TWI831693B - Electronic device - Google Patents

Abstract

An electronic device includes a first housing including a first opening, a second housing coupled to the first housing to jointly define a receiving space, an elastic base, a camera module disposed on the elastic base and located in the receiving space, and a memory alloy base disposed on the first housing, wherein the memory alloy base penetrates through the elastic base to drive the elastic base to move. The second housing has a cover glass corresponding to the first opening. When at first temperature, the memory alloy base is at first deformed shape, and there is a first distance between the camera module and the cover glass. When at second temperature, the memory alloy base is at second deformed shape, and there is a second distance between the camera module and the cover glass.

Description

electronic device

The present disclosure relates to an electronic device.

In recent years, with the vigorous development of miniaturized photographic lenses, the demand for small imaging modules has been increasing day by day. With the advancement of semiconductor process technology, the pixel size of photosensitive elements has been reduced. In addition, today's electronic products have excellent functions. And light, thin and short appearance is the development trend. Therefore, miniaturized photography lenses with good imaging quality have become the mainstream in the current market.

While the image resolution of such miniaturized camera modules used in portable electronic devices continues to improve, the thickness of the imaging lens group also continues to shrink to match the thinner portable electronic devices. However, miniaturized camera modules still do not have the excellent optical zoom capabilities of traditional photography devices. As a result, the viewing range (photography angle) of the miniature imaging systems currently on the market is relatively narrow and cannot be adjusted more. Therefore, current miniaturized camera modules cannot fully meet the current trends in technological development and user needs.

The present disclosure provides an electronic device that can change the visual range of a camera module as required.

An electronic device of the present disclosure includes a first housing, a second housing, a first elastic base material, a camera module and a first memory metal base material. The first housing includes a first opening. The second housing is coupled to the first housing to jointly define an accommodation space with the first housing, wherein the second housing includes a second opening corresponding to the first opening and a glass cover disposed at the second opening. The first elastic base material is disposed on the first shell and covers the first opening. The camera module is arranged on the first elastic base material and located in the accommodation space. The first memory metal base material is disposed on the first shell and penetrates the first elastic base material to drive the first elastic base material to move, wherein the first memory metal base material exhibits a first memory deformation when at the first temperature, So that there is a first distance between the camera module and the glass cover, and when the first memory metal substrate exhibits a second memory deformation at the second temperature, there is a second distance between the camera module and the glass cover.

In an embodiment of the present disclosure, the second temperature is greater than the first temperature.

In an embodiment of the present disclosure, the second distance is greater than the first distance.

In an embodiment of the present disclosure, the electronic device further includes a heating element coupled to the first memory metal substrate to heat the first memory metal substrate.

In an embodiment of the present disclosure, the camera module includes a circuit board disposed on the first elastic base material and a camera body disposed on the circuit board.

In an embodiment of the present disclosure, the camera module further includes a microphone chip disposed on the circuit board.

In one embodiment of the present disclosure, the heating element includes an electromagnetic heater.

In an embodiment of the present disclosure, when there is a first distance between the camera module and the glass cover, the camera module has a first visual range, and when there is a second distance between the camera module and the glass cover, The camera module has a second visual range that is larger than the first visual range.

In an embodiment of the present disclosure, the electronic device further includes: a second elastic base material disposed on the second housing and covering the second opening; and a second memory metal base material disposed on the second housing and passing through the second opening. It is provided on the second elastic base material to drive the second elastic base material to move.

In an embodiment of the present disclosure, the first memory metal base material includes a plurality of memory metal wires, the first elastic base material includes a plurality of elastic wires, and the plurality of memory metal wires and the plurality of elastic wires are interlaced and braided with each other to jointly cover the first Open your mouth.

Based on the above, the electronic device of the present disclosure disposes the camera module on the elastic base material, and makes the memory metal base material penetrate into the elastic base material to drive the elastic base material to move together. In this configuration, when the memory metal substrate exhibits the first memory deformation at the first temperature, there is a first distance between the camera module and the glass cover, and the camera module has a first visible range, and when the memory metal substrate At a higher second temperature, the second memory deformation occurs, so that there is a larger second distance between the camera module and the glass cover, and the camera module has a wider second visual range. That is to say, when the electronic device of the present disclosure heats the memory metal substrate to a preset temperature higher than normal temperature, the memory metal substrate can be bent in a direction away from the glass cover to a preset deformation state, so that the camera module and the glass The distance between the covers increases, thereby increasing the viewing range of the camera module to achieve a wider angle effect. Therefore, as the preset temperature changes, the electronic device of the present disclosure can change the distance between the camera module and the glass cover, thereby allowing the camera module to have different The visual range and depth of field improve the performance and design flexibility of the camera module.

100, 100a: Electronic devices

101:First body

102:Second body

103:Display panel

104:Keyboard module

110:First shell

112:First opening

120:Second shell

122:Second opening

130, 130a: first elastic base material

140:Camera module

142:Camera body

144:Circuit board

146:Microphone chip

150, 150a: first memory metal substrate

152:Deformation Department

154: Fixed part

160:Heating element

170:Glass cover

180: Second elastic base material

190: Second memory metal substrate

D1: first distance, distance

D2: second distance, distance

D3: distance

S1: Accommodation space

V1: first visual range

V2: Second visual range

FIG. 1 is a partial cross-sectional schematic diagram of an electronic device in an initial state according to an embodiment of the present disclosure.

FIG. 2 is a partial perspective view of an electronic device according to an embodiment of the present disclosure.

FIG. 3 is a partial enlarged schematic diagram of the electronic device of FIG. 1 .

FIG. 4 is a partial cross-sectional view of an electronic device in a wide-angle state according to an embodiment of the present disclosure.

FIG. 5 is a partial side view of an electronic device in a wide-angle state according to an embodiment of the present disclosure.

FIG. 6 is a partial side view of an electronic device in a wide-angle state according to another embodiment of the present disclosure.

FIG. 7 is a partial cross-sectional view of an electronic device in an initial state according to yet another embodiment of the present disclosure.

FIG. 8 is a partially enlarged schematic diagram of the electronic device of FIG. 7 .

FIG. 9 is a partial cross-sectional view of the electronic device of FIG. 7 in a wide-angle state.

FIG. 1 shows an electronic device in an initial state according to an embodiment of the present disclosure. A partial cross-section diagram of the state. FIG. 2 is a partial perspective view of an electronic device according to an embodiment of the present disclosure. Please refer to FIGS. 1 and 2 simultaneously. In some embodiments, the electronic device 100 includes a first housing 110 , a second housing 120 , a first elastic base material 130 , a camera module 140 and a first memory metal base material 150 . In this embodiment, the electronic device 100 can be a notebook computer, but in other embodiments it can also be other electronic devices with camera modules, such as smart phones or tablet computers. The first housing 110 and the second housing 120 are assembled with each other to jointly define an accommodating space S1, and the camera module 140 is disposed in this accommodating space. In the embodiment of the present disclosure, the first housing 110 and the second housing 120 may be assembled by gluing, mechanical engagement, or integral molding, but are not limited thereto. In an embodiment in which the electronic device 100 is a notebook computer, the first housing 110 and the second housing 120 may together form the first body 101 of the electronic device 100, which may have a display panel 103, and the electronic device 100 may include a hub. The second body 102 connected to the first body 101 may have a keyboard module 104 . Of course, this embodiment is only used for illustration, and the present disclosure is not limited thereto.

In some embodiments, the first housing 110 includes a first opening 112 , and the second housing 120 includes a second opening 122 corresponding to the first opening 112 and a glass cover 170 . The second opening 122 may be located on the first body 101 The upper edge of the display side (the side where the display panel 103 is disposed), and the glass cover 170 is disposed at the second opening 122 . In this embodiment, the first elastic base material 130 is disposed on the first housing 110 and covers the first opening 112 . In this embodiment, the first elastic base material 130 may be elastic cloth or other elastic base materials. The camera module 140 can be disposed on the first elastic base material 130 and located in the accommodating space S1 by, for example, adhering.

FIG. 3 is a partial enlarged schematic diagram of the electronic device of FIG. 1 . Please refer to Figure 3. Specifically, in this embodiment, the camera module 140 may include a camera body 142 and a circuit board 144. The circuit board 144 is disposed on the first elastic base material 130, and the camera body 142 is disposed on the circuit board. 144 on. In this embodiment, the camera body 142 can be disposed on the circuit board through surface mounting technology (SMT) or other methods. In one embodiment, the camera module 140 may further include a microphone chip 146, which may also be disposed on the circuit board 144 through surface bonding technology or other methods. In this way, since the first elastic base material 130 is a sound-permeable elastic fabric, the microphone chip 146 can be disposed on the circuit board of the camera module 140 together, so that the array configuration of the microphone chip 146 can have more designs. Flexibility (such as the number of microphone chips 146, linear arrangement or circular arrangement, etc.) to achieve different directivity sound pickup effects. In this embodiment, the microphone chip 146 may include a Micro Electro Mechanical System (MEMS) microphone chip or other suitable microphone chip.

The first memory metal base material 150 is disposed on the first housing 110 and penetrates the first elastic base material 130 to drive the first elastic base material 130 to move. In one embodiment, the first memory metal substrate 150 can be in the shape of a strip or a sheet, and the first elastic substrate 130 can have a plurality of perforations as shown in FIG. 3 for the first memory metal substrate 150 to penetrate. pass.

FIG. 4 is a partial cross-sectional view of an electronic device in a wide-angle state according to an embodiment of the present disclosure. FIG. 5 is a partial side view of an electronic device in a wide-angle state according to an embodiment of the present disclosure. Please refer to Figures 1, 4 and 5. In some embodiments, the first memory metal base material 150 is disposed on the first housing 110 and penetrates the first elastic base material 130 to drive the first elastic base material. Material 130 moves together.

Generally speaking, memory metal (Shape Memory Alloys, SMA) is an alloy material that can completely eliminate its deformation at a lower temperature and restore its original shape before deformation after heating. In other words, when the memory metal undergoes a limited plastic deformation below the phase transformation temperature, it can be restored to its original shape before deformation by heating. Therefore, in this embodiment, when the first memory metal substrate 150 exhibits the first memory deformation as shown in FIG. 1 at the first temperature, the camera module 140 and the glass cover 170 have a first distance. D1, and when the first memory metal substrate 150 is at the second temperature, it exhibits the second memory deformation as shown in FIG. 4, so that there is a second distance D2 between the camera module 140 and the glass cover 170, where, The second temperature is greater than the first temperature, and the second distance D2 is greater than the first distance D1.

That is to say, the original shape of the first memory metal substrate 150 can be the deformation state shown in FIG. 3 , and the shape memory effect (SME) of the first memory metal substrate 150 can be utilized to make the memory metal After being subjected to limited plastic deformation below the phase transformation temperature, the first memory metal substrate 150 is plastically deformed to the deformation state shown in FIG. 4 , and then can be restored to the deformation state shown in FIG. 4 by heating. the deformation state shown.

In this way, when there is a first distance D1 between the camera module 140 and the glass cover 170 (or the second opening 122), the camera module 140 has a first field of view (FoV) V1. When there is a second distance D2 between the group 140 and the glass cover 170 (or the second opening 122), the camera module 140 has a second visual range V2. Since there is a large distance between the camera module 140 and the glass cover 170 , the second visual range V2 is larger than the first visual range V1 . In other words, through When the first memory metal substrate 150 is overheated to a preset temperature higher than normal temperature, the first memory metal substrate 150 can return to the deformation state as shown in FIG. 4 , so that the gap between the camera module 140 and the glass cover 170 The distance increases, thereby increasing the visual range of the camera module 140 to achieve a wider angle effect.

In some embodiments, the electronic device 100 further includes a heating element 160 coupled to the first memory metal substrate 150 to heat the first memory metal substrate 150 . In this embodiment, the heating element 160 includes an electromagnetic heater, which uses electromagnetic induction to heat an electrical conductor (such as the first memory metal substrate 150 ). The electromagnetic heater can generate eddy currents in the first memory metal substrate 150 , causing the first memory metal substrate 150 to heat up due to resistance. Specifically, the electromagnetic heater includes an electromagnet. In addition, in this embodiment, the first memory metal base material 150 may include a deformation part 152 and a fixing part 154 connected to two opposite ends of the deformation part 152 . The fixing part 154 is fixed on the first housing 110 , and the deformation part 152 can bend and deform as the temperature changes, so as to switch between the deformation state shown in FIG. 1 and the deformation state shown in FIG. 4 .

With such configuration, under normal room temperature (ie, first temperature), the first memory metal substrate 150 exhibits the first memory deformation as shown in FIG. 1 , at which time the back surface of the first memory metal substrate 150 is in contact with the first memory deformation. The outer surface of a housing 110 is substantially coplanar, and there is a first distance D1 between the camera module 140 and the glass cover 170 (or the second opening 122), so that the camera module 140 has a first visual range V1 . When the camera module 140 needs wide-angle shooting, the controller of the electronic device 100 can activate the heating element 160 to heat the first memory metal substrate 150 to a higher second temperature. At this time, the first memory metal The back surface of the substrate 150 protrudes from the first There is a larger second distance D2 between the outer surface of the housing 110 and the camera module 140 and the glass cover 170 (or the second opening 122), so that the camera module 140 has a wider second viewing range. V2.

FIG. 6 is a partial side view of an electronic device in a wide-angle state according to another embodiment of the present disclosure. Please refer to FIG. 4 and FIG. 6 . In this embodiment, the electronic device 100 further includes a second elastic base material 180 and a second memory metal base material 190 , wherein the second elastic base material 180 can be disposed on the second housing 120 and covers the second opening 122, and the second memory metal base material 190 is disposed on the second housing 120 and penetrates the second elastic base material 180 to drive the second elastic base material 180 to move together, that is, That is, with the preset temperature change, not only the position of the camera module 140 can be changed, but also the position of the glass cover 170 (or the second opening 122) can be changed, so that the camera module 140 and the glass cover 170 can be There are more different distance changes (such as distances D1, D2, D3) between the second openings 122), so that the camera module 140 can have different viewing ranges and depths of field. In this embodiment, the heating element 160 can be coupled to the first memory metal substrate 150 and the second memory metal substrate 190 to heat both at the same time. In other embodiments, the first memory metal substrate 150 And the second memory metal substrate 190 can also be coupled to respective heating elements, so that they are heated by respective heating elements.

FIG. 7 is a partial cross-sectional view of an electronic device in an initial state according to yet another embodiment of the present disclosure. FIG. 8 is a partially enlarged schematic diagram of the electronic device of FIG. 7 . FIG. 9 is a partial cross-sectional view of the electronic device of FIG. 7 in a wide-angle state. It must be noted here that the electronic device 100a of this embodiment is different from the electronic device of the previous embodiment. 100 is similar, therefore, this embodiment follows the component numbers and part of the contents of the previous embodiment, where the same numbers are used to represent the same or similar components, and descriptions of the same technical contents are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in this embodiment.

Please refer to FIGS. 7 to 9 . In some embodiments, the first memory metal substrate 150a may include a plurality of memory metal lines, and the first elastic base material 130a may include a plurality of elastic wires. In this way, the plurality of memory metal lines and Multiple elastic wires can be interlaced and braided with each other as shown in FIG. 8 to form a deformable and supportive base material to jointly cover the first opening 112 . With this configuration, under normal normal temperature (ie, first temperature), the first memory metal substrate 150a exhibits the first memory deformation as shown in FIG. 7 , and the camera module 140 and the glass cover 170 (or, the first memory deformation) There is a first distance D1 between the two openings 122), so that the camera module 140 has a first visual range V1. When the camera module 140 needs wide-angle shooting, the controller of the electronic device 100 can activate the heating element 160 to heat the first memory metal substrate 150a to a higher second temperature. At this time, the first memory metal As shown in FIG. 9 , the back surface of the base material 150 a protrudes from the outer surface of the first housing 110 , and there is a larger second distance D2 between the camera module 140 and the glass cover 170 (or the second opening 122 ). , thus allowing the camera module 140 to have a wider second visual range V2. That is to say, with the preset temperature change, not only the position of the camera module 140 can be changed, but also the position of the glass cover 170 (or the second opening 122) can be changed, so that the camera module 140 and the glass cover can be There are more different distance changes between the plates 170 (or the second opening 122), so that the camera module 140 can have different viewing ranges and depths of field.

To sum up, in the electronic device of the present disclosure, the camera module is disposed on the elastic base material, and the memory metal base material is penetrated in the elastic base material to drive the elastic base material to move together. In this configuration, when the memory metal substrate exhibits the first memory deformation at the first temperature, there is a first distance between the camera module and the glass cover (or, the second opening), and the camera module has a first visible range. , and when the memory metal substrate is at a higher second temperature, it exhibits a second memory deformation, so that there is a larger second distance between the camera module and the glass cover (or the second opening), and the camera module The group has a wider second viewing range. That is to say, when the electronic device of the present disclosure heats the memory metal substrate to a preset temperature higher than normal temperature, the memory metal substrate can be bent in a direction away from the glass cover to a preset deformation state, so that the camera module and the glass The distance between the cover plates (or second openings) is increased, thereby increasing the viewing range of the camera module to achieve a wider angle effect. Therefore, as the preset temperature changes, the electronic device of the present disclosure can change the distance between the camera module and the glass cover (or the second opening), thereby allowing the camera module to have different viewing ranges and depths of field. Improve the performance and design flexibility of camera modules.

100: Electronic devices

110:First shell

112:First opening

120:Second shell

122:Second opening

130: First elastic base material

140:Camera module

142:Camera body

144:Circuit board

150: First memory metal substrate

152:Deformation Department

154: Fixed part

160:Heating element

170:Glass cover

180: Second elastic base material

190: Second memory metal substrate

D1: first distance

S1: Accommodation space

V1: first visual range

Claims (10)

An electronic device including: a first housing including a first opening; a second housing assembled to the first housing to jointly define an accommodation space with the first housing, wherein the second housing includes a second opening corresponding to the first opening; A first elastic base material is provided on the first housing and covers the first opening; A camera module is provided on the first elastic base material and located in the accommodation space; and The first memory metal base material is disposed on the first shell and penetrates the first elastic base material to drive the first elastic base material to move. When the first memory metal base material is at a first temperature, it exhibits a second A memory deformation, so that there is a first distance between the camera module and the second opening, and when the first memory metal substrate exhibits a second memory deformation at a second temperature, so that the camera module and the third opening There is a second distance between the two openings. The electronic device of claim 1, wherein the second temperature is greater than the first temperature. The electronic device of claim 1, wherein the second distance is greater than the first distance. The electronic device of claim 1 further includes a heating element coupled to the first memory metal substrate to heat the first memory metal substrate. The electronic device of claim 1, wherein the camera module includes a circuit board disposed on the first elastic base material and a camera body disposed on the circuit board. The electronic device of claim 5, wherein the camera module further includes a microphone chip disposed on the circuit board. The electronic device of claim 1, wherein the heating element includes an electromagnetic heater. The electronic device of claim 1, wherein when there is the first distance between the camera module and the second opening, the camera module has a first visual range, and when the camera module and the second opening are When there is the second distance between them, the camera module has a second visual range that is larger than the first visual range. The electronic device as described in claim 1 further includes: A second elastic base material is disposed on the second housing and covers the second opening; and The second memory metal base material is disposed on the second housing and penetrates the second elastic base material to drive the second elastic base material to move. The electronic device of claim 1, wherein the first memory metal substrate includes a plurality of memory metal lines, the first elastic base material includes a plurality of elastic wires, and the plurality of memory metal lines and the plurality of elastic wires are mutually exclusive. The braids are interlaced to collectively cover the first opening.