TWI839174B - Parallel module driver - Google Patents

Abstract

The present invention provides a parallel module driver including a modular backplane structure, a rectifier module and an inverter module. The modular backplane structure includes a plurality of connectors arranged equidistantly in a first direction. The rectifier module includes a rectifier-connection slot disposed on a rear surface and configured to match with one of the plurality of connectors along a second direction. The inverter module includes an inverter-connection slot disposed on a rear surface and configured to match with one of the plurality of connectors along the second direction. The rectifier module and the inverter module are arranged adjacent to each other and the rectifier-connection slot and the inverter-connection slot are connected to two adjacent connectors on the modular backplane structure. The rectifier module and the inverter module have the adjacent lateral sides attached to each other and respectively include a guiding element and a guiding groove matched with each other and limiting the rectifier module and the inverter module to slide in the second direction.

Description

Parallel module driver

This case is about an electronic assembly structure, especially a modular backplane structure and its applicable parallel module driver, which allows the book-type module and the modular backplane structure to be assembled and disassembled in the same single direction, so as to effectively increase the space utilization of the electric control box or equipment.

Traditional parallel module drivers are to place inverter modules and rectifier modules in parallel in a single direction, that is, to install them on a base in a horizontal plug-in manner, and to connect them through the base connector to form an electrical connection. However, although the inverter module or rectifier module can be quickly installed on or removed from the base, if the base is damaged, it must be disassembled and repaired one by one. Furthermore, the equipment store cabinet is full of different electrical equipment and wiring, and the disassembly direction of the damaged module is easily limited, and it is difficult to obtain the force application point, which is not user-friendly.

In equipment cabinets, space utilization is one of the indicators of product competitiveness. Although the body of the traditional inverter module can be disassembled by rotation, its rotation path requires space to be reserved in the equipment cabinet for the withdrawal path, resulting in space waste. When the body of the inverter module is assembled back to the base, there is no structural alignment mechanism. Customers need to blindly insert and align, which can easily cause the connector on the base to be damaged by impact, which is not user-friendly and lacks reliability.

On the other hand, the connection between modules is only fixed by the connector. When the vibration environment is bad or the module is subjected to force vibration or impact, the terminal block of the connector is easy to wear and damage. In addition, the locking position is far away from the front end of the module. The force arm effect caused by the vibration plus the weight difference between the modules will produce different vibration modes, which will cause the modules to collide with each other, thereby increasing the risk of components falling or loosening, or even explosion.

In addition, the parallel structure of the parallel module driver is to input power from the rectifier module, and then transmit the electrical signal to the inverter module through the connector. The more the number of inverter modules is expanded on one side, the longer the path of the electrical signal transmission is, and the more unstable the electrical signal transmission is. Therefore, there is a limit on the number of single-sided horizontal expansion structures.

There are also regulatory requirements for system grounding continuity. The impedance from the grounding point of the rectifier module to the grounding point of the inverter module (the farthest point) must be less than the regulatory standard. If the modules are connected through the clips and PINs of the connector, the higher the resistance value and the more expansion is allowed, the higher the risk of grounding continuity failing to meet the regulations.

In view of this, it is necessary to provide a modular backplane structure and its applicable parallel module driver to solve the deficiencies in the prior art.

The purpose of this case is to provide a modular backplane structure and a parallel module driver applicable thereto. The installation and assembly of the modular backplane structure can be limited to a single direction. The rectifier module and the inverter module adopt a book-type parallel module design, which allows them to be plugged into the modular backplane structure or disassembled from the modular backplane structure in the same single direction, so as to effectively increase the space utilization of the electric control box or equipment.

Another purpose of the present invention is to provide a modular backplane structure and a parallel module driver applicable thereto. The plurality of connectors on the modular backplane structure are arranged equidistantly in a first direction, and allow the plurality of connectors to be arranged equidistantly after two or more modular backplane structures are spliced together in the first direction. The size design of at least one rectifier module and at least one inverter module relative to the plurality of connectors on the modular backplane structure is a multiple of the distance between two adjacent connectors in the first direction, allowing the rectifier module and the inverter module to be installed and connected to any two adjacent connectors of the modular backplane structure in the second direction, forming a parallel module driver arranged in the first direction, and individual modules can be disassembled or replaced in the second direction. The inverter modules can be arranged on one or both sides of the rectifier module in the first direction for parallel expansion, and the number is not limited.

Another purpose of this case is to provide a modular backplane structure and a parallel module driver applicable thereto. The modular backplane structure is composed of a base, a circuit board and an outer cover. A plurality of connectors on the circuit board protrude from the outer cover for connecting the rectifier module and the inverter module to form a parallel module driver. The rectifier module and the inverter module are electrically connected through the connector and the circuit board, effectively reducing the electrical impedance increased by assembly.

To achieve the above-mentioned purpose, the present invention provides a parallel module driver including a modular backplane structure, at least one rectifier module and at least one inverter module. The modular backplane structure includes a first side of the backplane, a second side of the backplane, a first surface, a second surface and a plurality of connectors, wherein the first side of the backplane and the second side of the backplane are arranged opposite to each other in a first direction, and the first surface and the second surface are arranged opposite to each other in a second direction. Each rectifier module includes a first rectifier side, a second rectifier side, a rectifier connecting groove, a rectifier guide and a rectifier guide groove, wherein the first rectifier side and the second rectifier side are arranged opposite to each other in the first direction, and the rectifier connecting groove is arranged on the back of the rectifier module and between the first rectifier side and the second rectifier side, and is assembled in the second direction to be connected with one of the plurality of connectors. Each inverter module includes an inverter first side, an inverter second side, an inverter connection slot, a transformer guide and an inverter guide slot. The inverter first side and the inverter second side are arranged opposite to each other in a first direction. The inverter connection slot is arranged on the back of the inverter module and between the inverter first side and the inverter second side. It is assembled in a second direction and docked with one of a plurality of connectors. At least one rectifier module and at least one inverter module are arranged adjacent to each other. The rectifier connection slot and the inverter connection slot are respectively connected to two adjacent connectors on the modular backplane structure. The rectifier first side and the inverter second side are attached to each other or the rectifier second side and the inverter first side are attached to each other. The rectifier guide and the rectifier guide groove are respectively arranged on the rectifier first side and the rectifier second side, and extend along the second direction. The inverter guide and the inverter guide groove are respectively arranged on the inverter first side and the inverter second side, and extend along the second direction, wherein the rectifier guide allows to be paired with the inverter guide groove or the rectifier guide groove is paired with the inverter guide so that the rectifier module and the inverter module can be assembled and slid in the second direction.

1, 1 ' , 1a, 1a ' , 1b, 1b ' , 1c, 1c ' , 1d, 1d ' : Parallel module driver

2, 2a, 2b, 2c, 2d: Modular backplane structure

201: First surface

202: Second surface

203: First side of back panel

204: Second side of back panel

205: Third side of backboard

206: Fourth side of back panel

21: Base

211: Second joint

212: Second locking hole

22: Circuit board

221:Piercing

222: Grounding ring

23: Outer cover

231: Open mouth

232: First locking hole

233: First joint

234: Groove

24: Connector

25: Positioning ribs

26: First connecting piece

27: Second connecting piece

3: Rectifier module

301: Front

302: Back

303: Rectification first side

304: Rectification second side

305: Upper Edge

306: Lower Edge

31: Rectification guide

32: Rectification guide groove

33: Rectifier connection slot

34: Rectification positioning slot

35: flange

36: Arc-shaped convex block

4: Inverter module

401: Positive

402: Back

403: Invert first side

404: Invert the second side

405: Upper Edge

406: Lower Edge

41: Inverter guide

42: Inverter guide groove

43: Inverter connection slot

44: Inverter positioning slot

45: Arc-shaped convex block

H1: First docking height

H2: Second docking height

WR: Rectifier module width

WI: Inverter module width

W21, W31: First interval distance

W22, W32, W42: Second interval distance

W23, W33, W43: The third interval distance

W24: The fourth interval distance

X, Y, Z: axis

Figures 1A and 1B are diagrams showing the appearance of the parallel module driver of the first embodiment of the present invention.

Figure 2A and Figure 2B are structural exploded views of the parallel module driver of the first embodiment of the present invention.

Figure 3 is a structural exploded view of the modular backplane structure of the first embodiment of the present invention.

Figures 4A and 4B are exterior structural diagrams of the modular backplane structure of the first embodiment of the present invention.

Figure 5 is a front view of the modular backplane structure of the first embodiment of the present invention.

Figure 6A and Figure 6B reveal the appearance structure diagram and rear view of the rectifier module of this case.

Figures 7A and 7B reveal the appearance structure diagram and rear view of the inverter module of this case.

Figures 8A and 8B are front views of the parallel module driver of the first embodiment of the present invention.

Figure 9 is a front view of the modular backplane structure of the second embodiment of the present invention.

Figures 10A and 10B are front views of the parallel module driver of the second embodiment of the present invention.

Figure 11 is a front view of the modular backplane structure of the third embodiment of the present invention.

Figures 12A and 12B are front views of the parallel module driver of the third embodiment of the present invention.

Figure 13 is a schematic diagram showing the assembly of the modular backplane structure of the fourth embodiment of the present invention.

Figures 14A and 14B are front views of the parallel module driver of the fourth embodiment of the present invention.

Figures 15A and 15B are front views of the parallel module driver of the fifth embodiment of the present invention.

Refer to Figures 1A to 2B. In this embodiment, the present invention provides a parallel module driver 1 including a modular backplane structure 2, at least one rectifier module 3 and at least one inverter module 4. The modular backplane structure 2 includes a first backplane side 203, a second backplane side 204, a first surface 201, a second surface 202 and a plurality of connectors 24. The first backplane side 203 and the second backplane side 204 are arranged opposite to each other in a first direction such as the X-axis, the first surface 201 and the second surface 202 are arranged opposite to each other in a second direction such as the Y-axis, and the plurality of connectors 24 are arranged equidistantly in the first direction (i.e., the X-axis direction) and partially protrude from the first surface 201. Two or more modular backplane structures 2 are allowed to be spliced with each other in the second direction (i.e., the Y-axis direction) through the backplane first side 203 and the backplane second side 204 and extend in the first direction (i.e., the X-axis direction) (see FIG. 13 ). The detailed structure of the modular backplane structure 2 will be described in detail later.

In this embodiment, each of at least one rectifier module 3 includes a rectifier first side 303, a rectifier second side 304, and a rectifier connection slot 33. The rectifier first side 303 and the rectifier second side 304 are arranged opposite to each other in the first direction (i.e., the X-axis direction). The rectifier connection slot 33 is arranged on the back side 302 of the rectifier module 3 and is located between the rectifier first side 303 and the rectifier second side 304. It is assembled in the second direction (i.e., the Y-axis direction) and docked with one of the plurality of connectors 24 of the modular backplane structure 2. The front side 301 of the rectifier module 3 has accessories such as input ports and control panels for user operation.

In this embodiment, each of at least one inverter module 4 includes an inverter first side 403, an inverter second side 404, and an inverter connection slot 43. The inverter first side 403 and the inverter second side 404 are arranged opposite to each other in the first direction (i.e., the X-axis direction). The inverter connection slot 43 is arranged on the back side 402 of the inverter module 4 and is located between the inverter first side 403 and the inverter second side 404. It is connected to one of the multiple connectors 24 of the modular backplane structure 2 in the second direction (i.e., the Y-axis direction). The front side 401 of the inverter module 4 has accessories such as output ports for user operation.

It is worth noting that at least one rectifier module 3 and at least one inverter module 4 are arranged adjacent to each other, the rectifier connection slot 33 and the inverter connection slot 43 are respectively connected to two adjacent connectors 24 on the modular backplane structure 2, and the rectifier second side 304 and the inverter first side 403 are attached to each other. In other embodiments, the inverter module 4 is attached to the other side of the rectifier module 3, that is, the rectifier first side 303 of the rectifier module 3 and the inverter second side 404 of the inverter module 4 are attached to each other.

Refer to Figures 3 to 5. In this embodiment, the modular backplane structure 2 includes a base 21, a circuit board 22, an outer cover 23 and N connectors 24. The circuit board 22 is disposed between the base 21 and the outer cover 23. In this embodiment, N=2, that is, two connectors 24 are disposed on the circuit board 22. In other embodiments, N is an integer, and N>2. In other embodiments of the present invention, the N connectors 24 are arranged equidistantly along a first direction such as the X-axis direction. The outer cover 23 includes N openings 231, which are spatially opposite to the N connectors 24. The outer cover 23, the circuit board 22 and the base 21 are stacked in sequence along a second direction such as the Y-axis direction. The outer cover 23 forms a first surface 201 of the modular back plate structure 2 on one side, and the base 21 forms a second surface 202 of the modular back plate structure 2 on one side. The first surface 201 and the second surface 202 are arranged opposite to each other in the second direction (i.e., the Y-axis direction). In this embodiment, the outer cover 23 is connected to the base 21 to form a first side 203 and a second side 204 of the back plate of the modular back plate structure 2. The first side 203 and the second side 204 of the back plate are opposite to each other in the first direction (i.e., the X-axis direction) and are connected through the first surface 201 and the second surface 202. It should be noted that the present case is not limited to the combination method of the outer cover 23 and the base 21 and the method of forming the first surface 201, the second surface 202, the first side 203 of the back plate, and the second side 204 of the back plate. In this embodiment, N connectors 24 partially protrude from the first surface 201 through N openings 231. In addition, in this embodiment, the modular backplane structure 2 further includes a first connector 26 and a second connector 27, which are respectively disposed on the first side 203 and the second side 204 of the backplane, wherein the first connector 26 and the second connector 27 have structures that are opposite to each other and can be matched, and allow the first connector 26 to be matched and engaged with the second connector 27 of another modular backplane structure 2 in the second direction (i.e., the Y-axis direction), or the second connector 27 to be matched and engaged with the first connector 26 of another modular backplane structure 2 in the second direction to combine two modular backplane structures 2 (see FIG. 13).

In this embodiment, N connectors 24 are arranged equidistantly in a first direction (i.e., the X-axis direction), wherein any two adjacent ones of the N connectors 24 have a first spacing distance W21, a second spacing distance W22 is provided between the first side 203 of the backplane and the adjacent and closest ones of the N connectors 24, and a third spacing distance W23 is provided between the second side 204 of the backplane and the adjacent and closest ones of the N connectors 24, wherein the first spacing distance W21 is equal to the sum of the second spacing distance W22 and the third spacing distance W23. Thus, after two or more modular backplane structures 2 are spliced with each other in the second direction (i.e., the Y-axis direction) through the backplane first side 203 and the backplane second side 204 and extended in the first direction (i.e., the X-axis direction) (see FIG. 13 ), any two adjacent connectors 24 on the two or more modular backplane structures 2 still maintain the same first spacing distance W21, thus realizing modular expansion applications. Of course, the present case is not limited to this.

Refer to Figures 1A to 6B. In this embodiment, N connectors 24 are respectively arranged in the second direction (i.e., the Y-axis direction) to connect the rectifier connection slot 33 of at least one rectifier module 3 and the inverter connection slot 43 of at least one inverter module 4. In this embodiment, any two adjacent connectors 24 on the modular backplane structure 2 have a first spacing distance W21 in the first direction (i.e., the X-axis direction). In addition, there is a rectifier module width WR between the rectifier first side 303 and the rectifier second side 304 of the rectifier module 3, and the rectifier module width WR is twice the first spacing distance W21. In this embodiment, the rectifier module 3 shown in FIG. 6A and FIG. 6B includes two rectifier connection slots 33, which are located between the rectifier first side 303 and the rectifier second side 304, wherein the first spacing distance W31 defined by the two rectifier connection slots 33 in the first direction (i.e., the X-axis direction) is equal to the first spacing distance W21 of any two adjacent connectors 24 on the modular backplane structure 2. It should be noted that the rectifier module 3 can be electrically connected to the circuit board 22 of the modular backplane structure 2 by connecting any one of the two rectifier connection slots 33 of the rectifier module 3 to the connector 24 of the modular backplane structure 2. Of course, the two rectifier connection slots 33 can also be connected to the two connectors 24. Through the control of the circuit board, the effect is the same as the effect of connecting a single rectifier connection slot 33 to a single connector 24. The present case is not limited to this and will not be elaborated. In this embodiment, there is a second spacing distance W32 between the rectifying first side 303 of the rectifying module 3 and the adjacent and closest one of the two rectifying connecting slots 33, and there is a third spacing distance W33 between the rectifying second side 304 and the adjacent and closest one of the two rectifying connecting slots 33, wherein the first spacing distance W21 of any two adjacent connectors 24 on the modular backplane structure 2 is equal to the first spacing distance W31 defined by the two rectifying connecting slots 33 in the first direction (i.e., the X-axis direction), and the first spacing distance W31 of the rectifying module 3 is also equal to the sum of the second spacing distance W32 and the third spacing distance W33 on the rectifying module 3. In addition, the rectifying module width WR is twice the first spacing distances W21 and W31. In this way, the rectifier module 3 can be adjusted in position or increased in number on the modular backplane structure 2 according to needs, thus realizing modular expansion applications.

In addition, refer to Figures 1A to 7B. The inverter first side 403 and the inverter second side 404 of the inverter module 4 shown in Figures 7A and 7B have an inverter module width WI, and the inverter module width WI is equal to the first spacing distance W21 between any two adjacent phase connectors 24 on the modular backplane structure 2. In this embodiment, there is a second spacing distance W42 between the inverter first side 403 and the inverter connection slot 43 of the inverter module 4, and there is a third spacing distance W43 between the inverter second side 404 and the inverter connection slot 43, wherein the first spacing distance W21 of any two adjacent phase connectors 24 on the modular backplane structure 2 is equal to the inverter module width WI, and is also equal to the sum of the second spacing distance W42 and the third spacing distance W43 of the inverter module 4. In this way, the inverter module 4 can be adjusted according to the needs to be set on the modular backplane structure 2 or the number can be increased to achieve modular expansion application.

Refer to Figures 1A to 8B. In this embodiment, at least one rectifier module 3 further includes a rectifier guide 31 and a rectifier guide groove 32, which are respectively disposed on the rectifier first side 303 and the rectifier second side 304, and extend along the second direction (i.e., the Y-axis direction). At least one inverter module 4 includes an inverter guide 41 and an inverter guide groove 42, which are respectively disposed on the inverter first side 403 and the inverter second side 404, and extend along the second direction (i.e., the Y-axis direction). In this embodiment, the rectifier guide 31 and the inverter guide 41 are, for example, guide rib structures having the same structure, and the rectifier guide groove 32 and the inverter guide groove 42 are, for example, guide frames that match the guide ribs, or are composed of a plurality of hooks to match the guide ribs. In this embodiment, the rectifying guide 31 is allowed to be paired with the inverter guide groove 42 or the rectifying guide groove 32 of another rectifying module 3 and slide in the second direction (i.e., the Y-axis direction), and the rectifying guide groove 32 is allowed to be paired with the inverter guide 41 or the rectifying guide groove 31 of another rectifying module 3 and assembled and slide in the second direction (i.e., the Y-axis direction). Similarly, the inverter guide 41 is allowed to be paired with the rectifying guide groove 32 or the inverter guide groove 42 of another inverter module 4 and assembled and slide in the second direction (i.e., the Y-axis direction), and the inverter guide groove 42 is allowed to be paired with the rectifying guide 31 or the inverter guide 41 of another inverter module 4 and assembled and slide in the second direction (i.e., the Y-axis direction). It is worth noting that, by providing the rectifier guide 31, the rectifier guide groove 32, the inverter guide 41 and the inverter guide groove 42, the rectifier module 3 and the inverter module 4 can be installed, expanded or disassembled relative to the modular backplane structure 2, and the assembly and sliding direction can be limited to the second direction (i.e., the Y-axis direction), so as to avoid the rectifier module 3 and the inverter module 4 from generating rotational deflection movement, so that the rectifier module 3 and the inverter module 4 can be installed, disassembled or replaced in the second direction (i.e., the Y-axis direction), and the linear disassembly action in the second direction will not waste the customer's cabinet space like the known rotation method.

In this embodiment, the modular backplane structure 2 further includes a plurality of positioning ribs 25, a third backplane side 205, and a fourth backplane side 206. The third backplane side 205 and the fourth backplane side 206 are opposite to each other and are respectively connected between the first backplane side 203 and the second backplane side 204. The plurality of positioning ribs 25 are adjacent to the third backplane side 205 and the fourth backplane side 206, and are assembled in the second direction (i.e., the Y-axis direction) to cooperate with a set of rectifier positioning grooves 34 of at least one rectifier module 3 or a set of inverter positioning grooves 44 of at least one inverter module 4. In this embodiment, there is a fourth spacing distance W24 between any two adjacent ones of the plurality of positioning ribs 25, and the fourth spacing distance W24 is equal to the first spacing distance W21. In addition, the relationship between the positioning rib 25 and the first side 203 of the back plate and the second side 204 of the back plate is similar to that of the connector 24, which will not be described in detail here. Similarly, the relationship between the rectifier positioning groove 34 and the first rectifier side 303 and the second rectifier side 304 is similar to that of the rectifier connecting groove 33, and the relationship between the inverter positioning groove 44 and the first inverter side 403 and the second inverter side 404 is similar to that of the inverter connecting groove 43, which will not be described in detail here. It is worth noting that the rectifier connecting groove 33 of at least one rectifier module 3 and the inverter connecting groove 43 of at least one inverter module 4 form a first docking height H1 when docking with a plurality of connectors 24 in the second direction (i.e., the Y-axis direction). The rectifying positioning groove 34 of at least one rectifying module 3 and the inverter positioning groove 44 of at least one inverter module 4 form a second docking height H2 when docking with the plurality of positioning ribs 25 in the second direction (ie, the Y-axis direction). The first docking height H1 is less than or equal to the second docking height H2. In other words, the second docking height H2 formed by each positioning rib 25 docking with each rectifier positioning groove 34 and inverter positioning groove 44 can be greater than or equal to the first docking height H1 of each connector 24 docking with the rectifier connection groove 33 and inverter connection groove 43, so that the rectifier module 3 and the inverter module 4 can be installed at any position of the modular backplane structure 2 through the matching of the positioning rib 25 and the rectifier positioning groove 34 and the inverter positioning groove 44 to achieve the function of guiding the alignment, and the rectifier module 3 and the inverter module 4 will not be damaged due to different docking heights when they are installed on the modular backplane structure 2. Of course, the present case is not limited to this.

In this embodiment, the modular backplane structure 2 includes a groove 234 adjacent to the one of the plurality of connectors 24 closest to the first side 203 of the backplane, at least one rectifier module 3 includes a flange 35, and the rectifier connection groove 33 is arranged between the flange 35 and the first rectifier side 303, wherein the rectifier connection groove 33 is connected to the one of the plurality of connectors 24 closest to the first side 203 of the backplane in the second direction (i.e., the Y-axis direction), and the flange 35 and the groove 234 are matched and engaged to achieve a physical anti-fool effect when the rectifier module 3 is installed on the modular backplane structure 2. Of course, the present case is not limited thereto.

In addition, in this embodiment, at least one rectifier module 3 includes an arc-shaped protrusion 36, which is disposed on the upper edge 305 of the front face 301 or the lower edge 306 of the front face 301, and is located between the first rectifier side 303 and the second rectifier side 304, and is assembled for the user to hold and apply force in the second direction (i.e., the Y-axis direction) to move the rectifier module 3 in the second direction. In this embodiment, at least one inverter module 4 includes an arc-shaped protrusion 45, which is disposed on the upper edge 405 of the front face 401 or the lower edge 406 of the front face 401, and is located between the first inverter side 403 and the second inverter side 404, and is assembled for the user to hold and apply force in the second direction (i.e., the Y-axis direction) to move the inverter module 4 in the second direction. In other words, the arrangement of the arc-shaped protrusions 36 and 45 can provide a force application point for the user when disassembling the rectifier module 3 and the inverter module 4 from the modular backplane structure 2 along the second direction. In this embodiment, a plurality of protrusions can also be arranged on the arc-shaped protrusions 36 and 45 for positioning of accessory assembly. Of course, the present case is not limited to this.

It should be noted that, in this embodiment, the arc-shaped protrusions 36 and 45 extend to two sides of the rectifier module 3 or the inverter module 4, respectively corresponding to the rectifier guide 31, the inverter guide 41 and the rectifier guide groove 32, the inverter guide groove 42, and provide the rectifier module 3 and the inverter module 4 to limit the sliding direction to the second direction (i.e., the Y-axis direction) when installing, expanding or disassembling, so as to avoid the rotational deflection movement of the rectifier module 3 and the inverter module 4, so that the rectifier module 3 and the inverter module 4 can be installed, disassembled or replaced in the second direction, and the straight-line disassembly action will not waste the customer's cabinet space. In addition, in addition to the connection between the connector 24 and the rectifier connection slot 33 and the inverter connection slot 43, the matching of the rectifier guide 31, the inverter guide 41, the rectifier guide groove 32, the inverter guide groove 42, the positioning rib 25, the rectifier positioning groove 34, the inverter positioning groove 44, the flange 35, and the groove 234 is more helpful for the user to complete the installation or removal action more quickly, and the connector 24 and the rectifier connection slot 33 are connected. 3. The matching of the inverter connection groove 43, the matching of the rectifier guide 31, the inverter guide 41 and the rectifier guide groove 32, the inverter guide groove 42, the matching of the positioning rib 25 and the rectifier positioning groove 34, the inverter positioning groove 44, and the matching of the flange 35 and the groove 234 are more constrained, and the rectifier module 3 and the inverter module 4 can be closely arranged when they are expanded in parallel. Even if different modules have different modal amplitudes, they can be effectively homogenized and resist more severe vibration environments.

Refer to FIG. 1A to FIG. 8B. In this embodiment, the installation and assembly of the modular backplane structure 2 can be limited to the second direction (i.e., the Y-axis direction). Similarly, the rectifier module 3 and the inverter module 4 are further designed as book-type parallel modules, allowing them to be plugged into the modular backplane structure 2 or removed from the modular backplane structure 2 in the same second direction (i.e., the Y-axis direction), so as to effectively increase the space utilization of the electric control box or equipment. In this embodiment, the rectifier module 3 and the inverter module 4 are arranged adjacent to each other, and the rectifier connection slot 33 and the inverter connection slot 43 are respectively connected to two adjacent connectors 24 on the modular backplane structure 2, and are matched with the inverter guide member 41 through the rectifier guide groove 32, so that the rectifier second side 304 of the rectifier module 3 fits the inverter first side 403 of the inverter module 4 and is inserted into the modular backplane structure 2 to form an electrical connection, and the formed parallel module driver 1 is shown in Figure 8A. In another embodiment, the inverter module 4 and the rectifier module 3 are matched with the rectifier guide member 31 through the inverter guide groove 42, so that the rectifier first side 303 of the rectifier module 3 fits the inverter second side 404 of the inverter module 4 and is inserted into the modular backplane structure 2 to form an electrical connection, and the formed parallel module driver 1 ' is shown in Figure 8B. In the parallel module drivers 1, 1 ' structured in this way, the rectifier module 3 can convert the AC input power into a DC current, which is then transmitted to each inverter module 4 through the modular backplane structure 2, and finally the IGBT in the inverter module 4 converts the DC into an AC output for use by other motors. The electrical connection bridge between the rectifier module 3 and the inverter module 4 is realized through the circuit board 22 in the modular backplane structure 2, which reduces the problems of increased electrical impedance, metal wear, and spring deformation caused by the use of traditional connectors, thereby increasing product reliability. In the parallel module driver 1, 1 ' , the inverter module 4 can be connected in parallel and expanded on either side of the rectifier module 3, which can more appropriately optimize the use of the customer's cabinet space. In other words, the arrangement combination of the rectifier module 3 and the inverter module 4 set in parallel on the modular backplane structure 2 can be adjusted according to actual application requirements and expanded for application.

Refer to Figures 3 to 5. In this embodiment, the outer cover 23 includes a first engagement member 233, and the base 21 includes a second engagement member 211. The first engagement member 233 and the second engagement member 211 are opposite to each other in space, such as a concave portion and a convex portion that are matched to each other, or a hook and a tail groove that are matched to each other. When the first engagement member 233 and the second engagement member 211 are engaged with each other, the outer cover 23 and the base 21 are assembled into a whole, and the circuit board 22 is disposed between the outer cover 23 and the base 21. In other embodiments, the outer cover 23 and the base 21 can be combined by elastic sheets, adhesive or magnetic connection to form the first surface 201, the second surface 202, the first side 203 and the second side 204 of the modular back plate structure 2. In this embodiment, the outer cover 23 includes a first locking hole 232, and the base 21 includes a second locking hole 212. The first locking hole 232 and the second locking hole 212 are opposite to each other in space and connected. The modular back plate structure 2 is fixed to the wall of the electric control box or equipment by assembly. Afterwards, the rectifier module 3 and the inverter module 4 can be inserted into the modular backplane structure 2 in the second direction (i.e., the Y-axis direction) to form a book-type parallel module driver 1 (see Figures 1A to 1B). Of course, the method of locking the modular backplane structure 2 to the electric control box or equipment is not limited to this. In one embodiment, the circuit board 22 includes a through hole 221, which is spatially opposite to the first locking hole 232 and the second locking hole 212. The locking member (not shown) can fix the modular backplane structure 2 to the wall of the electric control box or equipment through the first locking hole 232, the through hole 221 and the second locking hole 212. The present case does not limit the type of the circuit board 22 connecting multiple connectors 24 or clamping the outer cover 23 and the base 21.

Refer to Figures 1A to 8B. In this embodiment, N connectors 24 are electrically connected through the copper bars of the circuit board 22. Since the rectifier module 3 and the inverter module 4 are electrically connected through the circuit board 22 and the corresponding connectors 24 in the modular backplane structure 2, the rectifier connection slot 33 of the rectifier module 3, the inverter connection slot 43 of the inverter module 4 and the connector 24 on the circuit board 22 can be provided with a ground signal connection interface at the same time. After the three are assembled, the connector 24 is turned on and can be used for system electrical transmission or ground signal transmission. In other embodiments, the circuit board 22 includes copper foil to provide heat dissipation performance. The circuit board 22 also includes a tin surface for copper sheet parts to increase heat dissipation effect or provide contact for electrical conduction. The present case is not limited to this. In this embodiment, the circuit board 22 further includes a grounding hole ring 222 (including the through hole 221), which is spatially relative to the first locking hole 232 and the second locking hole 212. When a fastener (not shown) fixes the modular backplane structure 2 to the wall through the first locking hole 232, the grounding hole ring 222 and the second locking hole 212, the circuit board 22 and the wall form a grounding line. In other words, the grounding hole ring 222 can be added to the grounding signal transmission path of the circuit board 22, and combined with the locking operation of the modular backplane structure 2, customers can selectively lock the grounding hole ring 222 and the equipment in the customer cabinet for application environments with greater interference, increase the stability of the system grounding, and further improve the competitiveness of the product. Of course, this case is not limited to this.

Refer to Figures 9 to 10B. They disclose the parallel module drivers 1a, 1a ' and the modular backplane structure 2a of the second embodiment of the present case. In this embodiment, the parallel module drivers 1a, 1a ' and the modular backplane structure 2a are similar to the parallel module drivers 1, 1 ' and the modular backplane structure 2 shown in Figures 1A to 8B, and the same component numbers represent the same components, structures and functions. In this embodiment, three connectors 24 arranged equidistantly in the first direction (i.e., the X-axis direction) are respectively assembled in the second direction (i.e., the Y-axis direction) to connect a rectifier module 3 and two inverter modules 4. In one embodiment, the rectifier module 3 is inserted into the connector 24 on the modular backplane structure 2a that is closest to the first side 203 of the backplane, and the two inverter modules 4 are inserted side by side into the other two connectors 24 on the modular backplane structure 2a, so that the rectifier second side 304 of the rectifier module 3 fits the outermost inverter first sides 403 of the two inverter modules 4, and the formed parallel module driver 1a is shown in Figure 10A. In another embodiment, the rectifier module 3 is inserted into the connector 24 closest to the second side 204 of the backplane on the modular backplane structure 2a, and the two inverter modules 4 are inserted side by side into the other two connectors 24 on the modular backplane structure 2a, so that the rectifier first side 303 of the rectifier module 3 fits the outermost inverter second sides 404 of the two inverter modules 4, and the formed parallel module driver 1a ' is shown in Figure 10B. The electrical connection bridge between the rectifier module 3 and the two inverter modules 4 is realized through the circuit board 22 in the backplane structure 2a, reducing the problems of increased electrical impedance, metal wear, and spring deformation caused by the use of traditional connectors, thereby increasing product reliability. In addition, in the parallel module driver 1a, 1a ' , the arrangement and combination of the rectifier module 3 and the inverter module 4 arranged in parallel on the modular backplane structure 2a can be adjusted according to actual application requirements and expanded for application.

Refer to Figures 11 to 12B. They disclose the parallel module drivers 1b, 1b ' and the modular backplane structure 2b of the third embodiment of the present case. In this embodiment, the parallel module drivers 1b, 1b ' and the modular backplane structure 2b are similar to the parallel module drivers 1, 1 ' and the modular backplane structure 2 shown in Figures 1A to 8B, and the same component numbers represent the same components, structures and functions. In this embodiment, four connectors 24 arranged equidistantly in the first direction (i.e., the X-axis direction) are respectively assembled in the second direction (i.e., the Y-axis direction) to connect a rectifier module 3 and three inverter modules 4. In one embodiment, the rectifier module 3 is inserted into the connector 24 on the modular backplane structure 2b that is closest to the first side 203 of the backplane, and the three inverter modules 4 are inserted side by side into the other three connectors 24 on the modular backplane structure 2b, so that the rectifier second side 304 of the rectifier module 3 fits the outermost inverter first side 403 of the three inverter modules 4, and the formed parallel module driver 1b is shown in Figure 12A. In another embodiment, the rectifier module 3 is inserted into the connector 24 closest to the second side 204 of the backplane on the modular backplane structure 2b, and the three inverter modules 4 are inserted side by side into the other three connectors 24 on the modular backplane structure 2b, so that the rectifier first side 303 of the rectifier module 3 fits the outermost inverter second side 404 of the three inverter modules 4, and the formed parallel module driver 1b ' is shown in Figure 12B. The electrical connection bridge between the rectifier module 3 and the three inverter modules 4 is realized through the circuit board 22 in the backplane structure 2b, reducing the problems of increased electrical impedance, metal wear, and spring deformation caused by the use of traditional connectors, thereby increasing product reliability. In addition, in the parallel module drivers 1b, 1b ' , the arrangement and combination of the rectifier module 3 and the inverter module 4 arranged in parallel on the modular backplane structure 2b can be adjusted according to actual application requirements and expanded for application.

Refer to Figures 13 to 14B. They disclose the parallel module drivers 1c, 1c ' and the modular backplane structure 2c of the fourth embodiment of the present case. In this embodiment, the parallel module drivers 1c, 1c ' and the modular backplane structure 2c are similar to the parallel module drivers 1, 1 ' and the modular backplane structure 2 shown in Figures 1A to 8B, and the same component numbers represent the same components, structures and functions. In this embodiment, the modular backplane structure 2c is composed of two modular backplane structures 2 spliced together in the second direction (i.e., the Y-axis direction) and extending in the first direction (i.e., the X-axis direction). Thus, the assembled modular backplane structure 2c is equivalent to having four connectors 24 arranged equidistantly in the first direction (i.e., the X-axis direction) and respectively assembled in the second direction (i.e., the Y-axis direction) to connect the rectifier module 3 and the inverter module 4. In one embodiment, the rectifier module 3 is inserted into two connectors 24 near the center of the modular backplane structure 2c, and two inverter modules 4 are respectively inserted into the other two connectors 24 on the modular backplane structure 2c, so that the first rectifier side 303 and the second rectifier side 304 of the rectifier module 3 are respectively attached to an inverter module 4, and the formed parallel module driver 1c is shown in FIG. 14A. In another embodiment, two inverter modules 4 are inserted side by side on two connectors 24 near the center of the modular backplane structure 2c, and two rectifier modules 3 are respectively inserted on the modular backplane structure 2c near the connector 24 on the first side 203 of the backplane and the connector 24 on the second side 204 of the backplane, so that the two inverter modules 4 are placed side by side between the two rectifier modules 3, and the formed parallel module driver 1c ' is shown in Figure 14B. It is worth noting that, unlike the parallel module drivers 1, 1 ' , 1a, 1a ' , 1b, 1b ' of the aforementioned embodiments, in which the inverter module 4 is only connected in parallel and expanded on either side of the rectifier module 3, the inverter module 4 of the parallel module driver 1c is expanded on both sides of the rectifier module 3. This helps to make the electrical coupling effect and signal transmission more stable, while reducing the impact of impedance and system parallel length. When multiple rectifier modules 3 are connected in parallel, a higher power input can be provided to the inverter module 4, allowing the application of the inverter module 4 to develop towards higher power applications. Of course, the present case is not limited to this.

Refer to Figures 15A to 15B. They disclose the parallel modular drivers 1d, 1d ' and the modular backplane structure 2d of the fifth embodiment of the present case. In this embodiment, the parallel modular drivers 1d, 1d ' and the modular backplane structure 2d are similar to the parallel modular drivers 1b, 1b ' and the modular backplane structure 2b shown in Figures 11 to 12B, and the same component numbers represent the same components, structures and functions. In this embodiment, the modular backplane structure 2d is composed of two modular backplane structures 2b spliced together in the second direction (i.e., the Y-axis direction) and extending in the first direction (i.e., the X-axis direction). Thus, the assembled modular backplane structure 2d is equivalent to having eight connectors 24 arranged equidistantly in the first direction (i.e., the X-axis direction) and respectively assembled in the second direction (i.e., the Y-axis direction) to connect the rectifier module 3 and the inverter module 4. In one embodiment, the plurality of connectors 24 of the modular backplane structure 2d can be assembled and connected to one rectifier module 3 and six inverter modules 4. Three inverter modules 4 are arranged side by side on one side of the rectifier module 3, and the other three inverter modules 4 are arranged side by side on the other side of the rectifier module 3. The resulting parallel module driver 1d is shown in FIG. 15A. In one embodiment, the plurality of connectors 24 of the modular backplane structure 2d can be assembled and connected to two rectifier modules 3 and five inverter modules 4, and the resulting parallel module driver 1d ' is shown in Figure 15B. In another embodiment, the plurality of connectors 24 of the modular backplane structure 2d can be assembled and connected to two rectifier modules 3 and five inverter modules 4. Of course, in other embodiments, the number and arrangement of rectifier modules 3 and inverter modules 4 inserted in parallel in the modular backplane structure 2d can be changed according to actual application requirements.

As can be seen from the above, the modular backplane structures 2~2d can be spliced together in the second direction (i.e., the Y-axis direction) and extended in the first direction (i.e., the X-axis direction) according to actual application requirements, so as to form different numbers of connectors 24, which are arranged equidistantly in the first direction (i.e., the X-axis direction). Since the characteristic dimensions of the rectifier module 3 and the inverter module 4 are also designed according to the spacing distance between any two adjacent connectors 24, the parallel module drivers 1~1d ' with different application requirements can be realized by adjusting the configuration of the modular backplane structures 2~2d, the rectifier module 3 and the inverter module 4, and the aforementioned many technical features can be combined and changed according to actual application requirements. The present case is not limited to this and will not be elaborated.

In summary, the present invention provides a modular backplane structure and a parallel module driver applicable thereto. The installation and assembly of the modular backplane structure can be limited to a single direction. The rectifier module and the inverter module adopt a book-type parallel module design, which allows them to be plugged into the modular backplane structure or disassembled from the modular backplane structure in the same single direction, so as to effectively increase the space utilization of the electric control box or equipment. The plurality of connectors on the modular backplane structure are arranged equidistantly in a first direction, and it is allowed to maintain the equidistant arrangement of the plurality of connectors after splicing two or more modular backplane structures to each other in the first direction. Relative to the multiple connectors on the modular backplane structure, the size design of at least one rectifier module and at least one inverter module is multiple of the distance between the two adjacent connectors, allowing the rectifier module and the inverter module to be installed and connected to any two adjacent connectors of the modular backplane structure in the second direction, forming a parallel module driver arranged in the first direction, and individual modules can be removed or replaced in the second direction. The inverter modules can be arranged on one side or both sides of the rectifier module in the first direction for parallel expansion, and the number is not limited. In the parallel module driver with such a structure, the rectifier module can convert the AC input power into DC current, which is then transmitted to each inverter module through the modular backplane structure, and finally the IGBT in the inverter module converts the DC into AC output for use by other motors. The electrical connection bridge between the rectifier module and the inverter module is realized through the circuit board in the backplane structure, reducing the problems of increased electrical impedance, metal wear, and spring deformation caused by the use of traditional connectors, thereby increasing product reliability. In the parallel module driver, the inverter module can be connected in parallel and expanded on either side of the rectifier module, which can better optimize the use of the customer's cabinet space. When the inverter module is expanded on both sides of the rectifier module at the same time, it helps to make the electrical coupling effect and signal transmission smoother, while reducing the impedance and the impact of the system parallel length. When multiple rectifier modules are connected in parallel, a higher power input can be provided to the inverter module, allowing the application of the inverter module to develop towards higher power applications. On the other hand, the modular backplane structure can be provided with equidistantly arranged positioning ribs corresponding to a plurality of connectors, and the rectifier module and the inverter module are provided with corresponding positioning grooves. The docking height formed by each positioning rib and each positioning groove can be greater than the docking height of each connector docking with the connection groove, so that the rectifier module and the inverter module can be installed at any position of the modular backplane structure. The positioning ribs and the positioning grooves can achieve the function of guiding the alignment, and the rectifier module and the inverter module will not cause damage to the connector when they are installed on the modular backplane structure. The rectifier module is provided with a flange on the surface corresponding to the modular backplane structure, which corresponds to the groove provided on the modular backplane structure, so that the rectifier module can be physically foolproof when it is installed on the modular backplane structure. In addition, the front of the rectifier module and the inverter module is provided with an arc-shaped protrusion, which can provide the user with a force point when removing the rectifier module and the inverter module from the modular backplane structure. The protrusion is also provided with a plurality of protrusions for positioning the assembly of accessories. The arc-shaped protrusion extends to the sides of the rectifier module or the inverter module, corresponding to the setting of the guide and the guide groove respectively, to limit the sliding direction when the rectifier module and the inverter module are installed, expanded or removed, to avoid the rotational deflection movement of the rectifier module and the inverter module, so that the rectifier module and the inverter module can be installed, removed or replaced in the second direction, and its linear disassembly action will not waste the customer's cabinet space. Furthermore, the matching of the guide, guide groove, positioning rib, positioning groove, flange, and groove helps the user to complete the installation or removal action more quickly. The matching of the guide and the guide groove, the matching of the positioning rib and the positioning groove, and the matching of the flange and the groove are constrained, and provide a close arrangement when the rectifier module and the inverter module are expanded in parallel. Even when different modules have different modal amplitudes, they can be effectively homogenized and resist more severe vibration environments. On the other hand, the modular backplane structure is composed of a base, a circuit board, and an outer cover. Multiple connectors on the circuit board protrude from the outer cover for the rectifier module and the inverter module to connect to form a parallel module driver. The rectifier module and the inverter module are electrically connected through the circuit board, which effectively reduces the electrical impedance increased by assembly. Since the rectifier module and the inverter module are electrically connected through the circuit board in the modular backplane structure, the connection slot of the rectifier module, the connection slot of the inverter module and the connector of the circuit board can be provided with a grounding signal connection interface at the same time. After the three are assembled, the connector conduction can be used for system grounding signal transmission. Among them, an additional grounding hole ring can be added to the circuit board grounding signal transmission path, combined with the locking operation of the modular backplane structure, so that customers can selectively lock the grounding hole ring and the equipment of the customer cabinet for application environments with greater interference, increase the stability of system grounding, and further improve the competitiveness of the product.

This case can be modified in various ways by people familiar with this technology, but it will not deviate from the scope of protection of the attached patent application.

1: Parallel module driver

2: Modular backplane structure

201: First surface

203: First side of back panel

204: Second side of back panel

232: First locking hole

234: Groove

24: Connector

25: Positioning ribs

27: Second connecting piece

3: Rectifier module

301: Front

302: Back

303: Rectification first side

304: Rectification second side

31: Rectification guide

32: Rectification guide groove

4: Inverter module

401: Positive

402: Back

403: Invert first side

404: Invert the second side

41: Inverter guide

42: Inverter guide groove

X, Y, Z: axis

Claims (14)

A parallel module driver, comprising: A modular backplane structure, comprising a first side of the backplane and a second side of the backplane arranged opposite to each other in a first direction, a first surface and a second surface arranged opposite to each other in a second direction, and a plurality of connectors, wherein the plurality of connectors are arranged on the first surface equidistantly in the first direction; At least one rectifier module, each of which comprises a first rectifier side, a second rectifier side, a rectifier connecting groove, a rectifier guide, and a rectifier guide groove, wherein the first rectifier side and the second rectifier side are arranged opposite to each other in the first direction, the rectifier connecting groove is arranged on a back side of the rectifier module and is located between the first rectifier side and the second rectifier side, and is assembled in the second direction to dock with one of the plurality of connectors; and At least one inverter module, each of which includes an inverter first side, an inverter second side, an inverter connecting slot, an inverter guide and an inverter guide groove, wherein the inverter first side and the inverter second side are arranged opposite to each other in the first direction, and the inverter connecting slot is arranged on a back side of the inverter module and between the inverter first side and the inverter second side, and is assembled in the second direction to connect with one of the plurality of connectors; One of the at least one rectifier module and one of the at least one inverter module are arranged adjacent to each other, and the corresponding rectifier connection slot and the inverter connection slot are respectively connected to two adjacent connectors on the modular backplane structure, and the rectifier first side and the inverter second side are attached to each other or the rectifier second side and the inverter first side are attached to each other; The rectifying guide and the rectifying guide groove are respectively arranged on the rectifying first side and the rectifying second side, and extend along the second direction; the inverter guide and the inverter guide groove are respectively arranged on the inverter first side and the inverter second side, and extend along the second direction; the rectifying guide and the inverter guide groove are matched or the rectifying guide groove and the inverter guide are matched so that the rectifying module and the inverter module are assembled and slid in the second direction. A parallel module driver as described in claim 1, wherein there is a first spacing distance between any two adjacent connectors in the first direction, there is a second spacing distance between the first side of the backplane and the closest one of the plurality of connectors, and there is a third spacing distance between the second side of the backplane and the closest one of the plurality of connectors, wherein the first spacing distance is equal to the sum of the second spacing distance and the third spacing distance. A parallel module driver as described in claim 2, wherein the rectifier module includes two rectifier connecting slots, which are arranged on the back side of the rectifier module and located between the first rectifier side and the second rectifier side, wherein the two rectifier connecting slots are separated by the first spacing distance in the first direction, and there is a rectifier module width between the first rectifier side and the second rectifier side, and the rectifier module width is twice the first spacing distance. A parallel module driver as described in claim 3, wherein the first side of the rectifier is spaced from the closest one of the two rectifier connecting slots by the second spacing distance, and the second side of the rectifier is spaced from the closest one of the two rectifier connecting slots by the third spacing distance. A parallel module driver as described in claim 2, wherein there is an inverter module width between the first side of the inverter and the second side of the inverter, and the inverter module width is equal to the first spacing distance. A parallel module driver as described in claim 5, wherein the first side of the inverter is spaced from the inverter connecting slot by the second spacing distance, and the second side of the inverter is spaced from the inverter connecting slot by the third spacing distance. A parallel module driver as described in claim 1, wherein the modular backplane structure further includes a groove, and the one of the plurality of connectors closest to the first side of the backplane is arranged between the first side of the backplane and the groove, and the at least one rectifier module further includes a flange, and the rectifier connecting groove is arranged between the first rectifier side and the flange, wherein the rectifier connecting groove is connected to the one of the plurality of connectors closest to the first side of the backplane in the second direction, and the flange is matched and engaged with the groove. A parallel module driver as described in claim 1, wherein the modular backplane structure further includes a first connector and a second connector, which are respectively arranged on the first side of the backplane and the second side of the backplane, wherein the first connector and the second connector are structurally opposite to each other, and the first connector or the second connector is matched and engaged with the second connector or the first connector of another modular backplane structure in the second direction to combine the two modular backplane structures. A parallel module driver as described in claim 1, wherein the modular backplane structure further includes a plurality of sets of positioning ribs, a third side of the backplane and a fourth side of the backplane, the third side of the backplane and the fourth side of the backplane are opposite to each other and are respectively connected between the first side of the backplane and the second side of the backplane, the plurality of sets of positioning ribs are adjacent to the third side of the backplane and the fourth side of the backplane, and are assembled in the second direction to cooperate with a set of rectifier positioning grooves of the at least one rectifier module or a set of inverter positioning grooves of the at least one inverter module. A parallel module driver as described in claim 9, wherein the rectifier connecting slot of the at least one rectifier module and the inverter connecting slot of the at least one inverter module form a first docking height when docked with the plurality of connectors in the second direction, and the group of rectifier positioning slots of the at least one rectifier module and the group of inverter positioning slots of the at least one inverter module form a second docking height when docked with the plurality of positioning ribs in the second direction, wherein the first docking height is less than or equal to the second docking height. A parallel module driver as described in claim 1, wherein there is a first spacing distance between any two adjacent connectors in the first direction, and the modular backplane structure further includes a plurality of sets of positioning ribs, wherein there is a fourth spacing distance between any two adjacent ones of the plurality of positioning ribs, and the fourth spacing distance is equal to the first spacing distance. A parallel module driver as described in claim 1, wherein the at least one rectifier module further includes an arc-shaped protrusion, which is arranged on the front upper edge or the front lower edge of the rectifier module and is located between the first rectifier side and the second rectifier side, and is assembled for a user to hold and apply force in the second direction to move the rectifier module in the second direction. A parallel module driver as described in claim 1, wherein the at least one inverter module further includes an arc-shaped protrusion, which is arranged on the front upper edge or the front lower edge of the inverter module and is located between the first side of the inverter and the second side of the inverter, and is assembled for a user to hold and apply force in the second direction to move the inverter module in the second direction. In the parallel module driver as described in claim 1, the rectifier connection slot, the inverter connection slot and the connector can be provided with a ground signal connection interface at the same time.