the light-emitting semiconductor layer 6 and the P-type semiconductor layer 7 each having an electrode & electrode 6 1 u. ^ / 目 1 丨 Set $ on the bottom surface of the transparent substrate 5. In Suimingji-type electrode b 1 n # e 6 丄 and a p-type electrode 7 丄 the reflective layer β 4c; [— σ, if it constitutes a light-emitting Diode. And by setting π — 0 面 夕 口 口 — nt: * ^ r

再反鼻〈早一反射層8 ,使得光源透過透明基板5时J 其係由一 ,一層豐 $:部份之光源,然而其雖可減少發光二極體之光源 丹提昇該發光二極體於使用上之亮度,但實際上之光 源政逸仍相當嚴重,故對整體亮度之提昇上仍然有限或對 現有LED製程'及後段封裝製程形成干擾; 或有再一習用之發光二極體(如第8圖所示)Reverse the nose (early a reflective layer 8), so that when the light source passes through the transparent substrate 5, it is made up of one layer and one layer of light source. However, it can reduce the light source of the light emitting diode and enhance the light emitting diode. The brightness in use, but in fact the light source is still very serious, so the overall brightness improvement is still limited or interferes with the existing LED process' and the subsequent packaging process; or there is another conventional light-emitting diode ( (As shown in Figure 8)

基板9 0,一層疊於該基板9 0上之反射層S 於该反射層9 1上之N型半導體層9 2 ,一層疊於該N型半 導體層9 2上之發光層g 3,一層疊於該發光層9 3上之P 型半導體層9 4 ,一層疊於該p型半導體層9 4上之窗戶層 9 5及一層疊於該窗戶層9 5上之接觸層9 6所構成,且 於該基板9 0與接觸層g 6上係分別設置有一電極9 7、 9 8 ,由於此一結構之反射層9 1係基板9 〇上方’可用 於反射往下之光源增加出光,但此結構之反射層9 1其有 效之反射角度為2 0。,所以並不能將全部光源反射,因 此,習用之發光二極體仍無法符合目前使用者之所需。 三、【新型内容】Substrate 90, a reflective layer S laminated on the substrate 90, an N-type semiconductor layer 92 on the reflective layer 91, a light-emitting layer g3 laminated on the N-type semiconductor layer 92, a layer A P-type semiconductor layer 9 4 on the light-emitting layer 93, a window layer 95 stacked on the p-type semiconductor layer 94, and a contact layer 96 stacked on the window layer 95, and On the substrate 90 and the contact layer g 6, electrodes 9 7 and 9 8 are respectively provided. Because the reflective layer 9 1 of the structure 9 is above the substrate 9 and can be used to reflect downward light sources to increase light, but this structure The effective reflection angle of the reflective layer 9 1 is 20. Therefore, it is impossible to reflect all the light sources. Therefore, the conventional light-emitting diodes still cannot meet the needs of current users. Three, [new content]

M244587 五、創作說明(3) 爰是,本創作之主要目的,在於解決習用之缺失,避免缺 失的存在,本創作係一種具化合物反射結構之發光二極 體,係在於可使發光二極體於發出光源時,藉由設於基板 底面或上面之各反射層分別反射由各種角度射入之光源, 使達到減少發光二極體之光源散逸’ k幵該發光二極體& 使用上之亮度。 ' 為達上述之目的本創作一種具化合物反射結構之發光二極 體’係包括:叠設之反射層,各反射層係為分佈式布拉才久 反射層(Distributed Bragg Reflector, DBR); —基板, 該基板之底面係設於相互疊設之反射層的頂面上; 一 N型半導體層,該N型半導體層之底面係層疊於上述基板 之表面上,且該N型半導體層上係具有一N型電極;一發光 層,該發光層之底面係層疊於上述N型半導體之表面上;一 P型半導體層,邊p型半導體層之底面係層疊於上述發光層 之表面上,且該p型半導體層上係具有一p型電極;如是, 藉此結構,可使該各疊設之反射層設置於基板之下方。 另本創作之發光二極體,亦可為:一基板;疊設之反射 層,各反射層係為分佈式布拉格反射層(DishibUed B: = g Reflect〇r, DBR),且該疊設之反射層其底面係相互 頂面;—N型半導體層,該”半導體層之底 面係層豐於上述相互疊設之反射層之頂面上,一發光層, 面上,且該ρ型半導體層上係具有一 ρ型電極;如\先曰藉此 η面係層疊於上型半導體之表面上;-η =體層’w型半導體層之底面係層疊M244587 V. Creation Instructions (3) 爰 Yes, the main purpose of this creation is to solve the lack of habit and avoid the existence of the absence. This creation is a light-emitting diode with a reflective structure of a compound, which is designed to make the light-emitting diode When the light source is emitted, the light sources incident from various angles are reflected by the reflective layers provided on the bottom surface or on the substrate, so as to reduce the dissipation of the light source of the light emitting diode. 'K 幵 The light emitting diode & brightness. 'In order to achieve the above purpose, this invention creates a light-emitting diode with a reflective structure of a compound' system including: stacked reflective layers, each of which is a distributed Bragg Reflector (DBR); A substrate, the bottom surface of the substrate is disposed on the top surface of the reflective layers stacked on top of each other; an N-type semiconductor layer, the bottom surface of the N-type semiconductor layer is stacked on the surface of the substrate, and the N-type semiconductor layer is It has an N-type electrode; a light-emitting layer, the bottom surface of which is laminated on the surface of the N-type semiconductor; a P-type semiconductor layer, and the bottom surface of the edge p-type semiconductor layer is laminated on the surface of the light-emitting layer, and The p-type semiconductor layer is provided with a p-type electrode; if so, with this structure, the stacked reflective layers can be disposed below the substrate. In addition, the light-emitting diodes in this creation can also be: a substrate; stacked reflective layers, each reflective layer is a distributed Bragg reflective layer (DishibUed B: = g Reflector, DBR), and the stacked The bottom surface of the reflective layer is the top surface of each other;-the N-type semiconductor layer, the bottom surface of the "semiconductor layer" layer is richer than the top surface of the above-mentioned reflective layers, a light-emitting layer, the surface, and the p-type semiconductor layer The upper system has a ρ-type electrode; for example, \ n means that the η plane is stacked on the surface of the upper semiconductor; -η = bulk layer; the bottom surface of the w-type semiconductor layer is stacked

第7頁 M244587Page 7 M244587

置於基板與N型半導體層之 五、創作說明(4) 結構 間〇 可使該各疊設之反射層設 菱疋’可猎由上述之結構,用、拉 、、馬拄 i私溫八s,丨c 用 k供發光二極體於發出光 源時,由各反射層分別反射以夂 光二極體於使用 各種角度射入之弁满,而逵 到減少發光二極體之光源散逸,提昇該 先原 違 上之亮度者。 ^ 四、【實施方式】 凊參閱『第1圖』,係本創你_ & _ Λ ^ 个則作一極體之剖面狀態示意圖、 ^ ^ 下·本創作係一種具化合物反射 〜構之發光二極體,其係由相互疊設之二反射層丄、丄a、 一基板2、一發光層32 、一N型半導體層3及一p型半導 體層4所構成,而該各反射層2 、丄a係形成於發光二極體 晶粒切割製程前,使該各疊設之反射層1 、1 a、設置於基 板2下方,讓發光二極體於發出光源時,藉由該反射層工 及反射層1 a分別反射由各種不同角度射入之光源,而達到 減少發光二極體光源散逸之現象,提昇該發光二極體於使 用上之亮度。 上述所提之反射層1 、反射層la係為分佈式布拉格反射層 (Distributed Bragg Reflector, DBR),藉以形成一反身于 結構,且該反射層1 、反射層1 a係以複數層成對層疊之化 合物所構成,而該化合物之材料係可為氧化物(ox i de )、 氡化物(n i t r i d e )、碳化物(c a r b i d e )及氟化物 (f luor ide),等材質,使該反射層1 、la為一具有大入射 角、高反射率、寬頻寬之反射層,且該反射層結構中的dbrPlaced between the substrate and the N-type semiconductor layer. Fifth, the creation description (4). The structure can be made of the superposed reflective layers. It can be used for the above structure. s, 丨 c When k is used for the light-emitting diode to emit light, it is reflected by each reflective layer, and the light-emitting diode is filled at various angles, and the light source is reduced to reduce the dissipation of the light-emitting diode. The one who violated the original brightness. ^ IV. [Implementation] 凊 Refer to "Figure 1", which is a schematic diagram of the cross-section of a polar body. ^ ^ Below. This creation is a compound reflection ~ The light-emitting diode is composed of two reflective layers 丄, 丄 a, a substrate 2, a light-emitting layer 32, an N-type semiconductor layer 3, and a p-type semiconductor layer 4 stacked on each other, and the reflective layers 2. 丄 a is formed before the light emitting diode die cutting process, and the stacked reflective layers 1 and 1 a are arranged under the substrate 2 so that the light emitting diode uses the reflection when emitting a light source. The layerer and the reflective layer 1 a respectively reflect the light source incident from various angles, so as to reduce the phenomenon of light emitting diode light source scattering, and improve the brightness of the light emitting diode in use. The above-mentioned reflective layer 1 and the reflective layer 1a are distributed Bragg reflectors (DBR), thereby forming a reflexive structure, and the reflective layer 1 and the reflective layer 1a are stacked in pairs. It is composed of a compound, and the material of the compound can be an oxide (ox i de), a halide (nitride), a carbide (carbide), and a fluoride (fluor ide), etc., so that the reflective layer 1, la is a reflective layer with a large incident angle, high reflectivity, and wide bandwidth, and dbr in the reflective layer structure

第8頁 M244587 五、創作說明(5) 係依據該發光二極體輸出光譜來組成,例如:發光二極體 輸出光譜介於500nm〜520nm時,採用一組光譜500nm的DBR, 再加上一組或數組光譜大於5 0 0 n m的D B R來組成反射結構。 該基板2之底面係設於反射層1的頂面上,且該基板2係 為一透明狀。 該N型半導體層3之底面係層疊於上述基板2之表面上,且 該N型半導體層3上係具有一 N型電極3 1 。 该發光層3 2之底面係層疊於上述n型半導體層3之表面 上,該P型半導體層4之底面係層疊於上述發光層32之表 ,上,且該P型半導體層4上係具有一 p型電極4丄;如 疋,藉由上述之結構構成一全新之具化合物反射結構之發 光二極體。 請參閱 圖、本 發光層 層4之 透至該 即照射 布拉格 可將照 之光源 再透過 半導體 光二極 第2 、3圖』,係本創作二極體之剖面狀態示意 創作之特性圖。如圖所示:當本創作之光二極體由 3 2么出光源時’該一部分之光源係由該p型半導體 ,,,出而另一部分之光源則由基板2之表面穿 =Ϊ f面,此時,該穿透至基板2底面之光源 涵曰之表面,而由於該反射層1係為分佈式 、曰 1Stributed Bragg Refiect〇r, DBR),故 n i:f1表面之光源均勻反射,而使該反射後 先由该基板2之底面穿透過該基板2之表面之後, 該N型半導體層3及?别束遑挪成1 衣® t傻 ^3^^4νΛΛ " ^ 子聪增4之表面射出,如此,即可使發 體於發出光源時之一部份光源由該反射層丄接受Page 8 M244587 5. Creation instructions (5) are based on the light-emitting diode output spectrum. For example, when the light-emitting diode output spectrum is between 500nm and 520nm, a set of 500nm DBR is used, plus one Groups or arrays of DBR with a spectrum greater than 50 nm form a reflective structure. The bottom surface of the substrate 2 is disposed on the top surface of the reflective layer 1, and the substrate 2 is transparent. The bottom surface of the N-type semiconductor layer 3 is laminated on the surface of the substrate 2, and the N-type semiconductor layer 3 has an N-type electrode 3 1 thereon. The bottom surface of the light-emitting layer 32 is laminated on the surface of the n-type semiconductor layer 3, the bottom surface of the P-type semiconductor layer 4 is laminated on the surface of the light-emitting layer 32, and the P-type semiconductor layer 4 has A p-type electrode 4 丄; such as 疋, a new light-emitting diode with a compound reflection structure is formed by the above structure. Please refer to the figure, the light-emitting layer of layer 4 is transparent to the point where the light can be irradiated to Prague, and then the light source can be transmitted again through the semiconductor light diode (Figures 2 and 3), which is a characteristic diagram of the creative cross-section of this creative diode. As shown in the figure: When the light diode of this creation is light source from 3 2 'the part of the light source is from the p-type semiconductor, and the other part of the light source is penetrated by the surface of the substrate 2 = Ϊ f surface At this time, the surface of the light source penetrating to the bottom surface of the substrate 2 and the reflective layer 1 is distributed (1 Distributed Bragg Refiector (DBR)), so the light source on the ni: f1 surface is uniformly reflected, and After the reflection is passed through the bottom surface of the substrate 2 through the surface of the substrate 2, the N-type semiconductor layer 3 and? Don't bundle it into 1 clothes ® t silly ^ 3 ^^ 4νΛΛ " ^ Zi Cong Zeng's surface is emitted, so that when the light source emits a part of the light source, it is accepted by the reflective layer 丄

光二極體所發出之光源將有 射層1,並射至該反射層la 減少發光二極體光源散逸之 用上之亮度。 所需,將該疊設之反射層 • ··等,以藉由各反射層 源(如第3圖之所示),進 散逸,提昇該發光二極體整 a、1 b係可依所需分別為不 各反射層之厚度亦可搭配調 極體得到更好之反射效率, 求。 作於實際應用上藉由疊設之 低發光二極體之光源在不同 射角度同樣在6 〇度時,僅 ,其光源穿透率約為7 3 極體,其光源穿透.率約為丄 二極體可有效減少發光二極 極體整體之免度,同理可 極體,其光源穿透率將降至 極體之光源散逸,而再提昇 創作具化合物反射結構之發 狀態示意圖,其係由一基板 M244587 五、創作說明(6) 後’再進行反射,而同樣由發 一部份以不同之角度穿透該反 後’方進行反射,而達到大幅 現象,提昇該發光二極體於使 當然本創作亦可依實際狀況之 1 、la再層疊多數反射層 分別反射由各種角度射入之光 而大幅減少發光二極體之光源 體之亮度,而該反射層^ 、工· 同之化合物之材料所製成,而 整設置’而使本創作之發光二 且更能符合實際使用狀況之需 請參閱『第4圖』所示,本創 多數反射層設計,而可有效降 入射角度時之穿透率,如於入 設置單一反射層之發光二極體 % ,而設置雙反射層之發光二 0 % ,故設置雙反射層之發光 體之光源散逸’提昇該發光二 知,設置多數反射層之發光二 更低,故可更有效減少發光二 該發光二極體整體之亮度。 請參閱『第5圖』所示,係本 光二極體之弟二實施例之剖面The light source emitted by the photodiode will have a radiating layer 1 and hit the reflecting layer 1a to reduce the brightness for the dissipation of the light emitting diode light source. If necessary, the stacked reflective layers are to be diffused by each reflective layer source (as shown in Fig. 3), and the whole a, 1 b of the light emitting diode can be improved according to the requirements. It is required that the thickness of each reflective layer can be matched with the polarizer to obtain better reflection efficiency. For practical applications, light sources with stacked low-light-emitting diodes at different angles of radiation are also at 60 degrees. Only, the light source transmission rate is about 7 3 poles, and the light source transmission rate is about丄 Diodes can effectively reduce the overall immunity of light-emitting diodes. By the same token, the light source transmittance of the diodes will be reduced to the dissipation of the light sources of the polar bodies, and the schematic diagram of the development state of the compound reflection structure will be improved. A substrate M244587 5. After the creation instructions (6), 'reflection is performed, and the same part is transmitted through the reverse at a different angle to reflect, and a large phenomenon is achieved, which enhances the light-emitting diode. Of course, this creation can also be based on the actual situation, la, and then a number of reflective layers are laminated to reflect light incident from various angles, respectively, and the brightness of the light source body of the light emitting diode is greatly reduced. The material is made of compounds, and the whole setting is made to make the light of this creation more suitable for actual use. Please refer to "Figure 4". Most of the original reflective layer designs can effectively reduce the angle of incidence. Time Transmittance, such as the light-emitting diode% provided with a single reflective layer, and the light-emitting diode 20% provided with a double-reflective layer, so the light source of the light-emitting body provided with a double-reflective layer is diffused. The light-emitting diode is lower, so it can reduce the overall brightness of the light-emitting diode more effectively. Please refer to "Figure 5", which is a cross section of the second embodiment of the light diode

第10頁 M244587 五、創作說明(7) ' -一· 2a、璺设之反射層1 、la、一N型半導體層3β、一發光 層3 2a及一 Ρ型半導體層4a所構成,且該Ρ型半導體層4a 上係具有一 P型電極4 1 a,而該各反射層1 、1 a係可形成 於發光二極體之蠢晶製程中,使該各鲞設之反射層1、工a 没置於基板2 a與N型半導體層3 a之間,以供發光二極體於 發出光源時’由各反射層1 、1 a分別反射以各種角度射入 之光源,而達到減少發光二極體之光源散逸,提昇該發光 二極體於使用上之亮度者。Page 10 M244587 V. Creative Instructions (7) '-a · 2a, a reflective layer 1, la, an N-type semiconductor layer 3β, a light-emitting layer 3 2a, and a P-type semiconductor layer 4a, and the The P-type semiconductor layer 4a has a P-type electrode 4 1 a, and the reflective layers 1 and 1 a can be formed in a stupid process of a light-emitting diode. a is not placed between the substrate 2 a and the N-type semiconductor layer 3 a, so that when the light emitting diode emits a light source, the light sources that are incident at various angles are reflected by the reflective layers 1 and 1 a respectively, thereby reducing light emission The light source of the diode is dissipated, which enhances the brightness of the light emitting diode in use.

其中該疊設之反射層丨、1 a係為分佈式布拉格反射層 (Distributed Bragg Reflector, DBR),且該反射層係以 有機金屬化學氣相磊晶沉積法(M〇CVD)成長或分子束磊晶 (Μ B E)成長’藉以形成一反射結構,而該各反射層1 、1a 係以成對層疊之化合物所構成,而該化合物之材料係搭配 發光一極體羞晶製程之材料,如在AiGalnP發光二極體中可 為 AllnP、AlGaInP、AlAs 及 GaAs 等;如在 InGaN 發光二極體 中可為InGaN、AlGaN、GaN等,且該疊設之反射層1 、ia 其底面係相互疊設於基板2 a之頂面,又該反射結構中的 DBR係依據該發光二極體輸出光譜來組成,例如:發光二極 體輸出光譜介於590nm〜620nm時,採用一組光譜590 nm的 DBR,再加上一組或數組光譜大於59〇nin的DBR來組成反射結 構。 另請參閱附件一,係為本創作與習用之反射率與波長之關 係圖。圖中係本創作反射層1 、1 a (二種波長組合之布拉 格反射鏡)與習用二種布拉格反射鏡之比較。比較後可知本The stacked reflective layer 1 and 1 a are distributed Bragg Reflector (DBR), and the reflective layer is grown by organic metal chemical vapor phase epitaxy (MOCVD) or molecular beam The epitaxial (M BE) grows' to form a reflective structure, and the reflective layers 1 and 1a are composed of a pair of stacked compounds, and the material of the compound is matched with the light-emitting polar crystal process, such as In the AiGalnP light-emitting diode, it can be AllnP, AlGaInP, AlAs, GaAs, etc .; for example, in the InGaN light-emitting diode, it can be InGaN, AlGaN, GaN, etc., and the bottom surfaces of the stacked reflective layers 1 and ia overlap each other. It is set on the top surface of the substrate 2a, and the DBR in the reflective structure is composed according to the light-emitting diode output spectrum. For example, when the light-emitting diode output spectrum is between 590nm and 620nm, a group of 590 nm DBR, plus a set or array of DBRs with a spectrum greater than 590 nin to form a reflective structure. Please also refer to Annex I, which is a graph of the reflectance versus wavelength for this creative and customary use. The figure shows the comparison of the original reflective layer 1 and 1 a (Brag mirrors with two wavelength combinations) and the two conventional Bragg mirrors. After comparison, we can know that

第11頁 M244587 五、創作說明(8) 創作同時擁有南反射率與極寬的帶寬。(A、b、c curve採 自Ρ·Α· Kish等人之論文)。 由於本創作之反射層係以布拉格反射(Distributed BraggPage 11 M244587 V. Creation Instructions (8) The creation has both the south reflectivity and extremely wide bandwidth. (A, b, and c curves are taken from a paper by P · A · Kish et al.). Because the reflection layer of this creation is Bragg reflection (Distributed Bragg

Reflector,DBR)結構為主,而將該疊設之反射層結構於發 光二極體晶粒切割製程前形成於基板之底部,或於發光二 極體之蠢晶製程中形成於基板與N型半導體層之間;使本創 作可藉由布拉格反射層(Distributed Bragg Reflector, DBR)與波長關係的特性創作出一種新的結構—疊設之DBR反 射層。 使本創作之「具化合物反射結構之發光二極體」幾乎克服 了 布拉格反射層(Distributed Bragger Reflection, DBR) 因有限的帶寬(angular bandwidth),而不能將光全部反射 的缺點,又避免了使用金屬反射層,所衍生的製程困難 度。藉由本創作之新結構,可使發光二極體於發出光源 時’由各反射層分別反射以各種角度入射之光源,而達到 減^發光二極體之光源散逸,提昇該發光二極體於使用上 之亮度者。 准以上所述者,僅為本創作之較佳實施例而已,當不能以 之限定本創作實施之範圍,即大凡依本創作申請專利範圍 所作之均等變化與修飾,皆應仍屬本創作專利涵蓋之範圍 内0 乡示上7述’本創作具化合物反射結構之發光二極體可有效 ,善習知結構之種種缺點,使其更具進步、實用性者,並 符合新型專利申請之要件,爰依法提出專利申請,尚請Reflector (DBR) structure, and the stacked reflective layer structure is formed on the bottom of the substrate before the light emitting diode die cutting process, or is formed on the substrate and the N-type in the stupid process of the light emitting diode. Between the semiconductor layers; this creation can create a new structure—the stacked DBR reflective layer—by using the characteristics of the Bragg Reflector (DBR) and wavelength relationship. The "light-emitting diode with compound reflection structure" in this creation almost overcomes the shortcomings of the Distributed Bragger Reflection (DBR) which cannot reflect all the light due to the limited bandwidth, and avoids the use of Metal reflective layer, derived from the process difficulty. With the new structure of this creation, when a light emitting diode emits a light source, the light sources that are incident at various angles are reflected by the reflective layers, respectively, so that the light source of the light emitting diode is reduced, and the light emitting diode is improved. Use the brighter ones. Those mentioned above are only the preferred embodiments of this creation. When the scope of implementation of this creation cannot be limited, that is, all equal changes and modifications made in accordance with the scope of the patent application for this creation shall still belong to this creation patent. Within the scope of 0, the above-mentioned 7 mentioned in the above description, "This creation of a light-emitting diode with a reflective structure of a compound can be effective, and it is well acquainted with the shortcomings of the structure, making it more progressive and practical, and meets the requirements for new patent applications. , File a patent application according to law, please

M244587M244587

第13頁 M244587 圖式簡單說明 五、【圖式簡單說明】 第1圖,係本創作第一實施例之剖面狀態示意圖。 第2圖,係本創作第一實施例之反射狀態示意圖。 第3圖,係本創作第二實施例之剖面狀態示意圖。 第4圖,係本創作具雙反射層之發光二極體與習用具單一 反射層之發光二極體兩者間之光源入射角度與穿透率之比 較曲線示意圖。 第5圖,係本創作第三實施例之剖面狀態示意圖。 第6圖,係一習用發光二極體之發光狀態示意圖。 第7圖,係另一習用發光二極體之發光狀態示意圖。 第8圖,係再一習用發光二極體之發光狀態示意圖。 【圖號說明】 , (本創作部份): 反射層1 、la、lb 基板2、2 a N型半導體層3、3a N型電極3 1 發光層32、32a P型半導體層4 、4a P型電極41、41a (習用部份): 透明基板5 N型半導體層6 N型電極6 1Page 13 M244587 Simple illustration of the drawing 5. [Simplified illustration of the drawing] Fig. 1 is a schematic sectional view of the first embodiment of this creation. FIG. 2 is a schematic view of a reflection state in the first embodiment of the present invention. Fig. 3 is a schematic sectional view of the second embodiment of the present invention. Figure 4 is a graph showing the comparison of the incidence angle and transmittance of the light source between the light-emitting diode with a double reflection layer and the light-emitting diode with a single reflection layer. Fig. 5 is a schematic sectional view of a third embodiment of the present invention. Fig. 6 is a schematic diagram of a light emitting state of a conventional light emitting diode. Fig. 7 is a schematic diagram of the light emitting state of another conventional light emitting diode. Fig. 8 is a schematic view of the light emitting state of a light emitting diode which is used again. [Illustration of drawing number], (this creative part): Reflective layer 1, la, lb substrate 2, 2 a N-type semiconductor layer 3, 3a N-type electrode 3 1 Light-emitting layer 32, 32a P-type semiconductor layer 4, 4a P Type electrodes 41, 41a (conventional part): Transparent substrate 5 N-type semiconductor layer 6 N-type electrode 6 1

第14頁 M244587 圖式簡單說明 發光層6 2 P型半導體層7 P型電極7 1 反射層8 基板9 0 反射層9 1 N型半導體層92 發光層9 3 P型半導體層94 窗戶層9 5 接觸層9 6 電極9 7、9 8Page 14 M244587 Simple illustration of the light emitting layer 6 2 P-type semiconductor layer 7 P-type electrode 7 1 Reflective layer 8 Substrate 9 0 Reflective layer 9 1 N-type semiconductor layer 92 Light-emitting layer 9 3 P-type semiconductor layer 94 Window layer 9 5 Contact layer 9 6 Electrode 9 7, 9 8

第15頁Page 15

Claims (1)

M244587 六、申請專利範圍 1 · 一種具化合物反射結構之發光二極體,其至少包括: 疊設之反射層,各反射層係為分佈式布拉格反射層 (Distributed Bragg Reflector,DBR),藉以形成一反射 結構; 一基板,該基板之底面係設於相互疊設之反射層的頂面 上; 一 N型半導體層,形成於上述基板上; 一發光層,形成於該N型半導體層上; 一P型半導體層,披覆於該發光層上; 使該各疊設之反射層設置於基板下方,以供發光二極體於 發出光源時’由各反射層分別反射以各種角度射入之光 源’而達到減少發光二極體之光源散逸,提昇該發光二極 體於使用上之亮度者。 2 ·如申請專利範圍第1項所述之具化合物反射結構之發光 二極體’其中,該反射結構中的D B R係依據該發光二極體輸 出光谱來組成。 3 ·如申請專利範圍第1項所述之具化合物反射結構之發光 二極體,其中,該基板係為一透明狀。 4 ·如申請專利範圍第2項所述之化合物反射結構之發光二 極體’其中,該化合物之材料係為氧化物(ο X i d e )、氮化 物(nitride)、碳化物(carbide)及氟化物(fluoride) 等材質。 5 · 一種具化合物反射結構之發光二極體,其至少包括: '^基板,M244587 6. Application scope 1. A light-emitting diode with a compound reflection structure, which at least includes: a stacked reflective layer, each reflective layer being a distributed Bragg reflector (DBR), so as to form a A reflective structure; a substrate, the bottom surface of which is arranged on the top surface of the reflective layers stacked on top of each other; an N-type semiconductor layer formed on the substrate; a light-emitting layer formed on the N-type semiconductor layer; A P-type semiconductor layer is coated on the light-emitting layer; the stacked reflective layers are arranged below the substrate so that when the light-emitting diode emits a light source, the light sources that are incident at various angles are reflected by the reflective layers respectively 'In order to reduce the emission of the light source of the light emitting diode and improve the brightness of the light emitting diode in use. 2. The light-emitting diode with a reflective structure of a compound as described in item 1 of the scope of the patent application, wherein D B R in the reflective structure is based on the output spectrum of the light-emitting diode. 3. The light-emitting diode with a compound reflection structure as described in item 1 of the scope of the patent application, wherein the substrate is transparent. 4 · The light-emitting diode of the compound reflective structure described in item 2 of the scope of the patent application, wherein the material of the compound is oxide (ο X ide), nitride (carbide), and fluoride (carbide) And other materials. 5 · A light emitting diode with a compound reflection structure, which at least comprises: a substrate, 第16頁 M244587Page 16 M244587 疊設之反射層’各反射層係為分佈式布拉格反射声 (Distributed Bragg Reflector, DBR),藉以开/ 成一;5 結構,且該反射結構係形成於基板上; ㈢ ^成一反: 一 N型半導體層,形成於上述反射結構上; 一發光層,形成於該N型半導體層上; 一p型半導體層,彼覆於該發光層上; 如是’藉由上述之結構,使發光二極體於發出光源時,由 各反射層分別反射以各種角度射入之光源,而達到減少發 光二極體之光源散逸,提昇該發光二極體於使用上之亮^ 者0 6 ·如申請專利範圍第5項所述之具化合物反射結構之發光二 極體,其中,該反射結構中的DBR係依據該發光二極^輸出 光譜來組成。 7 ·如申請專利範圍第5項所述之具化合物反射結構之發光二 極體,該各反射層係以成對層疊之化合物所構成,而該化 合物之材料係搭配發光二極體磊晶製程之材料,如在 AlGalnP 發光二極體中可為 AllnP、AlGaInP、AlAs 及 GaAs 等,如在InGaN發光二極體中可為InGaN、AlGaN、GaN等。 8 ·如申請專利範圍第5項所述之具化合物反射結構之發光二 極體,其中,該反射層係以有機金屬化學氣相磊晶沉積法 (M0CVD)成長或分子束蠢晶(MBE)成長。Each of the stacked reflective layers is a distributed Bragg Reflector (DBR), so as to open / into one; 5 structures, and the reflective structure is formed on the substrate; 成 ^ into a reverse: an N-type A semiconductor layer is formed on the above-mentioned reflective structure; a light-emitting layer is formed on the N-type semiconductor layer; a p-type semiconductor layer is overlaid on the light-emitting layer; if the light-emitting diode is formed by the above-mentioned structure When the light source is emitted, each reflecting layer reflects the light source incident at various angles respectively, so as to reduce the light source dissipation of the light emitting diode and improve the brightness of the light emitting diode in use ^ 6 0 The light-emitting diode with a compound reflection structure according to item 5, wherein the DBR in the reflection structure is composed according to the output spectrum of the light-emitting diode ^. 7 · The light-emitting diode with a compound reflection structure as described in item 5 of the scope of the patent application, each reflective layer is composed of a pair of stacked compounds, and the material of the compound is matched with a light-emitting diode epitaxial process The materials can be AllnP, AlGaInP, AlAs, GaAs, etc. in the AlGalnP light-emitting diode, and InGaN, AlGaN, GaN, etc. in the InGaN light-emitting diode. 8. The light-emitting diode with a compound reflection structure as described in item 5 of the scope of the patent application, wherein the reflective layer is grown by an organometallic chemical vapor phase epitaxial deposition method (MOCVD) or a molecular beam stupid crystal (MBE) growing up. 第17頁Page 17
TW92215841U 2003-09-02 2003-09-02 LED with compound reflection structure TWM244587U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103545414A (en) * 2012-07-13 2014-01-29 晶元光电股份有限公司 Light-emitting element with window layers sandwiching distributed bragg reflector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103545414A (en) * 2012-07-13 2014-01-29 晶元光电股份有限公司 Light-emitting element with window layers sandwiching distributed bragg reflector
CN103545414B (en) * 2012-07-13 2018-04-20 晶元光电股份有限公司 Light-emitting component with Bragg reflecting layer between window layers

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