TWI828478B - Electronic device - Google Patents
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- TWI828478B TWI828478B TW111148356A TW111148356A TWI828478B TW I828478 B TWI828478 B TW I828478B TW 111148356 A TW111148356 A TW 111148356A TW 111148356 A TW111148356 A TW 111148356A TW I828478 B TWI828478 B TW I828478B
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- 230000004308 accommodation Effects 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0021—Side-by-side or stacked arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
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Abstract
Description
本發明涉及一種電子裝置,特別是涉及一種具隱藏式組裝結構的電子裝置,其中電子裝置的組裝結構隱藏於內部。The present invention relates to an electronic device, and in particular to an electronic device with a hidden assembly structure, wherein the assembly structure of the electronic device is hidden inside.
一般電子裝置的組裝結構通常使用多顆螺絲,有時配合一些卡勾。此種組裝固定方式需要較多螺絲及卡勾,導致生產的料件成本增加,組裝過程也耗費工時。再者,若是電子裝置的外觀區域有美觀要求時,現有的作法是再加上其他料件以遮蔽螺絲,此種作法又進一步地增加更多料件成本以及工時。The assembly structure of general electronic devices usually uses multiple screws, sometimes with some hooks. This assembly and fixation method requires more screws and hooks, which increases the cost of production materials and the assembly process is also time-consuming. Furthermore, if the appearance area of the electronic device has aesthetic requirements, the existing method is to add other materials to cover the screws, which further increases the cost of more materials and man-hours.
故,如何通過結構設計的改良,來提升電子裝置組裝後的美觀度,將電子裝置的組裝結構隱藏於其內部,來克服上述的缺陷,已成為該項技術領域所欲解決的一項課題。Therefore, how to improve the aesthetics of the electronic device after assembly through structural design improvements and hide the assembly structure of the electronic device inside to overcome the above-mentioned defects has become a problem to be solved in this technical field.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種電子裝置,以解決上述的缺欠。The technical problem to be solved by the present invention is to provide an electronic device to solve the above-mentioned shortcomings in the existing technology.
為了解決上述的技術問題,本發明所採用的其中一技術方案是,提供一種電子裝置,其包括一殼體、一蓋板及至少一連接件。殼體包括一組裝壁,所述組裝壁形成多個卡合孔。所述蓋板包含多個固定卡勾設置於朝向所述組裝壁的一底面,所述多個固定卡勾的位置相對應於所述殼體的所述多個卡合孔。至少一連接件設置於所述組裝壁與所述蓋板之間,以固定所述蓋板於所述殼體。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an electronic device, which includes a housing, a cover and at least one connector. The housing includes an assembly wall that forms a plurality of engagement holes. The cover plate includes a plurality of fixed hooks disposed on a bottom surface facing the assembly wall, and the positions of the plurality of fixed hooks correspond to the plurality of engagement holes of the housing. At least one connecting piece is provided between the assembly wall and the cover plate to fix the cover plate to the housing.
本發明的其中一有益效果在於,本發明所提供的電子裝置,其能通過“一蓋板包含多個固定卡勾設置於所述蓋板朝向所述組裝壁的一底面,所述多個固定卡勾的位置相對應於所述殼體的所述多個卡合孔”以及“至少一連接件,設置於所述組裝壁與所述蓋板之間,以固定所述蓋板於所述殼體”的結構,可以完全隱藏組裝結構在電子裝置的內部,以提升電子裝置的美觀。One of the beneficial effects of the present invention is that the electronic device provided by the present invention can use "a cover plate including a plurality of fixed hooks disposed on a bottom surface of the cover plate facing the assembly wall, and the plurality of fixed hooks are disposed on a bottom surface of the cover plate facing the assembly wall. The position of the hook corresponds to the plurality of engaging holes of the housing and "at least one connecting piece is provided between the assembly wall and the cover plate to fix the cover plate on the The "shell" structure can completely hide the assembly structure inside the electronic device to enhance the appearance of the electronic device.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.
[第一實施例][First Embodiment]
參閱圖1至圖5所示,本發明第一實施例提供一種電子裝置100,其包括一蓋板10、一殼體20、及一連接件30。本發明的特點在於,如圖2所示,當蓋板10固定地組裝於殼體20後,由電子裝置100的外觀未看到任何螺絲之類的固定元件。換句話說,蓋板10與殼體20之間的組裝結構完全隱藏在電子裝置100的內部。藉此可以提升電子裝置100的美觀,也可以避免非專業人士自行拆卸所導致的損毀。Referring to FIGS. 1 to 5 , a first embodiment of the present invention provides an
請參閱圖1,殼體20包括一側壁21及一組裝壁22。組裝壁22形成多個卡合孔223。側壁21環繞於組裝壁22的周圍。本實施例的組裝壁22朝上,組裝壁22可以是殼體20的頂壁或底壁,本發明並不限制於此。殼體20在本實施例中以長方形為例。然而,本發明不限制於此,例如可以是矩形、圓形或其他形狀。Referring to FIG. 1 , the
蓋板10的形狀對應於組裝壁22的形狀。本實施例中,蓋板10呈平板狀,具有平坦的頂面及底面,頂面背向殼體20,底面朝向組裝壁22。側壁21突出於組裝壁22而形成一突垣220。蓋板10的周圍抵接於突垣220。參閱圖2及圖5所示,蓋板10組裝於殼體20後,蓋板10的頂面切齊於突垣220的頂緣。然而,本發明不限制於此。蓋板10的頂面也可以是非平面狀。The shape of the
蓋板10包含多個固定卡勾13設置於朝向組裝壁22的一底面,多個固定卡勾13的位置相對應於多個卡合孔223。本實施例的蓋板10具有兩個固定卡勾13,相對地位於蓋板10的兩側。卡合孔223的數量也是兩個。固定卡勾13的數量可以視蓋板10的形狀與尺寸而定。本實施例的固定卡勾13具有一勾部132。另外,固定卡勾13還可以具有一加強肋134。加強肋134與勾部132位於固定卡勾13的相對兩側。The
如圖3及圖4所示,為加強蓋板10的固定效果,蓋板10的第一側包括三個第一側勾11、蓋板10的第二側具有三個第二側勾12。每個第一側勾11大略呈L形,其各具有第一豎臂111及第一勾臂112,第一勾臂112大致垂直連接於第一豎臂111。每個第二側勾12大略呈L形,其各具有第二豎臂121及第二勾臂122,第二勾臂122大致垂直連接於第二豎臂121。本實施例中,第一勾臂112的長度大於第二勾臂122的長度。As shown in FIGS. 3 and 4 , in order to enhance the fixing effect of the
配合上述的該些第一側勾11與第二側勾12,殼體20的組裝壁22包括一第一側孔221、及一第二側孔222。本實施例中,第一側孔221呈長條狀,第二側孔222也呈長條狀,第一側孔221與第二側孔222的位置相對,且分別靠近殼體20的兩側邊。三個第一側勾11對應地卡合於第一側孔221,三個第二側勾12對應地卡合於第二側孔222。In conjunction with the above-mentioned
然而,本發明不限制於此,第一側勾11與第二側勾12的數量可以是至少一個,視蓋板10的形狀與尺寸而定。其中第一側孔221與第二側孔222的數量可以是一個以上,其數量與形狀也不限制於此。例如,第一側孔221的數量可以對應於第一側勾11的數量,第二側孔222的數量可以對應於第二側勾12的數量。However, the present invention is not limited thereto. The number of the
本實施例設有一連接件30設置於組裝壁22與蓋板10之間,以加強固定蓋板10於殼體20。本實施例的連接件30是一黏接層,將蓋板10黏固於組裝壁22。例如可以是雙面膠,或黏膠。當蓋板10蓋合於殼體20後,使蓋板10黏接於殼體20。連接件30的數量可以是至少一個,但本發明不限制於此。In this embodiment, a connecting
請參閱圖4與圖5,其中圖5是沿著圖2的V-V剖線的剖視圖。如圖4所示,本發明的電子裝置100在組裝過程,先將蓋板10對應於第一側勾11的一側傾斜靠近殼體20。然後將第一側勾11的第一勾臂112斜插入殼體20的第一側孔221內。本實施例中,第一勾臂112的長度大於第二勾臂122的長度,可以提供更強的卡勾效果。接著,壓下蓋板10對應於第二側勾12的第二側,使第二側勾12卡合於第二側孔222,即組裝完成。本實施例,具有較大剛性的第一勾臂112先勾接於組裝壁22的底面,以提供較穩固的卡合強度;接著,具有較佳彈性的第二勾臂122再卡合於第二側孔222,可以容易完成組裝步驟。其中,只需要設置一個連接件30,連接件30的位置對應於第二勾臂122,也就是位於組裝壁22的頂面且鄰近第二側孔222的位置。Please refer to FIGS. 4 and 5 , where FIG. 5 is a cross-sectional view along the V-V line of FIG. 2 . As shown in FIG. 4 , during the assembly process of the
當蓋板10固定地組裝於殼體20後,蓋板10與殼體20之間的組裝結構完全隱藏在電子裝置100的內部。電子裝置100的外觀未外露任何固定元件。本發明可以提升電子裝置100的美觀。After the
[第二實施例][Second Embodiment]
請參閱圖6至圖10,為本發明第二實施例電子裝置100a。其與第一實施例的差異主要在於,本實施例設有兩個連接件30a。連接件30a可滑動地設置於蓋板10a的底面,且能位於一鎖扣位置或一解鎖位置,使蓋板10a在組合後以卡扣的方式固定於殼體20a。然而,本發明不限制於此。連接件的數量可以是一個以上,視蓋板10的形狀與尺寸而定。Please refer to FIG. 6 to FIG. 10 , which shows an
如圖6所示,每個連接件30a包括一板狀本體34、及多個滑行卡勾31。多個滑行卡勾31設置於板狀本體34上。本實施例的連接件30a可以是一金屬板經由沖壓而成,或者由塑膠注塑而成。多個滑行卡勾31經由沖壓一體成型地形成於板狀本體34。As shown in FIG. 6 , each connecting
相對應於兩個連接件30a,其中殼體20a的組裝壁22兩側各自包括多個滑接孔221a、222a,當連接件30a位於鎖扣位置,滑行卡勾31相對應地卡合於滑接孔221a、222a。Corresponding to the two
關於連接件30a可滑動地設置於蓋板10a的方式,具體的說,其中每個連接件30a的板狀本體34具有兩個長形通孔33。本實施例利用固持件S穿過每一長形通孔33且固定於蓋板10,從而限制連接件30能相對蓋板10滑動於長形通孔33內。在本實施例中,固持件S可以是螺絲,相對應地,板狀本體34形成類似於螺帽的螺接部15,供固持件S螺鎖於板狀本體34。然而,本發明不限制於此,例如,固持件可以是熱熔柱。Regarding the manner in which the connecting
此外,連接件30a還具有多個彈性部32,彈性部32一體成型地形成於板狀本體34,彈性部32的兩側呈鏤空狀,彈性部32朝向蓋板10突出,略呈V形,且抵接於蓋板10。藉此使連接件30a能緊迫地接觸蓋板10,避免意外滑動。In addition, the connecting
如圖6所示,本實施例移動連接件30a的方法具體說明如下,連接件30a形成一施力部37,施力部37可以是小圓孔。蓋板10a的組裝壁22形成一鏤空的操作孔227,操作孔227的長度大於施力部37的長度,施力部37對組裝壁22的正投影重疊操作孔227。然而,本發明不限制於此,施力部37可以是突出於操作孔227的元件,能供操作人員移動該連接件30a即可。As shown in FIG. 6 , the method of moving the connecting
本實施例的電子裝置100a組裝完成後,如圖7及圖8所示。蓋板10a固定地組裝於殼體20a,蓋板10a與殼體20a之間的組裝結構完全隱藏在電子裝置100a的內部。電子裝置100a的外觀未外露任何固定元件。After the
如圖9所示及圖9A所示,顯示本實施例的連接件30a位於解鎖位置。此時,施力部37鄰近操作孔227的一端(請同時參考圖8下方以虛線表示施力部37於解鎖時的位置,位置靠近操作孔227的左端)。同時,滑行卡勾31只位於滑接孔(221a、222a)內,並未卡合。操作者可以由殼體20的內部,利用一移動工具在操作孔227內推動施力部37,參圖8的移動方向D1。藉此可以移動連接件30a。As shown in FIG. 9 and FIG. 9A , the connecting
如圖10及圖10A所示,通過施力於施力部37以鄰近操作孔227的另一端,連接件30a被移到鎖扣位置,(請同時參考圖8,實線所表示施力部37的位置,靠近操作孔227的右端)。此時,滑行卡勾31滑動且卡合於滑接孔(221a、222a)內。藉此,連接件30a將蓋板10a固定地組裝於殼體20a。此外,本實施例藉由連接件30a的彈性部32提供的彈力,可以使連接件30a的滑行卡勾31抵緊於滑接孔(221a、222a)的周圍,透過摩擦力,連接件30a不會鬆脫滑動。As shown in FIG. 10 and FIG. 10A , by applying force to the other end of the
補充說明,其中組裝壁22形成兩個容置淺槽225,兩個容置淺槽225的位置對應於兩個連接件30a的位置,其中容置淺槽225的長度大於板狀本體34的長度,板狀本體34能滑行於容置淺槽225內。Supplementary explanation, the
本實施例的優點在於,操作者可以透過移動連接件30a,也就是由圖10的鎖扣狀態移動至圖9的解鎖狀態,蓋板10a即可以從殼體20a拆卸下來。The advantage of this embodiment is that the operator can move the connecting
[實施例的有益效果][Beneficial effects of the embodiment]
本發明的其中一有益效果在於,本發明所提供的電子裝置,其能通過“所述蓋板的所述多個固定卡勾相對應於所述殼體的所述多個卡合孔”以及“至少一連接件,設置於所述組裝壁與所述蓋板之間,以固定所述蓋板於所述殼體”的結構,可以完全隱藏組裝結構在電子裝置100的內部,以提升電子裝置100的美觀。One of the beneficial effects of the present invention is that the electronic device provided by the present invention can use "the plurality of fixed hooks of the cover plate to correspond to the plurality of engagement holes of the housing" and The structure of "at least one connector disposed between the assembly wall and the cover to fix the cover to the housing" can completely hide the assembly structure inside the
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.
100、100a:電子裝置100, 100a: Electronic devices
10、10a:蓋板10, 10a: Cover plate
11:第一側勾11: First side hook
111:第一豎臂111:First vertical arm
112:第一勾臂112:First hook arm
12:第二側勾12: Second side hook
121:第二豎臂121:Second vertical arm
122:第二勾臂122:Second hook arm
13:固定卡勾13: Fixed hook
132:勾部132: hook part
134:加強肋134: Reinforced ribs
15:螺接部15:Screw joint
20、20a:殼體20, 20a: Shell
21:側壁21:Side wall
22:組裝壁22:Assemble the wall
220:突垣220: sudden wall
221:第一側孔221: First side hole
222:第二側孔222:Second side hole
221a、222a:滑接孔221a, 222a: sliding hole
223:卡合孔223:Latching hole
225:容置淺槽225: Accommodation shallow tank
227:操作孔227: Operation hole
30、30a:連接件30, 30a: Connector
31:滑行卡勾31:Sliding hook
32:彈性部32: Elastic part
33:長形通孔33: Long through hole
34:板狀本體34:Plate body
37:施力部37: Department of force application
S:固持件S: Holding piece
D1:移動方向D1:Moving direction
圖1為本發明第一實施例的電子裝置的分解圖。FIG. 1 is an exploded view of the electronic device according to the first embodiment of the present invention.
圖2為本發明第一實施例的電子裝置的立體組合圖。FIG. 2 is a perspective assembly view of the electronic device according to the first embodiment of the present invention.
圖3為本發明第一實施例的電子裝置未組裝前的剖視圖。FIG. 3 is a cross-sectional view of the electronic device before assembly according to the first embodiment of the present invention.
圖4為本發明第一實施例的電子裝置組裝過程的剖視圖。4 is a cross-sectional view of the assembly process of the electronic device according to the first embodiment of the present invention.
圖5為本發明的電子裝置組合後沿圖2的V-V剖線的剖視圖。FIG. 5 is a cross-sectional view along the V-V line in FIG. 2 after the electronic device of the present invention is assembled.
圖6為本發明第二實施例的電子裝置的分解圖。FIG. 6 is an exploded view of the electronic device according to the second embodiment of the present invention.
圖7為本發明第二實施例的電子裝置的立體組合圖。FIG. 7 is a perspective assembly view of the electronic device according to the second embodiment of the present invention.
圖8為本發明第二實施例的電子裝置組裝後的仰視圖。FIG. 8 is a bottom view of the assembled electronic device according to the second embodiment of the present invention.
圖9為本發明第二實施例的電子裝置於解鎖狀態的剖視圖。FIG. 9 is a cross-sectional view of the electronic device in an unlocked state according to the second embodiment of the present invention.
圖9A是圖9的IXA部分的放大圖。FIG. 9A is an enlarged view of part IXA of FIG. 9 .
圖10為本發明的電子裝置於鎖扣狀態沿圖8的X-X剖線的剖視圖。FIG. 10 is a cross-sectional view of the electronic device of the present invention along the X-X line in FIG. 8 in a locked state.
圖10A是圖10的XA部分的放大圖。FIG. 10A is an enlarged view of part XA of FIG. 10 .
100:電子裝置 100: Electronic devices
10:蓋板 10:Cover
11:第一側勾 11: First side hook
112:第一勾臂 112:First hook arm
12:第二側勾 12: Second side hook
122:第二勾臂 122:Second hook arm
13:固定卡勾 13: Fixed hook
132:勾部 132: hook part
134:加強肋 134: Reinforced ribs
20:殼體 20: Shell
21:側壁 21:Side wall
22:組裝壁 22:Assemble the wall
220:突垣 220: sudden wall
221:第一側孔 221: First side hole
222:第二側孔 222:Second side hole
223:卡合孔 223:Latching hole
30:連接件 30: Connector
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111148356A TWI828478B (en) | 2022-12-16 | 2022-12-16 | Electronic device |
CN202311180904.2A CN118215238A (en) | 2022-12-16 | 2023-09-13 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111148356A TWI828478B (en) | 2022-12-16 | 2022-12-16 | Electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI828478B true TWI828478B (en) | 2024-01-01 |
TW202428094A TW202428094A (en) | 2024-07-01 |
Family
ID=90459050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111148356A TWI828478B (en) | 2022-12-16 | 2022-12-16 | Electronic device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN118215238A (en) |
TW (1) | TWI828478B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM267809U (en) * | 2004-11-19 | 2005-06-11 | Fih Co Ltd | Battery cover and shell assembly for portable electronic device |
TWM438097U (en) * | 2011-11-11 | 2012-09-21 | Wistron Corp | Electronic apparatus and the casing structure thereof |
US20120297689A1 (en) * | 2011-05-27 | 2012-11-29 | San-Pao Kao | Door structure |
CN104902706A (en) * | 2015-06-08 | 2015-09-09 | 廖婕 | High-precision assembling housing |
TW202102984A (en) * | 2019-07-12 | 2021-01-16 | 致伸科技股份有限公司 | Touch pad module |
-
2022
- 2022-12-16 TW TW111148356A patent/TWI828478B/en active
-
2023
- 2023-09-13 CN CN202311180904.2A patent/CN118215238A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM267809U (en) * | 2004-11-19 | 2005-06-11 | Fih Co Ltd | Battery cover and shell assembly for portable electronic device |
US20120297689A1 (en) * | 2011-05-27 | 2012-11-29 | San-Pao Kao | Door structure |
TWM438097U (en) * | 2011-11-11 | 2012-09-21 | Wistron Corp | Electronic apparatus and the casing structure thereof |
CN104902706A (en) * | 2015-06-08 | 2015-09-09 | 廖婕 | High-precision assembling housing |
TW202102984A (en) * | 2019-07-12 | 2021-01-16 | 致伸科技股份有限公司 | Touch pad module |
Also Published As
Publication number | Publication date |
---|---|
CN118215238A (en) | 2024-06-18 |
TW202428094A (en) | 2024-07-01 |
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