TWI836568B - Manufacturing method of circuit board circuit structure with through hole and circuit board circuit structure with through hole manufactured thereof - Google Patents

Abstract

A manufacturing method of circuit board circuit structure with through hole includes providing a substrate. Covering the two first photoresist layers on the surfaces of the two copper layers of the substrate, and performing exposure and development. An etching process is performed to remove the surfaces of the copper layers not covered by the first photoresist layers. Two first photoresist layers are removed. Covering two second photoresist layers on the surface of each copper layer, and exposing. Drilling holes are respectively performed from the surface of each second photoresist layer to form a first hole and a second hole. A metallization layer is chemically formed to cover the first hole, the second hole and each of the second photoresist layers. A copper clad layer is formed by electroplating to cover the first hole, the second hole and each of the second photoresist layers. Part of the copper clad layer is removed by chemical etching. Two second photoresist layers are removed.

Description

Method for manufacturing circuit board wiring structure with via hole and manufactured circuit board wiring structure with via hole

A method for manufacturing a circuit board with via holes, in particular a method for manufacturing a circuit board circuit structure and the manufactured circuit board circuit structure with via holes.

The conventional method of making circuit board circuit structure is to complete the electroplating hole structure first, and then make the circuits on both sides. It is generally a full plating process or a selective plating process. In the general process, if the conductive layer is disconnected, it will affect the quality of electroplating. In the special metallization system, due to the characteristics of metallization, the circuits of the substrate must be made separately. For example, in the graphene metallization system, during electroplating, if the conductive layer is disconnected on both sides, it will affect the performance of electroplating. Therefore, only one side of the conductor can be kept intact to form the circuit on one side first, and then the circuit on the other side. This is to help control the thickness of the substrate and the conductor. However, this manufacturing method will affect the manufacturing efficiency of the circuit board structure and also generate additional steps and cost consumption.

In view of this, in one embodiment of the present invention, a method for manufacturing a circuit board circuit structure with via holes is provided, which includes providing a substrate. The substrate includes a base material layer and a copper layer, and the base material layer has a phase For the first surface and the second surface, two copper layers are respectively formed on the first surface and the second surface of the base material layer. Cover two first photoresist layers on the surface of the two copper layers, and through exposure and development, the first photoresist layer on one side of the first surface forms a first pattern structure, so that the first photoresist layer on one side of the second surface The resist layer forms a second pattern structure. An etching process is performed to remove the surface of each copper layer not covered by each first photoresist layer. Remove the first photoresist layer. Cover two second photoresist layers on the surface of each copper layer, and through exposure, the second photoresist layer on one side of the first surface forms a third pattern structure, so that the second photoresist layer on one side of the second surface A fourth pattern structure is formed. Drilling is performed on the surface of the second photoresist layer located on one side of the first surface to form at least one first hole. The at least one first hole is conductive to the second surface of the base material layer, and is formed on one side of the second surface. The surface of the second photoresist layer is drilled to form at least one second hole, and the at least one second hole is connected to the first surface of the base material layer. A metallized layer is formed by direct metallization through chemical means. The metallized layer covers the surface of at least one first hole, the surface of the second photoresist layer located on one side of the first surface, the surface of at least one second hole and is located on the first surface. The surface of the second photoresist layer on one side of the two surfaces. A copper-clad layer is formed through electroplating. The copper-clad layer covers the surfaces of at least one first hole and at least one second hole respectively and extends along at least one first hole and at least one second hole respectively and covers the first surface and the second hole. A second photoresist layer on one side of the two surfaces. Remove part of the copper layer through chemical etching. Remove the second photoresist layer.

In some embodiments, after removing the two second photoresist layers, two outer layer plates are provided, each outer layer plate includes a material layer and a copper layer, the material layer has a third surface and a fourth surface opposite to each other, the third surface of the material layer of each outer layer plate is respectively arranged on the copper layer on the first surface side and the second surface side of the substrate, and the copper layer is formed on the fourth surface of the material layer. A third photoresist layer is covered on the surface of the copper layer, and the third photoresist layer is formed into a fifth pattern structure through exposure and development. An etching process is performed to remove the surface of the copper layer not covered by the third photoresist layer. The third photoresist layer is removed. A fourth photoresist layer is covered on the surface of the copper layer, and the fourth photoresist layer is formed into a sixth pattern structure through exposure. Drilling is performed from the surface of the fourth photoresist layer to form at least one third hole, and at least one third hole of each outer layer is respectively connected to the copper-clad layer of the substrate on one side of the first surface and one side of the second surface. A metallization layer is formed by direct metallization by chemical means, and the metallization layer covers the surface of at least one third hole and the surface of the fourth photoresist layer. A copper-plated layer is formed by electroplating, and the copper-plated layer covers at least one third hole and extends along at least one third hole and covers the fourth photoresist layer. Part of the copper-plated layer is removed by chemical etching. The fourth photoresist layer is removed.

In some embodiments, after removing the two second photoresist layers, an outer layer board is provided. The outer layer board includes a material layer and a copper material layer. The material layer has a third surface and a fourth surface opposite to each other. The third surface of the material layer is provided On the copper layer on the first surface side of the substrate, the copper material layer is formed on the fourth surface of the material layer. Cover the third photoresist layer on the surface of the copper material layer and the surface of the copper layer on one side of the second surface, and through exposure and development, the third photoresist layer forms a fifth pattern structure. An etching process is performed to remove the surface of the copper layer not covered by the third photoresist layer. Remove the third photoresist layer. Cover the fourth photoresist layer on the surface of the copper material layer and the surface of the copper layer on one side of the second surface, and expose the fourth photoresist layer to form a sixth pattern structure. Drilling is performed from the surface of the fourth photoresist layer on one side of the first surface to form at least a third hole, and the at least one third hole is conductive to the copper-clad layer on one side of the first surface of the substrate. A metallization layer is formed by direct metallization through chemical means, and the metallization layer covers the surface of at least one third hole and the surface of the fourth photoresist layer. A copper plating layer is formed through electroplating, and the copper plating layer covers at least one third hole, extends along at least one third hole, and covers the fourth photoresist layer. Remove part of the copper plating through chemical etching. Remove the fourth photoresist layer.

In some embodiments, after chemical etching, the height of the copper-clad layer is flush with the second photoresist layer.

In some embodiments, after chemical etching, the height of the copper clad layer is flush with the copper layer.

In some embodiments, after the outer layer is chemically etched, the height of the copper layer is aligned with the fourth photoresist layer.

In some embodiments, after the outer layer is chemically etched, the height of the copper layer is aligned with the copper material layer.

In some embodiments, the material layer of the outer layer board covers part of the copper clad layer on one side of the first surface of the substrate.

In some embodiments, the first photoresist layer and the second photoresist layer are dry film photoresists.

In some embodiments, at least one first hole and at least one second hole are formed by laser drilling.

In addition, in one embodiment, the present invention provides a circuit board circuit structure with via holes, which is manufactured by the manufacturing method of the above embodiments.

In summary, two first photoresist layers are covered on the surface of two copper layers, and exposure, development and etching are performed to form the circuit patterns on the two sides first, and then other structures are manufactured. In this way, the manufacturing process is simplified and the consumption of manpower and cost is reduced. In addition, in the subsequent structure manufacturing, the metallization and electroplating range is increased through the second photoresist layer. During the electroplating process, the copper-clad layer extends to the surface of the second photoresist layer, and then the copper-clad layer exceeding the height range of the second photoresist layer and the second photoresist layer are removed at the same time to control the protrusion of the copper-clad layer, avoiding the problem of the electroplated layer overflowing the hole during electroplating and forming a protrusion around the hole. In addition, the protrusion of the electroplating layer can be controlled to facilitate the subsequent stacking of multiple layers. For example, if you want to stack an outer layer, you can make the height of the copper-clad layer and the second photoresist layer roughly the same to increase the connection efficiency between the substrate and the outer layer. If the circuit board circuit structure has been completed, the height of the copper-clad layer and the copper layer can also be roughly the same to make the outer side of the circuit board circuit structure flat.

100: Circuit board circuit structure

10: Substrate

11:Substrate layer

111: First surface

112: Second surface

12A, 12B: Copper layer

13A, 13B: first photoresist layer

131A: First pattern structure

131B: Second pattern structure

14A, 14B: second photoresist layer

141A: The third pattern structure

141B: Fourth pattern structure

15A:First hole

15B:Second hole

151A, 151B: Hole wall

152A, 152B: Bottom of hole

16A, 16B: Metallized layer

17A, 17B: Copper clad layer

20: Outer layer

21: Material layer

211: Third surface

212: The fourth surface

22: Copper layer

23: The third photoresist layer

231: The fifth pattern structure

24: Fourth photoresist layer

241: The sixth pattern structure

25:The third hole

251: Hole wall

252: Bottom of hole

26:Metalization layer

27: Copper plating layer

30: Outer layer

31: Material layer

311:Third surface

312:Fourth surface

32: Copper layer

33: The third photoresist layer

331: Fifth pattern structure

34: The fourth photoresist layer

341: The sixth pattern structure

35:The third hole

351:hole wall

352: Bottom of hole

36:Metalization layer

37: Copper plating layer

S10-S29: Steps

S20’-S29’: steps

[Figure 1] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a first embodiment (I).

[Fig. 2] is a structural schematic diagram (2) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 3] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a first embodiment (III).

[Fig. 4] is a structural schematic diagram (4) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 5] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a first embodiment (V).

[Fig. 6] is a structural schematic diagram (6) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 7] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a first embodiment (VII).

[Fig. 8] is a schematic structural diagram (8) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Fig. 9] is a structural schematic diagram (9) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 10] is a structural schematic diagram (ten) of a method for manufacturing a circuit board line structure with a via hole according to a first embodiment.

[Fig. 11] is a structural schematic diagram (11) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Fig. 12] is a structural schematic diagram (12) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 13] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a first embodiment (XIII).

[Fig. 14] is a schematic structural diagram (14) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Fig. 15] is a schematic structural diagram (fifteen) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 16] is a structural schematic diagram of a method for manufacturing a circuit board line structure with a via hole according to a first embodiment (XVI).

[Fig. 17] is a structural schematic diagram (17) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Fig. 18] is a structural schematic diagram (18) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Fig. 19] is a structural schematic diagram (1) of a method for manufacturing a circuit board circuit structure with via holes according to the second embodiment.

[Figure 20] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a second embodiment (II).

[Figure 21] shows the result of a method for manufacturing a circuit board circuit structure with via holes according to the second embodiment. Structure diagram (3).

[Figure 22] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a second embodiment (IV).

[Fig. 23] is a structural schematic diagram (5) of a method for manufacturing a circuit board circuit structure with via holes according to the second embodiment.

[Fig. 24] is a structural schematic diagram (6) of a method for manufacturing a circuit board circuit structure with via holes according to the second embodiment.

[Figure 25] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a second embodiment (VII).

[Figure 26] is a structural schematic diagram of a method for manufacturing a circuit board circuit structure with a via hole according to a second embodiment (VIII).

[Fig. 27] is a flow chart (1) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment.

[Figure 28] is a flow chart (II) of a method for manufacturing a circuit board circuit structure with a via hole according to a first embodiment.

[Figure 29] is a flow chart of a method for manufacturing a circuit board circuit structure with a via hole according to a second embodiment.

Please refer to Figures 1 to 10, and also see Figure 27. 1 to 10 are structural schematic diagrams (1) to (10) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment. Figure 27 is a flow chart (1) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment. As shown in Figure 1 and Figure 27, the circuit board circuit structure with via holes in this embodiment The manufacturing method of 100 includes providing a substrate (step S10). The substrate 10 includes a base material layer 11 and two copper layers 12A and 12B. The base material layer 11 has an opposite first surface 111 and a second surface 112. The two copper layers 12A and 12B are respectively formed on the first surface 111 of the base material layer 11. and second surface 112. In this embodiment, the first surface 111 and the second surface 112 of the base material layer 11 are used to manufacture circuit board circuit structures 100 of different specifications at the same time. However, it is not limited to this, and circuit board circuit structures 100 of the same specifications can also be produced.

As shown in Figure 2 and Figure 27, the two first photoresist layers 13A and 13B are covered on the surfaces of the two copper layers 12A and 12B, and through exposure and development, the first photoresist layer 13A on one side of the first surface 111 is The first pattern structure 131A is formed, so that the first photoresist layer 13B on one side of the second surface 112 forms the second pattern structure 131B (step S11). In this embodiment, the photoresist layer is formed by laminating dry film photoresist.

As shown in FIG3 and FIG27, an etching process is performed to remove the surfaces of the copper layers 12A and 12B that are not covered by the first photoresist layers 13A and 13B (step S12). Then, as shown in FIG4 and FIG27, the two first photoresist layers 13A and 13B are removed (step S13) to complete part of the circuit structure.

As shown in FIG. 5 and FIG. 27 , two second photoresist layers 14A and 14B are covered on the surfaces of the copper layers 12A and 12B, and through exposure, the second photoresist layer 14A on one side of the first surface 111 forms a third pattern structure 141A, and the second photoresist layer 14B on one side of the second surface 112 forms a fourth pattern structure 141B (step S14). In this embodiment, dry film photoresist is used as an example, and the photoresist is formed into a chemical-resistant state by full exposure.

As shown in FIGS. 6 and 27 , drilling is performed from the surface of the second photoresist layer 14A located on one side of the first surface 111 (step S15 ) to form at least one first hole 15A, and at least one first hole 15A is conductive. to the second surface 112 of the base material layer 11 , from the third surface located on one side of the second surface 112 The surfaces of the two photoresist layers 14B are drilled to form at least one second hole 15B, and the at least one second hole 15B is connected to the first surface 111 of the base material layer 11 . In this embodiment, the first hole 15A and the second hole 15B are formed by laser drilling. Here, one first hole 15A and one second hole 15B is used as an example, but it is not limited to this. The first hole 15A sequentially passes through the second photoresist layer 14A, the copper layer 12A and the base material layer 11 from the second photoresist layer 14A on one side of the first surface 111 to the copper layer 12B on one side of the second surface 112 and form guide holes. The first hole 15A includes a hole wall 151A and a hole bottom 152A. The hole wall 151A includes drilled and exposed side surfaces of the second photoresist layer 14A, the copper layer 12A and the base material layer 11 . Hole bottom 152A includes the surface of copper layer 12B bonded to second surface 112 . The second hole 15B goes from the second photoresist layer 14B on one side of the second surface 112 to the copper layer 12A on one side of the first surface 111, passing through the second photoresist layer 14B, the copper layer 12B and the base material layer 11 in sequence. and form guide holes. The second hole 15B includes a hole wall 151B and a hole bottom 152B. The hole wall 151B includes the side surfaces of the second photoresist layer 14B, the copper layer 12B and the base material layer 11 that are drilled and exposed. Hole bottom 152B includes the surface of copper layer 12A bonded to second surface 112 .

As shown in FIGS. 7 and 27 , metallized layers 16A and 16B are chemically formed (step S16 ). The metallized layers 16A and 16B cover the surface of the first hole 15A and the second second hole located on one side of the first surface 111 . The surface of the photoresist layer 14A, the surface of the second hole 15B and the surface of the second photoresist layer 14B located on one side of the second surface 112 . For convenience of subsequent description, the metallization layer located on the first surface 111 side is represented by metallization layer 16A, and the metallization layer located on the second surface 112 side is represented by metallization layer 16B. In this embodiment, the metallization layers 16A and 16B are formed by chemical direct metallization treatment. Since the chemical direct metallization treatment is used, even if the copper layers 12A and 12B on both sides of the substrate 10 are not in a full copper state, Metalization is also possible.

As shown in FIG8 and FIG27, copper-clad layers 17A and 17B are formed by electroplating (step S17). The copper-clad layers 17A and 17B cover the surfaces of the first hole 15A and the second hole 15B respectively and extend along the first hole 15A and the second hole 15B respectively and cover the second photoresist layers 14A and 14B on one side of the first surface 111 and the second surface 112. For the convenience of subsequent explanation, the copper-clad layer located on the first surface 111 side is indicated by the copper-clad layer 17A, and the copper-clad layer located on the second surface 112 side is indicated by the copper-clad layer 17B.

As shown in FIG9 and FIG27, a portion of the copper-coated layers 17A and 17B are removed by chemical etching (step S18). In this embodiment, the height of the copper-coated layers 17A and 17B is made equal to the height of the second photoresist layers 14A and 14B to facilitate the subsequent lamination of double-sided boards or multi-layer boards (described later), but not limited to this. For example, when the lamination operation is not to be continued, the height of the copper-coated layers 17A and 17B can also be equal to the second copper layers 12A and 12B respectively. Then, as shown in FIG10 and FIG27, the second photoresist layers 14A and 14B are removed (step S19), and the circuit board circuit structure 100 is completed.

Specifically, the circuit patterns on the two sides of the substrate 10 are formed first, and then other structures are manufactured. In this way, the manufacturing process is simplified and the cost consumption is reduced. In addition, in the subsequent structure manufacturing, the metallization and electroplating range is enlarged through the second photoresist layer 14A, 14B. During the electroplating process, the copper-clad layers 17A, 17B extend to the surface of the second photoresist layer 14A, 14B respectively, and then the copper-clad layers 17A, 17B exceeding the height range of the second photoresist layer 14A, 14B and the second photoresist layer 14A, 14B are removed together to control the protrusion of the copper-clad layers 17A, 17B, thereby avoiding the problem of the electroplated layer overflowing the hole and forming a protrusion around the hole during electroplating. In addition, by controlling the protrusion of the copper-clad layers 17A, 17B, the subsequent multi-layer board manufacturing is facilitated. If another plate is to be stacked, the height of the copper-clad layers 17A, 17B and the second photoresist layers 14A, 14B can be roughly the same to increase the connection efficiency between the substrate 10 and the other plate. If the circuit board circuit structure has been completed, the height of the copper-clad layers 17A, 17B and the copper layers 12A, 12B can also be roughly the same to make the outer side of the circuit board circuit structure flat.

Please refer to Figures 11 to 18 and also see Figure 28. 11 to 18 are structural schematic diagrams (11) to (18) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment. Figure 28 is a flow chart (2) of a method for manufacturing a circuit board circuit structure with via holes according to the first embodiment. In this embodiment, the circuit board circuit structure 100 is suitable for, for example, a double-sided board or an inner board of a multi-layer board. Here, a double-layer board is taken as an example. Double-layer boards are stacked on both sides of the circuit board circuit structure 100 . However, it is not limited to this. Multi-layer boards can also be stacked on a single side of the circuit board circuit structure 100 . Homework.

As shown in FIG. 11 and FIG. 28 , after removing the two second photoresist layers (step S19 ), two outer layer boards 20 are provided (step S20 ). Each outer layer board 20 includes a material layer 21 and a copper material layer 22 . The material layer 21 It has an opposite third surface 211 and a fourth surface 212. The third surface 211 of the material layer 21 is provided on the copper layer 12A on the first surface 111 side of the substrate 10 and the copper layer 12B on the second surface 112 side. The copper material layer 22 Formed on the fourth surface 212 of the material layer 21 . In this embodiment, due to step S18, the height of the copper-clad layers 17A and 17B is flush with the second photoresist layers 14A and 14B. After the second photoresist layers 14A and 14B are removed, the copper-clad layers will be 17A and 17B protrude, and when the outer layer plate 20 is stacked on one side of the first surface 111 of the substrate 10, the material layer 21 of the outer layer plate 20 will cover the substrate 10 on one side of the first surface 111 and the second surface respectively. Part of the copper-clad layers 17A and 17B on one side of 112.

As shown in FIG. 12 and FIG. 28 , the third photoresist layer 23 is covered on the surface of the copper material layer 22, and through exposure and development, the third photoresist layer 23 forms a fifth pattern structure 231 (step S21). Then, an etching process is performed to remove the surface of the copper material layer 22 not covered by the third photoresist layer 23 (step S22), and the third photoresist layer 23 is removed (step S23).

As shown in FIG. 13 and FIG. 28 , the fourth photoresist layer 24 is covered on the surface of the copper layer 22 surface, and through exposure, the fourth photoresist layer 24 forms a sixth pattern structure 241 (step S24). In this embodiment, dry film photoresist is used as an example, and the photoresist is formed into a chemical-resistant state by full exposure.

As shown in FIGS. 14 and 28 , drilling is performed from the surface of the fourth photoresist layer 24 (step S25 ) to form at least one third hole 25 . The third holes 25 of each outer layer plate 20 are respectively connected to the substrate 10 at the third hole 25 . Copper clad layers 17A and 17B on one side of the first surface 111 and on one side of the second surface 112 . In this embodiment, the third hole 25 is formed by laser drilling. Here, taking one side of the first surface 111 as an example, the number of the third holes 25 corresponds to one first hole 15A. The third hole 25 extends from the fourth photoresist layer 24 to the copper-clad layer 17A of the substrate 10 , passes through the fourth photoresist layer 24 , the copper material layer 22 and the material layer 21 in sequence and forms a via hole. The third hole 25 includes a hole wall 251 and a hole bottom 252. The hole wall 251 includes the side surfaces of the fourth photoresist layer 24, the copper material layer 22 and the material layer 21 exposed through drilling. In this embodiment, since the material layer 21 of the outer layer board 20 covers part of the copper-clad layer 17A of the substrate 10 on one side of the first surface 111, the depth required for drilling can be reduced, and the subsequent formation of the After the copper-plated layer 27 is connected to the copper-clad layer 17A, the substrate 10 and the outer layer board 20 are conveniently connected.

As shown in FIGS. 15 and 28 , a metallization layer 26 is chemically formed (step S26 ), and the metallization layer 26 covers the surface of the third hole 25 and the surface of the fourth photoresist layer 24 . In this embodiment, the metallization layer 26 is formed by chemical direct metallization treatment.

As shown in FIG. 16 and FIG. 28 , a copper-plated layer 27 is formed by electroplating (step S27 ), and the copper-plated layer 27 covers the third hole 25 and extends along the third hole 25 and covers the fourth photoresist layer 24 .

As shown in FIGS. 17 and 28 , part of the copper plating layer 27 is removed through chemical etching (step S28 ). In this embodiment, since there is no need to continue the lamination operation, the height of the copper plating layer 27 is It is flush with the copper material layer 22 , but is not limited to this. If you want to continue the lamination operation, you can also make the height of the copper plating layer 27 flush with the fourth photoresist layer 24 . In this way, the A/R value after hole forming in subsequent lamination operations can be reduced and the yield during electroplating can be improved. Next, as shown in FIGS. 18 and 28 , the fourth photoresist layer 24 is removed (step S29 ), thereby completing the production of the multilayer board.

In addition, please refer to Figures 19 to 26 and Figure 29 at the same time. Figures 19 to 26 are structural schematic diagrams (i) to (viii) of a method for manufacturing a circuit board wiring structure with a via hole in a second embodiment. Figure 29 is a flow chart of a method for manufacturing a circuit board wiring structure with a via hole in a second embodiment. In the first embodiment, a double-layer board stacking operation is illustrated using both sides of the circuit board wiring structure 100, but it is not limited to this. A multi-layer board stacking operation can also be performed using a single side of the circuit board wiring structure 100. This aspect is illustrated here using the second embodiment. The similar parts of the second embodiment to the first embodiment are not described in detail. In the second embodiment, as shown in Figures 19 and 29, after removing the two second photoresist layers 14A and 14B, an outer layer plate 30 is provided (step S20'). The outer layer plate 30 includes a material layer 31 and a copper material layer 32. The material layer 31 has a third surface 311 and a fourth surface 312 opposite to each other. The third surface 311 of the material layer 31 is disposed on the copper layer 12A on the side of the first surface 111 of the substrate 10, and the copper material layer 32 is formed on the fourth surface 312 of the material layer 31. In the second embodiment, since the lamination operation is performed on only one side, that is, one side of the first surface 111, in step S18, the height of the copper-clad layer 17A is made flush with the second photoresist layer 14A to increase the connection efficiency between the substrate 10 and the outer layer 30. In addition, on one side of the second surface 112 where the lamination operation is no longer performed, the height of the copper-clad layer 17B is made roughly consistent with the height of the copper layer 12B, so that the outer side of the circuit board circuit structure is flat.

As shown in FIGS. 20 and 29 , the third photoresist layer 33 is covered on the surface of the copper material layer 32 and the surface of the copper layer 12B on one side of the second surface 112 , and through exposure and development, the third photoresist layer 33 is 33 forms a fifth pattern structure 331 (step S21'). Next, an etching process is performed to remove unused The surface of the copper material layer 32 covered by the third photoresist layer 33 (step S22'), and the third photoresist layer 33 is removed (step S23'). In the second embodiment, even if no lamination operation is performed on one side of the second surface 112, it still needs to be protected by coating a photoresist layer.

As shown in FIG. 21 and FIG. 29 , the fourth photoresist layer 34 is covered on the surface of the copper material layer 32 and the surface of the copper layer 12B on one side of the second surface 112, and the fourth photoresist layer 34 is exposed to form a sixth pattern structure 341 (step S24’).

As shown in Figures 22 and 29, drilling is performed from the surface of the fourth photoresist layer 34 on one side of the first surface 111 (S25') to form at least one third hole 35, and the at least one third hole 35 is connected to The copper clad layer 17A on one side of the first surface 111 of the substrate 10 . The third hole 35 extends from the fourth photoresist layer 34 to the copper-clad layer 17A of the substrate 10 and sequentially passes through the fourth photoresist layer 34 , the copper material layer 32 and the material layer 31 to form a via hole. The third hole 35 includes a hole wall 351 and a hole bottom 352. The hole wall 351 includes the side surfaces of the fourth photoresist layer 34, the copper material layer 32 and the material layer 31 exposed through drilling.

As shown in Figures 23 and 29, a metallization layer 36 is formed by chemical direct metallization (step 26'). The metallization layer 36 covers the surface of the third hole 35 and the surface of the fourth photoresist layer 34.

As shown in FIGS. 24 and 29 , a copper plating layer 37 is formed through electroplating (step S27′). The copper plating layer 37 covers the third hole 35 and extends along the third hole 35 and covers the fourth photoresist layer 34 .

As shown in Figures 25 and 29, a portion of the copper plating layer 37 is removed through chemical etching (step S28'). In the second embodiment, since the lamination operation is not to be continued, the height of the copper plating layer 37 is made to be flush with the copper material layer 32. However, it is not limited to this. If you want to continue the lamination operation, you can also make the plating layer 37 flush with the copper material layer 32. The height of the copper layer 37 is flush with the fourth photoresist layer 34 . Next, as shown in Figure 26 and Figure 29, go to After removing the fourth photoresist layer 34 (step S29'), the production of the multilayer board is completed.

In summary, by first forming the circuit patterns on both sides of the substrate, other structures can then be produced. In this way, the production process is simplified and the cost consumption is reduced. In addition, in the subsequent structural fabrication, the metallization and electroplating ranges are increased through the second photoresist layer. During the electroplating process, the copper-clad layer extends to the surface of the second photoresist layer, and then is removed together with more than The height range of the copper clad layer of the second photoresist layer and the removal of the second photoresist layer to control the protrusion of the copper clad layer to avoid the problem of the plating layer overflowing the hole and forming a protrusion around the hole when plating the hole. . In addition, by controlling the protrusion amount of the copper clad layer, the subsequent production of multi-layer boards is facilitated. If the outer layer boards are to be stacked, the heights of the copper-clad layer and the second photoresist layer can be made approximately the same to increase the connection efficiency between the substrate and the outer layer board. If the production of the circuit board circuit structure has been completed, the height of the copper clad layer and the copper layer can also be roughly the same, so that the outer surface of the circuit board circuit structure is flat.

100: Circuit board circuit structure 11:Substrate layer 111: First surface 112: Second surface 12A, 12B: Copper layer 17A, 17B: Copper clad layer

Claims (12)

A method for manufacturing a circuit board circuit structure with a via, comprising: Providing a substrate, the substrate comprising a base material layer and two copper layers, the base material layer having a first surface and a second surface opposite to each other, the two copper layers being formed on the first surface and the second surface of the base material layer respectively; Covering the surfaces of the two copper layers with two first photoresist layers, and through exposure and development, forming a first pattern structure on the first photoresist layer on one side of the first surface, and forming a second pattern structure on the first photoresist layer on one side of the second surface; Performing an etching process to remove the surfaces of the copper layers not covered by the first photoresist layers; Removing the two first photoresist layers; Covering the surfaces of the copper layers with two second photoresist layers, and through exposure, forming a third pattern structure in the second photoresist layer on one side of the first surface, and forming a fourth pattern structure in the second photoresist layer on one side of the second surface; Drilling from the surface of the second photoresist layer on one side of the first surface to form at least one first hole, the at least one first hole is connected to the second surface of the substrate layer, drilling from the surface of the second photoresist layer on one side of the second surface to form at least one second hole, the at least one second hole is connected to the first surface of the substrate layer; Directly metallizing by chemical means forms a metallization layer, the metallization layer covers the surface of the at least one first hole, the surface of the second photoresist layer located on one side of the first surface, the surface of the at least one second hole, and the surface of the second photoresist layer located on one side of the second surface; Forming a copper-coated layer by electroplating, the copper-coated layer covers the surfaces of the at least one first hole and the at least one second hole, respectively, and extends along the at least one first hole and the at least one second hole, respectively, and covers the second photoresist layer on one side of the first surface and the second surface; Removing part of the copper-coated layer by chemical etching; and Removing the two second photoresist layers. The method for manufacturing a circuit board circuit structure with a via as described in claim 1, after removing the two second photoresist layers, further includes: Providing two outer layer boards, each of the outer layer boards includes a material layer and a copper material layer, the material layer has a third surface and a fourth surface opposite to each other, the third surface of the material layer of each outer layer board is respectively arranged on the copper layer on the first surface side and the second surface side of the substrate, and the copper material layer is formed on the fourth surface of the material layer; Covering a third photoresist layer on the surface of the copper material layer, and forming a fifth pattern structure on the third photoresist layer through exposure and development; Performing an etching process to remove the surface of the copper material layer not covered by the third photoresist layer; Removing the third photoresist layer; Covering a fourth photoresist layer on the surface of the copper material layer, and forming a sixth pattern structure on the fourth photoresist layer through exposure; Drilling from the surface of the fourth photoresist layer to form at least one third hole, the at least one third hole of each outer plate is respectively connected to the copper-clad layer of the substrate on one side of the first surface and one side of the second surface; Forming a metallization layer by direct metallization by chemical means, the metallization layer covers the surface of the at least one third hole and the surface of the fourth photoresist layer; Forming a copper-plated layer by electroplating, the copper-plated layer covers the at least one third hole and extends along the at least one third hole and covers the fourth photoresist layer; Removing a portion of the copper-plated layer by chemical etching; and Removing the fourth photoresist layer. The manufacturing method of a circuit board circuit structure with via holes as described in claim 1, after removing the two second photoresist layers, further includes: An outer layer board is provided. The outer layer board includes a material layer and a copper material layer. The material layer has an opposite third surface and a fourth surface. The third surface of the material layer is located on the first surface of the substrate. The copper layer on the surface side, the copper material layer is formed on the fourth surface of the material layer; Cover a third photoresist layer on the surface of the copper material layer and the surface of the copper layer on one side of the second surface, and through exposure and development, the third photoresist layer forms a fifth pattern structure; Perform an etching process to remove the surface of the copper layer not covered by the third photoresist layer; Remove the third photoresist layer; Covering a fourth photoresist layer on the surface of the copper material layer and the surface of the copper layer on one side of the second surface, and exposing the fourth photoresist layer to form a sixth pattern structure; Drilling is performed from the surface of the fourth photoresist layer on one side of the first surface to form at least one third hole. The at least one third hole is conductive to the copper clad layer on one side of the first surface of the substrate. ; A metallization layer is formed by direct metallization through chemical means, and the metallization layer covers the surface of the at least one third hole and the surface of the fourth photoresist layer; Forming a copper plating layer through electroplating, the copper plating layer covers the at least one third hole and extends along the at least one third hole and covers the fourth photoresist layer; removing part of the copper plating layer through chemical etching; and Remove the fourth photoresist layer. The method for manufacturing a circuit board circuit structure with via holes as described in any one of claims 1 to 3, wherein after chemical etching, the height of the copper-clad layer is flush with the second photoresist layer. The method for manufacturing a circuit board circuit structure with via holes as described in any one of claims 1 to 3, wherein after chemical etching, the height of the copper-clad layer is flush with the copper layer. As claimed in claim 2, the method for manufacturing a circuit board circuit structure with via holes, wherein after the outer layer board is chemically etched, the height of the copper plating layer is flush with the fourth photoresist layer. The method for manufacturing a circuit board circuit structure with via holes as described in claim 2, wherein after the outer layer board is chemically etched, the height of the copper plating layer is flush with the copper material layer. A method for manufacturing a circuit board wiring structure with a through hole as described in claim 2, wherein the material layers of the two outer layers respectively cover a portion of the copper-clad layer of the substrate on one side of the first surface and one side of the second surface. The method for manufacturing a circuit board circuit structure with via holes as described in claim 3, wherein the material layer of the outer layer board covers part of the copper clad layer of the substrate on one side of the first surface. As claimed in claim 1, the method for manufacturing a circuit board circuit structure with via holes, wherein the first photoresist layer and the second photoresist layer are dry film photoresist. As claimed in claim 1, the method for manufacturing a circuit board circuit structure with via holes, wherein the at least one first hole and the at least one second hole are formed using a laser drilling method. A circuit board wiring structure with via holes manufactured by the manufacturing method of a circuit board wiring structure with via holes as described in any one of claims 1 to 11.

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