TWI829247B - Electrical connection structure of micro loudspeaker - Google Patents

Abstract

An electrical connection structure of a micro loudspeaker, which includes a diaphragm, a circuit board, a first voice coil and a second voice coil. The diaphragm has a central part and a hole, a circuit board is arranged in the central part and a corresponding hole is arranged, the first voice coil is arranged in the central part and its lead is electrically connected to the circuit board, the second voice coil is arranged in the central part and its lead is electrically connected to the circuit plate. Thereby, the electrical connection structure of the microspeaker of the present invention can simplify the circuit connection method of the voice coil and facilitate the electrical connection with external sound source signals. At the same time, it can avoid the disconnection of the leads during assembly and use.

Description

Electrical connection structure of micro loudspeaker

The present invention provides an electrical connection structure for a micro loudspeaker, particularly a micro speaker circuit connection method that can simplify the circuit connection method of the voice coil, facilitate electrical connection with external sound source signals, and avoid wire breakage during assembly and use. The electrical connection structure of the loudspeaker.

In order to facilitate the electrical connection between the voice coil lead and the external sound source signal, a general dual-drive unit micro-speaker usually has a circuit board installed on the speaker base to weld the leads of the two voice coils, and through the circuit board The wiring design further electrically connects the electronic lines for external audio source access.

However, the conventional method will extend the voice coil lead to the circuit board contact too long, which not only increases the difficulty of welding, but also makes the lead length too long, causing the lead to swing too much when the speaker vibrates, causing the lead to hit other components. Components may emit abnormal noise and distortion, and may also be at risk of disconnection.

Therefore, how to invent an electrical connection structure for a micro-speaker that can simplify the circuit connection method of the voice coil, facilitate electrical connection with external sound source signals, and at the same time avoid wire breakage during assembly and use. This is where the present invention is intended to be actively disclosed.

In view of the shortcomings of the above-mentioned conventional technology, the inventor felt that it was not perfect, so he devoted himself to research and overcome it, and then developed an electrical connection structure of a micro-speaker, hoping to simplify the circuit connection method of the voice coil and make it possible to It facilitates electrical connection with external audio signals and prevents wire breakage during assembly and use.

In order to achieve the above objects and other objects, the present invention provides an electrical connection structure of a micro speaker, which includes: a diaphragm, a circuit board, a first voice coil and a second voice coil. The diaphragm includes a central part and a setting hole, and the setting hole is provided in the central part; the circuit board is provided in the central part, and the circuit board includes a first wiring area and a second wiring area, the first wiring area area and the second wiring area are located in the setting hole. The first wiring area is provided with a first voice coil contact, a second voice coil contact and a first conductive contact. The second wiring area is provided with a third Voice coil contact, a fourth voice coil contact and a second conductive contact; the first voice coil is located at the center part, the first voice coil includes a first lead and a second lead, the first The lead is electrically connected to the first voice coil contact point, and the second lead wire is electrically connected to the third voice coil contact point; the second voice coil is provided at the center part, and the second voice coil includes a third lead wire and a fourth The third lead is electrically connected to the second voice coil contact point, and the fourth lead wire is electrically connected to the fourth voice coil contact point.

In the above electrical connection structure of the micro speaker, the first lead can be parallel to the second lead, and the third lead can be parallel to the fourth lead.

In the electrical connection structure of the above-mentioned micro speaker, the diaphragm may include a hanging portion and a set of connecting portions. The hanging portion is wound around the central portion, and the connecting portion is wound around the hanging portion. Around, the assembly part is provided on a speaker base, and a hollow area is provided in the center of the speaker base. The hollow area corresponds to the hole and the circuit board. The speaker base is provided with a first conductive piece and a second conductive piece. , the first conductive sheet and the second conductive sheet are located at diagonally opposite corners of the hollow area, the first conductive sheet is electrically connected to the first conductive contact with a first brocade wire, and the second conductive sheet is electrically connected with a second The brocade wire is electrically connected to the second conductive contact.

In the electrical connection structure of the above-mentioned micro speaker, the speaker base can be provided with a first voice coil setting area and a second voice coil setting area. The first voice coil setting area is connected to one side of the hollow area, and the third voice coil setting area is connected to one side of the hollow area. Two voice coil setting areas are connected and arranged on the other side of the hollow area, the first voice coil is arranged in the first voice coil setting area, and the second voice coil is arranged in the second voice coil setting area.

In the electrical connection structure of the above-mentioned micro speaker, the first voice coil setting area may be further provided with a first magnetic return component, the first voice coil is movably provided on the first magnetic return component, and the second voice coil setting area may be further provided with a first magnetic return component. A second magnetic return component may be provided, and the second voice coil is movably provided on the second magnetic return component.

In the electrical connection structure of the above-mentioned micro speaker, the speaker base can be provided with a first elastic wave setting area and a second elastic wave setting area, and the first elastic wave setting area is connected to one of the first voice coil setting areas. side, the second elastic wave setting area is connected to one side of the second voice coil setting area, the first elastic wave setting area is provided with a first elastic wave, and the first elastic wave is fixed by a first elastic wave The second elastic wave setting area is provided with a second elastic wave, and the second elastic wave is connected to the central part of the diaphragm through a second elastic wave fixing member.

In the above-mentioned electrical connection structure of the micro speaker, the first elastic wave and the second elastic wave may respectively have a first hanging portion and a second hanging portion.

In the above electrical connection structure of the micro speaker, the first wiring area is provided on the top and bottom surfaces of the circuit board, or the second wiring area is provided on the top and bottom surfaces of the circuit board.

In the above electrical connection structure of the micro speaker, the first conductive contact and the second conductive contact are provided on the same side of the circuit board.

In order to achieve the above objects and other objects, the present invention also provides an electrical connection structure of a micro speaker, which includes: a diaphragm, a circuit board, a first voice coil and a second voice coil. The diaphragm includes a central part and a setting hole, and the setting hole is provided in the central part; the circuit board is provided in the central part, and the circuit board includes a first wiring area and a second wiring area, the first wiring area area and the second wiring area are located in the setting hole, the first wiring area is provided with a first voice coil contact and a first conductive contact, the second wiring area is provided with a second voice coil contact and a second Conductive contacts; the first voice coil is located at the central part, the first voice coil includes a first lead and a second lead, the first lead is electrically connected to the first voice coil contact; the second voice coil Located at the center part, the second voice coil includes a third lead and a fourth lead. The fourth lead is electrically connected to the second voice coil contact point, and the third lead is electrically connected to the second lead.

In the above electrical connection structure of the micro speaker, the first wiring area is provided on the top and bottom surfaces of the circuit board, or the second wiring area is provided on the top and bottom surfaces of the circuit board.

In the above electrical connection structure of the micro speaker, the third lead is electrically connected to the second lead through at least one voice coil contact, and the voice coil contact is provided on the circuit board.

In the above electrical connection structure of the micro speaker, the third lead is directly electrically connected to the second lead.

Thereby, the electrical connection structure of the microspeaker of the present invention can simplify the circuit connection method of the voice coil and facilitate the electrical connection with external sound source signals. At the same time, it can avoid the disconnection of the leads during assembly and use.

In order to fully understand the purpose, characteristics and effects of the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings, as follows:

Please refer to Figures 1 to 3. As shown in the figures, the present invention provides an electrical connection structure 1 for a microspeaker, which includes: a diaphragm 1, a circuit board 2, a first voice coil 3 and a second voice coil. Circle 4.

The diaphragm 1 includes a central portion 11 and a setting hole 12 . The setting hole 12 is opened at the bottom of a setting groove 15 (as shown in FIG. 9 ) on the top surface of the central portion 11 .

The circuit board 2 is disposed in the slot 15 of the central portion 11. The circuit board 2 can be a single-sided circuit board. The bottom surface of the circuit board 2 includes a first wiring area 21 and a second wiring area 22. The first wiring area 21 and a second wiring area 22. The wiring area 21 and the second wiring area 22 are located in the setting hole 12. The first wiring area 21 is provided with a first voice coil contact 23, a second voice coil contact 24 and a first conductive contact 25. The first conductive contact 25 is located between the first voice coil contact 23 and the second voice coil contact 24. The second wiring area 22 is provided with a third voice coil contact 26 and a fourth voice coil contact. point 27 and a second conductive contact 28. The third voice coil contact 26 is located between the fourth voice coil contact 27 and the second conductive contact 28.

The top surface of the first voice coil 3 is located on the bottom surface of the central portion 11. The first voice coil 3 includes a first lead 31 and a second lead 32. The first lead 31 is electrically connected to the first voice coil connection. At point 23, the second lead 32 is electrically connected to the third voice coil contact point 26.

The top surface of the second voice coil 4 is located on the bottom surface of the central part 11. The second voice coil 4 includes a third lead 41 and a fourth lead 42. The third lead 41 is electrically connected to the second voice coil connection. At point 24, the fourth lead 42 is electrically connected to the fourth voice coil contact point 27.

When actually used, the circuit board 2 can be attached to the groove 15 of the central portion 11 , and the first lead 31 and the second lead 32 can be extended from the top surface of the first voice coil 3 Afterwards, the first voice coil contact point 23 and the third voice coil contact point 26 are directly electrically connected to the bottom surface of the circuit board 2 respectively, and the third lead wire 41 and the fourth lead wire 42 are also connected from the second voice coil contact point 26 . After the top surface of the coil 4 extends out, it is directly electrically connected to the second voice coil contact 24 and the fourth voice coil contact 27 on the bottom surface of the circuit board 2. Therefore, the first lead 31, the second The extension lengths of the lead wires 32, the third lead wires 41 and the fourth lead wires 42 are shorter than those of conventional leads, and pass through the first wiring area 21 and the second wiring area 22 of the circuit board 2 , the wiring method of the first voice coil contact 23, the second voice coil contact 24, the third voice coil contact 26 and the fourth voice coil contact 27 can make the first voice coil 3 and the The second voice coil 4 realizes parallel connection.

In addition, in one embodiment of the present invention, because the first wiring area 21, the second wiring area 22, the first voice coil contact 23, the second voice coil contact 24, the The third voice coil contact 26 and the fourth voice coil contact 27 are arranged in such a way that the first lead 31 and the second lead 32 are parallel (or substantially parallel), and the third lead 41 and the fourth lead 32 are parallel to each other. The leads 42 are parallel (or substantially parallel), and the circuit board 2 is placed in the setting groove 15 of the central part 11 of the diaphragm 1 so that the first lead 31 , the second lead 32 , and the third lead When 41 and the fourth lead 42 respectively extend from the first voice coil 3 and the second voice coil 4, they can be electrically connected to the bottom surface of the circuit board 2, thereby reducing the need to lengthen the leads during common operations. This causes some problems, and because the first lead 31 , the second lead 32 , the third lead 41 and the fourth lead 42 extend out of the suspended portion less than the common technology, and the first lead 31 , the third lead 31 The second lead 32 , the third lead 41 and the fourth lead 42 are almost flat against the bottom surface of the central part 11 of the diaphragm 1 , so it is possible to avoid the first lead 31 , the second lead 32 , the third lead 41 and the The fourth lead 42 swings too large, which may cause various problems and risks in the use of the speaker. In this way, the circuit connection method of the first voice coil 3 and the second voice coil 4 can be simplified, and the electrical connection operation with external sound source signals can be facilitated. At the same time, the first lead 31, the second lead 32, and the first lead 31 can be avoided. The third lead 41 and the fourth lead 42 may be disconnected during assembly and use.

Please refer to Figures 4 and 5. As shown in the figures, in one embodiment of the present invention, the diaphragm 1 can include a hanging portion 13 and a set of connecting portions 14. The hanging portion 13 is wound around the center. Around the part 11, the assembly part 14 is arranged around the suspension part 13. The assembly part 14 can be disposed on the top surface of a speaker base 5, and a hollow area 51 is provided in the center of the speaker base 5. The hollow area 51 corresponds to the installation hole 12 and the circuit board 2. The speaker base 5 can be embedded with a partially exposed first conductive sheet 52 and a second conductive sheet 53. The first conductive sheet 52 and the second conductive sheet 53 are embedded in the hollow area 51. The sheet 53 is located at the diagonal corner of the hollow area 51. The first conductive sheet 52 is electrically connected to the first conductive contact 25 with a first silk wire 521, and the second conductive sheet 53 is electrically connected with a second silk wire 531. the second conductive contact 28 .

In one embodiment of the present invention, the speaker base 5 can be provided with a first voice coil setting area 54 and a second voice coil setting area 55. The first voice coil setting area 54 is connected to one of the hollow areas 51. side, the second voice coil setting area 55 is connected to the other side of the hollow area 51, the first voice coil 3 is set in the first voice coil setting area 54, and the second voice coil 4 is set in the second Voice coil setting area 55.

In the above embodiment, the hollow area 51 can facilitate the welding operation of the first brocade wire 521 and the second brocade wire 531 . When assembling, the diaphragm 1, the first voice coil 3 and the second voice coil 4 can be assembled into a semi-finished product, and after the assembly portion 14 of the diaphragm 1 is combined with the speaker base 5, the third voice coil 3 can be assembled into a semi-finished product. The two ends of a brocade wire 521 are electrically connected to the first conductive sheet 52 and the first conductive contact 25 respectively by welding, and the two ends of the second brocade wire 531 are also electrically connected to the second conductive sheet by welding. 53 and the second conductive contact 28, and finally the electronic wire (not shown) for external access to the audio source signal is electrically connected to the first conductive sheet 52 and the second conductive sheet 53. In this way, electrical connection with external audio source signals can be facilitated.

The first conductive sheet 52 and the second conductive sheet 53 can be made of metal (such as stainless steel), and the first conductive sheet 52 and the second conductive sheet 53 can be integrally formed with the speaker base 5; A conductive sheet 52 and the second conductive sheet 53 are both disposed in the middle section of the speaker base 5 (that is, between the first voice coil 3 and the second voice coil 4) so as to electrically connect the first conductive part of the circuit board 2 nearby. The contact point 25 and the second conductive contact point 28. The first conductive sheet 52 has two exposed surfaces 522 and 523, and the second conductive sheet 53 has two exposed surfaces 532 and 533. The exposed surfaces 522 and 532 adjacent to the circuit board 2 are used to connect the first brocade wire 521 With the second brocade wire 531, the other exposed surfaces 523 and 533 are larger in area and are located on the bottom surface of the speaker base 5 for electrically connecting external electronic wires (not shown) for accessing audio signals.

Based on the above embodiments, it can be seen that the first lead 31 , the second lead 32 , the third lead 41 and the fourth lead 42 in the present invention are generally attached to the bottom surface of the diaphragm 1 and then extend to the circuit board. 2, so that the diaphragm 1, the first voice coil 3 and the second voice coil 4 will not swing significantly when they vibrate. In addition, when the first brocade wire 521 and the second brocade wire 531 are assembled, they can respectively extend around an arc to the first conductive sheet 52 and the second conductive sheet 53, and through the first brocade wire 521 and the The curvature of the second brocade wire 531 prevents the vibration amplitude of the diaphragm 1 , the first voice coil 3 and the second voice coil 4 from being too large, causing the first brocade wire 521 and the second brocade wire 531 to vibrate. Breakage occurs at the welding point.

Please refer to Figures 4 to 13. As shown in the figures, in one embodiment of the present invention, the speaker base 5 can be provided with a first elastic wave setting area 56 and a second elastic wave setting area 57. The first elastic wave setting area 57 The wave setting area 56 is connected to one side of the first voice coil setting area 54 , and the second elastic wave setting area 57 is connected to one side of the second voice coil setting area 55 . The first elastic wave setting area 56 A first elastic wave 6 is provided, and the first elastic wave 6 is connected to the bottom surface of the central part 11 of the diaphragm 1 through a first elastic wave fixing member 61; the second elastic wave setting area 57 is provided with a second elastic wave. The second elastic wave 7 is connected to the bottom surface of the central portion 11 of the diaphragm 1 through a second elastic wave fixing member 71 (as shown in Figures 6 to 8).

In one embodiment of the present invention, the first voice coil setting area 54 can further be provided with a first magnetic return component 8, the first voice coil 3 is movably provided on the first magnetic return component 8, and the second voice coil The setting area 55 may further be provided with a second magnetic return component 9, and the second voice coil 4 is movably provided on the second magnetic return component 9 (as shown in Figures 9 to 13). In addition, the first voice coil setting area 54 may have two C-shaped fixing brackets for setting the first magnetic return component 8, and the second voice coil setting area 55 may have two C-shaped fixing brackets for setting the second magnetic return component. 9.

In this way, through the diaphragm 1, the circuit board 2, the first voice coil 3, the second voice coil 4, the speaker base 5, and the first magnetic return component 8 mentioned in the above embodiment, the third The two magnetic return components 9, the first elastic wave 6 and the second elastic wave 7 can form a micro speaker 10 (as shown in Figures 9 to 13), and the micro speaker 10 can be combined with a sound box during use. (not shown), and use the first conductive sheet 52 and the second conductive sheet 53 to receive external sound source signals to the circuit board 2, so that the first voice coil 3 and the second voice coil 4 respectively pass through the third conductive sheet 52 and the second conductive sheet 53. The electromagnetic interaction between a magnetic return component 8 and the second magnetic return component 9 drives the diaphragm 1 to vibrate.

In one embodiment of the present invention, in order to increase the power of the micro speaker 10, the first elastic wave 6 and the second elastic wave 7 are respectively disposed at both ends of the long side of the speaker base 5 according to the needs of the present invention. And the diaphragm, the first elastic wave 6 and the second elastic wave 7 are connected respectively through the first elastic wave fixing part 61 and the second elastic wave fixing part 71, so that the first elastic wave 6 and the second elastic wave 7 are connected to each other respectively. The second bomb wave 7 can play a damping function.

In one embodiment of the present invention, the flange portion 13, the first elastic wave 6 and the second elastic wave 7 can be made of the same material, and in order to improve the damping function, the first elastic wave 6 and the second elastic wave 7 can be made of the same material. The wave 7 can have a first hanging portion 62 and a second hanging portion 72 respectively. The first hanging portion 62 and the second hanging portion 72 have the same shape as the hanging portion 13 but have opposite bulging directions. , to obtain better damping effect.

Please refer to Figure 14. As shown in the figure, in one embodiment of the present invention, the circuit board 2 can be a double-sided circuit board, and a part of the first wiring area 21 can be provided on the top surface of the circuit board 2 (such as The dotted line portion of the first wiring area 21 shown in Figure 14), the remaining portion of the first wiring area 21 can be provided on the bottom surface of the circuit board 2 (the solid line portion of the first wiring area 21 shown in Figure 14) . Similarly, part of the second wiring area 22 can also be provided on the top surface of the circuit board 2 , and the remaining part of the second wiring area 22 can also be provided on the bottom surface of the circuit board 2 . In addition, when a part of the first wiring area 21 or a part of the second wiring area 22 is provided on the top surface of the circuit board 2, a black plastic sheet can be attached to the top surface of the circuit board 2 to avoid the first wiring area 21. The wiring area 21 or the second wiring area 22 is exposed, resulting in poor appearance. As mentioned above, by disposing the first wiring area 21 or the second wiring area 22 on the top and bottom surfaces of the circuit board 2, the electrical connection structure of the micro speaker of the present invention can be configured in an appropriate parallel connection method according to actual needs. .

Please refer to Figure 15. As shown in the figure, in one embodiment of the present invention, the first conductive contact 25 and the second conductive contact 28 can be disposed on the same side of the circuit board 2, for example, the circuit board 2 short side. Thereby, the first conductive sheet 52 and the second conductive sheet 53 shown in FIGS. 4 to 7 , 11 and 12 can be changed from diagonally opposite corners of the hollow area 51 of the speaker base 5 to being disposed on the speaker base. 5, such as the short side of the hollow area 51 (the long side of the speaker base 5), to meet different installation requirements.

Please refer to Figures 16 and 17. As shown in the figures, the present invention also provides an electrical connection structure of a micro speaker. The difference from the electrical connection structure of the above-mentioned micro speaker is that the circuit board 2 includes a first wiring. Area 21' and a second wiring area 22', the first wiring area 21' is provided with a first voice coil contact 211' and a first conductive contact 212', the first conductive contact 212' can be electrically connected The first conductive sheet, the second wiring area 22' is provided with a second voice coil contact 221' and a second conductive contact 222', the second conductive contact 222' can be electrically connected to the second conductive sheet; A voice coil 3 includes a first lead 31 and a second lead 32. The first lead 31 is electrically connected to the first voice coil contact 211'; the second voice coil 4 includes a third lead 41 and a fourth The fourth lead 42 is electrically connected to the second voice coil contact 221 ′, and the third lead 41 is electrically connected to the second lead 32 . Thereby, the electrical connection structure of the microspeaker of this embodiment enables the first voice coil 3 and the second voice coil 4 to be connected in series.

Please refer to Figure 16. As shown in the figure, in one embodiment of the present invention, the circuit board 2 can be a double-sided circuit board, and a part of the second wiring area 22' can be provided on the top surface of the circuit board 2 ( As shown in the dotted line part of the second wiring area 22' in Figure 16), the remaining parts of the second wiring area 22' can be provided on the bottom surface of the circuit board 2 (as shown in the dotted line part of the second wiring area 22' in Figure 16). solid line part). In the same way, part of the first wiring area 21' can also be provided on the top surface of the circuit board 2, and the remaining part of the first wiring area 21' can also be provided on the bottom surface of the circuit board 2. In addition, when a part of the first wiring area 21' or a part of the second wiring area 22' is provided on the top surface of the circuit board 2, a black plastic sheet can be attached to the top surface of the circuit board 2 to avoid the The first wiring area 21' or the second wiring area 22' is exposed, resulting in poor appearance. As mentioned above, by disposing the first wiring area 21' or the second wiring area 22' on the top and bottom surfaces of the circuit board 2, the electrical connection structure of the micro speaker of the present invention can be configured appropriately according to actual needs. Series mode.

Please refer to Figure 16. As shown in the figure, in one embodiment of the present invention, the third lead 41 can be electrically connected to the second lead 32 through at least one voice coil contact 411 or 321 (in Figure 16, they are electrically connected to each other). Taking the two connected voice coil contacts 411 and 321 as an example), the voice coil contacts 411 and 321 are provided on the circuit board 2 . In addition, please refer to FIG. 17 . As shown in the figure, in one embodiment of the present invention, the third lead 41 can be directly electrically connected to the second lead 32 . As mentioned above, through the different electrical connection methods of the third lead 41 and the second lead 32, the electrical connection structure of the micro speaker of the present invention can be configured in an appropriate series connection method according to actual needs.

The present invention has been disclosed above with preferred embodiments. However, those skilled in the art should understand that the embodiments are only used to illustrate the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that any changes and substitutions that are equivalent to this embodiment should be considered to be within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope of the patent application.

10: Micro speaker 1:Diaphragm 11:Center 12: Setting holes 13: Suspended edge part 14: Assembly and connection department 15:Set slot 2:Circuit board 21: First wiring area 21’: First wiring area 211’: First voice coil contact 212’: First conductive contact 22: Second wiring area 22’: Second wiring area 221’: Second voice coil contact 222’: Second conductive contact 23: First voice coil contact 24: Second voice coil contact 25: First conductive contact 26: Third voice coil contact 27: Fourth voice coil contact 28: Second conductive contact 3: First voice coil 31: First lead 32:Second lead 321:Voice coil contact 4: Second voice coil 41:Third lead 411:Voice coil contact 42:Fourth lead 5: Speaker holder 51: Hollow area 52: First conductive sheet 521:The first brocade thread 522: Show your face 523: Show your face 53: Second conductive sheet 531:Second Brocade Thread 532: Show your face 533: Show your face 54: First voice coil setting area 55: Second voice coil setting area 56: The first bomb setting area 57: Second bomb setting area 6:The first bomb wave 61: The first elastic wave fixing piece 62: First hanging edge part 7: The second bomb wave 71: Second elastic wave fixing piece 72: Second hanging edge part 8: The first magnetic return component 9: Second magnetic return component

[Figure 1] is a schematic diagram of the combination of the diaphragm and the circuit board of the present invention. [Figure 2] is an exploded schematic diagram of the diaphragm, circuit board, first voice coil and second voice coil of the present invention. [Figure 3] is a schematic diagram of the combination of the diaphragm, circuit board, first voice coil and second voice coil of the present invention. [Figure 4] is an exploded schematic diagram of the diaphragm, circuit board, first voice coil, second voice coil and speaker base of the present invention. [Figure 5] is a schematic diagram of the combination of the diaphragm, circuit board, first voice coil, second voice coil and speaker base of the present invention. [Figure 6] is an exploded schematic diagram of the present invention without the first magnetic return component and the second magnetic return component. [Figure 7] is a schematic diagram of the combination of the present invention without the first magnetic return component and the second magnetic return component. [Figure 8] is a schematic cross-sectional view of the present invention without the first magnetic return component and the second magnetic return component. [Figure 9] is an exploded schematic diagram of the micro speaker of the present invention. [Figure 10] is a schematic diagram of the combination of the micro-speaker of the present invention. [Figure 11] is another exploded schematic diagram of the micro speaker of the present invention. [Figure 12] is a schematic diagram of another combination of the micro-speaker of the present invention. [Fig. 13] is a schematic cross-sectional view of the microspeaker of the present invention. [Figure 14] is a schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil of the present invention. [Figure 15] is the second schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil of the present invention. [Figure 16] is the third schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil of the present invention. [Figure 17] is a schematic diagram 4 of the connection between the circuit board, the first voice coil and the second voice coil of the present invention.

1:Diaphragm

11:Center

12: Setting holes

13: Suspended edge part

14: Assembly and connection department

2:Circuit board

21: First wiring area

22: Second wiring area

23: First voice coil contact

24: Second voice coil contact

25: First conductive contact

26: Third voice coil contact

27: Fourth voice coil contact

28: Second conductive contact

3: First voice coil

31: First lead

32:Second lead

4: Second voice coil

41:Third lead

42:Fourth lead

Claims (10)

An electrical connection structure for a micro-speaker, which includes: A diaphragm including a central part and a setting hole, the setting hole being provided in the central part; A circuit board is provided in the central part. The circuit board includes a first wiring area and a second wiring area. The first wiring area and the second wiring area are located in the setting hole. The first wiring area is provided with a A first voice coil contact, a second voice coil contact and a first conductive contact. The second wiring area is provided with a third voice coil contact, a fourth voice coil contact and a second conductive contact. ; A first voice coil is provided at the central part. The first voice coil includes a first lead and a second lead. The first lead is electrically connected to the first voice coil contact point, and the second lead is electrically connected to the first voice coil contact point. third voice coil contact; and A second voice coil is provided at the central part. The second voice coil includes a third lead and a fourth lead. The third lead is electrically connected to the second voice coil contact point, and the fourth lead is electrically connected to the second voice coil. The fourth voice coil contact. The electrical connection structure of the micro speaker as claimed in claim 1, wherein the first lead is parallel to the second lead, and the third lead is parallel to the fourth lead. The electrical connection structure of the microspeaker as claimed in claim 1, wherein the diaphragm includes a hanging portion and a set of connecting portions, the hanging portion is wound around the central portion, and the connecting portion is wound around the central portion. Around the hanging edge part, the assembly part is arranged on a speaker base. A hollow area is provided in the center of the speaker base. The hollow area corresponds to the hole and the circuit board. The speaker base is provided with a first conductive piece and a The second conductive sheet. The first conductive sheet and the second conductive sheet are located at diagonally opposite corners of the hollow area. The first conductive sheet is electrically connected to the first conductive contact with a first brocade wire. The second conductive sheet A second silk wire is electrically connected to the second conductive contact. The electrical connection structure of the micro-speaker according to claim 3, wherein the speaker base is provided with a first voice coil setting area and a second voice coil setting area, and the first voice coil setting area is connected to one of the hollow areas. side, the second voice coil setting area is connected to the other side of the hollow area, the first voice coil is placed in the first voice coil setting area, and the second voice coil is placed in the second voice coil setting area. The electrical connection structure of the microspeaker as claimed in claim 4, wherein the speaker base is provided with a first elastic wave setting area and a second elastic wave setting area, and the first elastic wave setting area is connected to the first voice coil On one side of the setting area, the second elastic wave setting area is connected to one side of the second voice coil setting area. The first elastic wave setting area is provided with a first elastic wave. The first elastic wave is passed through a first An elastic wave fixing piece is connected to the center part of the diaphragm; the second elastic wave setting area is provided with a second elastic wave, and the second elastic wave is connected to the center part of the diaphragm through a second elastic wave fixing piece . The electrical connection structure of the micro speaker according to claim 1, wherein the first conductive contact and the second conductive contact are provided on the same side of the circuit board. An electrical connection structure for a micro-speaker, which includes: A diaphragm including a central part and a setting hole, the setting hole being provided in the central part; A circuit board is provided in the central part. The circuit board includes a first wiring area and a second wiring area. The first wiring area and the second wiring area are located in the setting hole. The first wiring area is provided with a a first voice coil contact and a first conductive contact, and the second wiring area is provided with a second voice coil contact and a second conductive contact; A first voice coil, which is located at the central part, the first voice coil includes a first lead and a second lead, the first lead is electrically connected to the first voice coil contact point; and A second voice coil is provided at the central part. The second voice coil includes a third lead and a fourth lead. The fourth lead is electrically connected to the second voice coil contact point, and the third lead is electrically connected to the second voice coil contact point. Second lead. The electrical connection structure of the micro-speaker as claimed in claim 1 or 7, wherein the first wiring area is provided on both top and bottom surfaces of the circuit board, or the second wiring area is provided on both top and bottom surfaces of the circuit board. The electrical connection structure of the microspeaker as claimed in claim 7, wherein the third lead is electrically connected to the second lead through at least one voice coil contact, and the voice coil contact is provided on the circuit board. The electrical connection structure of the micro speaker as claimed in claim 7, wherein the third lead is directly electrically connected to the second lead.

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