TWI836990B - Impedance measuring device and method for measuring interfacial contact resistance - Google Patents

Impedance measuring device and method for measuring interfacial contact resistance Download PDF

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TWI836990B
TWI836990B TW112117822A TW112117822A TWI836990B TW I836990 B TWI836990 B TW I836990B TW 112117822 A TW112117822 A TW 112117822A TW 112117822 A TW112117822 A TW 112117822A TW I836990 B TWI836990 B TW I836990B
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impedance
lower clamp
sample
clamp part
upper clamp
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TW112117822A
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黃鎮江
陳鎮昌
李達人
劉邦旋
張嶒
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張嶒
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Abstract

The present invention discloses an impedance measuring device, comprising: a first fixture comprising a first upper clamp and a first lower clamp; a second fixture comprising a second upper clamp and a second lower clamp; an impedance tester, electrically connected to the first upper clamp, the first lower clamp, the second upper clamp and the second lower clamp; and a processor, electrically connected to the impedance tester, wherein the first upper clamp and the second upper clamp are configured to simultaneously move along a longitudinal direction. The present invention further discloses a method for measuring interfacial contact impedance which may utilize the first fixture and the second fixture to simultaneously measure impedances of at least two samples. Thereby, the present invention can provide an advantageous technique for quickly and precisely measuring surface contact impedances of samples.

Description

阻抗測量裝置及測量表面接觸阻抗之方法Impedance measuring device and method of measuring surface contact impedance

本發明有關於一種阻抗測量裝置及方法,特別有關於一種可快速且準確地測得表面接觸阻抗的測量裝置及方法。The present invention relates to an impedance measuring device and method, and in particular to a measuring device and method capable of quickly and accurately measuring surface contact impedance.

燃料電池的內部阻抗為用於評估電池性能的重要指標,也是電堆發電效率的關鍵參數。因此,準確量測燃料電池的內部阻抗的技術對燃料電池的開發極為重要。The internal impedance of a fuel cell is an important indicator for evaluating the performance of a cell and is also a key parameter for the efficiency of a fuel cell stack. Therefore, the technology for accurately measuring the internal impedance of a fuel cell is extremely important for the development of fuel cells.

一般而言,燃料電池組件由數層片材組成,其中片材舉例如極板、或氣體擴散層。由於片材間的接觸面微觀上為不平整的,接觸面存在顯著的表面接觸阻抗,特別是極板與氣體擴散層間的接觸面。因此,即使表面接觸阻抗產生微小變化,也會對電堆功率產生巨大影響。申言之,存在燃料電池內部的由數層片材組成之積層體對燃料電池的內部阻抗影響極大。Generally speaking, a fuel cell assembly is composed of several layers of sheets, such as the electrode or the gas diffusion layer. Since the contact surface between the sheets is microscopically uneven, there is a significant surface contact impedance on the contact surface, especially the contact surface between the electrode and the gas diffusion layer. Therefore, even a slight change in the surface contact impedance will have a huge impact on the power of the fuel cell stack. In other words, the laminate composed of several layers of sheets inside the fuel cell has a great impact on the internal impedance of the fuel cell.

如圖1所示,為表面接觸阻抗的量測原理之示意圖。習知技術中,可藉由兩階段式的測量技術,獲得氣體擴散層與極板之間的表面接觸阻抗數值。具體而言,首先提供樣品,該樣品為由氣體擴散層203、極板204及氣體擴散層203組成之積層體。接著,測量樣品的歐姆阻抗Rs 1。進一步,將極板204自樣品取出,以形成由兩層氣體擴散層203組成之積層體。然後,測量樣品的歐姆阻抗Rs 2。最後,將兩次測量所得的歐姆阻抗值相減後除以2,可得到氣體擴散層與極板之間的表面接觸阻抗值。換言之,氣體擴散層203與極板204之間的表面接觸阻抗值可由下式表示: 表面接觸阻抗 = (Rs 1−Rs 2)/2。 As shown in Figure 1, it is a schematic diagram of the measurement principle of surface contact impedance. In the conventional technology, the surface contact resistance value between the gas diffusion layer and the electrode plate can be obtained through a two-stage measurement technology. Specifically, a sample is first provided, and the sample is a laminate composed of the gas diffusion layer 203 , the electrode plate 204 , and the gas diffusion layer 203 . Next, the ohmic impedance Rs 1 of the sample is measured. Further, the electrode plate 204 is taken out from the sample to form a laminate composed of two gas diffusion layers 203 . Then, the ohmic impedance Rs 2 of the sample is measured. Finally, the ohmic impedance values obtained from the two measurements are subtracted and divided by 2 to obtain the surface contact impedance value between the gas diffusion layer and the electrode plate. In other words, the surface contact resistance value between the gas diffusion layer 203 and the electrode plate 204 can be expressed by the following formula: surface contact resistance = (Rs 1 −Rs 2 )/2.

然而,受限於習知的阻抗測量裝置設計,需要執行至少兩次測量始能測得表面接觸阻抗,故現有的測量表面接觸阻抗技術耗費較多的時間。此外,將極板自樣品取出的操作容易破壞氣體擴散層表面的微觀樣貌,使得測量結果的準確度降低。因此,亟需要一種阻抗測量裝置,其可精簡化測量表面接觸阻抗之流程,以快速測得表面接觸阻抗,還可提高表面接觸阻抗測量結果的準確度。However, due to the design of the conventional impedance measurement device, at least two measurements are required before the surface contact impedance can be measured. Therefore, the existing surface contact impedance measurement technology consumes a lot of time. In addition, the operation of removing the electrode plate from the sample can easily destroy the microscopic appearance of the gas diffusion layer surface, reducing the accuracy of the measurement results. Therefore, there is an urgent need for an impedance measuring device that can simplify the process of measuring surface contact impedance, quickly measure surface contact impedance, and can also improve the accuracy of surface contact impedance measurement results.

為解決上述技術問題,本發明提供一種阻抗測量裝置,其包含:第一治具,包含第一上夾部及第一下夾部;第二治具,包含第二上夾部及第二下夾部;阻抗測試器,電性連接於該第一上夾部、該第一下夾部、該第二上夾部、及該第二下夾部;以及處理器,電性連接於該阻抗測試器;其中該第一上夾部及該第二上夾部設置成同步縱向移動;其中,在測量期間,該第一下夾部承載第一樣品,該第二下夾部承載第二樣品,其中該阻抗測試器設置成測得該第一樣品之第一阻抗值、及該第二樣品之第二阻抗值,該處理器設置成根據該第一阻抗值及該第二阻抗值計算得到第三阻抗值。藉由同步縱向移動的該第一上夾部及該第二上夾部,本發明能簡化測量流程,從而快速測量多個阻抗值。In order to solve the above technical problems, the present invention provides an impedance measuring device, which includes: a first fixture, including a first upper clamp and a first lower clamp; a second fixture, including a second upper clamp and a second lower clamp; an impedance tester, electrically connected to the first upper clamp, the first lower clamp, the second upper clamp, and the second lower clamp; and a processor, electrically connected to the impedance tester; wherein the first upper clamp and the second upper clamp are configured to move longitudinally synchronously; wherein, during measurement, the first lower clamp carries a first sample, and the second lower clamp carries a second sample, wherein the impedance tester is configured to measure a first impedance value of the first sample, and a second impedance value of the second sample, and the processor is configured to calculate a third impedance value based on the first impedance value and the second impedance value. By using the first upper clamp and the second upper clamp to move longitudinally synchronously, the present invention can simplify the measurement process, thereby quickly measuring multiple impedance values.

本發明提供之阻抗測量裝置可更包含升降台及平行於該升降台的載台,其中該第一上夾部及該第二上夾部配置於該升降台上,該第一下夾部及該第二下夾配置於該載台上。The impedance measurement device provided by the present invention may further include a lifting platform and a carrier platform parallel to the lifting platform, wherein the first upper clamp part and the second upper clamp part are arranged on the lifting platform, and the first lower clamp part and The second lower clamp is disposed on the carrier.

本發明提供之阻抗測量裝置可更包含連接於該升降台之壓力機,該壓力機設置成驅動該升降台之縱向移動。在一具體實施例中,本發明提供之阻抗測量裝置可包含:壓力機;升降台,連接於該壓力機;載台,平行於該升降台;第一治具,包含第一上夾部及第一下夾部,該第一上夾部配置於該升降台上,該第一下夾部配置於該載台上;第二治具,包含第二上夾部及第二下夾部,該第二上夾部配置於該升降台上,該第二下夾部配置於該載台上;阻抗測試器,電性連接於該第一上夾部、該第一下夾部、該第二上夾部、及該第二下夾部;以及處理器,電性連接於該壓力機及該阻抗測試器。The impedance measuring device provided by the present invention may further include a press connected to the lifting platform, and the press is configured to drive the longitudinal movement of the lifting platform. In a specific embodiment, the impedance measurement device provided by the present invention may include: a press; a lifting platform connected to the press; a carrier platform parallel to the lifting platform; a first fixture including a first upper clamp part and The first lower clamp part, the first upper clamp part is arranged on the lifting platform, the first lower clamp part is arranged on the carrier platform; the second fixture includes a second upper clamp part and a second lower clamp part, The second upper clamp part is arranged on the lifting platform, and the second lower clamp part is arranged on the stage; the impedance tester is electrically connected to the first upper clamp part, the first lower clamp part, and the third The two upper clamp parts, the second lower clamp part, and the processor are electrically connected to the press machine and the impedance tester.

本發明提供之阻抗測量裝置中的該第一下夾部及該第二下夾部用於承載待測量樣品。在一具體實施例中,該第一下夾部承載第一樣品,該第二下夾部承載第二樣品,該阻抗測試器設置成測得該第一樣品之第一阻抗值、及該第二樣品之第二阻抗值。The first lower clamp part and the second lower clamp part in the impedance measuring device provided by the present invention are used to carry the sample to be measured. In a specific embodiment, the first lower clamp portion carries the first sample, the second lower clamp portion carries the second sample, the impedance tester is configured to measure the first impedance value of the first sample, and The second impedance value of the second sample.

本發明提供之阻抗測量裝置中該阻抗測試器可包含至少一阻抗感測元件,該至少一阻抗感測元件用於偵測樣品的阻抗。該至少一阻抗感測元件的設置方式不予限制,該阻抗感測元件可以固定方式、或可拆卸方式設置於該第一治具及第二治具上。在一具體實施例中,該至少一阻抗感測元件以可拆卸方式設置於該第一治具及第二治具上。在另一具體實施例中,該至少一阻抗感測元件以固定方式設置於該第一治具及第二治具上。The impedance tester in the impedance measuring device provided by the present invention may include at least one impedance sensing element, and the at least one impedance sensing element is used to detect the impedance of the sample. The arrangement of the at least one impedance sensing element is not limited, and the impedance sensing element can be arranged on the first fixture and the second fixture in a fixed manner or a detachable manner. In a specific embodiment, the at least one impedance sensing element is detachably arranged on the first fixture and the second fixture. In another specific embodiment, the at least one impedance sensing element is fixedly arranged on the first fixture and the second fixture.

本發明提供之阻抗測量裝置中的該處理器可設置成根據該第一阻抗值及該第二阻抗值計算得到第三阻抗值。在一具體實施例中,該第一樣品包含具有依序堆疊的氣體擴散層、極板、及氣體擴散層之積層體,該第二樣品包含具有彼此堆疊的兩層氣體擴散層之積層體,該第三阻抗值為該第一阻抗值及該第二阻抗值之差值的一半。The processor in the impedance measurement device provided by the present invention can be configured to calculate a third impedance value based on the first impedance value and the second impedance value. In a specific embodiment, the first sample includes a laminate having a gas diffusion layer, a plate, and a gas diffusion layer stacked in sequence, and the second sample includes a laminate having two gas diffusion layers stacked on each other, and the third impedance value is half of the difference between the first impedance value and the second impedance value.

本發明提供之阻抗測量裝置中的該壓力機包括伺服馬達及電動缸,該伺服馬達耦合於該電動缸, 該電動缸連接於該升降台,其中該伺服馬達設置成控制該電動缸之縱向移動,以驅動該升降台之上升行程或該升降台之下降行程。該伺服馬達及該電動缸的耦合方式不予限制,該伺服馬達可電性連接於或垂直於該電動缸。在一具體實施例中,該伺服馬達垂直於該電動缸,且該伺服馬達電性連接於該電動缸。The press in the impedance measuring device provided by the present invention includes a servo motor and an electric cylinder. The servo motor is coupled to the electric cylinder. The electric cylinder is connected to the lifting platform. The servo motor is configured to control the longitudinal movement of the electric cylinder. , to drive the ascending stroke of the lifting platform or the descending stroke of the lifting platform. The coupling method of the servo motor and the electric cylinder is not limited, and the servo motor can be electrically connected to or perpendicular to the electric cylinder. In a specific embodiment, the servo motor is perpendicular to the electric cylinder, and the servo motor is electrically connected to the electric cylinder.

本發明提供之阻抗測量裝置可更包含調溫器,該調溫器電性連接於該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部,其中該調溫器設置成調整該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部之至少一者的溫度,以升高或降低該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部之至少一者的溫度。在一些具體實施例中,該調溫器可包含加熱器,該加熱器設置成加熱該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部之至少一者。在一些具體實施例中,該調溫器可包含至少一溫度感測元件,該至少一溫度感測元件設置成偵測該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部之至少一者的溫度。此外,該至少一溫度感測元件的設置方式不予限制,該溫度感測元件可以固定方式、或可拆卸方式設置於該第一治具及第二治具上。在一具體實施例中,該至少一溫度感測元件以可拆卸方式設置於該第一治具及第二治具上。在另一具體實施例中,該至少一溫度感測元件以固定方式設置於該第一治具及第二治具上。The impedance measuring device provided by the present invention may further include a temperature regulator electrically connected to the first upper clamp part, the first lower clamp part, the second upper clamp part and the second lower clamp part, Wherein the thermostat is configured to adjust the temperature of at least one of the first upper clamp part, the first lower clamp part, the second upper clamp part and the second lower clamp part to increase or decrease the first The temperature of at least one of the upper clamp part, the first lower clamp part, the second upper clamp part and the second lower clamp part. In some embodiments, the thermostat may include a heater configured to heat the first upper clamp, the first lower clamp, the second upper clamp, and the second lower clamp. At least one. In some embodiments, the thermostat may include at least one temperature sensing element configured to detect the first upper clamp portion, the first lower clamp portion, the second upper clamp portion The temperature of at least one of the lower clamp portion and the second lower clamp portion. In addition, the arrangement manner of the at least one temperature sensing element is not limited. The temperature sensing element can be fixedly or detachably arranged on the first fixture and the second fixture. In a specific embodiment, the at least one temperature sensing element is detachably disposed on the first fixture and the second fixture. In another specific embodiment, the at least one temperature sensing element is fixedly disposed on the first fixture and the second fixture.

本發明提供之阻抗測量裝置可更包含使用者介面,該使用者介面與該處理器通信。在一些具體實施例中,該使用者介面可與該處理器有線通信,例如,該使用者介面可透過以太網電纜、USB電纜或RJ6電纜與該處理器有線通信。在一些具體實施例中,該使用者介面可與該處理器無線通信,例如,該使用者介面可透過Wi-Fi(802.11標準)、藍芽、蜂巢式通訊或近場無線通訊裝置與該處理器無線通信。The impedance measurement device provided by the present invention may further include a user interface that communicates with the processor. In some embodiments, the user interface can communicate with the processor via wired communication. For example, the user interface can communicate with the processor via an Ethernet cable, a USB cable, or an RJ6 cable. In some embodiments, the user interface can communicate with the processor wirelessly. For example, the user interface can communicate with the processor through Wi-Fi (802.11 standard), Bluetooth, cellular communication or near field wireless communication device. wireless communication.

本發明提供之阻抗測量裝置中的該使用者介面可為螢幕、觸控螢幕、智慧裝置、電腦或任一人機介面裝置。在一具體實施例中,使用者可藉由該使用者介面輸入壓合壓力、溫度及測量時間之至少一者的設定值,使得與該使用者介面通信的該處理器根據所輸入之設定值控制該壓力機、該阻抗測試器、或該調溫器。The user interface in the impedance measurement device provided by the present invention can be a screen, a touch screen, a smart device, a computer or any human-machine interface device. In a specific embodiment, the user can input a setting value of at least one of the pressing pressure, temperature and measurement time through the user interface, so that the processor communicating with the user interface controls the press, the impedance tester, or the thermostat according to the input setting value.

本發明提供之阻抗測量裝置中的該載台可更包含轉盤,其中該第一下夾部及該第二下夾部配置於該轉盤上。在一具體實施例中,當該轉盤處於第一測量位置,該第一上夾部耦合該第一下夾部,該第二上夾部耦合該第二下夾部。在一具體實施例中,當該轉盤處於第二測量位置,該第一上夾部耦合該第二下夾部,該第二上夾部耦合該第一下夾部。在一具體實施例中,當該轉盤處於第一測量位置,該第一上夾部對齊該第一下夾部,該第二上夾部耦合該第二下夾部。在一具體實施例中,當該轉盤處於第二測量位置,該第一上夾部對齊該第二下夾部,該第二上夾部耦合該第一下夾部。The carrier in the impedance measuring device provided by the present invention may further include a turntable, wherein the first lower clamp and the second lower clamp are arranged on the turntable. In a specific embodiment, when the turntable is in a first measuring position, the first upper clamp is coupled to the first lower clamp, and the second upper clamp is coupled to the second lower clamp. In a specific embodiment, when the turntable is in a second measuring position, the first upper clamp is coupled to the second lower clamp, and the second upper clamp is coupled to the first lower clamp. In a specific embodiment, when the turntable is in a first measuring position, the first upper clamp is aligned with the first lower clamp, and the second upper clamp is coupled to the second lower clamp. In a specific embodiment, when the turntable is in the second measuring position, the first upper clamp is aligned with the second lower clamp, and the second upper clamp is coupled to the first lower clamp.

本發明提供之阻抗測量裝置中的處理器可電性連接於壓力機、阻抗測試器、調溫器、使用者介面及轉盤之至少一者。The processor in the impedance measuring device provided by the present invention can be electrically connected to at least one of a press, an impedance tester, a temperature regulator, a user interface and a turntable.

本發明提供之阻抗測量裝置中的處理器可與壓力機、阻抗測試器、調溫器、使用者介面及轉盤之至少一者有線通信或無線通信,以進行數據交換。在一些具體實施例中,該處理器可與壓力機、阻抗測試器、調溫器、使用者介面及轉盤之至少一者透過以太網電纜、USB電纜或RJ6電纜進行有線通信。在一些具體實施例中,該處理器可與壓力機、阻抗測試器、調溫器、使用者介面及轉盤之至少一者透過Wi-Fi(802.11標準)、藍芽、蜂巢式通訊或近場無線通訊裝置與該處理器進行無線通信。The processor in the impedance measurement device provided by the present invention can communicate with at least one of a press, an impedance tester, a temperature regulator, a user interface and a turntable via wired or wireless communication to exchange data. In some embodiments, the processor may be in wired communication with at least one of the press, the impedance tester, the thermostat, the user interface, and the turntable via an Ethernet cable, a USB cable, or an RJ6 cable. In some embodiments, the processor can communicate with at least one of the press, the impedance tester, the thermostat, the user interface, and the turntable via Wi-Fi (802.11 standard), Bluetooth, cellular communications, or near field The wireless communication device performs wireless communication with the processor.

本發明之另一目的在提供一種測量接觸阻抗之方法,其包含步驟:(a) 提供上述之阻抗測量裝置;(b) 進行對該阻抗測量裝置的校準操作;(c) 將第一樣品及該第二樣品分別放置於該第一下夾部及該第二下夾部,其中該第一樣品包含具有依序堆疊的氣體擴散層、極板、及氣體擴散層之積層體,該第二樣品包含具有彼此堆疊的兩層氣體擴散層之積層體;(d) 將該第一樣品及該第二樣品分別夾置在該第一上夾部及該第一下夾部之間、及該第二上夾部及該第二下夾部之間,以施加壓合壓力於該第一樣品及該第二樣品;(e) 藉由使用阻抗測試器,測得該第一樣品之第一阻抗值、及該第二樣品之第二阻抗值;以及(f) 藉由該處理器的計算,獲得該氣體擴散層及該極板之間的表面接觸阻抗值,其中該表面接觸阻抗值為該第一阻抗值及該第二阻抗值之差值的一半。Another object of the present invention is to provide a method for measuring contact impedance, which includes the steps of: (a) providing the above-mentioned impedance measuring device; (b) performing a calibration operation on the impedance measuring device; (c) applying the first sample to and the second sample are respectively placed on the first lower clamp part and the second lower clamp part, wherein the first sample includes a laminate having a gas diffusion layer, an electrode plate, and a gas diffusion layer stacked in sequence, and the The second sample includes a laminate with two gas diffusion layers stacked on each other; (d) sandwiching the first sample and the second sample between the first upper clamp part and the first lower clamp part respectively , and between the second upper clamp part and the second lower clamp part to apply pressing pressure on the first sample and the second sample; (e) By using an impedance tester, measure the first the first impedance value of the sample, and the second impedance value of the second sample; and (f) obtaining the surface contact impedance value between the gas diffusion layer and the electrode plate through calculation by the processor, wherein the The surface contact resistance value is half of the difference between the first resistance value and the second resistance value.

本發明提供之測量接觸阻抗之方法中的步驟(b)包含步驟:(b-1) 將標準樣品放置於該第一下夾部;(b-2) 將該標準樣品夾置在該第一上夾部及該第一下夾部之間;(b-3) 藉由使用阻抗測試器,測得該標準樣品之第一校準值;(b-4) 將該標準樣品放置於該第二下夾部;(b-5) 將該標準樣品夾置在該第二上夾部及該第二下夾部之間;(b-6) 藉由使用阻抗測試器,測得該標準樣品之第二校準值; (b-7) 藉由處理器的計算,獲得校準誤差,其中該校準誤差為該第一校準值及該第二校準值之差的絕對值除以該第一校準值;以及(b-8) 若該校準誤差大於預定值,則調整該阻抗測量裝置的設定參數,重複步驟(b-1)至(b-7);若該校準誤差不大於預定值,則結束該阻抗測量裝置的校準操作。在一些具體實施例中,該預定值為1%、2%、3%、4%、5%、6%、7%、8%、9%或10%。The step (b) of the method for measuring contact impedance provided by the present invention comprises the steps of: (b-1) placing a standard sample in the first lower clamp; (b-2) clamping the standard sample between the first upper clamp and the first lower clamp; (b-3) measuring a first calibration value of the standard sample by using an impedance tester; (b-4) placing the standard sample in the second lower clamp; (b-5) clamping the standard sample between the second upper clamp and the second lower clamp; (b-6) measuring a second calibration value of the standard sample by using an impedance tester; (b-7) The processor calculates a calibration error, wherein the calibration error is the absolute value of the difference between the first calibration value and the second calibration value divided by the first calibration value; and (b-8) if the calibration error is greater than a predetermined value, the setting parameters of the impedance measurement device are adjusted, and steps (b-1) to (b-7) are repeated; if the calibration error is not greater than the predetermined value, the calibration operation of the impedance measurement device is terminated. In some specific embodiments, the predetermined value is 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, or 10%.

本發明提供之測量接觸阻抗之方法更包含步驟:(g) 調整該升降台的下降行程以改變施加於該第一樣品及該第二樣品的壓合壓力;以及(h) 重複上述本發明之方法中的步驟(e)至(f)。在一些具體實施例中,可多次重複本發明提供之測量接觸阻抗之方法中的步驟(g)及步驟(h)以測得多種壓力下的表面接觸阻抗值,從而本發明能提供樣品的表面接觸阻抗與壓力的關係圖表。The method for measuring contact impedance provided by the present invention further comprises the steps of: (g) adjusting the descending stroke of the lifting platform to change the pressing pressure applied to the first sample and the second sample; and (h) repeating steps (e) to (f) in the above method of the present invention. In some specific embodiments, steps (g) and (h) in the method for measuring contact impedance provided by the present invention can be repeated multiple times to measure the surface contact impedance values under multiple pressures, so that the present invention can provide a relationship chart between the surface contact impedance of the sample and the pressure.

本發明提供之測量接觸阻抗之方法更包含步驟:(i) 將該轉盤從第一測量位置調整至第二測量位置,其中當該轉盤處於該第一測量位置,該第一上夾部耦合該第一下夾部,該第二上夾部耦合該第二下夾部,當該轉盤處於該第二測量位置,該第一上夾部耦合該第二下夾部,該第二上夾部耦合該第一下夾部; (j) 重複上述本發明之方法中的步驟(e)至(f)以獲得該氣體擴散層及該極板之間的參考表面接觸阻抗值;以及(k) 藉由該處理器計算該表面接觸阻抗值及該參考表面接觸阻抗值的平均值,獲得經優化之表面接觸阻抗值。The method for measuring contact impedance provided by the present invention further includes the steps of: (i) adjusting the turntable from the first measurement position to the second measurement position, wherein when the turntable is in the first measurement position, the first upper clamp portion is coupled to the The first lower clamp part, the second upper clamp part couples with the second lower clamp part, when the turntable is in the second measurement position, the first upper clamp part couples with the second lower clamp part, the second upper clamp part Couple the first lower clamp part; (j) Repeat steps (e) to (f) in the method of the present invention to obtain the reference surface contact resistance value between the gas diffusion layer and the electrode plate; and (k) The processor calculates the average value of the surface contact resistance value and the reference surface contact resistance value to obtain an optimized surface contact resistance value.

本發明至少藉由「第一治具及第二治具」之技術特徵,可同時量測至少兩種樣品之阻抗以計算目標待測物之表面接觸阻抗,可避免從治具反覆取下及安置樣品,從而簡化量測流程、節省量測時間。另一面而言,由於可避免從治具反覆取下及安置樣品,可防止樣品的表面狀態及治具的表面狀態遭受破壞,從而獲得更準確的量測結果。此外,本發明至少藉由「第一治具、第二治具及轉盤的組合」之技術特徵,可在避免從治具反覆取下及安置樣品的前提下,交替使用兩組治具的阻抗感測元件以快速獲取多組測量結果,從而計算獲得經優化之表面接觸阻抗值以提供更準確的量測結果。The present invention can simultaneously measure the impedance of at least two samples to calculate the surface contact impedance of the target object to be measured by at least the technical features of "a first jig and a second jig", thereby avoiding the repeated removal and placement of samples from the jig, thereby simplifying the measurement process and saving measurement time. On the other hand, since the repeated removal and placement of samples from the jig can be avoided, the surface state of the sample and the surface state of the jig can be prevented from being damaged, thereby obtaining more accurate measurement results. In addition, the present invention can alternately use the impedance sensing elements of the two sets of jigs to quickly obtain multiple sets of measurement results while avoiding the repeated removal and placement of samples from the jig by at least the technical features of "a combination of a first jig, a second jig and a turntable", thereby calculating and obtaining optimized surface contact impedance values to provide more accurate measurement results.

參見圖2至4,其顯示根據本發明的阻抗測量裝置100之一個實施例的示意圖。2 to 4, which show schematic diagrams of an embodiment of an impedance measurement device 100 according to the present invention.

本實施例中,阻抗測量裝置100可包含壓力機101、升降台102、載台103、第一治具104、第二治具105、阻抗測試器106、處理器107、調溫器109及使用者介面108。如圖3所示,壓力機101可包含伺服馬達1011及電動缸1012,伺服馬達1011耦合於電動缸1012,電動缸1012連接於升降台102。載台103配置成平行於升降台102。第一治具104包含第一上夾部1041及第一下夾部1042,第一上夾部1041配置於升降台102上,第一下夾部1042配置於載台103上。第二治具105包含第二上夾部1051及第二下夾部1052,第二上夾部1051配置於升降台102上,第二下夾部1052配置於載台103上。阻抗測試器106電性連接於第一上夾部1041、第一下夾部1042、第二上夾部1051、及第二下夾部1052。如圖4所示,處理器107可電性連接於壓力機101、阻抗測試器106、調溫器109及使用者介面108。In this embodiment, the impedance measuring device 100 may include a press 101, a lifting platform 102, a carrier 103, a first fixture 104, a second fixture 105, an impedance tester 106, a processor 107, a temperature regulator 109, and a user interface 108. As shown in FIG3 , the press 101 may include a servo motor 1011 and an electric cylinder 1012, wherein the servo motor 1011 is coupled to the electric cylinder 1012, and the electric cylinder 1012 is connected to the lifting platform 102. The carrier 103 is configured to be parallel to the lifting platform 102. The first fixture 104 includes a first upper clamp 1041 and a first lower clamp 1042, wherein the first upper clamp 1041 is configured on the lifting platform 102, and the first lower clamp 1042 is configured on the carrier 103. The second fixture 105 includes a second upper clamp 1051 and a second lower clamp 1052. The second upper clamp 1051 is disposed on the lifting platform 102, and the second lower clamp 1052 is disposed on the carrier 103. The impedance tester 106 is electrically connected to the first upper clamp 1041, the first lower clamp 1042, the second upper clamp 1051, and the second lower clamp 1052. As shown in FIG. 4 , the processor 107 can be electrically connected to the press 101, the impedance tester 106, the temperature regulator 109, and the user interface 108.

參見圖5至6,其顯示根據本發明的測量接觸阻抗之方法之一個實施例的流程圖。5 to 6, which show a flow chart of an embodiment of a method for measuring contact impedance according to the present invention.

如圖5所示,本實施例之測量接觸阻抗之方法包含步驟:(S1)提供如圖2所示之阻抗測量裝置100;(S2)進行對阻抗測量裝置100的校準操作;(S3) 如圖2所示,將兩組阻抗感測元件、第一樣品201及第二樣品202分別放置於第一下夾部1042及第二下夾部1052,其中第一樣品201包含具有依序堆疊的氣體擴散層203、極板204、及氣體擴散層203之積層體,第二樣品202包含具有彼此堆疊的兩層氣體擴散層203之積層體;(S4)藉由使用壓力機101以驅動升降台102的下降行程,將第一樣品201及第二樣品202分別夾置在第一上夾部1041及第一下夾部1042之間、及第二上夾部1051及第二下夾部1052之間,以施加壓合壓力於阻抗感測元件、第一樣品201及第二樣品202; (S5) 藉由使用阻抗測試器106,測得第一樣品201之第一阻抗值、及第二樣品202之第二阻抗值;以及(S6) 藉由處理器107的計算,獲得氣體擴散層203及極板204之間的表面接觸阻抗值,其中表面接觸阻抗值為第一阻抗值及第二阻抗值之差值的一半。換言之,氣體擴散層203與極板204之間的表面接觸阻抗值可由下式表示,其中Rs 1為第一阻抗值,Rs 2為第二阻抗值: 表面接觸阻抗 = (Rs 1−Rs 2)/2。 As shown in Figure 5, the method of measuring contact impedance in this embodiment includes the steps: (S1) Provide the impedance measurement device 100 as shown in Figure 2; (S2) Perform a calibration operation on the impedance measurement device 100; (S3) As As shown in Figure 2, two sets of impedance sensing elements, the first sample 201 and the second sample 202 are placed on the first lower clamp part 1042 and the second lower clamp part 1052 respectively, where the first sample 201 includes a A laminate of stacked gas diffusion layers 203, electrode plates 204, and gas diffusion layers 203. The second sample 202 includes a laminate having two layers of gas diffusion layers 203 stacked on each other; (S4) driven by using the press 101 The descending stroke of the lifting platform 102 clamps the first sample 201 and the second sample 202 between the first upper clamp part 1041 and the first lower clamp part 1042, and the second upper clamp part 1051 and the second lower clamp respectively. 1052 to apply pressing pressure on the impedance sensing element, the first sample 201 and the second sample 202; (S5) By using the impedance tester 106, measure the first impedance value of the first sample 201 , and the second impedance value of the second sample 202; and (S6) through calculation by the processor 107, obtain the surface contact impedance value between the gas diffusion layer 203 and the electrode plate 204, where the surface contact impedance value is the first impedance. half the difference between the value and the second impedance value. In other words, the surface contact resistance value between the gas diffusion layer 203 and the electrode plate 204 can be expressed by the following formula, where Rs 1 is the first resistance value and Rs 2 is the second resistance value: Surface contact resistance = (Rs 1 −Rs 2 ) /2.

另一方面,如圖6所示,步驟(S2)的校準操作包含步驟:(S2-1) 將標準樣品放置於第一下夾部1042;(S2-2) 藉由使用壓力機101以驅動升降台102的下降行程, 將標準樣品夾置在第一上夾部1041及第一下夾部1042之間;(S2-3) 藉由使用阻抗測試器106,測得標準樣品之第一校準值;(S2-4) 將標準樣品放置於第二下夾部1052;(S2-5) 藉由使用壓力機101以驅動升降台102的下降行程, 將標準樣品夾置在第二上夾部1051及第二下夾部1052之間;(S2-6) 藉由使用阻抗測試器106,測得標準樣品之第二校準值;(S2-7) 藉由處理器107的計算,獲得校準誤差,其中校準誤差為第一校準值及第二校準值之差的絕對值除以第一校準值;以及(S2-8) 若校準誤差大於3%,調整阻抗測量裝置100的設定參數,重複步驟(S2-1)至(S2-7);若校準誤差不大於3%,結束阻抗測量裝置100的校準操作。進一步而言,藉由本實施例之校準操作,能減少逐次量測結果之間的誤差。因此,本發明有利於提供更準確的表面接觸阻抗量測值。On the other hand, as shown in FIG. 6 , the calibration operation of step (S2) includes the steps: (S2-1) placing the standard sample on the first lower clamp 1042; (S2-2) driving by using the press 101 The descending stroke of the lifting platform 102 clamps the standard sample between the first upper clamp part 1041 and the first lower clamp part 1042; (S2-3) By using the impedance tester 106, the first calibration of the standard sample is measured value; (S2-4) Place the standard sample in the second lower clamp part 1052; (S2-5) By using the press 101 to drive the downward stroke of the lifting platform 102, clamp the standard sample in the second upper clamp part 1051 and the second lower clamp part 1052; (S2-6) By using the impedance tester 106, the second calibration value of the standard sample is measured; (S2-7) Through the calculation of the processor 107, the calibration error is obtained , where the calibration error is the absolute value of the difference between the first calibration value and the second calibration value divided by the first calibration value; and (S2-8) if the calibration error is greater than 3%, adjust the setting parameters of the impedance measurement device 100 and repeat the steps (S2-1) to (S2-7); if the calibration error is not greater than 3%, end the calibration operation of the impedance measuring device 100. Furthermore, through the calibration operation of this embodiment, errors between successive measurement results can be reduced. Therefore, the present invention is beneficial to providing more accurate surface contact impedance measurement values.

參見圖7,其顯示根據本發明的測量接觸阻抗之方法之另一個實施例的流程圖。Refer to Figure 7, which shows a flow chart of another embodiment of the method for measuring contact impedance according to the present invention.

本實施例與前一個實施例內容大致相同,本實施例之測量接觸阻抗之方法更包含步驟:(S7) 調整該升降台102的下降行程以改變施加於阻抗感測元件、第一樣品201及第二樣品202的壓合壓力;以及(S8)重複步驟(S5)至(S6)。藉由本實施例提供之方法,可數次調整施加於第一樣品201及第二樣品202的壓合壓力,並測量各種壓合壓力下的表面接觸阻抗。具體而言,可逐次提高或降低施加於第一樣品201及第二樣品202的壓合壓力,最後獲得壓合壓力下與表面接觸阻抗的關聯性數據。The content of this embodiment is substantially the same as that of the previous embodiment. The method for measuring contact impedance of this embodiment further includes the steps of: (S7) adjusting the descending stroke of the lifting platform 102 to change the pressing pressure applied to the impedance sensing element, the first sample 201 and the second sample 202; and (S8) repeating steps (S5) to (S6). By the method provided in this embodiment, the pressing pressure applied to the first sample 201 and the second sample 202 can be adjusted several times, and the surface contact impedance under various pressing pressures can be measured. Specifically, the pressing pressure applied to the first sample 201 and the second sample 202 can be gradually increased or decreased, and finally the correlation data of the pressing pressure and the surface contact impedance can be obtained.

在其它實施例中,各種壓合壓力下測得之表面接觸阻抗可儲存於處理器107 的記憶單元中,再由處理器107分析累積的測量資料,並將分析結果傳送至使用者介面108,由使用者介面108以圖表形式呈現分析結果,從而使用者可獲取壓合壓力下與表面接觸阻抗的關係圖。In other embodiments, the surface contact impedance measured under various pressing pressures can be stored in the memory unit of the processor 107, and the processor 107 analyzes the accumulated measurement data and transmits the analysis results to the user interface 108, which presents the analysis results in a graphical form, so that the user can obtain a relationship diagram between the pressing pressure and the surface contact impedance.

參見圖8至9,其顯示根據本發明的阻抗測量裝置100之一個實施例的示意圖。8 to 9, which show schematic diagrams of an embodiment of an impedance measurement device 100 according to the present invention.

本實施例中,阻抗測量裝置100可包含壓力機101、升降台102、載台103、第一治具104、第二治具105、阻抗測試器106、處理器107、調溫器109及使用者介面108,其中載台103包含轉盤110。壓力機101可包含伺服馬達1011及電動缸1012,伺服馬達1011耦合於電動缸1012,電動缸1012連接於升降台102。載台103配置成平行於升降台102。第一治具104包含第一上夾部1041及第一下夾部1042,第一上夾部1041配置於升降台102上,第一下夾部1042配置於轉盤110上。第二治具105包含第二上夾部1051及第二下夾部1052,第二上夾部1051配置於升降台102上,第二下夾部1052配置於轉盤110上。進一步而言,當轉盤110處於第一測量位置,第一上夾部1041耦合第一下夾部1042,第二上夾部1051耦合第二下夾部1052,當該轉盤110處於第二測量位置,第一上夾部1041耦合該第二下夾部1052,第二上夾部1051耦合該第一下夾部1042。此外,阻抗測試器106電性連接於第一上夾部1041、第一下夾部1042、第二上夾部1051、及第二下夾部1052。如圖9所示,處理器107可電性連接於壓力機103、阻抗測試器106、調溫器109、使用者介面108及轉盤110。In this embodiment, the impedance measurement device 100 may include a press 101, a lifting platform 102, a carrier 103, a first jig 104, a second jig 105, an impedance tester 106, a processor 107, a temperature regulator 109 and a user. user interface 108, in which the stage 103 includes a turntable 110. The press 101 may include a servo motor 1011 and an electric cylinder 1012. The servo motor 1011 is coupled to the electric cylinder 1012, and the electric cylinder 1012 is connected to the lifting platform 102. The stage 103 is arranged parallel to the lifting platform 102 . The first fixture 104 includes a first upper clamp part 1041 and a first lower clamp part 1042. The first upper clamp part 1041 is arranged on the lifting platform 102, and the first lower clamp part 1042 is arranged on the turntable 110. The second fixture 105 includes a second upper clamp part 1051 and a second lower clamp part 1052. The second upper clamp part 1051 is arranged on the lifting platform 102, and the second lower clamp part 1052 is arranged on the turntable 110. Furthermore, when the turntable 110 is in the first measurement position, the first upper clamp part 1041 is coupled to the first lower clamp part 1042, and the second upper clamp part 1051 is coupled to the second lower clamp part 1052. When the turntable 110 is in the second measurement position, , the first upper clip portion 1041 is coupled to the second lower clip portion 1052, and the second upper clip portion 1051 is coupled to the first lower clip portion 1042. In addition, the impedance tester 106 is electrically connected to the first upper clamp part 1041, the first lower clamp part 1042, the second upper clamp part 1051, and the second lower clamp part 1052. As shown in FIG. 9 , the processor 107 can be electrically connected to the press 103 , the impedance tester 106 , the thermostat 109 , the user interface 108 and the turntable 110 .

參見圖10,其顯示根據本發明的測量接觸阻抗之方法之一個實施例的流程圖。Referring to Figure 10, a flow chart of one embodiment of a method for measuring contact impedance according to the present invention is shown.

如圖10所示,本實施例之測量接觸阻抗之方法包含步驟:(S1)提供如圖2所示之阻抗測量裝置100;(S2)進行對阻抗測量裝置100的校準操作;(S3) 如圖11所示,將兩組阻抗感測元件、第一樣品201及第二樣品202分別放置於第一下夾部1042及第二下夾部1052,其中第一樣品201包含具有依序堆疊的氣體擴散層203、極板204、及氣體擴散層203之積層體,第二樣品202包含具有彼此堆疊的兩層氣體擴散層203之積層體;(S4)藉由使用壓力機101以驅動升降台102的下降行程,將第一樣品201及第二樣品202分別夾置在第一上夾部1041及第一下夾部1042之間、及第二上夾部1051及第二下夾部1052之間,以施加壓合壓力於第一樣品201及第二樣品202;(S5) 藉由使用阻抗測試器106,測得第一樣品201之第一阻抗值、及第二樣品202之第二阻抗值;(S6) 藉由處理器107的計算,獲得氣體擴散層203及極板204之間的表面接觸阻抗值,其中表面接觸阻抗值為第一阻抗值及第二阻抗值之差值的一半;(S7’) 將轉盤110從第一測量位置調整至第二測量位置;(S8’) 重複步驟(S5)至(S6)以獲得氣體擴散層203及極板204之間的參考表面接觸阻抗值;以及(S9’) 藉由處理器107計算表面接觸阻抗值及參考表面接觸阻抗值的平均值,獲得經優化之表面接觸阻抗值。換言之,經優化之表面接觸阻抗值為步驟(S6)中獲得之表面接觸阻抗值、及步驟(S9’)中獲得之參考表面接觸阻抗值之和的一半。As shown in Figure 10, the method of measuring contact impedance in this embodiment includes the steps: (S1) Provide the impedance measurement device 100 as shown in Figure 2; (S2) Perform a calibration operation on the impedance measurement device 100; (S3) As As shown in Figure 11, two sets of impedance sensing elements, the first sample 201 and the second sample 202 are placed on the first lower clamp part 1042 and the second lower clamp part 1052 respectively, where the first sample 201 includes a A laminate of stacked gas diffusion layers 203, electrode plates 204, and gas diffusion layers 203. The second sample 202 includes a laminate having two layers of gas diffusion layers 203 stacked on each other; (S4) driven by using the press 101 The descending stroke of the lifting platform 102 clamps the first sample 201 and the second sample 202 between the first upper clamp part 1041 and the first lower clamp part 1042, and the second upper clamp part 1051 and the second lower clamp respectively. between the parts 1052 to apply pressing pressure to the first sample 201 and the second sample 202; (S5) By using the impedance tester 106, measure the first impedance value of the first sample 201 and the second sample The second impedance value of 202; (S6) Through calculation by the processor 107, the surface contact impedance value between the gas diffusion layer 203 and the electrode plate 204 is obtained, where the surface contact impedance value is the first impedance value and the second impedance value. half of the difference; (S7') Adjust the turntable 110 from the first measurement position to the second measurement position; (S8') Repeat steps (S5) to (S6) to obtain the gap between the gas diffusion layer 203 and the electrode plate 204 The reference surface contact impedance value; and (S9') the processor 107 calculates the surface contact impedance value and the average value of the reference surface contact impedance value to obtain an optimized surface contact impedance value. In other words, the optimized surface contact impedance value is half of the sum of the surface contact impedance value obtained in step (S6) and the reference surface contact impedance value obtained in step (S9').

此外,在步驟(S1)至(S6)期間,轉盤110設定為處於第一測量位置。如圖11所示,當轉盤110處於第一測量位置,第一上夾部1041耦合第一下夾部1042,第二上夾部1051耦合第二下夾部1052。在步驟(S7’)中,轉盤110從第一測量位置切換成第二測量位置。如圖12所示,當轉盤110處於第二測量位置,第一上夾部1041耦合第二下夾部1052,第二上夾部1051耦合第一下夾部1042。藉由轉盤110在第一測量位置及第二測量位置之間的切換,施加於阻抗感測元件、第一樣品201及第二樣品202能予以快速交替使用,進而有利於設計更快速、更多元、更準確的量測技術,亦有利於快速察覺兩組治具量測結果誤差過大之情形,從而重新校準量測裝置。Furthermore, during steps (S1) to (S6), the turntable 110 is set to be in the first measurement position. As shown in FIG. 11 , when the turntable 110 is in the first measurement position, the first upper clamp part 1041 is coupled to the first lower clamp part 1042 , and the second upper clamp part 1051 is coupled to the second lower clamp part 1052 . In step (S7'), the turntable 110 is switched from the first measurement position to the second measurement position. As shown in FIG. 12 , when the turntable 110 is in the second measurement position, the first upper clamp part 1041 is coupled to the second lower clamp part 1052 , and the second upper clamp part 1051 is coupled to the first lower clamp part 1042 . By switching the turntable 110 between the first measurement position and the second measurement position, the impedance sensing element, the first sample 201 and the second sample 202 can be quickly used interchangeably, which is conducive to faster and more efficient design. Diversified and more accurate measurement technology also helps to quickly detect excessive errors in the measurement results of the two sets of fixtures, so that the measurement device can be recalibrated.

進一步而言,本發明之方法有利於不同阻抗感測元件的交替使用,而無須反覆將樣品從治具取出再置入,故能簡化量測流程。不但如此,還能在避免破壞樣品表面狀態下,快速取得參考表面接觸阻抗值,從而提高所測得之表面接觸阻抗的準確度。Furthermore, the method of the present invention facilitates the alternate use of different impedance sensing elements without the need to repeatedly remove the sample from the fixture and then insert it, thus simplifying the measurement process. Not only that, it can also quickly obtain the reference surface contact impedance value without damaging the surface of the sample, thereby improving the accuracy of the measured surface contact impedance.

100:阻抗測量裝置 101:壓力機 1011:伺服馬達 1012:電動缸 102:升降台 103:載台 104:第一治具 1041:第一上夾部 1042:第一下夾部 105:第二治具 1051:第二上夾部 1052:第二下夾部 106:阻抗測試器 107:處理器 108:使用者介面 109:調溫器 110:轉盤 201:第一樣品 202:第二樣品 203:氣體擴散層 204:極板 S1:步驟 S2:步驟 S3:步驟 S4:步驟 S5:步驟 S6:步驟 S7:步驟 S8:步驟 S9:步驟 S2-1:步驟 S2-2:步驟 S2-3:步驟 S2-4:步驟 S2-5:步驟 S2-6:步驟 S2-7:步驟 S2-8:步驟100: Impedance measuring device 101:Press 1011:Servo motor 1012: Electric cylinder 102: Lifting platform 103: Carrier platform 104:The first fixture 1041: First upper clamping part 1042: First lower clamping part 105: Second fixture 1051: The second upper clamp part 1052: The second lower clamp part 106:Impedance tester 107: Processor 108:User interface 109: Thermostat 110:Turntable 201:First sample 202:Second sample 203: Gas diffusion layer 204:Plate S1: Steps S2: Step S3: Steps S4: Steps S5: Steps S6: Steps S7: Steps S8: Steps S9: Steps S2-1: Steps S2-2: Steps S2-3: Steps S2-4: Steps S2-5: Steps S2-6: Steps S2-7: Steps S2-8: Steps

圖1顯示表面接觸阻抗的量測原理之示意圖; 圖2顯示根據本發明之一個實施例之阻抗測量裝置100的示意圖; 圖3顯示根據本發明之一個實施例之阻抗測量裝置100的示意圖; 圖4顯示根據本發明之一個實施例之阻抗測量裝置的示意圖; 圖5顯示根據本發明之一個實施例之測量接觸阻抗之方法的流程圖; 圖6顯示根據本發明之一個實施例之測量接觸阻抗之方法的流程圖; 圖7顯示根據本發明之一個實施例之測量接觸阻抗之方法的流程圖; 圖8顯示根據本發明之一個實施例之阻抗測量裝置100的示意圖; 圖9顯示根據本發明之一個實施例之阻抗測量裝置的示意圖; 圖10顯示根據本發明之一個實施例之測量接觸阻抗之方法的流程圖; 圖11根據本發明之一個實施例之阻抗測量裝置100的示意圖;以及 圖12根據本發明之一個實施例之阻抗測量裝置100的示意圖。 FIG1 is a schematic diagram showing the measurement principle of surface contact impedance; FIG2 is a schematic diagram showing an impedance measuring device 100 according to an embodiment of the present invention; FIG3 is a schematic diagram showing an impedance measuring device 100 according to an embodiment of the present invention; FIG4 is a schematic diagram showing an impedance measuring device according to an embodiment of the present invention; FIG5 is a flow chart showing a method for measuring contact impedance according to an embodiment of the present invention; FIG6 is a flow chart showing a method for measuring contact impedance according to an embodiment of the present invention; FIG7 is a flow chart showing a method for measuring contact impedance according to an embodiment of the present invention; FIG8 is a schematic diagram showing an impedance measuring device 100 according to an embodiment of the present invention; FIG9 is a schematic diagram showing an impedance measuring device according to an embodiment of the present invention; FIG. 10 is a flow chart showing a method for measuring contact impedance according to an embodiment of the present invention; FIG. 11 is a schematic diagram of an impedance measuring device 100 according to an embodiment of the present invention; and FIG. 12 is a schematic diagram of an impedance measuring device 100 according to an embodiment of the present invention.

(無)(without)

100:阻抗測量裝置 100: Impedance measuring device

101:壓力機 101: Press machine

1011:伺服馬達 1011:Servo motor

1012:電動缸 1012: Electric cylinder

102:升降台 102: Lifting platform

103:載台 103: Carrier

104:第一治具 104: The first fixture

1041:第一上夾部 1041: First upper clamp

1042:第一下夾部 1042: First lower clamp

105:第二治具 105: Second fixture

1051:第二上夾部 1051: Second upper clamp

1052:第二下夾部 1052: Second lower clamp

106:阻抗測試器 106: Impedance tester

108:使用者介面 108:User interface

Claims (11)

一種阻抗測量裝置,包含: 第一治具,包含第一上夾部及第一下夾部; 第二治具,包含第二上夾部及第二下夾部; 阻抗測試器,電性連接於該第一上夾部、該第一下夾部、該第二上夾部、及該第二下夾部;以及 處理器,電性連接於該阻抗測試器; 其中該第一上夾部及該第二上夾部設置成同步縱向移動; 其中,在測量期間,該第一下夾部承載第一樣品,該第二下夾部承載第二樣品, 其中該阻抗測試器設置成測得該第一樣品之第一阻抗值、及該第二樣品之第二阻抗值,該處理器設置成根據該第一阻抗值及該第二阻抗值計算得到第三阻抗值。 An impedance measuring device containing: The first fixture includes a first upper clamping part and a first lower clamping part; The second fixture includes a second upper clamp part and a second lower clamp part; An impedance tester, electrically connected to the first upper clamp part, the first lower clamp part, the second upper clamp part, and the second lower clamp part; and A processor, electrically connected to the impedance tester; Wherein the first upper clamp part and the second upper clamp part are arranged to move longitudinally simultaneously; Wherein, during measurement, the first lower clamp part carries the first sample, and the second lower clamp part carries the second sample, The impedance tester is configured to measure the first impedance value of the first sample and the second impedance value of the second sample, and the processor is configured to calculate based on the first impedance value and the second impedance value. The third impedance value. 如請求項1所述之裝置,更包含升降台及平行於該升降台的載台,其中該第一上夾部及該第二上夾部配置於該升降台上,該第一下夾部及該第二下夾配置於該載台上。The device according to claim 1 further includes a lifting platform and a carrier platform parallel to the lifting platform, wherein the first upper clamp part and the second upper clamp part are arranged on the lifting platform, and the first lower clamp part And the second lower clamp is arranged on the carrier platform. 如請求項1所述之裝置,更包含連接於該升降台之壓力機,該壓力機設置成驅動該升降台之縱向移動。The device as claimed in claim 1 further includes a press connected to the lifting platform, and the press is configured to drive the longitudinal movement of the lifting platform. 如請求項3所述之裝置,其中該壓力機包含伺服馬達及電動缸,該伺服馬達耦合於該電動缸, 該電動缸連接於該升降台, 其中該伺服馬達設置成控制該電動缸之縱向移動,以驅動該升降台之上升行程或該升降台之下降行程。 The device as described in claim 3, wherein the press comprises a servo motor and an electric cylinder, the servo motor is coupled to the electric cylinder, the electric cylinder is connected to the lifting platform, wherein the servo motor is configured to control the longitudinal movement of the electric cylinder to drive the lifting platform to move upward or downward. 如請求項1所述之裝置,更包含調溫器,該調溫器電性連接於該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部, 其中該調溫器設置成調整該第一上夾部、該第一下夾部、該第二上夾部及該第二下夾部之溫度。 The device according to claim 1, further comprising a thermostat electrically connected to the first upper clamp part, the first lower clamp part, the second upper clamp part and the second lower clamp part , The thermostat is configured to adjust the temperatures of the first upper clamp part, the first lower clamp part, the second upper clamp part and the second lower clamp part. 如請求項1所述之裝置,更包含使用者介面,該使用者介面與該處理器通信。The device as described in claim 1 further includes a user interface that communicates with the processor. 如請求項1所述之裝置,其中該載台更包含轉盤,該第一下夾部及該第二下夾部配置於該轉盤上, 當該轉盤處於第一測量位置,該第一上夾部耦合該第一下夾部,該第二上夾部耦合該第二下夾部, 當該轉盤處於第二測量位置,該第一上夾部耦合該第二下夾部,該第二上夾部耦合該第一下夾部。 The device as described in claim 1, wherein the carrier further comprises a turntable, the first lower clamp and the second lower clamp are arranged on the turntable, when the turntable is in a first measuring position, the first upper clamp is coupled to the first lower clamp, and the second upper clamp is coupled to the second lower clamp, when the turntable is in a second measuring position, the first upper clamp is coupled to the second lower clamp, and the second upper clamp is coupled to the first lower clamp. 一種測量接觸阻抗之方法,包含步驟: (a) 提供請求項1至7中任一項所述之阻抗測量裝置; (b) 進行對該阻抗測量裝置的校準操作; (c) 將第一樣品及該第二樣品分別放置於該第一下夾部及該第二下夾部,其中該第一樣品包含具有依序堆疊的氣體擴散層、極板、及氣體擴散層之積層體,該第二樣品包含具有彼此堆疊的兩層氣體擴散層之積層體; (d) 將該第一樣品及該第二樣品分別夾置在該第一上夾部及該第一下夾部之間、及該第二上夾部及該第二下夾部之間,以施加壓合壓力於該第一樣品及該第二樣品; (e) 藉由使用該阻抗測試器,測得該第一樣品之第一阻抗值、及該第二樣品之第二阻抗值;以及 (f) 藉由該處理器的計算,獲得該氣體擴散層及該極板之間的表面接觸阻抗值,其中該表面接觸阻抗值為該第一阻抗值及該第二阻抗值之差值的一半。 A method of measuring contact impedance, including steps: (a) Provide an impedance measuring device as described in any one of claims 1 to 7; (b) Perform calibration operations on the impedance measuring device; (c) Place the first sample and the second sample on the first lower clamp part and the second lower clamp part respectively, wherein the first sample includes a gas diffusion layer, an electrode plate, and a gas diffusion layer stacked in sequence. A laminate of gas diffusion layers, the second sample comprising a laminate of two gas diffusion layers stacked on each other; (d) Sandwich the first sample and the second sample respectively between the first upper clamp part and the first lower clamp part, and between the second upper clamp part and the second lower clamp part , to apply pressing pressure to the first sample and the second sample; (e) By using the impedance tester, measure the first impedance value of the first sample and the second impedance value of the second sample; and (f) Obtain the surface contact resistance value between the gas diffusion layer and the electrode plate through calculation by the processor, wherein the surface contact resistance value is the difference between the first resistance value and the second resistance value half. 如請求項8所述之方法,其中步驟(b)包含以下步驟: (b-1) 將標準樣品放置於該第一下夾部; (b-2) 將該標準樣品夾置在該第一上夾部及該第一下夾部之間; (b-3) 藉由使用該阻抗測試器,測得該標準樣品之第一校準值; (b-4) 將該標準樣品放置於該第二下夾部; (b-5) 將該標準樣品夾置在該第二上夾部及該第二下夾部之間; (b-6) 藉由使用該阻抗測試器,測得該標準樣品之第二校準值; (b-7) 藉由該處理器的計算,獲得校準誤差,其中該校準誤差為該第一校準值及該第二校準值之差的絕對值除以該第一校準值;以及 (b-8) 若該校準誤差大於預定值,則調整該阻抗測量裝置的設定參數,重複步驟(b-1)至(b-7);若該校準誤差不大於該預定值,則結束該阻抗測量裝置的校準操作。 The method as described in request item 8, wherein step (b) includes the following steps: (b-1) Place the standard sample on the first lower clamp; (b-2) Clamp the standard sample between the first upper clamp part and the first lower clamp part; (b-3) By using the impedance tester, measure the first calibration value of the standard sample; (b-4) Place the standard sample on the second lower clamp; (b-5) Clamp the standard sample between the second upper clamp part and the second lower clamp part; (b-6) By using the impedance tester, measure the second calibration value of the standard sample; (b-7) Obtain a calibration error through calculation by the processor, wherein the calibration error is the absolute value of the difference between the first calibration value and the second calibration value divided by the first calibration value; and (b-8) If the calibration error is greater than the predetermined value, adjust the setting parameters of the impedance measuring device and repeat steps (b-1) to (b-7); if the calibration error is not greater than the predetermined value, end the Calibration operations for impedance measuring devices. 如請求項8所述之方法,更包含步驟: (g) 改變施加於該第一樣品及該第二樣品的壓合壓力;以及 (h)  重複步驟(e)至(f)。 The method as described in claim 8 further comprises the steps of: (g) changing the pressing pressure applied to the first sample and the second sample; and (h) repeating steps (e) to (f). 如請求項8所述之方法,其中該載台更包含轉盤,該第一下夾部及該第二下夾部配置於該轉盤上, 該測量接觸阻抗之方法更包含以下步驟: (i) 將該轉盤從第一測量位置調整至第二測量位置,其中當該轉盤處於該第一測量位置,該第一上夾部耦合該第一下夾部,該第二上夾部耦合該第二下夾部,當該轉盤處於該第二測量位置,該第一上夾部耦合該第二下夾部,該第二上夾部耦合該第一下夾部; (j) 重複步驟(e)至(f)以獲得該氣體擴散層及該極板之間的參考表面接觸阻抗值;以及 (k) 藉由該處理器計算該表面接觸阻抗值及該參考表面接觸阻抗值的平均值,獲得經優化之表面接觸阻抗值。 The method as described in claim 8, wherein the carrier further comprises a turntable, the first lower clamp and the second lower clamp are arranged on the turntable, and the method for measuring contact impedance further comprises the following steps: (i) adjusting the turntable from a first measurement position to a second measurement position, wherein when the turntable is at the first measurement position, the first upper clamp is coupled to the first lower clamp, and the second upper clamp is coupled to the second lower clamp, and when the turntable is at the second measurement position, the first upper clamp is coupled to the second lower clamp, and the second upper clamp is coupled to the first lower clamp; (j) repeating steps (e) to (f) to obtain a reference surface contact impedance value between the gas diffusion layer and the electrode; and (k) The processor calculates the average value of the surface contact impedance value and the reference surface contact impedance value to obtain an optimized surface contact impedance value.
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Publication number Priority date Publication date Assignee Title
KR101320786B1 (en) * 2012-11-09 2013-10-23 현대하이스코 주식회사 Apparatus for measuring of contact resistance and method for measuring of contact resistance of bopolar plate for a fuel cell
CN110061270A (en) * 2019-04-08 2019-07-26 嘉兴信普勒机电有限公司 The non-destructive measuring method of fuel battery double plates and carbon paper interface contact resistance
CN114280373A (en) * 2021-12-31 2022-04-05 氢电中科(广州)新能源设备有限公司 Nondestructive measurement device for contact resistance of fuel cell bipolar plate and carbon paper interface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101320786B1 (en) * 2012-11-09 2013-10-23 현대하이스코 주식회사 Apparatus for measuring of contact resistance and method for measuring of contact resistance of bopolar plate for a fuel cell
CN110061270A (en) * 2019-04-08 2019-07-26 嘉兴信普勒机电有限公司 The non-destructive measuring method of fuel battery double plates and carbon paper interface contact resistance
CN114280373A (en) * 2021-12-31 2022-04-05 氢电中科(广州)新能源设备有限公司 Nondestructive measurement device for contact resistance of fuel cell bipolar plate and carbon paper interface

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