TWI830608B - Generic interface system and control method thereof - Google Patents

Generic interface system and control method thereof Download PDF

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TWI830608B
TWI830608B TW112106555A TW112106555A TWI830608B TW I830608 B TWI830608 B TW I830608B TW 112106555 A TW112106555 A TW 112106555A TW 112106555 A TW112106555 A TW 112106555A TW I830608 B TWI830608 B TW I830608B
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pin
electronic device
external electronic
power supply
module
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TW112106555A
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吳永瀧
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神雲科技股份有限公司
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Abstract

A generic interface system and its control method are disclosed. The generic interface system comprises a transmission interface, a power supply module, a power switch module, a first control module, a detection module, and a second control module. The transmission interface is configured to send a first power and a second power to an external electronic device, and receive a first answer signal, a second answer signal, and a third answer signal sent by the external electronic device. The power supply module is configured to generate the first power and the second power. The power switch module is configured to turn-on the line between the transmission interface and the power supply module according to a control signal. The first control module is configured to generate the control signal to control the power switch module. The detection module is configured to receive the first answer signal, and detect whether the external electronic device exists according to the first answer signal.

Description

通用介面系統及其控制方法Universal interface system and control method

本發明係有關固態硬碟,特別是有關一種適於固態硬碟的通用介面系統及其控制方法。The present invention relates to solid state hard disks, and in particular to a universal interface system suitable for solid state hard disks and a control method thereof.

NF1固態硬碟(SSD)是三星電子於2017年針對新世代數據中心所推出之固態硬碟規格。起初NF1被稱為次世代小尺寸規格(Next Generation Small Form Factor,NGSFF),後來俗稱M.3,目前則定名為NF1。三星電子推出NF1固態硬碟的主要目的是在固態硬碟之體積與容量之間取得最佳的平衡點,進而建構出具有最佳品質及最高效能的固態硬碟。NF1 solid state drive (SSD) is a solid state drive specification launched by Samsung Electronics in 2017 for new generation data centers. At first, NF1 was called Next Generation Small Form Factor (NGSFF), later it was commonly known as M.3, and it is currently named NF1. The main purpose of Samsung Electronics' NF1 SSD is to achieve the best balance between the size and capacity of the SSD, thereby creating a SSD with the best quality and highest performance.

相較於傳統的M.2固態硬碟,NF1固態硬碟包含三個優勢:一是NF1固態硬碟具有較大的印刷電路板(PCB)面積以設置更多的快閃記憶體(Flash memory),使得NF1固態硬碟之容量可以達到M.2固態硬碟之容量的2至4倍多;二是NF1固態硬碟沿用M.2固態硬碟的連接器結構,並新增了企業用固態硬碟的功能(例如雙通道選項、12伏特電源供應及電源關閉功能等);三是NF1固態硬碟支援熱插拔(Hot swap)功能。Compared with traditional M.2 solid-state drives, NF1 solid-state drives have three advantages: First, NF1 solid-state drives have a larger printed circuit board (PCB) area to accommodate more flash memory (Flash memory). ), so that the capacity of NF1 solid-state drive can reach more than 2 to 4 times that of M.2 solid-state drive; secondly, NF1 solid-state drive follows the connector structure of M.2 solid-state drive, and adds enterprise use The functions of the solid-state drive (such as dual-channel options, 12-volt power supply and power-off function, etc.); third, the NF1 solid-state drive supports hot swap function.

由於NF1固態硬碟沿用M.2固態硬碟的連接器結構,NF1固態硬碟可以被插入至僅支援M.2固態硬碟之系統,且M.2固態硬碟亦可以被插入至僅支援NF1固態硬碟之系統。然而,由於M.2固態硬碟與NF1固態硬碟之間的引腳定義不同,當M.2固態硬碟被插入至僅支援NF1固態硬碟之系統時,僅支援NF1固態硬碟之系統中的高壓電源會導致M.2固態硬碟的損壞;反之,當NF1固態硬碟被插入至僅支援M.2固態硬碟之系統時,NF1固態硬碟並不會受到高壓電源的影響而導致損壞。Since NF1 SSDs follow the connector structure of M.2 SSDs, NF1 SSDs can be inserted into systems that only support M.2 SSDs, and M.2 SSDs can also be inserted into systems that only support M.2 SSDs. NF1 solid state drive system. However, due to the different pin definitions between M.2 SSDs and NF1 SSDs, when an M.2 SSD is inserted into a system that only supports NF1 SSDs, the system that only supports NF1 SSDs will The high-voltage power supply in the M.2 solid-state drive will cause damage to the M.2 solid-state drive; conversely, when the NF1 solid-state drive is inserted into a system that only supports M.2 solid-state drives, the NF1 solid-state drive will not be affected by the high-voltage power supply. cause damage.

有鑑於此,本發明提出一種通用介面系統,包含:一傳輸介面,用以發送一第一電源及一第二電源至一外部電子裝置,並接收所述外部電子裝置所發送之一第一應答訊號、一第二應答訊號及一第三應答訊號;一供電模組,電性連接於所述傳輸介面,用以產生所述第一電源及所述第二電源;一電源開關模組,設置於所述傳輸介面與所述供電模組之間,用以根據一控制訊號而選擇性地導通所述傳輸介面與所述供電模組之間的線路;一第一控制模組,電性連接於所述傳輸介面及所述電源開關模組,用以產生所述控制訊號而控制所述電源開關模組,以及用以所述第一控制模組更用以執行所述外部電子裝置之韌體;一偵測模組,電性連接於所述傳輸介面及所述第一控制模組,用以偵測所述第一應答訊號以判斷所述外部電子裝置是否存在,以及用以偵測所述第二應答訊號及所述第三應答訊號以判斷所述外部電子裝置是否為一固態硬碟,其中所述固態硬碟係選自NF1固態硬碟或M.2固態硬碟;以及一第二控制模組,電性連接於所述第一控制模組,用以儲存所述外部電子裝置之韌體。In view of this, the present invention proposes a universal interface system, including: a transmission interface for sending a first power supply and a second power supply to an external electronic device, and receiving a first response sent by the external electronic device. signal, a second response signal and a third response signal; a power supply module electrically connected to the transmission interface for generating the first power supply and the second power supply; a power switch module configured Between the transmission interface and the power supply module, it is used to selectively conduct the line between the transmission interface and the power supply module according to a control signal; a first control module, electrically connected The transmission interface and the power switch module are used to generate the control signal to control the power switch module, and the first control module is further used to execute the firmware of the external electronic device. body; a detection module, electrically connected to the transmission interface and the first control module, for detecting the first response signal to determine whether the external electronic device exists, and for detecting The second response signal and the third response signal are used to determine whether the external electronic device is a solid state drive, wherein the solid state drive is selected from an NF1 solid state drive or an M.2 solid state drive; and a The second control module is electrically connected to the first control module and is used to store the firmware of the external electronic device.

在一些實施例中,所述偵測模組電性連接於所述傳輸介面之一第五十二個引腳(PIN52)。In some embodiments, the detection module is electrically connected to the fifty-second pin (PIN52) of the transmission interface.

在一些實施例中,所述偵測模組電性連接於所述傳輸介面之一第六個引腳(PIN6)及一第二十六個引腳(PIN26)。In some embodiments, the detection module is electrically connected to a sixth pin (PIN6) and a twenty-sixth pin (PIN26) of the transmission interface.

在一些實施例中,所述第一電源之電壓值為3.3伏特。In some embodiments, the voltage value of the first power supply is 3.3 volts.

在一些實施例中,當所述偵測模組偵測所述外部電子裝置為M.2固態硬碟時,所述第一電源係透過所述傳輸介面之一第二個引腳(PIN2)、一第四個引腳(PIN4)、一第十二個引腳(PIN12)、一第十四個引腳(PIN14)、一第十六個引腳(PIN16)、一第十八個引腳(PIN18)、一第七十個引腳(PIN70)、一第七十二個引腳(PIN72)及一第七十四個引腳(PIN74)傳輸至所述外部電子裝置。In some embodiments, when the detection module detects that the external electronic device is an M.2 solid state drive, the first power supply is through a second pin (PIN2) of the transmission interface , - the fourth pin (PIN4), - the twelfth pin (PIN12), - the fourteenth pin (PIN14), - the sixteenth pin (PIN16), - the eighteenth pin pin (PIN18), a seventieth pin (PIN70), a seventy-second pin (PIN72) and a seventy-fourth pin (PIN74) are transmitted to the external electronic device.

在一些實施例中,當所述偵測模組偵測所述外部電子裝置為NF1固態硬碟時,所述第二電源係透過所述傳輸介面之一第三十個引腳(PIN30)、一第三十二個引腳(PIN32)、一第三十四個引腳(PIN34)及一第三十六個引腳(PIN36)發送至所述外部電子裝置,且所述第二電源之電壓值為12伏特。In some embodiments, when the detection module detects that the external electronic device is an NF1 solid state drive, the second power supply is through one of the thirtieth pin (PIN30) of the transmission interface. A thirty-second pin (PIN32), a thirty-fourth pin (PIN34) and a thirty-sixth pin (PIN36) are sent to the external electronic device, and the second power supply The voltage value is 12 volts.

本發明另提出一種通用介面系統控制方法,包含:發送一第一電源;偵測一第一應答訊號以判斷一外部電子裝置是否存在,其中所述第一應答訊號係由所述外部電子裝置所發送;當所述外部電子裝置存在時,偵測所述外部電子裝置所發送之一第二應答訊號及一第三應答訊號以判斷所述外部電子裝置是否為一固態硬碟,其中所述固態硬碟係選自NF1固態硬碟或M.2固態硬碟;以及當所述外部電子裝置為固態硬碟時,執行所述外部電子裝置之韌體並控制一電源開關模組導通,使得所述第一電源或一第二電源發送至所述外部電子裝置。The present invention also proposes a universal interface system control method, which includes: sending a first power supply; detecting a first response signal to determine whether an external electronic device exists, wherein the first response signal is received by the external electronic device. Send; when the external electronic device exists, detect a second response signal and a third response signal sent by the external electronic device to determine whether the external electronic device is a solid-state hard drive, wherein the solid-state drive The hard drive is selected from NF1 solid state drive or M.2 solid state drive; and when the external electronic device is a solid state drive, execute the firmware of the external electronic device and control a power switch module to conduct, so that all The first power supply or a second power supply is sent to the external electronic device.

請參照圖1,圖1是本發明之一實施例中,通用介面系統10的模組方塊圖。在一些實施例中,通用介面系統10為一電腦系統、一伺服器系統中的一主機板、一背板(Backplane)或一豎卡(Riser Card)等具有可供固態硬碟插設之插槽的電路板,不以此為限。如圖1所示,通用介面系統10包含一傳輸介面100、一供電模組110、一電源開關模組120、一第一控制模組130、一偵測模組140以及一第二控制模組150,其中供電模組110電耦接於傳輸介面100,電源開關模組120設置於傳輸介面100與供電模組110之間,第一控制模組130電性連接於傳輸介面100及電源開關模組120,偵測模組140電性連接於傳輸介面100及第一控制模組130,第二控制模組150電性連接於第一控制模組130。以下將詳細解釋傳輸介面100、供電模組110、電源開關模組120、第一控制模組130、偵測模組140以及第二控制模組150各自的結構與功能,並說明彼此間的設置方式。Please refer to FIG. 1 , which is a module block diagram of the universal interface system 10 in one embodiment of the present invention. In some embodiments, the universal interface system 10 is a computer system, a motherboard in a server system, a backplane or a riser card, etc., which has a slot for inserting a solid state drive. Slotted circuit boards are not limited to this. As shown in Figure 1, the universal interface system 10 includes a transmission interface 100, a power supply module 110, a power switch module 120, a first control module 130, a detection module 140 and a second control module 150. The power supply module 110 is electrically coupled to the transmission interface 100, the power switch module 120 is disposed between the transmission interface 100 and the power supply module 110, and the first control module 130 is electrically connected to the transmission interface 100 and the power switch module. In group 120, the detection module 140 is electrically connected to the transmission interface 100 and the first control module 130, and the second control module 150 is electrically connected to the first control module 130. The structure and function of the transmission interface 100, the power supply module 110, the power switch module 120, the first control module 130, the detection module 140 and the second control module 150 will be explained in detail below, and the settings of each other will also be described. Way.

傳輸介面100用以傳送一第一電源V1及一第二電源V2至一外部電子裝置以提供所述外部電子裝置運作所需的電力,並接收所述外部電子裝置所傳送之一第一應答訊號Van1、一第二應答訊號Van2及一第三應答訊號Van3。在一些實施例中,通用介面系統10之傳輸介面100符合M.2固態硬碟之連接器結構(例如適於M.2固態硬碟之金手指插槽)。因此,具有相對應之M.2固態硬碟之連接器結構的所述外部電子裝置(例如具有M.2固態硬碟之金手指的M.2固態硬碟或NF1固態硬碟)係可選擇性地電性連接於通用介面系統10,例如插設於通用介面系統10上。The transmission interface 100 is used to transmit a first power source V1 and a second power source V2 to an external electronic device to provide power required for the operation of the external electronic device, and receive a first response signal sent by the external electronic device. Van1, a second response signal Van2 and a third response signal Van3. In some embodiments, the transmission interface 100 of the universal interface system 10 conforms to the connector structure of the M.2 solid-state drive (for example, a gold finger slot suitable for the M.2 solid-state drive). Therefore, the external electronic device with a corresponding connector structure of the M.2 solid state drive (such as an M.2 solid state drive or an NF1 solid state drive with a golden finger of the M.2 solid state drive) can be selected electrically connected to the universal interface system 10 , for example, plugged into the universal interface system 10 .

請同時參照圖2A及圖2B,圖2A及圖2B是本發明之一實施例中,M.2固態硬碟及NF1固態硬碟的引腳定義圖。如圖2A及圖2B所示,M.2固態硬碟之連接器結構及NF1固態硬碟之連接器結構皆包含七十五個引腳。其中,M.2固態硬碟及NF1固態硬碟中每一個引腳所定義的功能略有不同。以第七十四個引腳(PIN74)為例,M.2固態硬碟之PIN74用以傳輸3.3伏特之訊號,NF1固態硬碟之PIN74則未定義功能(N/C)。Please refer to FIGS. 2A and 2B at the same time. FIGS. 2A and 2B are pin definition diagrams of M.2 solid-state drives and NF1 solid-state drives in one embodiment of the present invention. As shown in Figure 2A and Figure 2B, the connector structure of the M.2 solid-state drive and the connector structure of the NF1 solid-state drive both include seventy-five pins. Among them, the functions defined by each pin in M.2 solid-state drives and NF1 solid-state drives are slightly different. Taking the seventy-fourth pin (PIN74) as an example, PIN74 of the M.2 solid-state drive is used to transmit a 3.3-volt signal, while PIN74 of the NF1 solid-state drive has an undefined function (N/C).

供電模組110用以產生第一電源V1及第二電源V2。在一些實施例中,供電模組110用以提供通用介面系統10中各電路之用電,並提供所述外部電子裝置之用電,其中第一電源V1及第二電源V2即為所述外部電子裝置之用電。在一些實施例中,第一電源V1之電壓值為3.3伏特,其中3.3伏特為M.2固態硬碟之工作電壓(Operating voltage)。在一些實施例中,第二電源V2之電壓值為12伏特,其中12伏特為NF1固態硬碟之工作電壓。The power supply module 110 is used to generate the first power supply V1 and the second power supply V2. In some embodiments, the power supply module 110 is used to provide power for each circuit in the universal interface system 10 and to provide power for the external electronic device, wherein the first power supply V1 and the second power supply V2 are the external electronic devices. Electricity consumption of electronic devices. In some embodiments, the voltage value of the first power supply V1 is 3.3 volts, where 3.3 volts is the operating voltage (Operating voltage) of the M.2 solid state drive. In some embodiments, the voltage value of the second power supply V2 is 12 volts, where 12 volts is the operating voltage of the NF1 solid state drive.

電源開關模組120用以根據一控制訊號Vc而選擇性地導通傳輸介面100與供電模組110之間的線路。請參照圖3,圖3是本發明之一實施例中,電源開關模組120的電路示意圖。如圖3所示,電源開關模組120包含複數開關Q1、Q2。其中,開關Q1係設置於傳輸介面100之電源引腳組Spp與供電模組110之間,開關Q2係設置於傳輸介面100之複數引腳101、102、103、104與供電模組110之間。在一些實施例中,電源引腳組Spp包含傳輸介面100之一第二個引腳(PIN2)、一第四個引腳(PIN4)、一第十二個引腳(PIN12)、一第十四個引腳(PIN14)、一第十六個引腳(PIN16)、一第十八個引腳(PIN18)、一第七十個引腳(PIN70)、一第七十二個引腳(PIN72)及一第七十四個引腳(PIN74)。The power switch module 120 is used to selectively conduct the line between the transmission interface 100 and the power supply module 110 according to a control signal Vc. Please refer to FIG. 3 , which is a schematic circuit diagram of the power switch module 120 in one embodiment of the present invention. As shown in FIG. 3 , the power switch module 120 includes a plurality of switches Q1 and Q2. Among them, the switch Q1 is set between the power pin group Spp of the transmission interface 100 and the power supply module 110, and the switch Q2 is set between the plurality of pins 101, 102, 103, 104 of the transmission interface 100 and the power supply module 110. . In some embodiments, the power pin group Spp includes a second pin (PIN2), a fourth pin (PIN4), a twelfth pin (PIN12), a tenth pin of the transmission interface 100 Four pins (PIN14), one sixteenth pin (PIN16), one eighteenth pin (PIN18), one seventieth pin (PIN70), one seventy-second pin ( PIN72) and one seventy-fourth pin (PIN74).

在一些實施例中,開關Q1用以控制第一電源V1之供應。當開關Q1導通時,開關Q1電性連接於第一電源V1,此時供電模組110係可提供第一電源V1至電源引腳組Spp中的所有引腳。當開關Q1不導通時,開關Q1未電性連接於第一電源V1,此時供電模組110係無法提供第一電源V1至電源引腳組Spp中的所有引腳。In some embodiments, the switch Q1 is used to control the supply of the first power supply V1. When the switch Q1 is turned on, the switch Q1 is electrically connected to the first power supply V1. At this time, the power supply module 110 can provide the first power supply V1 to all pins in the power pin group Spp. When the switch Q1 is not conducting, the switch Q1 is not electrically connected to the first power supply V1. At this time, the power supply module 110 is unable to provide the first power supply V1 to all the pins in the power pin group Spp.

在一些實施例中,開關Q2用以控制第二電源V2之供應。當開關Q2導通時,供電模組110係可提供第二電源V2至傳輸介面100之複數引腳101、102、103、104;當開關Q2不導通時,供電模組110係無法提供第二電源V2至傳輸介面100之複數引腳101、102、103、104。In some embodiments, the switch Q2 is used to control the supply of the second power supply V2. When the switch Q2 is turned on, the power supply module 110 can provide the second power supply V2 to the plurality of pins 101, 102, 103, and 104 of the transmission interface 100; when the switch Q2 is not turned on, the power supply module 110 cannot provide the second power supply. V2 is connected to the plurality of pins 101, 102, 103, and 104 of the transmission interface 100.

第一控制模組130用以產生控制訊號Vc而控制電源開關模組120。如圖3所示,控制訊號Vc包含一第一控制訊號Vc1及一第二控制訊號Vc2。在一些實施例中,第一控制訊號Vc1用以控制開關Q1,第二控制訊號Vc2用以控制開關Q2。其中,當第一控制訊號Vc1為一第一邏輯位準訊號時,開關Q1係導通而使得第一電源V1可以被提供至傳輸介面100;當第一控制訊號Vc1為一第二邏輯位準訊號時,開關Q1係不導通而使得第一電源V1無法被提供至傳輸介面100。其中,當第二控制訊號Vc2之電壓值處於所述第一邏輯位準訊號時,開關Q2係導通而使得第二電源V2可以被提供至傳輸介面100;當第二控制訊號Vc2之電壓值處於所述第二邏輯位準訊號時,開關Q2係不導通而使得第二電源V2無法被提供至傳輸介面100。The first control module 130 is used to generate the control signal Vc to control the power switch module 120 . As shown in FIG. 3, the control signal Vc includes a first control signal Vc1 and a second control signal Vc2. In some embodiments, the first control signal Vc1 is used to control the switch Q1, and the second control signal Vc2 is used to control the switch Q2. Among them, when the first control signal Vc1 is a first logic level signal, the switch Q1 is turned on so that the first power V1 can be provided to the transmission interface 100; when the first control signal Vc1 is a second logic level signal At this time, the switch Q1 is not conductive so that the first power supply V1 cannot be provided to the transmission interface 100 . Wherein, when the voltage value of the second control signal Vc2 is at the first logic level signal, the switch Q2 is turned on so that the second power V2 can be provided to the transmission interface 100; when the voltage value of the second control signal Vc2 is at When the second logic level signal is present, the switch Q2 is not conductive, so that the second power supply V2 cannot be provided to the transmission interface 100 .

在一些實施例中,開關Q1及開關Q2皆由第一控制訊號Vc1所控制。其中,當第一控制訊號Vc1為所述第一邏輯位準訊號時,開關Q1係導通且開關Q2係不導通;當第一控制訊號Vc1為所述第二邏輯位準訊號時,開關Q1係不導通且開關Q2係導通。In some embodiments, both the switch Q1 and the switch Q2 are controlled by the first control signal Vc1. Wherein, when the first control signal Vc1 is the first logic level signal, the switch Q1 is turned on and the switch Q2 is not turned on; when the first control signal Vc1 is the second logic level signal, the switch Q1 is turned on. There is no conduction and switch Q2 is conductive.

在一些實施例中,開關Q1及開關Q2皆由第二控制訊號Vc2所控制。其中,當第二控制訊號Vc2為所述第一邏輯位準訊號時,開關Q1係不導通且開關Q2係導通;當第二控制訊號Vc2為所述第二邏輯位準訊號時,開關Q1係導通且開關Q2係不導通。In some embodiments, both the switch Q1 and the switch Q2 are controlled by the second control signal Vc2. Wherein, when the second control signal Vc2 is the first logic level signal, the switch Q1 is not turned on and the switch Q2 is turned on; when the second control signal Vc2 is the second logic level signal, the switch Q1 is turned on. is turned on and switch Q2 is not turned on.

在一些實施例中,所述第一邏輯位準訊號為代表1之一高邏輯位準訊號(例如為3.3伏特,也可以是5伏特或12伏特等其他電壓位準,不以此為限),且所述第二邏輯位準訊號為代表0之一低邏輯位準訊號(例如為0伏特,也可以是0.1伏特或0.5伏特等其他電壓位準,不以此為限)。在另一些實施例中,所述第一邏輯位準訊號為所述低邏輯位準訊號,且所述第二邏輯位準訊號為所述高邏輯位準訊號。In some embodiments, the first logic level signal is a high logic level signal representing 1 (for example, 3.3 volts, or other voltage levels such as 5 volts or 12 volts, but is not limited thereto) , and the second logic level signal is a low logic level signal representing 0 (for example, 0 volts, or other voltage levels such as 0.1 volts or 0.5 volts, but is not limited to this). In other embodiments, the first logic level signal is the low logic level signal, and the second logic level signal is the high logic level signal.

偵測模組140用以偵測第一應答訊號Van1以判斷所述外部電子裝置是否存在,也就是偵測判斷是否有所述外部電子裝置經由傳輸介面100電性連接於通用介面系統10。此外,偵測模組140更用以偵測第二應答訊號Van2及第三應答訊號Van3以更進一步的判斷經由傳輸介面100電性連接於通用介面系統10的所述外部電子裝置是否為固態硬碟,其中所述固態硬碟係選自NF1固態硬碟或M.2固態硬碟。請參照圖4,圖4是本發明之一實施例中,偵測模組140的電路示意圖。如圖4所示,在一些實施例中,偵測模組140包含複數電阻器R1、R2、R3及一邏輯模組141。其中,電阻器R1係設置於引腳105與第一控制模組130之間,電阻器R2係設置於引腳106與邏輯模組141之間,電阻器R3係設置於引腳107與邏輯模組141之間,邏輯模組141係設置於電阻器R2、R3與第一控制模組130之間。在一些實施例中,邏輯模組141例如為但不限於及閘、反及閘、比較器、其他邏輯元件或是以上邏輯元件之其中至少二者之組合。The detection module 140 is used to detect the first response signal Van1 to determine whether the external electronic device exists, that is, to detect and determine whether the external electronic device is electrically connected to the universal interface system 10 through the transmission interface 100 . In addition, the detection module 140 is further used to detect the second response signal Van2 and the third response signal Van3 to further determine whether the external electronic device electrically connected to the universal interface system 10 through the transmission interface 100 is a solid-state hard drive. disk, wherein the solid state drive is selected from NF1 solid state drive or M.2 solid state drive. Please refer to FIG. 4 , which is a schematic circuit diagram of the detection module 140 in one embodiment of the present invention. As shown in FIG. 4 , in some embodiments, the detection module 140 includes complex resistors R1, R2, R3 and a logic module 141. Among them, the resistor R1 is set between the pin 105 and the first control module 130, the resistor R2 is set between the pin 106 and the logic module 141, and the resistor R3 is set between the pin 107 and the logic module. Between the groups 141, the logic module 141 is disposed between the resistors R2, R3 and the first control module 130. In some embodiments, the logic module 141 is, for example, but not limited to, an AND gate, an NAND gate, a comparator, other logic elements, or a combination of at least two of the above logic elements.

在一些實施例中,偵測模組140透過電阻器R1偵測第一應答訊號Van1以判斷所述外部電子裝置是否存在,透過電阻器R2、R3以分別拉引第二應答訊號Van2及第三應答訊號Van3,並透過邏輯模組141偵測第二應答訊號Van2及第三應答訊號Van3以判斷所述外部電子裝置是否為M.2固態硬碟或NF1固態硬碟。在一些實施例中,邏輯模組141具有二個輸入端及一個輸出端,其中邏輯模組141之一輸入端電性連接於電阻器R2,邏輯模組141之另一輸入端電性連接於電阻器R3,邏輯模組141之輸出端電性連接於第一控制模組130。當所述二個輸入端所接收之訊號皆為一第三邏輯位準訊號時,所述輸出端係輸出一第四邏輯位準訊號(對應偵測訊號Vd);當所述二個輸入端所接收之訊號中至少有一個為一第五邏輯位準訊號時,所述輸出端係輸出一第六邏輯位準訊號(對應偵測訊號Vd)。In some embodiments, the detection module 140 detects the first response signal Van1 through the resistor R1 to determine whether the external electronic device exists, and pulls the second response signal Van2 and the third response signal Van2 through the resistors R2 and R3 respectively. The response signal Van3 is detected through the logic module 141 to detect the second response signal Van2 and the third response signal Van3 to determine whether the external electronic device is an M.2 solid state drive or an NF1 solid state drive. In some embodiments, the logic module 141 has two input terminals and one output terminal. One input terminal of the logic module 141 is electrically connected to the resistor R2, and the other input terminal of the logic module 141 is electrically connected to the resistor R2. Resistor R3, the output terminal of the logic module 141 is electrically connected to the first control module 130. When the signals received by the two input terminals are both a third logic level signal, the output terminal outputs a fourth logic level signal (corresponding to the detection signal Vd); when the two input terminals When at least one of the received signals is a fifth logic level signal, the output terminal outputs a sixth logic level signal (corresponding to the detection signal Vd).

在一些實施例中,當邏輯模組141例如為及閘時,所述第三邏輯位準訊號為代表1之高邏輯位準訊號,所述第四邏輯位準訊號為代表1之高邏輯位準訊號,所述第五邏輯位準訊號為代表0之低邏輯位準訊號,所述第六邏輯位準訊號為所述低邏輯位準訊號。也就是說,當所述二個輸入端所接收之訊號皆為所述高邏輯位準訊號時,所述輸出端係輸出所述高邏輯位準訊號;當所述二個輸入端所接收之訊號中至少有一個為所述低邏輯位準訊號時,所述輸出端係輸出所述低邏輯位準訊號。In some embodiments, when the logic module 141 is, for example, an AND gate, the third logic level signal is a high logic level signal representing 1, and the fourth logic level signal is a high logic bit representing 1. The fifth logic level signal is a low logic level signal representing 0, and the sixth logic level signal is the low logic level signal. That is to say, when the signals received by the two input terminals are both the high logic level signal, the output terminal outputs the high logic level signal; when the signals received by the two input terminals are When at least one of the signals is the low logic level signal, the output terminal outputs the low logic level signal.

在一些實施例中,當邏輯模組141例如為反及閘時,所述第三邏輯位準訊號為所述高邏輯位準訊號,所述第四邏輯位準訊號為所述低邏輯位準訊號,所述第五邏輯位準訊號為所述低邏輯位準訊號,所述第六邏輯位準訊號為所述高邏輯位準訊號。也就是說,當所述二個輸入端所接收之訊號皆為所述高邏輯位準訊號時,所述輸出端係輸出所述低邏輯位準訊號;當所述二個輸入端所接收之訊號中至少有一個為所述低邏輯位準訊號時,所述輸出端係輸出所述高邏輯位準訊號。In some embodiments, when the logic module 141 is, for example, an NAND gate, the third logic level signal is the high logic level signal, and the fourth logic level signal is the low logic level. signal, the fifth logic level signal is the low logic level signal, and the sixth logic level signal is the high logic level signal. That is to say, when the signals received by the two input terminals are both the high logic level signal, the output terminal outputs the low logic level signal; when the signals received by the two input terminals are When at least one of the signals is the low logic level signal, the output terminal outputs the high logic level signal.

需注意的是,以下係以及閘為例來說明邏輯模組141之功能,進而解釋偵測模組140之運作。It should be noted that the following is a AND gate as an example to illustrate the function of the logic module 141 and further explain the operation of the detection module 140 .

在一些實施例中,引腳105係為傳輸介面100之第五十二個引腳(PIN52),其中第一應答訊號Van1係為圖2B中傳輸介面100之PIN52所傳輸之訊號。請參照表1,表1是本發明之一實施例中,M.2固態硬碟及NF1固態硬碟中PIN52、PIN26、PIN6的定義表(對應圖2B)。如表1所示,M.2固態硬碟之PIN52用以傳輸一高邏輯位準訊號,而NF1固態硬碟之PIN52亦用以傳輸一高邏輯位準訊號。因此,在一些實施例中,當偵測模組140偵測到傳輸介面100之PIN52所傳輸之訊號(即第一應答訊號Van1)為一高邏輯位準訊號時,代表所述外部電子裝置對於通用介面系統10而言係存在。也就是說,所述外部電子裝置係電性連接於通用介面系統10,例如插設於通用介面系統10上,或透過電纜線電性連接該傳輸介面100,進而電性連接該通用介面系統10。當偵測模組140並未偵測到傳輸介面100之PIN52所傳輸之任何訊號時,代表所述外部電子裝置對於通用介面系統10而言係不存在。也就是說,所述外部電子裝置係未直接或間接的電性連接於通用介面系統10,例如未電性連接於/插設於通用介面系統10上。 [表1] PIN NF1固態硬碟 M.2固態硬碟 52 高邏輯位準訊號 高邏輯位準訊號 26 低邏輯位準訊號 高邏輯位準訊號 6 低邏輯位準訊號 高邏輯位準訊號 In some embodiments, pin 105 is the fifty-second pin (PIN52) of the transmission interface 100, and the first response signal Van1 is the signal transmitted by PIN52 of the transmission interface 100 in Figure 2B. Please refer to Table 1. Table 1 is a definition table of PIN52, PIN26, and PIN6 in M.2 solid-state drives and NF1 solid-state drives in one embodiment of the present invention (corresponding to Figure 2B). As shown in Table 1, PIN52 of the M.2 SSD is used to transmit a high logic level signal, and PIN52 of the NF1 SSD is also used to transmit a high logic level signal. Therefore, in some embodiments, when the detection module 140 detects that the signal transmitted by PIN52 of the transmission interface 100 (ie, the first response signal Van1) is a high logic level signal, it means that the external electronic device is Universal Interface System 10 exists. That is to say, the external electronic device is electrically connected to the universal interface system 10 , such as being inserted into the universal interface system 10 , or electrically connected to the transmission interface 100 through a cable, and then electrically connected to the universal interface system 10 . When the detection module 140 does not detect any signal transmitted by the PIN 52 of the transmission interface 100 , it means that the external electronic device does not exist for the universal interface system 10 . That is to say, the external electronic device is not directly or indirectly electrically connected to the universal interface system 10 , for example, it is not electrically connected to/plugged into the universal interface system 10 . [Table 1] PIN NF1 solid state drive M.2 SSD 52 High logic level signal High logic level signal 26 low logic level signal High logic level signal 6 low logic level signal High logic level signal

在一些實施例中,引腳106係為傳輸介面100之第二十六個引腳(PIN26),引腳107係為傳輸介面100之第六個引腳(PIN6),其中第二應答訊號Van2係為圖2B中傳輸介面100之PIN26所傳輸之訊號,第三應答訊號Van3係為圖2B中傳輸介面100之PIN6所傳輸之訊號。如表1所示,NF1固態硬碟之PIN26用以傳輸一低邏輯位準訊號,而M.2固態硬碟之PIN26用以傳輸一高邏輯位準訊號;NF1固態硬碟之PIN6用以傳輸一低邏輯位準訊號,而M.2固態硬碟之PIN6用以傳輸一高邏輯位準訊號。因此,在一些實施例中,當所述外部電子裝置為NF1固態硬碟時,第二應答訊號Van2為一低邏輯位準訊號且第三應答訊號Van3亦為一低邏輯位準訊號,此時邏輯模組141係根據第二應答訊號Van2及第三應答訊號Van3而輸出一低邏輯位準之偵測訊號Vd;當所述外部電子裝置為M.2固態硬碟時,第二應答訊號Van2為一高邏輯位準訊號且第三應答訊號Van3亦為一高邏輯位準訊號,此時邏輯模組141係根據第二應答訊號Van2及第三應答訊號Van3而輸出一高邏輯位準之偵測訊號Vd。換句話說,當邏輯模組141所輸出之偵測訊號Vd為一低邏輯位準訊號時,代表所述外部電子裝置為NF1固態硬碟;當邏輯模組141所輸出之偵測訊號Vd為一高邏輯位準訊號時,代表所述外部電子裝置為M.2固態硬碟。In some embodiments, pin 106 is the twenty-sixth pin (PIN26) of the transmission interface 100, and pin 107 is the sixth pin (PIN6) of the transmission interface 100, wherein the second response signal Van2 It is the signal transmitted by PIN26 of the transmission interface 100 in Figure 2B. The third response signal Van3 is the signal transmitted by PIN6 of the transmission interface 100 in Figure 2B. As shown in Table 1, PIN26 of the NF1 SSD is used to transmit a low logic level signal, while PIN26 of the M.2 SSD is used to transmit a high logic level signal; PIN6 of the NF1 SSD is used to transmit A low logic level signal, while PIN6 of the M.2 solid state drive is used to transmit a high logic level signal. Therefore, in some embodiments, when the external electronic device is an NF1 solid state drive, the second response signal Van2 is a low logic level signal and the third response signal Van3 is also a low logic level signal. At this time The logic module 141 outputs a low logic level detection signal Vd according to the second response signal Van2 and the third response signal Van3; when the external electronic device is an M.2 solid state drive, the second response signal Van2 is a high logic level signal and the third response signal Van3 is also a high logic level signal. At this time, the logic module 141 outputs a high logic level signal based on the second response signal Van2 and the third response signal Van3. Test signal Vd. In other words, when the detection signal Vd output by the logic module 141 is a low logic level signal, it means that the external electronic device is an NF1 solid state drive; when the detection signal Vd output by the logic module 141 is A high logic level signal indicates that the external electronic device is an M.2 solid state drive.

第二控制模組150用以儲存所述外部電子裝置之韌體。如前所述,具有相對應之M.2固態硬碟之連接器結構的所述外部電子裝置(例如M.2固態硬碟或NF1固態硬碟)係可插設於具有M.2固態硬碟之連接器結構的通用介面系統10之傳輸介面100上。然而,通用介面系統10中必須存有所述外部電子裝置之韌體,方能支援所述外部電子裝置之功能。以M.2固態硬碟為例,由於M.2固態硬碟具有第二代通用序列匯流排(USB 2.0)之功能,通用介面系統10中必須存有USB 2.0之韌體方能支援M.2固態硬碟。又以NF1固態硬碟為例,由於NF1固態硬碟具有雙通道選項之功能,通用介面系統10中必須存有雙通道選項之韌體方能支援NF1固態硬碟。因此,在一些實施例中,當所述外部電子裝置電性連接於通用介面系統10時,第一控制模組130係執行儲存於第二控制模組150中所述外部電子裝置之韌體,使得通用介面系統10支援所述外部電子裝置之功能。The second control module 150 is used to store the firmware of the external electronic device. As mentioned above, the external electronic device (such as M.2 solid state drive or NF1 solid state drive) with the corresponding M.2 solid state drive connector structure can be plugged into the M.2 solid state drive. The transmission interface 100 of the universal interface system 10 of the disk connector structure. However, the universal interface system 10 must have the firmware of the external electronic device in order to support the functions of the external electronic device. Take M.2 solid-state drives as an example. Since M.2 solid-state drives have the second-generation Universal Serial Bus (USB 2.0) function, USB 2.0 firmware must be present in Universal Interface System 10 to support M. 2 solid state drives. Taking the NF1 solid state drive as an example, since the NF1 solid state drive has a dual-channel option, the firmware with the dual-channel option must be present in Universal Interface System 10 to support the NF1 solid-state drive. Therefore, in some embodiments, when the external electronic device is electrically connected to the universal interface system 10, the first control module 130 executes the firmware of the external electronic device stored in the second control module 150, The universal interface system 10 is caused to support the functions of the external electronic device.

請參照圖1至圖5,圖5是本發明之一實施例中,通用介面系統10的運作流程圖。如圖5所示,當通用介面系統10開始運作時,通用介面系統10之供電模組110係透過傳輸介面100之電源引腳組Spp發送一第一電源V1(步驟S100)。接著,通用介面系統10之偵測模組140係偵測傳輸介面100之引腳105所傳輸之訊號(即第一應答訊號Van1)以判斷所述外部電子裝置是否存在(步驟S110)。若所述外部電子裝置不存在,通用介面系統10係關閉供電模組110之電源(步驟S120)以節省電源;若所述外部電子裝置存在,偵測模組140係偵測傳輸介面100之引腳106所傳輸之第二應答訊號Van2及傳輸介面100之引腳107所傳輸之第三應答訊號Van3以判斷所述外部電子裝置是否為一固態硬碟(步驟S130),其中所述固態硬碟係選自NF1固態硬碟或M.2固態硬碟。若所述外部電子裝置不是固態硬碟,通用介面系統10係關閉供電模組110之電源(步驟S120),以避免產生不相容問題而導致所述外部電子裝置或通用介面系統10損壞;若所述外部電子裝置是固態硬碟,通用介面系統10之第一控制模組130係執行所述外部電子裝置之韌體並控制通用介面系統10之電源開關模組120導通,使得第一電源V1或第二電源V2發送至所述外部電子裝置(步驟S140),其中所述外部電子裝置之韌體係儲存於第二控制模組150中。Please refer to FIGS. 1 to 5 . FIG. 5 is an operation flow chart of the universal interface system 10 in one embodiment of the present invention. As shown in FIG. 5 , when the universal interface system 10 starts to operate, the power supply module 110 of the universal interface system 10 sends a first power supply V1 through the power pin group Spp of the transmission interface 100 (step S100 ). Next, the detection module 140 of the universal interface system 10 detects the signal transmitted by the pin 105 of the transmission interface 100 (ie, the first response signal Van1) to determine whether the external electronic device exists (step S110). If the external electronic device does not exist, the universal interface system 10 turns off the power supply module 110 (step S120) to save power; if the external electronic device exists, the detection module 140 detects the transmission interface 100. The second response signal Van2 transmitted by the pin 106 and the third response signal Van3 transmitted by the pin 107 of the transmission interface 100 are used to determine whether the external electronic device is a solid state drive (step S130), wherein the solid state drive The system can be selected from NF1 SSD or M.2 SSD. If the external electronic device is not a solid state drive, the universal interface system 10 turns off the power supply module 110 (step S120) to avoid incompatibility problems that may cause damage to the external electronic device or the universal interface system 10; if The external electronic device is a solid state hard drive. The first control module 130 of the universal interface system 10 executes the firmware of the external electronic device and controls the power switch module 120 of the universal interface system 10 to turn on, so that the first power supply V1 Or the second power V2 is sent to the external electronic device (step S140 ), where the firmware of the external electronic device is stored in the second control module 150 .

在一些實施例中,當偵測模組140偵測所述外部電子裝置為NF1固態硬碟時,第二電源V2係透過傳輸介面100之一第三十個引腳(PIN30)、一第三十二個引腳(PIN32)、一第三十四個引腳(PIN34)及一第三十六個引腳(PIN36)發送至所述外部電子裝置,其中引腳101係為傳輸介面100之PIN30,引腳102係為傳輸介面100之PIN32,引腳103係為傳輸介面100之PIN34,引腳104係為傳輸介面100之PIN36。如圖2B所示,NF1固態硬碟之PIN30、PIN32、PIN34、PIN36用以傳輸12伏特之訊號。因此,當NF1固態硬碟插設於通用介面系統10上時,通用介面系統10係發送12伏特之第二電源V2至NF1固態硬碟之PIN30、PIN32、PIN34、PIN36,使得NF1固態硬碟可以正常運作。In some embodiments, when the detection module 140 detects that the external electronic device is an NF1 solid-state drive, the second power supply V2 is connected through one of the thirtieth pin (PIN30) and a third pin of the transmission interface 100. Twelve pins (PIN32), a thirty-fourth pin (PIN34) and a thirty-sixth pin (PIN36) are sent to the external electronic device, of which pin 101 is the transmission interface 100 PIN30, pin 102 is the PIN32 of the transmission interface 100, pin 103 is the PIN34 of the transmission interface 100, and pin 104 is the PIN36 of the transmission interface 100. As shown in Figure 2B, PIN30, PIN32, PIN34, and PIN36 of the NF1 solid-state drive are used to transmit 12-volt signals. Therefore, when the NF1 solid state drive is plugged into the universal interface system 10, the universal interface system 10 sends the second power supply V2 of 12 volts to PIN30, PIN32, PIN34, and PIN36 of the NF1 solid state drive, so that the NF1 solid state drive can normal operation.

在一些實施例中,當偵測模組140偵測所述外部電子裝置為M.2固態硬碟時,第一電源V1係透過傳輸介面100之電源引腳組Spp傳輸至所述外部電子裝置。如圖2B所示,M.2固態硬碟之PIN2、PIN4、PIN12、PIN14、PIN16、PIN18、PIN70、PIN72、PIN74用以傳輸3.3伏特之訊號。因此,當M.2固態硬碟插設於通用介面系統10上時,通用介面系統10係發送3.3伏特之第一電源V1至M.2固態硬碟之PIN2、PIN4、PIN12、PIN14、PIN16、PIN18、PIN70、PIN72、PIN74,使得M.2固態硬碟可以正常運作。In some embodiments, when the detection module 140 detects that the external electronic device is an M.2 solid state drive, the first power V1 is transmitted to the external electronic device through the power pin set Spp of the transmission interface 100 . As shown in Figure 2B, PIN2, PIN4, PIN12, PIN14, PIN16, PIN18, PIN70, PIN72, and PIN74 of the M.2 solid-state drive are used to transmit 3.3 volt signals. Therefore, when the M.2 solid-state drive is plugged into the universal interface system 10, the universal interface system 10 sends the first power supply V1 of 3.3 volts to the PIN2, PIN4, PIN12, PIN14, PIN16, PIN18, PIN70, PIN72, and PIN74 enable the M.2 solid-state drive to operate normally.

請參照圖6,圖6是本發明之另一實施例中,通用介面系統10’的模組方塊圖。如圖6所示,在一些實施例中,通用介面系統10’之架構與圖1所示之通用介面系統10之架構大致相同,其二者之間的差別在於通用介面系統10’係將通用介面系統10之第一控制模組130及偵測模組140整合為一第一控制模組130’。在一些實施例中,第一控制模組130及第一控制模組130’為複雜可程式化邏輯裝置(Complex Programmable Logic Device,CPLD)、可程式化邏輯裝置(Programmable Logic Device,PLD)、場式可程式閘陣列(Field Programmable Gate Array,FPGA)或微控制器單元(Microcontroller Unit,MCU)等可執行編程程式的元件,不以此為限。因此,通用介面系統10’係可透過第一控制模組130’以實現圖1中第一控制模組130及偵測模組140之功能。Please refer to Figure 6, which is a module block diagram of the universal interface system 10' in another embodiment of the present invention. As shown in Figure 6, in some embodiments, the architecture of the universal interface system 10' is substantially the same as the architecture of the universal interface system 10 shown in Figure 1. The difference between the two is that the universal interface system 10' will be universal The first control module 130 and the detection module 140 of the interface system 10 are integrated into a first control module 130'. In some embodiments, the first control module 130 and the first control module 130' are complex programmable logic devices (Complex Programmable Logic Device, CPLD), programmable logic devices (Programmable Logic Device, PLD), field Components that can execute programming programs such as Field Programmable Gate Array (FPGA) or Microcontroller Unit (MCU) are not limited to this. Therefore, the universal interface system 10' can realize the functions of the first control module 130 and the detection module 140 in Figure 1 through the first control module 130'.

綜上所述,根據通用介面系統10之一些實施例,當一外部電子裝置插設於通用介面系統10上時,通用介面系統10係透過偵測傳輸介面100之特定引腳所傳輸之訊號,以判斷所述外部電子裝置是否為NF1固態硬碟或M.2固態硬碟,進而避免通用介面系統10提供錯誤的電源而導致所述外部電子裝置損壞。To sum up, according to some embodiments of the universal interface system 10, when an external electronic device is plugged into the universal interface system 10, the universal interface system 10 detects the signal transmitted by the specific pin of the transmission interface 100, This is used to determine whether the external electronic device is an NF1 solid state drive or an M.2 solid state drive, thereby preventing the universal interface system 10 from providing erroneous power and causing damage to the external electronic device.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明之創作,任何所屬技術領域中具有通常知識者,在不脫離本揭露內容之精神和範圍內,當可作些許之修改與變化,惟該些許之修改與變化仍然在本發明之申請專利範圍內。Although the present invention has been disclosed in the above embodiments, they are not intended to limit the creation of the present invention. Anyone with ordinary skill in the art may make slight modifications and modifications without departing from the spirit and scope of the disclosure. changes, but these slight modifications and changes are still within the patentable scope of the present invention.

10:通用介面系統 10’:通用介面系統 100:傳輸介面 101~107:引腳 110:供電模組 120:電源開關模組 130:第一控制模組 130’:第一控制模組 140:偵測模組 141:邏輯模組 150:第二控制模組 Q1:開關 Q2:開關 R1~R3:電阻器 S100~S140:步驟 Spp:電源引腳組 V1:第一電源 V2:第二電源 Van1:第一應答訊號 Van2:第二應答訊號 Van3:第三應答訊號 Vc:控制訊號 Vc1:第一控制訊號 Vc2:第二控制訊號 Vd:偵測訊號10: Universal interface system 10’: Universal interface system 100:Transmission interface 101~107: Pin 110:Power supply module 120:Power switch module 130:First control module 130’: First control module 140:Detection module 141: Logic module 150: Second control module Q1: switch Q2: switch R1~R3: resistor S100~S140: steps Spp: power pin group V1: first power supply V2: Second power supply Van1: first response signal Van2: second response signal Van3: The third response signal Vc: control signal Vc1: first control signal Vc2: second control signal Vd: detection signal

圖1是本發明之一實施例中,通用介面系統的模組方塊圖。 圖2A是本發明之一實施例中,M.2固態硬碟及NF1固態硬碟的引腳定義圖(一)。 圖2B是本發明之一實施例中,M.2固態硬碟及NF1固態硬碟的引腳定義圖(二)。 圖3是本發明之一實施例中,電源開關模組的電路示意圖。 圖4是本發明之一實施例中,偵測模組的電路示意圖。 圖5是本發明之一實施例中,通用介面系統的運作流程圖。 圖6是本發明之另一實施例中,通用介面系統的模組方塊圖。 Figure 1 is a module block diagram of a universal interface system in one embodiment of the present invention. FIG. 2A is a pin definition diagram (1) of an M.2 solid-state drive and an NF1 solid-state drive in an embodiment of the present invention. Figure 2B is a pin definition diagram (2) of the M.2 solid state drive and the NF1 solid state drive in one embodiment of the present invention. FIG. 3 is a schematic circuit diagram of a power switch module in one embodiment of the present invention. FIG. 4 is a schematic circuit diagram of a detection module in an embodiment of the present invention. Figure 5 is an operation flow chart of the universal interface system in one embodiment of the present invention. FIG. 6 is a module block diagram of a universal interface system in another embodiment of the present invention.

10:通用介面系統 10: Universal interface system

100:傳輸介面 100:Transmission interface

101~107:引腳 101~107: Pin

110:供電模組 110:Power supply module

120:電源開關模組 120:Power switch module

130:第一控制模組 130:First control module

140:偵測模組 140:Detection module

150:第二控制模組 150: Second control module

V1:第一電源 V1: first power supply

V2:第二電源 V2: Second power supply

Van1:第一應答訊號 Van1: first response signal

Van2:第二應答訊號 Van2: second response signal

Van3:第三應答訊號 Van3: The third response signal

Vc:控制訊號 Vc: control signal

Claims (10)

一種通用介面系統,包含: 一傳輸介面,用以發送一第一電源及一第二電源至一外部電子裝置,並接收該外部電子裝置所發送之一第一應答訊號、一第二應答訊號及一第三應答訊號; 一供電模組,電耦接於該傳輸介面,用以產生該第一電源及該第二電源; 一電源開關模組,設置於該傳輸介面與該供電模組之間,用以根據一控制訊號而選擇性地導通該傳輸介面與該供電模組之間的線路; 一第一控制模組,電性連接於該傳輸介面及該電源開關模組,用以產生該控制訊號而控制該電源開關模組,以及用以執行該外部電子裝置之韌體; 一偵測模組,電性連接於該傳輸介面及該第一控制模組,用以偵測該第一應答訊號以判斷該外部電子裝置是否存在,以及用以偵測該第二應答訊號及該第三應答訊號以判斷該外部電子裝置是否為一固態硬碟,其中該固態硬碟係選自NF1固態硬碟或M.2固態硬碟;以及 一第二控制模組,電性連接於該第一控制模組,用以儲存該外部電子裝置之韌體。 A common interface system that includes: a transmission interface for sending a first power supply and a second power supply to an external electronic device, and receiving a first response signal, a second response signal and a third response signal sent by the external electronic device; a power supply module electrically coupled to the transmission interface for generating the first power supply and the second power supply; A power switch module is disposed between the transmission interface and the power supply module to selectively conduct the line between the transmission interface and the power supply module according to a control signal; A first control module, electrically connected to the transmission interface and the power switch module, for generating the control signal to control the power switch module, and for executing the firmware of the external electronic device; A detection module, electrically connected to the transmission interface and the first control module, is used to detect the first response signal to determine whether the external electronic device exists, and is used to detect the second response signal and The third response signal is used to determine whether the external electronic device is a solid state drive, wherein the solid state drive is selected from NF1 solid state drive or M.2 solid state drive; and A second control module, electrically connected to the first control module, is used to store the firmware of the external electronic device. 如請求項1所述之通用介面系統,其中該偵測模組電性連接於該傳輸介面之一第五十二個引腳(PIN52)。The universal interface system as described in claim 1, wherein the detection module is electrically connected to one of the fifty-second pins (PIN52) of the transmission interface. 如請求項1所述之通用介面系統,其中該偵測模組電性連接於該傳輸介面之一第六個引腳(PIN6)及一第二十六個引腳(PIN26)。The universal interface system as described in claim 1, wherein the detection module is electrically connected to a sixth pin (PIN6) and a twenty-sixth pin (PIN26) of the transmission interface. 如請求項1所述之通用介面系統,其中該第一電源之電壓值為3.3伏特。The universal interface system as claimed in claim 1, wherein the voltage value of the first power supply is 3.3 volts. 如請求項4所述之通用介面系統,其中當該偵測模組偵測該外部電子裝置為M.2固態硬碟時,該第一電源係透過該傳輸介面之一第二個引腳(PIN2)、一第四個引腳(PIN4)、一第十二個引腳(PIN12)、一第十四個引腳(PIN14)、一第十六個引腳(PIN16)、一第十八個引腳(PIN18)、一第七十個引腳(PIN70)、一第七十二個引腳(PIN72)及一第七十四個引腳(PIN74)傳輸至該外部電子裝置。The universal interface system as described in claim 4, wherein when the detection module detects that the external electronic device is an M.2 solid state drive, the first power supply is through one of the second pins of the transmission interface ( PIN2), a fourth pin (PIN4), a twelfth pin (PIN12), a fourteenth pin (PIN14), a sixteenth pin (PIN16), a eighteenth pin A pin (PIN18), a seventieth pin (PIN70), a seventy-second pin (PIN72) and a seventy-fourth pin (PIN74) are transmitted to the external electronic device. 如請求項1所述之通用介面系統,其中當該偵測模組偵測該外部電子裝置為NF1固態硬碟時,該第二電源係透過該傳輸介面之一第三十個引腳(PIN30)、一第三十二個引腳(PIN32)、一第三十四個引腳(PIN34)及一第三十六個引腳(PIN36)傳送至該外部電子裝置,且該第二電源之電壓值為12伏特。The universal interface system as described in claim 1, wherein when the detection module detects that the external electronic device is an NF1 solid-state drive, the second power supply is through one of the thirtieth pin (PIN30) of the transmission interface. ), a thirty-second pin (PIN32), a thirty-fourth pin (PIN34) and a thirty-sixth pin (PIN36) are transmitted to the external electronic device, and the second power supply The voltage value is 12 volts. 一種通用介面系統控制方法,包含: 發送一第一電源; 偵測是否收到來自一外部電子裝置之一第一應答訊號以判斷該外部電子裝置是否存在,其中該第一應答訊號係該外部電子裝置接到該第一電源時所發送; 當該外部電子裝置存在時,偵測該外部電子裝置所發送之一第二應答訊號及一第三應答訊號以判斷該外部電子裝置是否為一固態硬碟,其中該固態硬碟係選自NF1固態硬碟或M.2固態硬碟;以及 當該外部電子裝置為固態硬碟時,執行該外部電子裝置之韌體並控制一電源開關模組導通,使得該第一電源或一第二電源傳送至該外部電子裝置。 A universal interface system control method, including: Send a first power source; Detect whether a first response signal is received from an external electronic device to determine whether the external electronic device exists, wherein the first response signal is sent when the external electronic device receives the first power supply; When the external electronic device exists, detect a second response signal and a third response signal sent by the external electronic device to determine whether the external electronic device is a solid state drive, wherein the solid state drive is selected from NF1 Solid state drive or M.2 solid state drive; and When the external electronic device is a solid-state hard drive, the firmware of the external electronic device is executed and a power switch module is controlled to be turned on, so that the first power supply or the second power supply is transmitted to the external electronic device. 如請求項7所述之通用介面系統控制方法,其中該第一電源之電壓值為3.3伏特。The universal interface system control method as described in claim 7, wherein the voltage value of the first power supply is 3.3 volts. 如請求項8所述之通用介面系統控制方法,其中當一偵測模組偵測該外部電子裝置為M.2固態硬碟時,該第一電源係透過一傳輸介面之一第二個引腳(PIN2)、一第四個引腳(PIN4)、一第十二個引腳(PIN12)、一第十四個引腳(PIN14)、一第十六個引腳(PIN16)、一第十八個引腳(PIN18)、一第七十個引腳(PIN70)、一第七十二個引腳(PIN72)及一第七十四個引腳(PIN74)傳輸至該外部電子裝置。The universal interface system control method as described in claim 8, wherein when a detection module detects that the external electronic device is an M.2 solid state drive, the first power supply is through a second driver of a transmission interface. pin (PIN2), a fourth pin (PIN4), a twelfth pin (PIN12), a fourteenth pin (PIN14), a sixteenth pin (PIN16), a Eighteen pins (PIN18), one seventieth pin (PIN70), one seventy-second pin (PIN72), and one seventy-fourth pin (PIN74) are transmitted to the external electronic device. 如請求項7所述之通用介面系統控制方法,其中當一偵測模組偵測該外部電子裝置為NF1固態硬碟時,該第二電源係透過一傳輸介面之一第三十個引腳(PIN30)、一第三十二個引腳(PIN32)、一第三十四個引腳(PIN34)及一第三十六個引腳(PIN36)傳送至該外部電子裝置,且該第二電源之電壓值為12伏特。The universal interface system control method as described in claim 7, wherein when a detection module detects that the external electronic device is an NF1 solid state drive, the second power supply is through a thirty-second pin of a transmission interface (PIN30), a thirty-second pin (PIN32), a thirty-fourth pin (PIN34) and a thirty-sixth pin (PIN36) are transmitted to the external electronic device, and the second The voltage value of the power supply is 12 volts.
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