TWI850567B - Method of packaging light emitting display device and light emitting display device packaging structure - Google Patents

Abstract

A method of packaging a light-emitting display device includes the following steps. Placing a substrate between a first laminating plate and a second laminating plate so that the opposite first and second surfaces of the substrate face toward the first laminating plate and the second laminating plate, respectively, wherein the substrate is formed with a patterned conductive layer and provided with a plurality of illuminating bodies arranged in an array with a minimum space of 2 to 3 mm between any two of the neighboring illuminating bodies. Placing a first hot-melt packaging material between the first surface of the substrate and the first laminating plate so that the two opposite surfaces of the first hot-melt packaging material face the first laminating plate and the first surface of the substrate, respectively. Placing at least two spacers between the first laminating plate and the second laminating plate with the spacers being disposed away from the substrate and the first hot-melt packaging material. Evacuating the space where the substrate and the first hot-melt packaging material locate, heating the first laminating plate and the second laminating plate, and pressing the substrate and the first hot-melt packaging material.

Description

Packaging method and packaging structure of luminescent display device

The present invention relates to a packaging method, in particular to a packaging method and packaging structure of a luminescent display device.

In recent years, the display screen of the display has developed towards larger size, flatter, thinner, lighter and more flexible. The manufacturing technology of display devices that place point light sources such as light emitting diodes (LEDs) on flexible transparent substrates has gradually matured. In one branch of technological development, the subsequent progress of large-screen luminous display devices for people to watch from a distance is worth paying attention to.

In the manufacturing process of this type of luminous display device, multiple LED beads or LED chips are usually installed in the form of an array on a substrate. The distance between adjacent LED beads or LED chips is not less than 2 mm, which is different from organic light-emitting diode (OLED) displays or micro-LED displays for people to watch at a close distance. In order for each LED bead or LED chip in the array to be lit, the substrate carrying these LED beads or LED chips and its conductive layer must have good conductivity. In addition, in order to improve the contrast of this type of luminous display device, the line width of the conductive line on the conductive layer must be minimized to reduce the visibility of the conductive layer in the display screen. In this case, how to prevent these tiny LED lamp beads or LED chips and tiny conductive lines from being damaged or destroyed during and after the production of the light-emitting display device has become an important issue. In response to the above technical problems, the present invention hopes to provide solutions.

In view of the above problems, the present invention provides a packaging method and packaging structure for a light-emitting display device, which can not only ensure that the LED lamp beads or LED chips and conductive circuits will not be damaged or destroyed during the manufacturing process of the light-emitting display device, but also ensure that the LED lamp beads or LED chips and conductive circuits will not be easily damaged or destroyed during the use of the light-emitting display device after the manufacturing is completed.

In one embodiment, a packaging method for a light-emitting display device comprises the following steps: placing a substrate between a first layer of pressing plate and a second layer of pressing plate, with a first surface of the substrate facing the first layer of pressing plate, and a second surface of the substrate facing away from the first surface facing the second layer of pressing plate, a first patterned conductive layer and a plurality of light-emitting bodies arranged in an array are disposed on the first surface, the minimum spacing between the light-emitting bodies is 2 to 3 mm, and the area of the substrate is 10x10 square centimeters to 300x300 square centimeters; placing a hot-melt material having a thickness equal to the height of the light-emitting body and the thickness of the substrate; A first packaging material with a height of 1 to 1.5 times the sum of the height of the light-emitting body and the thickness of the substrate is placed between the first surface of the substrate and the first pressing plate, so that one side of the first packaging material faces the first pressing plate, and the other side of the first packaging material faces the first surface of the substrate and is higher than the top surface of the light-emitting body; at least two spacers with a height of 1 to 1.2 times the sum of the height of the light-emitting body and the thickness of the substrate are placed between the first pressing plate and the second pressing plate; the space where the substrate and the first packaging material are located is evacuated; and the first pressing plate and the second pressing plate are heated so that the substrate and the first packaging material are squeezed by the first pressing plate and the second pressing plate. The heating temperature of the first pressing plate and the second pressing plate is set to 100 degrees Celsius to 160 degrees Celsius.

Optionally, the pressure on the substrate and the first packaging material is 0.5 to 2 standard atmospheres.

Optionally, the packaging method of the luminous display device of the above embodiment further comprises the following steps: placing a first release film between the first packaging material and the first pressing plate; subjecting the first release film and the first packaging material to compression by the first pressing plate and the second pressing plate; and removing the second release film from one side of the cured first packaging material.

Optionally, the packaging method of the light-emitting display device of the above-mentioned embodiment further comprises the following steps: placing a first electrically insulating substrate between the first packaging material and the first layer of pressing plate; subjecting the first electrically insulating substrate and the first packaging material to compression by the first layer of pressing plate and the second layer of pressing plate; and retaining the first electrically insulating substrate on one side of the cured first packaging material. In one embodiment, when the substrate has a plurality of through holes, the packaging method of the light-emitting display device further comprises the following steps: placing a second electrically insulating substrate between the substrate and the second layer of pressing plate; subjecting the second electrically insulating substrate and the substrate to compression by the first layer of pressing plate and the second layer of pressing plate; and retaining the second electrically insulating substrate on the other side of the cured first packaging material.

In one embodiment, in addition to the first packaging material, the packaging method of the light-emitting display device further comprises the following steps: placing a second packaging material between the second surface of the substrate and the second pressing plate, with one side of the second packaging material facing the second surface of the substrate and the other side of the second packaging material facing the second pressing plate; and subjecting the second packaging material and the first packaging material to compression by the first pressing plate and the second pressing plate. The heating temperature of the second pressing plate is less than or equal to the heating temperature of the first pressing plate. Optionally, the packaging method of the luminous display device further comprises the following steps: placing a first release film between the first packaging material and the first layer of pressing plate; placing a second release film between the second packaging material and the second layer of pressing plate; subjecting the first release film and the first packaging material to compression by the first layer of pressing plate and the second layer of pressing plate; subjecting the second release film and the second packaging material to compression by the first layer of pressing plate and the second layer of pressing plate; removing the first release film on one side of the cured first packaging material; removing the second release film on one side of the cured second packaging material.

Optionally, the packaging method of the light-emitting display device of the above-mentioned embodiment further comprises the following steps: placing a first electrically insulating substrate between the first packaging material and the first layer of pressing plate; subjecting the first electrically insulating substrate and the first packaging material to compression by the first layer of pressing plate and the second layer of pressing plate; and retaining the first electrically insulating substrate on one side of the cured first packaging material. Optionally, the packaging method of the light-emitting display device also has the following steps: placing a second electrically insulating substrate between the second packaging material and the second layer of pressing plate; subjecting the second electrically insulating substrate and the second packaging material to compression by the first layer of pressing plate and the second layer of pressing plate; and retaining the second electrically insulating substrate on one side of the cured second packaging material.

In one embodiment, the first patterned conductive layer has conductive lines with a line width of 10 microns to 100 microns.

In each embodiment, the material of the substrate is one of glass, ceramic, aluminum nitride ceramic, polycarbonate, ethylene-tetrafluoroethylene, polyethylene terephthalate, polyethylene naphthalate, polyimide, polymethyl methacrylate, polymethyl ether, BT resin, glass fiber and cyclic olefin copolymer.

In each embodiment, the material of the first packaging material is one of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), optical adhesive (OCR) and silicone.

On the other hand, the present invention proposes a light-emitting display device packaging structure manufactured according to the aforementioned light-emitting display device packaging method.

In one embodiment, the light-emitting display device packaging structure has a substrate, a light-emitting body, a first patterned conductive layer and a cured first packaging material. The substrate has a first surface and a second surface. The light-emitting body is arranged above the first surface of the substrate in an array manner. The first patterned conductive layer is arranged on the first surface of the substrate. The cured first packaging material is formed above the first surface of the substrate and covers the light-emitting body and the first patterned conductive layer, and the top surface of the cured first packaging material is higher than the top surface of the light-emitting body.

In one embodiment, the light-emitting display device packaging structure has a substrate, a light-emitting body, a first patterned conductive layer, a cured first packaging material, and a first electrically insulating substrate. The substrate has a first surface and a second surface. The light-emitting body is arranged in an array above the first surface of the substrate. The first patterned conductive layer is arranged on the first surface of the substrate. The cured first packaging material is formed above the first surface of the substrate and covers the light-emitting body and the first patterned conductive layer, and the top surface of the cured first packaging material is higher than the top surface of the light-emitting body. The first electrically insulating substrate is arranged on one side of the cured first packaging material.

Optionally, the light-emitting display device package structure of the above embodiment further has an anti-reflection layer, which is disposed above the first electrically insulating substrate, and the refractive index of the anti-reflection layer is less than or equal to the refractive index of the first electrically insulating substrate and greater than or equal to the refractive index of air. Optionally, the anti-reflection layer only includes a single anti-reflection film, and the refractive index of the film is the square root of the refractive index of the first electrically insulating substrate. Optionally, the anti-reflection layer includes a plurality of anti-reflection films, and the refractive index difference between these anti-reflection films changes gradually.

In one embodiment, the light-emitting display device packaging structure has a substrate, a light-emitting body, a first patterned conductive layer, a cured first packaging material, a first electrically insulating substrate, and a second electrically insulating substrate. The substrate has a first surface and a second surface. The light-emitting body is arranged in an array above the first surface of the substrate. The first patterned conductive layer is arranged on the first surface of the substrate. The cured first packaging material is formed above the first surface of the substrate and covers the light-emitting body and the first patterned conductive layer, and the top surface of the cured first packaging material is higher than the top surface of the light-emitting body. The first electrically insulating substrate is arranged on one side of the cured first packaging material. The second electrically insulating substrate is arranged on the other side of the cured first packaging material.

In one embodiment, the light-emitting display device packaging structure has a substrate, a light-emitting body, a first patterned conductive layer, a cured first packaging material, and a cured second packaging material. The substrate has a first surface and a second surface. The light-emitting body is arranged in an array above the first surface of the substrate. The first patterned conductive layer is arranged on the first surface of the substrate. The cured first packaging material is formed above the first surface of the substrate and covers the light-emitting body and the first patterned conductive layer, and the top surface of the cured first packaging material is higher than the top surface of the light-emitting body. The cured second packaging material is formed on the second surface of the substrate.

In one embodiment, the light-emitting display device packaging structure has a substrate, a light-emitting body, a first patterned conductive layer, a cured first packaging material, a cured second packaging material, a first electrically insulating substrate, and a second electrically insulating substrate. The substrate has a first surface and a second surface. The light-emitting body is arranged in an array above the first surface of the substrate. The first patterned conductive layer is arranged on the first surface of the substrate. The cured first packaging material is formed above the first surface of the substrate and covers the light-emitting body and the first patterned conductive layer, and the top surface of the cured first packaging material is higher than the top surface of the light-emitting body. The cured second packaging material is formed on the second surface of the substrate. The first electrically insulating substrate is arranged on one side of the cured first packaging material. The second electrically insulating substrate is arranged on one side of the cured second packaging material.

In summary, the packaging method and packaging structure of the luminescent display device described in the embodiments of the present invention can provide rapid and effective packaging for a substrate with a certain area or even a large area carrying a luminescent body at one time, and further provide protection for the upper and lower layers of the substrate to prevent the patterned conductive layer and its fine conductive circuits on the substrate and the luminescent body of a small volume from being polluted and damaged by contact with the external environment during the use of the luminescent display device. Since the materials of the first packaging material and the second packaging material can be transparent, and the protective plates additionally provided on the upper and lower layers of the substrate can also be transparent, the transparency of the entire luminescent display device will not be affected. In addition, based on the consideration of increasing the amount of light emitted by the luminescent body, a packaging material with the required refractive properties can be selected for packaging. Furthermore, a single layer or multiple layers of thin films may be additionally arranged on the protective plate additionally provided above the surface of the substrate carrying the light-emitting body to reduce the reflection of the emitted light of the light-emitting display device and the ambient light between the substrate and the air layer, so as to prevent people behind the substrate from seeing the reflected light of the light-emitting display device. In the present invention, the materials of the first packaging material and the second packaging material are not limited to the materials mentioned in the text, and any hot-melt transparent material can also be used. In addition, although the formation of the solidified first packaging material and the solidified second packaging material in the above-mentioned embodiments is explained by taking the lamination method as an example, it can also be carried out by non-lamination methods, such as autoclave, perfusion and spread coating. Therefore, the packaging structure of the light-emitting display device described in the present invention that is manufactured in a non-lamination manner is regarded as an equivalent embodiment that is completed without departing from the spirit disclosed by the present invention.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

10: Substrate

100: Luminous body

1001: Top surface of the light-emitting body

101: First surface

1011: First patterned conductive layer

10111: Conductor

10112: Welding pad area

102: Second surface

103:Through hole

11:Layer pressing device

111: First layer of pressure plate

112: Second pressure plate

20: First packaging material

201: Top surface of the first packaging material

202: Bottom surface of the first packaging material

30: First release film

40: Interstitial body

50: first electrically insulating substrate

60: Second electrically insulating substrate

70: Second packaging material

80: Second release film

700: Anti-reflective layer

F1~F4: Anti-reflection film

H1: The sum of the height of the light-emitting body and the thickness of the substrate

H2: Thickness of the first packaging material

H3: Height of the spacer

S11~S18,S21~S23,S31~S33,S41~S45,S51~S56: Steps

FIG1A is a flow chart showing the packaging method of the light-emitting display device of the first embodiment of the present invention.

FIG1B is a schematic plan view showing the state of the light-emitting display device of the first embodiment of the present invention before the packaging method is implemented.

FIG1C is a schematic plan view showing the state of the light-emitting display device of the first embodiment of the present invention after the packaging method is implemented.

FIG1D is a schematic plan view showing the packaging structure of the light-emitting display device of the first embodiment of the present invention after the packaging method is implemented, wherein the first surface of the substrate on which the light-emitting body is disposed has a solidified first packaging material.

FIG2A is a flow chart showing the packaging method of the light-emitting display device of the second embodiment of the present invention.

FIG2B is a schematic plan view showing the state of the light-emitting display device of the second embodiment of the present invention before the packaging method is implemented.

FIG2C is a schematic plan view showing the state of the light-emitting display device of the second embodiment of the present invention after the packaging method is implemented.

FIG2D is a schematic plan view showing the packaging structure of the light-emitting display device of the second embodiment of the present invention after the packaging method is implemented, wherein one side of the cured first packaging material has a first electrically insulating substrate.

FIG3A is a flow chart showing the packaging method of the light-emitting display device of the third embodiment of the present invention.

FIG3B is a schematic plan view showing the state of the light-emitting display device of the third embodiment of the present invention before the packaging method is implemented.

FIG3C is a schematic plan view showing the state of the light-emitting display device of the third embodiment of the present invention after the packaging method is implemented.

FIG3D is a schematic plan view showing the packaging structure of the light-emitting display device of the third embodiment of the present invention after the packaging method is implemented, wherein one side of the solidified first packaging material has a first electrically insulating substrate, and the other side of the solidified first packaging material has a second electrically insulating substrate.

FIG4A is a flow chart showing the packaging method of the light-emitting display device of the fourth embodiment of the present invention.

FIG4B is a schematic plan view showing the state of the light-emitting display device of the fourth embodiment of the present invention before the packaging method is implemented.

FIG4C is a schematic plan view showing the state of the light-emitting display device of the fourth embodiment of the present invention after the packaging method is implemented.

FIG4D is a schematic plan view showing the packaging structure of the light-emitting display device of the fourth embodiment of the present invention after the packaging method is implemented, wherein the first surface and the second surface of the substrate on which the light-emitting body is disposed have a solidified first packaging material and a solidified second packaging material respectively.

FIG5A is a flow chart showing the packaging method of the light-emitting display device of the fifth embodiment of the present invention.

FIG5B is a schematic plan view showing the state of the light-emitting display device of the fifth embodiment of the present invention before the packaging method is implemented.

FIG5C is a schematic plan view showing the state of the light-emitting display device of the fifth embodiment of the present invention after the packaging method is implemented.

FIG5D is a schematic plan view showing the packaging structure of the light-emitting display device of the fifth embodiment of the present invention after the packaging method is implemented, wherein one side of the solidified first packaging material has a first electrically insulating substrate, and one side of the solidified second packaging material has a second electrically insulating substrate.

FIG6 is a schematic plan view showing a first patterned conductive layer formed on a substrate of a light-emitting display device according to an embodiment of the present invention.

FIG7 is a schematic plan view showing the packaging structure of a light-emitting display device of an embodiment of the present invention after the packaging method is implemented, wherein an anti-reflection layer is disposed above the first electrically insulating substrate.

The present invention discloses a packaging method and packaging structure of a light-emitting display device. The following text will not fully describe the common knowledge that can be understood by those with ordinary knowledge in the technical field, such as the light-emitting principle of a light-emitting diode, a patterned conductive layer with a specific conductive circuit pattern and a layered three-dimensional structure (the circuit patterns have a height difference), etc. In addition, if the meaning of the technical terms described in the following text is different from the meaning of the common terms in the technical field to which it belongs, the meaning in the text shall prevail, and the corresponding figures in the text are used to express the meaning related to the characteristics of the present invention, and are not fully drawn according to the actual size, and are also described in advance. The first, second, third and fourth prepositions described in the following text are only used to distinguish similar components and have no order.

FIG. 1A is a flow chart showing a packaging method of a light-emitting display device according to the first embodiment of the present invention. FIG. 1B is a plan view showing a state of the light-emitting display device according to the first embodiment of the present invention before the packaging method is implemented. FIG. 1C is a plan view showing a state of the light-emitting display device according to the first embodiment of the present invention after the packaging method is implemented. FIG. 1D is a plan view showing a packaging structure of the light-emitting display device according to the first embodiment of the present invention after the packaging method is implemented, wherein a first surface of a substrate provided with a light-emitting body has a solidified first packaging material.

As shown in FIG. 1A , in a first embodiment, a packaging method of a luminous display device includes the following steps S11 to S15.

Step S11: Place a substrate between the first and second press plates, with a first surface of the substrate facing the first press plate, and a second surface of the substrate facing away from the first surface facing the second press plate. A first patterned conductive layer and a plurality of light-emitting bodies arranged in an array are disposed on the first surface, and the minimum spacing between the light-emitting bodies is 2 to 3 mm, which is different from an organic light-emitting diode (OLED) display or a micro-LED display. The first and second press plates here can be disposed on a press device. In one embodiment, as shown in FIG. 1B and FIG. 1C, the first and second press plates 111 and 112 are disposed on a press device 11. In one embodiment, as shown in FIG. 1B , the substrate 10 is placed between a first pressing plate 111 and a second pressing plate 112 , the first surface 101 of the substrate 10 faces the first pressing plate 111 , and the second surface 102 of the substrate 10 facing away from the first surface 101 faces the second pressing plate 112 , a first patterned conductive layer 1011 (see FIG. 6 ) and a plurality of light-emitting bodies 100 arranged in an array are disposed on the first surface 101 , the minimum spacing between the light-emitting bodies is 2 to 3 mm, and the area of the substrate is between 10x10 cm2 and 300x300 cm2.

Step S12: Place a first packaging material with heat-melting properties and a thickness of 1 to 1.5 times the sum of the height of the light-emitting body and the thickness of the substrate between the first surface of the substrate and the first layer of pressing plate, so that one side of the first packaging material faces the first layer of pressing plate, and the other side of the first packaging material faces the first surface of the substrate and is higher than the top surface of the light-emitting body. In one embodiment, as shown in FIG. 1B , the first packaging material 20 with heat-melting properties is placed between the first surface 101 of the substrate 10 and the first layer of pressing plate 111, the top surface 201 of the first packaging material 20 faces the first layer of pressing plate 111, and the bottom surface 202 of the first packaging material 20 faces the first surface 101 of the substrate 10 and is higher than the top surface 1001 of the light-emitting body 100. The thickness H2 of the first packaging material 20 is 1 to 1.5 times the sum of the height H1 of the light-emitting body 100 and the thickness H1 of the substrate 10.

Step S13: Place at least two spacers with a height of 1 to 1.2 times the sum of the height of the light-emitting body and the thickness of the substrate between the first and second press plates. In one embodiment, as shown in FIG. 1B , two spacers 40 are placed between the first and second press plates 111 and 112, and the spacers 40 are located around the substrate 10 and the first packaging material 20 and are arranged away from the substrate 10 and the first packaging material 20. The height H3 of the spacers 40 is 1 to 1.2 times the sum of the height H1 of the light-emitting body 100 and the thickness of the substrate 10.

Step S14: Vacuum the space where the substrate and the first packaging material are located. In one embodiment, as shown in FIG. 1C , the space where the substrate 10 and the first packaging material 20 are located is evacuated, and the first layer of pressing plate 111 and the second layer of pressing plate 112 are pressed on the substrate 10 and the first packaging material 20 under a specific vacuum state. Optionally, the pressure after vacuuming can be set to -50 to -120 kPa, and the vacuuming time can be set to 1 to 10 minutes.

Step S15: Heat the first and second press plates and squeeze the substrate and the first packaging material. In one embodiment, as shown in FIG. 1C , the substrate 10 and the first packaging material 20 are squeezed by the heated first and second press plates 111 and 112 . In this way, the first packaging material 20 is deformed, melted, flowed, and reshaped due to the heat of the first pressing plate 111 and the second pressing plate 112 during the extrusion or lamination process, and finally completely covers the substrate 10 and the light-emitting body 100 when it is cooled and solidified. After solidification, the first packaging material 20 forms a packaging body with the substrate 10 and the light-emitting body 100, as shown in FIG1D. The heating temperature setting of the first pressing plate 111 and the second pressing plate 112 is related to the thickness and material properties of the first packaging material 20. Optionally, the heating temperature of the first pressing plate 111 and the second pressing plate 112 can be set to 100 degrees Celsius to 160 degrees Celsius and the heating time can be set to 1 to 15 minutes, and the pressure applied by the first pressing plate 111 and the second pressing plate 112 to the substrate 10 and the first packaging material 20 can be set to 0.5 to 2 standard atmospheres (atm). Optionally, the method of using the first pressing plate 111 and the second pressing plate 112 to squeeze the substrate 10 and the first packaging material 20 is, for example, to use a mechanical method such as hydraulic pressure to allow the first pressing plate 111 and the second pressing plate 112 to squeeze the substrate 10 and the first packaging material 20. Alternatively, the first layer pressing plate 111 and the second layer pressing plate 112 clamp the substrate 10 and the first packaging material 20, and apply air pressure to the first layer pressing plate 111 and the second layer pressing plate 112, so that the substrate 10 and the first packaging material 20 are squeezed by the first layer pressing plate 111 and the second layer pressing plate 112.

Furthermore, as shown in FIG. 1A , in the first embodiment, the packaging method of the luminous display device may also include the following steps S16 to S18.

Step S16: Place a first release film between the first packaging material and the first pressing plate. In one embodiment, as shown in FIG1B , before the substrate 10, the light-emitting body 100 and the first packaging material 20 are squeezed by the first pressing plate 111 and the second pressing plate 112, a first release film 30 can be placed between the first packaging material 20 and the first pressing plate 111 to prevent the first packaging material 20 from adhering to the first pressing plate 111 during the process of deformation, melting, flowing and reshaping due to the heat of the first pressing plate 111 and the second pressing plate 112, so as to facilitate the subsequent separation of the first pressing plate 111.

Step S17: The first release film and the first packaging material are squeezed by the first pressing plate and the second pressing plate. In one embodiment, as shown in FIG1C , during the process of the substrate 10, the light emitting body 100 and the first packaging material 20 being squeezed by the first pressing plate 111 and the second pressing plate 112, the first release film 30 and the first packaging material 20 are squeezed by the first pressing plate 111 and the second pressing plate 112.

Step S18: Remove the first release film on one side of the cured first packaging material. In one embodiment, as shown in FIG. 1D , the first packaging material 20 forms a packaging body with the substrate 10 and the light-emitting body 100 after curing. At this time, the first release film 30 attached to one side of the first packaging material 20 can be removed.

As shown in FIG. 1D , the light-emitting display device packaging structure manufactured according to the light-emitting display device packaging method of steps S11 to S15 of FIG. 1A comprises a substrate 10, a light-emitting body 100, a first patterned conductive layer 1011 (see FIG. 6 ), and a cured first packaging material 20. The substrate 10 has a first surface 101 and a second surface 102 facing away from the first surface 101. The light-emitting body 100 is arranged in an array above the first surface 101 of the substrate 10. The first patterned conductive layer 1011 is arranged on the first surface 101 of the substrate 10 (see FIG. 6 ). The cured first packaging material 20 is formed above the first surface 101 of the substrate 10 and covers the light-emitting body 100 and the first patterned conductive layer 1011. The top surface 201 of the solidified first encapsulation material 20 is higher than the top surface 1001 of the light-emitting body 100.

FIG2A is a flow chart showing the packaging method of the light-emitting display device of the second embodiment of the present invention. FIG2B is a plan view showing the state of the light-emitting display device of the second embodiment of the present invention before the packaging method is implemented. FIG2C is a plan view showing the state of the light-emitting display device of the second embodiment of the present invention after the packaging method is implemented. FIG2D is a plan view showing the packaging structure of the light-emitting display device of the second embodiment of the present invention after the packaging method is implemented, wherein one side of the cured first packaging material has a first electrically insulating substrate.

As shown in FIG. 2A , in a second embodiment, the packaging method of the luminous display device, in addition to steps S11 to S15 of FIG. 1A , further includes the following steps S21 to S23.

Step S21: Place a first electrically insulating substrate between the first packaging material and the first layer of pressing plate. In one embodiment, as shown in FIG2B , before the substrate 10, the light-emitting body 100 and the first packaging material 20 are squeezed by the first layer of pressing plate 111 and the second layer of pressing plate 112, a first electrically insulating substrate 50 can be placed between the first packaging material 20 and the first layer of pressing plate 111 to serve as a protective substrate for the entire light-emitting display device packaging structure after the first packaging material 20 is cured.

Step S22: The first electrically insulating substrate and the first packaging material are squeezed by the first pressing plate and the second pressing plate. In one embodiment, as shown in FIG2C , during the process of the substrate 10, the light-emitting body 100 and the first packaging material 20 being squeezed by the first pressing plate 111 and the second pressing plate 112, the first electrically insulating substrate 50 and the first packaging material 20 are squeezed by the first pressing plate 111 and the second pressing plate 112.

Step S23: retain the first electrically insulating substrate on one side of the first packaging material after curing. In one embodiment, as shown in FIG. 2D, after the first packaging material 20 is cured, the first electrically insulating substrate 50 is attached to one side of the first packaging material 20, and together with the first packaging material 20, the substrate 10 and the light-emitting body 100, forms a packaging structure. The retained first electrically insulating substrate 50 can be used as a protective substrate for the entire light-emitting display device packaging structure, so that the substrate 10 and the light-emitting body 100 are protected from damage.

As shown in FIG2D , the light-emitting display device packaging structure manufactured according to the light-emitting display device packaging method of steps S11 and S15 of FIG1A and steps S21 to S23 of FIG2A comprises a substrate 10, a light-emitting body 100, a first patterned conductive layer 1011 (see FIG6 ), a cured first packaging material 20, and a first electrically insulating substrate 50. The substrate 10 has a first surface 101 and a second surface 102 facing away from the first surface 101. The light-emitting body 100 is arranged in an array above the first surface 101 of the substrate 10. The first patterned conductive layer 1011 is arranged on the first surface 101 of the substrate 10 (see FIG6 ). The cured first packaging material 20 is formed above the first surface 101 of the substrate 10 and covers the light-emitting body 100 and the first patterned conductive layer 1011. The top surface 201 of the solidified first packaging material 20 is higher than the top surface 1001 of the light-emitting body 100. The first electrically insulating substrate 50 is disposed on one side of the solidified first packaging material 20.

FIG3A is a flow chart showing the packaging method of the light-emitting display device of the third embodiment of the present invention. FIG3B is a plane schematic diagram showing the state of the light-emitting display device of the third embodiment of the present invention before the packaging method is implemented. FIG3C is a plane schematic diagram showing the state of the light-emitting display device of the third embodiment of the present invention after the packaging method is implemented. FIG3D is a plane schematic diagram showing the packaging structure of the light-emitting display device of the third embodiment of the present invention after the packaging method is implemented, wherein one side of the solidified first packaging material has a first electrically insulating substrate, and the other side of the solidified first packaging material has a second electrically insulating substrate.

As shown in FIG. 3A , in a third embodiment, the substrate 10 may have a plurality of through holes 103 for electrically connecting the patterned conductive layers to each other when different patterned conductive layers are respectively configured on the first surface 101 and the second surface 102 of the substrate 10 . For example, the inner surfaces of the through holes 103 have conductive materials. In this embodiment, the packaging method of the light-emitting display device, in addition to steps S11 to S15 of FIG. 1A , further includes the following steps S31 to S33.

Step S31: Place a second electrically insulating substrate between the substrate and the second layer of pressing plate. In one embodiment, as shown in FIG. 3B , the second electrically insulating substrate 60 is placed between the substrate 10 and the second layer of pressing plate 112.

Step S32: The second electrically insulating substrate is squeezed by the first and second pressing plates. In one embodiment, as shown in FIG3C , during the process in which the substrate 10, the light-emitting body 100, the first packaging material 20 and the first electrically insulating substrate 50 are squeezed by the first and second pressing plates 111 and 112, the second electrically insulating substrate 60 is also squeezed by the first and second pressing plates 111 and 112.

Step S33: retaining the second electrically insulating substrate on the other side of the cured first packaging material. In one embodiment, as shown in FIG. 3D , the first packaging material 20 is formed on the upper and lower sides of the substrate 10 after curing, and the first electrically insulating substrate 50 and the second electrically insulating substrate 60 respectively attached to the two sides of the first packaging material 20 are retained, so that the first electrically insulating substrate 50, the first packaging material 20 and the second electrically insulating substrate 60 together with the substrate 10 and the light-emitting body 100 form a light-emitting display device packaging structure. At this time, the first electrically insulating substrate 50 and the second electrically insulating substrate 60 respectively serve as the upper and lower protective substrates of the entire packaging structure to protect the substrate 10 and the light-emitting body 100 from damage.

As shown in FIG3D , the light-emitting display device packaging structure manufactured according to the light-emitting display device packaging method of steps S11 and S15 of FIG1A and steps S31 to S33 of FIG3A comprises a substrate 10, a light-emitting body 100, a first patterned conductive layer 1011 (see FIG6 ), a cured first packaging material 20, a first electrically insulating substrate 50, and a second electrically insulating substrate 60. The substrate 10 has a first surface 101 and a second surface 102 facing away from the first surface 101. The light-emitting body 100 is arranged above the first surface 101 of the substrate 10 in an array. The first patterned conductive layer 1011 is arranged on the first surface 101 of the substrate 10 (see FIG6 ). The solidified first encapsulation material 20 is formed on the first surface 101 of the substrate 10 and covers the light-emitting body 100 and the first patterned conductive layer 1011. The top surface 201 of the solidified first encapsulation material 20 is higher than the top surface 1001 of the light-emitting body 100. The first electrically insulating substrate 50 is disposed on one side of the solidified first encapsulation material 20, and the second electrically insulating substrate 60 is disposed on the other side of the solidified first encapsulation material 20.

FIG4A is a flow chart showing the packaging method of the light-emitting display device of the fourth embodiment of the present invention. FIG4B is a plan view showing the state of the light-emitting display device of the fourth embodiment of the present invention before the packaging method is implemented. FIG4C is a plan view showing the state of the light-emitting display device of the fourth embodiment of the present invention after the packaging method is implemented. FIG4D is a plan view showing the packaging structure of the light-emitting display device of the fourth embodiment of the present invention after the packaging method is implemented, wherein the first surface and the second surface of the substrate on which the light-emitting body is disposed have a cured first packaging material and a cured second packaging material, respectively.

As shown in FIG. 4A , in a fourth embodiment, the packaging method of the luminous display device, in addition to steps S11 to S15 of FIG. 1A , further includes the following steps S41 to S42.

Step S41: Place a second encapsulation material between the second surface of the substrate and the second pressing plate, with one side of the second encapsulation material facing the second surface of the substrate and the other side of the second encapsulation material facing the second pressing plate. In one embodiment, as shown in FIG. 4B , before the substrate 10, the light-emitting body 100 and the first encapsulation material 20 are squeezed by the first pressing plate 111 and the second pressing plate 112, the second encapsulation material 70 can be placed between the second surface 102 of the substrate 10 and the second pressing plate 112 as a protective plate for the substrate 10.

Step S42: The second packaging material and the first packaging material are squeezed by the first layer pressing plate and the second layer pressing plate. In one embodiment, as shown in FIG. 4C , during the process of the substrate 10, the light-emitting body 100 and the first packaging material 20 being squeezed by the first layer pressing plate 111 and the second layer pressing plate 112, the second packaging material 70 and the first packaging material 20 are squeezed by the first layer pressing plate 111 and the second layer pressing plate 112. The heating temperature setting of the first layer pressing plate 111 and the second layer pressing plate 112 is related to the thickness and material properties of the first packaging material 20 and the second packaging material 70. If the thickness of the first packaging material 20 is greater than the thickness of the second packaging material 70, the heating temperature of the first pressing plate 111 is 1% to 10% higher than the heating temperature of the second pressing plate 112. Optionally, the heating temperature of the first pressing plate 111 and the second pressing plate 112 can be set to 100 degrees Celsius to 160 degrees Celsius and the heating time can be set to 1 to 15 minutes, and the pressure applied by the first pressing plate 111 and the second pressing plate 112 to the substrate and the first packaging material can be set to 0.5 to 2 standard atmospheres (atm).

Furthermore, as shown in FIG. 4A , in the fourth embodiment, the packaging method of the luminous display device may also include the following steps S43 to S45.

Step S43: placing a first release film between the first packaging material and the first pressing plate, and placing a second release film between the second packaging material and the second pressing plate. In one embodiment, as shown in FIG. 4B , before the substrate 10, the light emitting body 100, and the first packaging material 20 are squeezed by the first pressing plate 111 and the second pressing plate 112, the first release film 30 may be placed between the first packaging material 20 and the first pressing plate 111, and the second release film 80 may be placed between the second packaging material 70 and the second pressing plate 112. 2, to prevent the first packaging material 20 and the second packaging material 70 from being respectively adhered to the first pressing plate 111 and the second pressing plate 112 during the process of deformation, melting, flowing, and reshaping due to the heat of the first pressing plate 111 and the second pressing plate 112, so as to facilitate the subsequent separation of the first pressing plate 111 and the second pressing plate 112.

Step S44: The first release film and the second release film are respectively squeezed by the first pressing plate and the second pressing plate together with the first packaging material and the second packaging material. In one embodiment, as shown in FIG. 4C , during the process of the substrate 10, the light emitting body 100, the first packaging material 20 and the second packaging material 70 being squeezed by the first pressing plate 111 and the second pressing plate 112, the first release film 30 and the second release film 80 are also squeezed by the first pressing plate 111 and the second pressing plate 112.

Step S45: Remove the first release film on one side of the cured first packaging material, and remove the second release film on one side of the cured second packaging material. In one embodiment, as shown in FIG. 4D , the first packaging material 20 and the second packaging material 70 form a light-emitting display device packaging structure with the substrate 10 and the light-emitting body 100 after curing. At this time, the first release film 30 attached to one side of the first packaging material 20 and the second release film 80 attached to one side of the second packaging material 70 can be removed.

As shown in FIG4D , the light-emitting display device packaging structure manufactured according to the light-emitting display device packaging method of steps S11 and S15 of FIG1A and steps S41 to S42 or S41 to S45 of FIG4A at least comprises a substrate 10, a light-emitting body 100, a first patterned conductive layer 1011 (see FIG6 ), a cured first packaging material 20, and a cured second packaging material 70. The substrate 10 has a first surface 101 and a second surface 102 facing away from the first surface 101. The light-emitting body 100 is arranged above the first surface 101 of the substrate 10 in an array. The first patterned conductive layer 1011 is arranged on the first surface 101 of the substrate 10 (see FIG6 ). The solidified first encapsulation material 20 is formed on the first surface 101 of the substrate 10 and covers the light-emitting body 100 and the first patterned conductive layer 1011, and the top surface 201 of the solidified first encapsulation material 20 is higher than the top surface 1001 of the light-emitting body 100. The solidified second encapsulation material 70 is formed on the second surface 102 of the substrate 10.

FIG5A is a flow chart showing a packaging method of a light-emitting display device according to the fifth embodiment of the present invention. FIG5B is a plan view showing a state of the light-emitting display device according to the fifth embodiment of the present invention before the packaging method is implemented. FIG5C is a plan view showing a state of the light-emitting display device according to the fifth embodiment of the present invention after the packaging method is implemented. FIG5D is a plan view showing a packaging structure of the light-emitting display device according to the fifth embodiment of the present invention after the packaging method is implemented, wherein one side of the cured first packaging material has a first electrically insulating substrate, and one side of the cured second packaging material has a second electrically insulating substrate.

As shown in FIG. 5A , in a fifth embodiment, the packaging method of the luminous display device, in addition to steps S11 to S15 of FIG. 1A and steps S41 to S42 of FIG. 4A , further includes the following steps S51 to S53.

Step S51: Place a first electrically insulating substrate between the first packaging material and the first layer of pressing plate. In one embodiment, as shown in FIG. 5B , before the substrate 10, the light-emitting body 100, the first packaging material 20 and the second packaging material 70 are squeezed by the first layer of pressing plate 111 and the second layer of pressing plate 112, a first electrically insulating substrate 50 can be placed between the first packaging material 20 and the first layer of pressing plate 111 to serve as a protective substrate for the first packaging material 20 after curing.

Step S52: The first electrically insulating substrate and the first packaging material are squeezed by the first layer of pressing plate and the second layer of pressing plate. In one embodiment, as shown in FIG. 5C , during the process of the substrate 10, the light-emitting body 100, the first packaging material 20 and the second packaging material 70 being squeezed by the first layer of pressing plate 111 and the second layer of pressing plate 112, the first electrically insulating substrate 50 and the first packaging material 20 are squeezed by the first layer of pressing plate 111 and the second layer of pressing plate 112.

Step S53: retain the first electrically insulating substrate on one side of the first packaging material after curing. In one embodiment, as shown in FIG. 5D , after the first packaging material 20 is cured, the first electrically insulating substrate 50 is attached to one side of the first packaging material 20 and forms a light-emitting display device packaging structure together with the first packaging material 20, the second packaging material 70, the substrate 10 and the light-emitting body 100. The retained first electrically insulating substrate 50 can be used as a protective substrate for the entire packaging structure to protect the substrate 10 and the light-emitting body 100 from damage.

Furthermore, as shown in FIG. 5A , in the fifth embodiment, the packaging method of the luminous display device may include the following steps S54 to S56 of FIG. 5A in addition to steps S11 to S15 of FIG. 1A , steps S41 to S42 of FIG. 4A , and steps S51 to S53 of FIG. 5A .

Step S54: Place a second electrically insulating substrate between the second packaging material and the second pressing plate. In one embodiment, as shown in FIG. 5B , before the substrate 10, the light-emitting body 100, the first packaging material 20 and the second packaging material 70 are squeezed by the first pressing plate 111 and the second pressing plate 112, a second electrically insulating substrate 60 can be placed between the second packaging material 70 and the second pressing plate 112 to serve as a protective substrate for the cured second packaging material 70.

Step S55: The second electrically insulating substrate and the second packaging material are squeezed by the first and second pressing plates. In one embodiment, as shown in FIG. 5C , during the process of the substrate 10, the light-emitting body 100, the first packaging material 20 and the second packaging material 70 being squeezed by the first and second pressing plates 111 and 112, the second electrically insulating substrate 60 and the second packaging material 70 are squeezed by the first and second pressing plates 111 and 112.

Step S56: retain the second electrically insulating substrate on one side of the cured second packaging material. In one embodiment, as shown in FIG. 5D , after the second packaging material 70 is cured, the second electrically insulating substrate 60 is attached to one side of the second packaging material 70 and forms a light-emitting display device packaging structure together with the first packaging material 20, the second packaging material 70, the substrate 10 and the light-emitting body 100. The retained second electrically insulating substrate 60 can be used as a protective substrate for the entire packaging structure to protect the substrate 10 and the light-emitting body 100 from damage.

As shown in FIG5D , the light-emitting display device packaging structure manufactured according to the light-emitting display device packaging method of steps S11 and S15 of FIG1A , steps S41 to S42 of FIG4A , and steps S51 to S56 of FIG5A comprises a substrate 10, a light-emitting body 100, a first patterned conductive layer 1011 (see FIG6 ), a cured first packaging material 20, a cured second packaging material 70, a first electrically insulating substrate 50, and a second electrically insulating substrate 60. The substrate 10 comprises a first surface 101 and a second surface 102 facing away from the first surface 101. The light-emitting body 100 is arranged above the first surface 101 of the substrate 10 in an array manner. The first patterned conductive layer 1011 is arranged on the first surface 101 of the substrate 10 (see FIG6 ). The solidified first encapsulation material 20 is formed on the first surface 101 of the substrate 10 and covers the light emitting body 100 and the first patterned conductive layer 1011, and the top surface 201 of the solidified first encapsulation material 20 is higher than the top surface 1001 of the light emitting body 100. The solidified second encapsulation material 70 is formed on the second surface 102 of the substrate 10. The first electrically insulating substrate 50 is disposed on one side of the solidified first encapsulation material 20 and the second electrically insulating substrate 60 is disposed on one side of the solidified second encapsulation material 70.

FIG6 is a schematic plan view showing a patterned conductive layer formed on a substrate of a light-emitting display device of an embodiment of the present invention. As shown in FIG6, in an embodiment, a first patterned conductive layer 1011 including a plurality of conductive wires 10111 and a plurality of pad areas 10112 electrically isolated from each other and arranged adjacently is disposed on the first surface 101 of the substrate 10 of the light-emitting display device. In an embodiment, these conductive wires 10111 may be a plurality of grid conductive wires interwoven into a plurality of polygonal grids or thin and long conductive wires parallel to each other, but the present invention is not limited thereto. In order to reduce the visibility of these conductive wires, the line width of these conductive wires is preferably 10 microns to 100 microns. In other embodiments, the second surface 102 of the substrate 10 may also be provided with a second patterned conductive layer and/or a third patterned conductive layer (not shown), and the present invention is not limited thereto. Optionally, the first patterned conductive layer 1011 is formed by one of sputtering, etching, chemical plating and electroplating, or by one of screen printing and inkjet printing. Preferably, it is formed by one of screen printing and inkjet printing.

FIG7 is a schematic plan view showing a packaging structure of a light-emitting display device according to an embodiment of the present invention after the packaging method is implemented, wherein an anti-reflection layer is disposed on the top of the first electrically insulating substrate. As shown in FIG7, when the light-emitting display device has the first electrically insulating substrate after packaging (as shown in FIGS. 2D, 3D, and 5D), an anti-reflection layer 700 may be additionally disposed on the top of the first electrically insulating substrate 50, and the refractive index of the anti-reflection layer 700 is less than or equal to the refractive index of the first electrically insulating substrate 50 and greater than or equal to the refractive index of air. When the anti-reflection layer 700 is composed of more than two layers of anti-reflection films, for example, four layers of anti-reflection films F1, F2, F3 and F4, the bottom anti-reflection film F1 is attached to the top surface of the first electrically insulating substrate 50, and the refractive index of each layer of anti-reflection film is different. The refractive index of all anti-reflection films is greater than the refractive index of the air layer but less than the refractive index of the first electrically insulating substrate 50, and the refractive index of each layer of anti-reflection film becomes closer to the refractive index of the air layer as it gets closer to the air layer. Preferably, among all anti-reflection films disposed above the first electrically insulating substrate 50, the refractive index of the bottom anti-reflection film is the same or similar to the refractive index of the first electrically insulating substrate 50, the refractive index of the top anti-reflection film is the same or similar to the refractive index of the air layer, and the refractive index difference between all anti-reflection films changes gradually, that is, gradually decreases, for example, in sequence of 1.4, 1.3, 1.2, and 1.1. In other embodiments, when the anti-reflection layer 700 above the first electrically insulating substrate 50 is only a single-layer anti-reflection film, the refractive index of the anti-reflection layer 700 is approximately the square root of the refractive index of the first electrically insulating substrate 50.

In the above embodiments, the materials of the first packaging material 20 and the second packaging material 70 can be ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), optical adhesive (OCR) or silicone, and the present invention is not limited thereto. In order to maintain the transparency of the entire light-emitting display device, the first packaging material 20 is preferably a transparent body, such as silicone. The so-called silicone refers to a transparent material that is liquid at room temperature and solid after high-temperature baking, and its refractive index can vary depending on the material formula.

In the above embodiments, the substrate 10 may be flexible, and its material may be glass, ceramic, aluminum nitride ceramic, polycarbonate (PC), ethylene tetrafluoroethylene (ETFE; Ethylene Tetrafluoroethylene), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polymethyl methacrylate (PMMA), polymethyl ether, BT resin, glass fiber or cyclic olefin copolymer, but the present invention is not limited thereto. The substrate 10 is preferably transparent.

In the above-mentioned embodiments, the first electrically insulating substrate 50 and the second electrically insulating substrate 60 may be in the form of a flexible or inflexible plate, sheet or film, preferably transparent, and their materials may be glass, ceramic, aluminum nitride ceramic, polycarbonate (PC), ethylene-tetrafluoroethylene (ETFE; Ethylene Tetrafluoroethylene), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polymethyl methacrylate (PMMA), polymethyl ether, BT resin, glass fiber or cyclic olefin copolymer. In addition, in each of the above embodiments, the light-emitting body 100 can be a light-emitting diode lamp bead composed of three light-emitting diodes (LEDs) that can emit red light, green light, and blue light without a driver chip (IC); or, the light-emitting body 100 can also be a single light-emitting diode component, or a bare die, or a light-emitting diode chip having a light-emitting diode that can emit red light, green light, and blue light and a driver chip (IC) and having an input voltage pin, a data signal input pin, a clock signal input pin, a ground pin, a clock signal output pin, and a data signal output pin.

In summary, according to the packaging method and packaging structure of the luminescent display device described in the embodiments of the present invention, a substrate with a certain area or even a large area carrying a luminescent body can be quickly and effectively packaged at one time, and further the upper and lower layers of the substrate can be protected to prevent the patterned conductive layer and its fine conductive circuits and the luminescent body of a small volume from being polluted and damaged by contact with the external environment during the use of the luminescent display device. Since the materials of the first packaging material and the second packaging material can be transparent, and the protective plates provided additionally on the upper and lower layers of the substrate can also be transparent, the transparency of the entire luminescent display device will not be affected. In addition, packaging materials with required refractive properties can be selected for packaging based on the consideration of increasing the amount of light emitted from the light-emitting body. In addition, a single-layer or multi-layer film can be additionally arranged on the protective plate additionally provided above the surface of the substrate carrying the light-emitting body to reduce the reflection of the emitted light of the light-emitting display device and the ambient light between the substrate and the air layer, so as to prevent people behind the substrate from seeing the reflected light of the light-emitting display device. In the present invention, the materials of the first packaging material and the second packaging material are not limited to the materials mentioned above, and any transparent material with hot melt properties can also be used. In addition, although the formation of the cured first packaging material and the cured second packaging material in the above-mentioned embodiments is explained by taking the lamination method as an example, it can also be carried out by non-lamination methods, such as autoclave, perfusion and spread coating. Therefore, the packaging structure of the light-emitting display device described in the present invention that is manufactured in a non-lamination manner is regarded as an equivalent embodiment that is completed without departing from the spirit disclosed by the present invention.

The above description should be understandable and implementable to those with ordinary knowledge in the technical field to which the present invention belongs. Some embodiments of the present invention are disclosed as above, but they are not used to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. In other words, other equivalent embodiments completed without departing from the spirit disclosed by the present invention should be included in the present invention, and the scope of protection of the present invention shall be defined by the scope of the attached patent application.

S11~S18: Steps

Claims (20)

A packaging method for a light-emitting display device, comprising: Placing a substrate between a first layer of pressing plate and a second layer of pressing plate, with a first surface of the substrate facing the first layer of pressing plate, and a second surface of the substrate facing away from the first surface facing the second layer of pressing plate, a first patterned conductive layer and a plurality of light-emitting bodies arranged in an array are arranged on the first surface, the minimum spacing between the light-emitting bodies is 2 to 3 mm, and the area of the substrate is 10x10 square centimeters to 300x300 square centimeters; Place a first packaging material with hot melt properties and a thickness of 1 to 1.5 times the sum of the height of the light-emitting bodies and the thickness of the substrate between the first surface of the substrate and the first pressing plate, so that one side of the first packaging material faces the first pressing plate, and the other side of the first packaging material faces the first surface of the substrate and is higher than the top surface of the light-emitting bodies; Place at least two spacers with a height of 1 to 1.2 times the sum of the height of the light-emitting bodies and the thickness of the substrate between the first pressing plate and the second pressing plate; Vacuum the space where the substrate and the first packaging material are located; and Heat the first pressing plate and the second pressing plate and squeeze the substrate and the first packaging material by the first pressing plate and the second pressing plate; The heating temperature of the first pressing plate and the second pressing plate is set to 100 degrees Celsius to 160 degrees Celsius. In the packaging method of the light-emitting display device of claim 1, the pressure to which the substrate and the first packaging material are subjected is 0.5 to 2 standard atmospheres. The packaging method of the luminous display device as claimed in claim 1 further comprises: Placing a first release film between the first packaging material and the first pressing plate; Extruding the first release film together with the first packaging material by the first pressing plate and the second pressing plate; and Removing the first release film from one side of the first packaging material after curing. The packaging method of the light-emitting display device as claimed in claim 1 further comprises: Placing a first electrically insulating substrate between the first packaging material and the first layer of pressing plate; Extruding the first electrically insulating substrate together with the first packaging material by the first layer of pressing plate and the second layer of pressing plate; and Retaining the first electrically insulating substrate on one side of the first packaging material after curing. The packaging method of the light-emitting display device as claimed in claim 4, wherein the substrate has a plurality of through holes, and the packaging method further comprises: Placing a second electrically insulating substrate between the substrate and the second layer pressing plate; Extruding the second electrically insulating substrate together with the substrate by the first layer pressing plate and the second layer pressing plate; and Retaining the second electrically insulating substrate on the other side of the first packaging material after curing. The packaging method of the light-emitting display device as claimed in claim 1 further comprises: Placing a second packaging material between the second surface of the substrate and the second pressing plate, with one side of the second packaging material facing the second surface of the substrate and the other side of the second packaging material facing the second pressing plate; and Extruding the second packaging material together with the first packaging material by the first pressing plate and the second pressing plate; Wherein, the heating temperature of the second pressing plate is less than or equal to the heating temperature of the first pressing plate. The packaging method of the luminous display device as claimed in claim 6 further comprises: Placing a first release film between the first packaging material and the first layer of pressing plate; Placing a second release film between the second packaging material and the second layer of pressing plate; Extruding the first release film together with the first packaging material by the first layer of pressing plate and the second layer of pressing plate; Extruding the second release film together with the second packaging material by the first layer of pressing plate and the second layer of pressing plate; Removing the first release film on one side of the first packaging material after curing; and Removing the second release film on one side of the second packaging material after curing. The packaging method of the light-emitting display device as claimed in claim 6 further comprises: Placing a first electrically insulating substrate between the first packaging material and the first layer of pressing plate; Extruding the first electrically insulating substrate together with the first packaging material by the first layer of pressing plate and the second layer of pressing plate; and Retaining the first electrically insulating substrate on one side of the first packaging material after curing. The packaging method of the light-emitting display device as claimed in claim 8 further comprises: Placing a second electrically insulating substrate between the second packaging material and the second layer pressing plate; Extruding the second electrically insulating substrate together with the second packaging material by the first layer pressing plate and the second layer pressing plate; and Retaining the second electrically insulating substrate on one side of the second packaging material after curing. A packaging method for a light-emitting display device as claimed in any one of claims 1 to 9, wherein the first patterned conductive layer has conductive lines with a line width of 10 microns to 100 microns. A packaging method for a luminescent display device as claimed in any one of claims 1 to 9, wherein the material of the substrate is one of glass, ceramic, aluminum nitride ceramic, polycarbonate (PC), ethylene tetrafluoroethylene (ETFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polymethyl methacrylate (PMMA), polymethyl ether, BT resin, glass fiber and cyclic olefin copolymer. A packaging method for a luminescent display device as claimed in any one of claims 1 to 9, wherein the material of the first packaging material is one of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), optical adhesive (OCR) and silicone. A light-emitting display device packaging structure manufactured by the light-emitting display device packaging method of any one of claims 1 to 3, comprising: The substrate has the first surface and the second surface; The light-emitting bodies are arranged in an array above the first surface of the substrate; The first patterned conductive layer is arranged on the first surface of the substrate; and The solidified first packaging material is formed above the first surface of the substrate and covers the light-emitting bodies and the first patterned conductive layer, and the top surface of the solidified first packaging material is higher than the top surface of the light-emitting bodies. A light-emitting display device packaging structure manufactured by the light-emitting display device packaging method as claimed in claim 4, comprising: The substrate has the first surface and the second surface; The light-emitting bodies are arranged in an array above the first surface of the substrate; The first patterned conductive layer is arranged on the first surface of the substrate; The solidified first packaging material is formed above the first surface of the substrate and covers the light-emitting bodies and the first patterned conductive layer, and the top surface of the solidified first packaging material is higher than the top surface of the light-emitting bodies; and The first electrically insulating substrate is arranged on one side of the solidified first packaging material. The light-emitting display device package structure of claim 14 further comprises: An anti-reflection layer disposed above the first electrically insulating substrate, the refractive index of the anti-reflection layer being less than or equal to the refractive index of the first electrically insulating substrate and greater than or equal to the refractive index of air. As in claim 15, the light-emitting display device packaging structure, wherein the anti-reflection layer only includes a single anti-reflection film, and the refractive index of the single anti-reflection film is the square root of the refractive index of the first electrically insulating substrate. As in the packaging structure of the luminescent display device of claim 15, the anti-reflection layer comprises a plurality of anti-reflection films, and the difference in refractive index between the anti-reflection films changes gradually. A packaging structure of a light-emitting display device manufactured by the packaging method of a light-emitting display device as claimed in claim 5, comprising: The substrate has the first surface and the second surface; The light-emitting bodies are arranged in an array above the first surface of the substrate; The first patterned conductive layer is arranged on the first surface of the substrate; The solidified first packaging material is formed above the first surface of the substrate and covers the light-emitting bodies and the first patterned conductive layer, and the top surface of the solidified first packaging material is higher than the top surface of the light-emitting bodies; The first electrically insulating substrate is arranged on one side of the solidified first packaging material; and The second electrically insulating substrate is arranged on the other side of the solidified first packaging material. A light-emitting display device packaging structure manufactured by the light-emitting display device packaging method of any one of claims 6 to 7, comprising: The substrate has the first surface and the second surface; The light-emitting bodies are arranged in an array above the first surface of the substrate; The first patterned conductive layer is arranged on the first surface of the substrate; The solidified first packaging material is formed above the first surface of the substrate and covers the light-emitting bodies and the first patterned conductive layer, and the top surface of the solidified first packaging material is higher than the top surface of the light-emitting bodies; and The solidified second packaging material is formed on the second surface of the substrate. A packaging structure of a light-emitting display device manufactured by the packaging method of a light-emitting display device as claimed in claim 9, comprising: The substrate has the first surface and the second surface; The light-emitting bodies are arranged in an array above the first surface of the substrate; The first patterned conductive layer is arranged on the first surface of the substrate; The solidified first packaging material is formed above the first surface of the substrate and covers the light-emitting bodies and the first patterned conductive layer, and the top surface of the solidified first packaging material is higher than the top surface of the light-emitting bodies; The first electrically insulating substrate is arranged on one side of the solidified first packaging material; The solidified second packaging material is formed on the second surface of the substrate; and The second electrically insulating substrate is arranged on one side of the solidified second packaging material.