TWI845672B - 封裝環結構 - Google Patents
封裝環結構 Download PDFInfo
- Publication number
- TWI845672B TWI845672B TW109115294A TW109115294A TWI845672B TW I845672 B TWI845672 B TW I845672B TW 109115294 A TW109115294 A TW 109115294A TW 109115294 A TW109115294 A TW 109115294A TW I845672 B TWI845672 B TW I845672B
- Authority
- TW
- Taiwan
- Prior art keywords
- seal ring
- ring structure
- seal
- ring
- Prior art date
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109115294A TWI845672B (zh) | 2020-05-08 | 封裝環結構 | |
CN202010483981.5A CN113629015A (zh) | 2020-05-08 | 2020-06-01 | 封装环结构 |
US16/889,816 US11448318B2 (en) | 2020-05-08 | 2020-06-02 | Seal ring structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109115294A TWI845672B (zh) | 2020-05-08 | 封裝環結構 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202143432A TW202143432A (zh) | 2021-11-16 |
TWI845672B true TWI845672B (zh) | 2024-06-21 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180047648A1 (en) | 2016-08-15 | 2018-02-15 | Globalfoundries Inc. | Ic structure integrity sensor having interdigitated conductive elements |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180047648A1 (en) | 2016-08-15 | 2018-02-15 | Globalfoundries Inc. | Ic structure integrity sensor having interdigitated conductive elements |
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