TWI833333B - High power test switching device - Google Patents

Abstract

The invention relates to a high-power test switching device. The main structure includes a micro-electromechanical switch and a signal output switch. The micro-electromechanical switch is provided with a test signal input terminal, first to fourth output terminals, and first to fourth output terminals. The fourth glass substrate channel switch is provided with first to fourth receiving terminals and test signal output terminals on the signal output switch. The first to third output terminals and the first to third receiving terminals are respectively provided with first to fourth receiving terminals. The third signal amplifier and the first to third signal filters are used as the signal input switch of the testing machine through this micro-electromechanical switch to increase the service life and signal accuracy.

Description

High power test switching device

The present invention provides a high-power test switching device with longer service life and more accurate signals.

Press, with the advancement of various technologies, the precision of various industries will increase. For example, the signal transmission industry will continue to improve with the advancement of the times. Relatively speaking, for various types of signals and power supplies The requirements of testing institutions will also increase accordingly.

Generally, high-power switcher testing requires high power endurance, low distortion, frequency selection and signal amplification functions to accurately measure the harmonics in the switcher. In order to cope with high-power Under certain conditions, a mechanical switch is often chosen to achieve low distortion. However, the mechanical switch has poor adjustment effect on frequency and power, and because the mechanical switch uses a magnetic reed type mechanism to perform the switching action. Therefore, elastic fatigue will easily occur, resulting in shorter service life, and the overall volume will be larger.

Therefore, how to solve the above conventional problems and deficiencies is an urgent research and improvement direction that the applicant of the present invention and related manufacturers engaged in this industry want to research and improve.

Therefore, in view of the above-mentioned shortcomings, the creator of the present invention collected relevant information, evaluated and considered many aspects, and used many years of experience accumulated in this industry, and through continuous trials and modifications, he designed such a device with a longer service life. The inventor and patentee of a high-power test switching device with more accurate signals.

The main purpose of the present invention is to replace traditional mechanical switches with microelectromechanical switches combined with filtering and amplification effects to improve service life and signal accuracy.

In order to achieve the above objectives, the main structure of the present invention includes: a micro-electromechanical switch, a A test signal input terminal provided on the microelectromechanical switch, a first output terminal provided on the microelectromechanical switch and connected to the test signal input terminal, and a first output terminal provided between the first output terminal and the test signal input terminal. A first glass substrate channel switch, a second output terminal provided on the MEMS switch and connected to the test signal input terminal, a second glass substrate channel switch provided between the second output terminal and the test signal input terminal , a third output terminal provided on the microelectromechanical switch and connected to the test signal input terminal, a third glass substrate channel switch provided between the third output terminal and the test signal input terminal, and a third output terminal provided on the microelectromechanical switch. a fourth output terminal on the switch and connected to the test signal input terminal, a signal output switch provided on one side of the MEMS switch, and a signal output switch provided on the signal output switch and connected to the first output terminal The first receiving end, at least one first signal amplifier disposed between the first receiving end and the first output end, at least one first signal filter disposed between the first output end and the first signal amplifier, a a second receiving end provided on the signal output switch and connected to the second output end; at least one second signal amplifier provided between the second receiving end and the second output end; and at least one second receiving end provided at the second output end. and a second signal filter between the second signal amplifier, a third receiving end disposed on the signal output switch and connected to the third output end, at least one disposed on the third receiving end and the third output end. a third signal amplifier between, at least one third signal filter provided between the third output terminal and the third signal amplifier, a fourth receiving terminal provided on the signal output switch, and a third signal filter provided on the signal output switch The test signal output terminal on the device is connected to the first receiving end, the second receiving end, the third receiving end, and the fourth receiving end.

Through the above structure, the user can input the signal into the MEMS switch from the test signal input terminal, and select whether to output the signal from the first output terminal, the second output terminal, or the third output terminal to the corresponding The first receiving end, the second receiving end, or the third receiving end, and because when controlling the switch, the first glass substrate channel switch, the second glass substrate channel switch, and the third glass substrate channel switch are used to select the opening and closing connection status, so it can have a better service life, and because the passing signal can filter the signal through the first signal filter, the second signal filter, and the third signal filter, and then through the first signal filter The amplifier, the second signal amplifier, or the third signal amplifier amplifies the signal, thereby improving the accuracy of the signal.

Through the above method, the test signal output terminal on the signal output switch is used to transmit the signal to the test equipment, so as to achieve the effect of increasing the service life and improving the signal accuracy through the micro-electromechanical switch.

Through the above technology, the problem of short service life of conventional switches can be solved. Breakthrough to achieve the practical and progressive nature of the above advantages.

1:Microelectromechanical switch

A: Test signal input terminal

11: First output terminal

111: First glass substrate channel switch

12: Second output terminal

121: Second glass substrate channel switch

13: The third output terminal

131:Third glass substrate channel switch

14: The fourth output terminal

141: Fourth glass substrate channel switch

2: Signal output switch

B: Test signal output terminal

21: First receiving end

22: Second receiving end

23: The third receiving end

24:The fourth receiving end

25: Output glass substrate channel switch

31:First signal amplifier

32: Second signal amplifier

33:Third signal amplifier

41:First signal filter

42: Second signal filter

43:Third signal filter

5:Digital signal auxiliary structure

51:Digital signal amplifier

52:Digital signal inverter

53:Relay switch

54:Power booster

C:Glass substrate channel

The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.

The second figure is a schematic structural block diagram of a preferred embodiment of the present invention.

The third figure is a schematic diagram of the glass channel switch according to the preferred embodiment of the present invention.

The fourth figure is a schematic diagram of signal transmission according to the preferred embodiment of the present invention.

The fifth figure is a three-dimensional perspective view of yet another preferred embodiment of the present invention.

Figure 6 is a schematic structural block diagram of yet another preferred embodiment of the present invention.

The seventh figure is a three-dimensional perspective view of another preferred embodiment of the present invention.

Figure 8 is a schematic structural block diagram of another preferred embodiment of the present invention.

In order to achieve the above-mentioned objects and effects, the technical means and structures adopted by the present invention are described in detail below with respect to the preferred embodiments of the present invention, so as to facilitate a complete understanding.

Please refer to the first to fourth figures, which are three-dimensional perspective views and signal transmission schematic diagrams of the preferred embodiments of the present invention. It can be clearly seen from the figures that the present invention includes:

A microelectromechanical switch 1. The microelectromechanical switch 1 in this embodiment is a switch model MM5130;

A test signal input terminal A provided on the microelectromechanical switch 1;

a first output terminal 11 provided on the MEMS switch 1 and connected to the test signal input terminal A;

A first glass substrate channel switch 111 located between the first output terminal 11 and the test signal input terminal A;

a second output terminal 12 provided on the MEMS switch 1 and connected to the test signal input terminal A;

A second glass substrate channel switch 121 located between the second output terminal 12 and the test signal input terminal A;

A third terminal located on the microelectromechanical switch 1 and connected to the test signal input terminal A Output 13;

A third glass substrate channel switch 131 located between the third output terminal 13 and the test signal input terminal A;

a fourth output terminal 14 provided on the MEMS switch 1 and connected to the test signal input terminal A;

A fourth glass substrate channel switch 141 located between the fourth output terminal 14 and the test signal input terminal A;

A signal output switch 2 located on one side of the MEMS switch 1;

a first receiving end 21 provided on the signal output switch 2 and connected to the first output end 11;

At least one first signal amplifier 31 disposed between the first receiving end 21 and the first output end 11;

At least one first signal filter 41 provided between the first signal amplifier 31 and the first output terminal 11;

a second receiving end 22 provided on the signal output switch 2 and connected to the second output end 12;

at least one second signal amplifier 32 disposed between the second receiving end 22 and the second output end 12;

at least one second signal filter 42 disposed between the second signal amplifier 32 and the second output terminal 12;

a third receiving terminal 23 provided on the signal output switch 2 and connected to the third output terminal 13;

At least one third signal amplifier 33 is provided between the third receiving end 23 and the first output end 11. The first signal amplifier 31, the second signal amplifier 32, and the third signal amplifier 33 in this embodiment all use radio frequency ( RF) amplifier as an example;

At least one third signal filter 43 disposed between the third signal amplifier 33 and the third output terminal 13, the first signal filter 41, the second signal filter 42, and the third signal filter 43 of this embodiment. The high-pass filter (HPF) is used as an example;

a fourth receiving end 24 provided on the signal output switch 2; and

One is provided on the signal output switch 2 and is connected with the first receiving end 21 and the second receiving end 2 2. The third receiving end 23 and the fourth receiving end 24 are connected to the test signal output end B.

Through the above description, we can understand the structure of this technology, and based on the corresponding cooperation of this structure, we can have the advantages of extending the service life and improving the signal accuracy, and the detailed explanation will be explained below.

The user can input the signal from the test signal input terminal A of the MEMS switch 1, and this embodiment takes a radio frequency signal (RF) as an example, and sets the first signal filter 41 so that the frequency of 1320 HMz can pass. The second signal filter 42 is set to allow the frequency of 3100 HMz to pass, and the third signal filter 43 is set to 9700 HMz to pass. In this way, the user can select the output through the first output terminal 11, the second output terminal 12, or the third output terminal 13 according to the needs, and the fourth output terminal 14 can be reserved for the integration purpose of the external circuit when needed. Also external.

This embodiment first takes the selection of the first output terminal 11 as an example, so that the user can control the first glass substrate channel switch 111 to open, so that the test signal input terminal A and the first output terminal 11 are connected to each other. Since this case uses The microelectromechanical switch 1, therefore, the first glass substrate channel switch 111, the second glass substrate channel switch 121, the third glass substrate channel switch 131, and the fourth glass substrate channel switch 141 all use glass substrate channels to match metal alloys. To perform signal switching, the so-called glass substrate channel is made of a glass substrate and a metal alloy. As shown in the third figure, when voltage is injected, the glass substrate channel C will move upward and be in a conductive state. This is The technical content is currently available and will not be described in detail.

As mentioned above, at this time, the test signal input terminal A and the first output terminal 11 will be connected to each other, so that the signal is output from the first output terminal 11 and first passes through the first signal filter 41 to allow the frequency signal of 1320 HMz to pass. Then the first signal amplifier 31 performs an amplification operation, and finally the first receiving end 21 receives the signal. At this time, the user can also control the first output end 11 and the test signal output end B to be connected to each other. The signal output switching in this embodiment Device 2 uses a solid-state mechanism switch as an example, so that the effect of cost saving can be achieved. The switching method of the solid-state mechanism switch is a common technical content, so it will not be described again. In this way, the signal can be output through the test signal output terminal B to perform the test operation, and because the signal is filtered and amplified through the first signal filter 41 and the first signal amplifier 31, it can be more accurate, and because the input The end uses a micro-electromechanical switch 1, which is used as a switch in conjunction with a glass substrate channel, so it can have a longer service life than the conventional spring switch.

Correspondingly, the user can also choose to turn on the second glass substrate channel switch 121 to enable The second output terminal 12 is connected to the test signal input terminal A, so that the signal passes through the second output terminal 12, the second signal filter 42, and the second signal amplifier 32 so that the signal with a frequency of 3100 HMz enters the second receiving terminal 22. . Or choose to turn on the third glass substrate channel switch 131 to connect the third output terminal 13 with the test signal input terminal A, so that the signal passes through the third output terminal 13, the third signal filter 43, and the third signal amplifier 33 The signal with a frequency of 9700 HMz enters the third receiving end 23, and the fourth receiving end 24 can also be used for integration of external circuits, and is externally connected when needed. In this way, users can adjust the use of lines with different frequencies to perform test actions according to needs to improve the diversity of use effects. And because the MEMS switch 1 itself can withstand high power, it can increase the accuracy of the signal through filters and amplifiers to avoid distortion.

Please refer to the fifth and sixth figures at the same time, which are three-dimensional perspective views and structural block diagrams of yet another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment is different from the above-mentioned embodiment. Similar to each other, only in this embodiment, the number of the first signal filter 41 , the second signal filter 42 and the third signal filter 43 between the MEMS switch 1 and the signal output switch 2 is two. As an example, the number of the first signal amplifier 31 , the second signal amplifier 32 , and the third signal amplifier 33 is also two as an example to show that the number is not limited, regardless of which line the user chooses to perform the test operation. At the same time, the signal can also be filtered twice and amplified twice so that the signal can be sorted more accurately.

And in this embodiment, the signal output switch 2 is a micro-electromechanical switch, so that between the first receiving end 21 and the test signal output end B, and between the second receiving end 22 and the test An output glass substrate channel switch 25 is provided between the signal output terminal B, the third receiving terminal 23 and the test signal output terminal B, and the fourth receiving terminal 24 and the test signal output terminal B, so that the image test can be performed The signal input terminal A and the first output terminal 11, the second output terminal 12, the third output terminal 13, and the fourth output terminal 14 respectively utilize the first glass substrate channel switch 111, the second glass substrate channel switch 121, and the The three glass substrate channel switches 131 and the fourth glass substrate channel switch 141 are controlled in the same manner, indicating that the type of the signal output switch 2 is not limited.

Please refer to the seventh and eighth figures at the same time, which are three-dimensional perspective views and structural block diagrams of another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment is different from the above-mentioned embodiment. Much the same, in this embodiment, the MEMS switch 1 is connected to a digital signal auxiliary structure 5, and the digital signal auxiliary structure 5 has a digital signal amplifier 51 and a digital signal inverter 52 connected to the digital signal amplifier 51. , multiple relays connected to the digital signal inverter 52 switch 53, and a power booster 54 connected to each relay switch 53. Each relay switch 53 will be connected to the microelectromechanical switch 1, so that the user can control it through digital signals. Since the microelectromechanical switch 1 requires a voltage of 90V to start, if a digital signal is used, Then, the digital signal amplifier 51 needs to be used to amplify the signal, and then the digital signal inverter 52 can be used to reverse the signal, so that the digital signal can meet the specifications required by the microelectromechanical switch 1 .

After that, the signal is increased to above 90V through the power booster 54, and the relay switch 53 will allow the voltage above 90V to pass through. In this way, the digital signal can also be tested in the same manner as in this case. , to improve the convenience of use.

However, the above descriptions are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made using the contents of the description and drawings of the present invention should be treated in the same way. It is included in the patent scope of the present invention and is hereby stated.

To sum up, the high-power test switching device of the present invention can indeed achieve its effect and purpose when used. Therefore, the present invention is an invention with excellent practicality and meets the application requirements for an invention patent. The application should be filed in accordance with the law. , I hope that the review committee will approve this invention as soon as possible to protect the creator's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to send a letter for instructions. The creator will try his best to cooperate. I feel that it will be convenient.

1:Microelectromechanical switch

A: Test signal input terminal

11: First output terminal

111: First glass substrate channel switch

12: Second output terminal

121: Second glass substrate channel switch

13: The third output terminal

131:Third glass substrate channel switch

14: The fourth output terminal

141: Fourth glass substrate channel switch

2: Signal output switch

B: Test signal output terminal

21: First receiving end

22: Second receiving end

23: The third receiving end

24:The fourth receiving end

31:First signal amplifier

32: Second signal amplifier

33:Third signal amplifier

41:First signal filter

42: Second signal filter

43:Third signal filter

Claims (6)

A high-power test switching device, which mainly includes: a microelectromechanical switch; A test signal input terminal, the test signal input terminal is provided on the microelectromechanical switch; a first output terminal, the first output terminal is provided on the micro-electromechanical switch and is connected to the test signal input terminal; A first glass substrate channel switch, the first glass substrate channel switch is provided between the first output terminal and the test signal input terminal for controlling the mutual connection status; a second output terminal, the second output terminal is provided on the micro-electromechanical switch and is connected to the test signal input terminal; A second glass substrate channel switch, the second glass substrate channel switch is provided between the second output terminal and the test signal input terminal for controlling the mutual connection status; a third output terminal, the third output terminal is provided on the micro-electromechanical switch and is connected to the test signal input terminal; A third glass substrate channel switch, the third glass substrate channel switch is provided between the third output terminal and the test signal input terminal for controlling the mutual connection status; a fourth output terminal, the fourth output terminal is provided on the micro-electromechanical switch and is connected to the test signal input terminal; A signal output switch, the signal output switch is located on one side of the micro-electromechanical switch; A first receiving end, the first receiving end is provided on the signal output switch and is information-connected to the first output end; At least one first signal amplifier, the first signal amplifier is provided between the first receiving end and the first output end; At least one first signal filter, the first signal filter is provided between the first output terminal and the first signal amplifier; a second receiving end, the second receiving end is provided on the signal output switch and is information-connected to the second output end; At least one second signal amplifier, the second signal amplifier is provided between the second receiving end and the second output end; At least one second signal filter, the second signal filter is provided at the second output end and the second signal between amplifiers; A third receiving end, the third receiving end is provided on the signal output switch and is connected to the third output end; At least one third signal amplifier, the third signal amplifier is provided between the third receiving end and the third output end; At least one third signal filter, the third signal filter is provided between the third output terminal and the third signal amplifier; a fourth receiving end, the fourth receiving end is provided on the signal output switch; and A test signal output terminal is provided on the signal output switch and is connected to the first receiving end, the second receiving end, the third receiving end, and the fourth receiving end. For the high-power test switching device described in item 1 of the patent application, the signal output switch is one of a mechanical switch or a micro-electromechanical switch. For example, in the high-power test switching device described in item 2 of the patent application, in which the signal output switch is a microelectromechanical switch, between the first receiving end and the test signal output end, the second receiving end An output glass substrate channel switch is provided between the terminal and the test signal output terminal, the third receiving terminal and the test signal output terminal, and the fourth receiving terminal and the test signal output terminal. A high-power test switching device as described in item 1 of the patent application, wherein the micro-electromechanical switch is connected to a digital signal auxiliary structure. The high-power test switching device described in item 4 of the patent application, wherein the digital signal auxiliary structure has a digital signal amplifier, a digital signal inverter connected to the digital signal amplifier, and a plurality of digital signal inverters connected to the digital signal amplifier. relay switches, and a power booster connected to each relay switch. A high-power test switching device as described in item 1 of the patent application, wherein the microelectromechanical switch is a switch model MM5130.

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