TWI828323B - Coupled antenna and electronic device - Google Patents
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Abstract
Description
本發明係關於一種天線結構及電子裝置，特別是關於一種耦合式天線及具有前述耦合式天線的電子裝置。The present invention relates to an antenna structure and an electronic device, and in particular to a coupled antenna and an electronic device having the aforementioned coupled antenna.
隨著無線通訊技術的快速發展，產品的天線增益越來越受到重視。現有行動式電子裝置(如筆記型電腦、平板電腦及手機)朝向輕、薄機身為主的趨勢進行發展，導致用來配置於系統主板上的雙頻天線的容置空間被嚴重地壓縮，使得天線增益的增幅受到限制。With the rapid development of wireless communication technology, more and more attention is paid to the antenna gain of products. Existing mobile electronic devices (such as laptops, tablets, and mobile phones) are developing towards a trend of light and thin bodies, resulting in the accommodation space for dual-band antennas configured on the system motherboard being severely compressed. This limits the increase in antenna gain.
有鑑於此，如何在行動式電子裝置的有限空間內仍然保有高天線增益，實為民眾所殷切企盼，亦係相關業者須努力研發突破的目標及方向。In view of this, how to maintain high antenna gain within the limited space of mobile electronic devices is a matter of great concern to the public, and it is also the goal and direction that relevant industry players must work hard to develop breakthroughs.
因此，本發明之目的在於提供一種耦合式天線及電子裝置，其在有限空間的條件下，透過配置間隔設置且彼此耦合的第一輻射部與第二輻射部在基板上，仍可達到雙頻且高天線增益效果。Therefore, the object of the present invention is to provide a coupled antenna and an electronic device that can achieve dual-band performance under limited space conditions by arranging a first radiating part and a second radiating part that are spaced apart and coupled to each other on a substrate. And high antenna gain effect.
依據本發明的一實施方式提供一種耦合式天線，其包含一基板、一第一輻射部、一第二輻射部以及一接地部。第一輻射部設置於基板且具有一第一長度。第一輻射部用以產生一第一頻帶的輻射場型。第二輻射部設置於基板且具有一第二長度。第二輻射部與第一輻射部間隔設置，且第二長度大於第一長度。接地部設置於基板，並連接第二輻射部。第一輻射部耦合第二輻射部，使第二輻射部用以產生一第二頻帶的輻射場型，且第一頻帶大於第二頻帶。According to an embodiment of the present invention, a coupled antenna is provided, which includes a substrate, a first radiating part, a second radiating part and a grounding part. The first radiating part is disposed on the substrate and has a first length. The first radiation part is used to generate a radiation field pattern of a first frequency band. The second radiating part is disposed on the substrate and has a second length. The second radiating part is spaced apart from the first radiating part, and the second length is greater than the first length. The ground part is provided on the substrate and connected to the second radiation part. The first radiating part is coupled to the second radiating part, so that the second radiating part is used to generate a radiation field pattern of a second frequency band, and the first frequency band is larger than the second frequency band.
依據本發明的另一實施方式提供一種電子裝置，其包含一系統主板以及如前述實施方式的耦合式天線。耦合式天線的基板為系統主板的一部分。According to another embodiment of the present invention, an electronic device is provided, which includes a system motherboard and a coupled antenna as in the foregoing embodiment. The substrate of the coupled antenna is part of the system motherboard.
請參照第1圖，其係繪示依照本發明的第一實施例的耦合式天線100的俯視示意圖。如第1圖所示，耦合式天線100包含一基板110、一第一輻射部200、一第二輻射部300以及一接地部400。基板110可為通訊設備中的一系統主板、一印刷電路板(Printed Circuit Board；PCB)、一FR4(Flame Retardant 4)基板或者是一柔性印刷電路板(Flexible Printed Circuit Board；FPCB)，但本發明不以此為限。第一輻射部200、第二輻射部300以及接地部400均設置於基板110的同一表面上。此外，第一輻射部200、第二輻射部300以及接地部400皆可由金屬材質製成，例如：銅、銀、鋁、鐵，或者是前述金屬的合金。第一輻射部200、第二輻射部300以及接地部400可透過電鍍以及/或3D列印技術製造於基板110上。Please refer to FIG. 1 , which is a schematic top view of a coupled antenna 100 according to a first embodiment of the present invention. As shown in FIG. 1 , the coupled antenna 100 includes a substrate 110 , a first radiating part 200 , a second radiating part 300 and a grounding part 400 . The substrate 110 may be a system motherboard in communication equipment, a printed circuit board (Printed Circuit Board; PCB), an FR4 (Flame Retardant 4) substrate, or a flexible printed circuit board (Flexible Printed Circuit Board; FPCB), but this invention The invention is not limited to this. The first radiating part 200 , the second radiating part 300 and the grounding part 400 are all disposed on the same surface of the substrate 110 . In addition, the first radiating part 200, the second radiating part 300 and the grounding part 400 can all be made of metal materials, such as copper, silver, aluminum, iron, or alloys of the aforementioned metals. The first radiating part 200, the second radiating part 300 and the grounding part 400 can be manufactured on the substrate 110 through electroplating and/or 3D printing technology.
於第1圖中，第一輻射部200具有一第一長度L 1，並用以產生一第一頻帶的輻射場型。第二輻射部300與第一輻射部200間隔設置並具有一第二長度L 2，且第二長度L 2大於第一長度L 1。第一輻射部200耦合第二輻射部300，使第二輻射部300用以產生一第二頻帶的輻射場型，且第一頻帶大於第二頻帶。接地部400連接第二輻射部300。接地部400可為一接地銅箔，其可延伸至基板110的外部，並耦接一系統接地。 In Figure 1, the first radiating part 200 has a first length L 1 and is used to generate a radiation field pattern in a first frequency band. The second radiating part 300 is spaced apart from the first radiating part 200 and has a second length L 2 , and the second length L 2 is greater than the first length L 1 . The first radiating part 200 is coupled to the second radiating part 300 so that the second radiating part 300 is used to generate a radiation field pattern of a second frequency band, and the first frequency band is larger than the second frequency band. The ground part 400 is connected to the second radiation part 300 . The ground portion 400 can be a ground copper foil, which can extend to the outside of the substrate 110 and be coupled to a system ground.
詳細地說，第一輻射部200可包含一饋入延伸段210與一高頻耦合段220。饋入延伸段210沿一第一方向D 1設置，並呈現一直條形。饋入延伸段的一端211耦接一饋入點(Feeding Point)F P。饋入點F P耦接一信號源S的一端，並接收一饋入訊號。信號源S可為一射頻(Radio Frequency，RF)模組，其用以激發耦合式天線100，且信號源S的另一端耦接一接地點G P。高頻耦合段220沿一第二方向D 2設置，並呈現一直條形。高頻耦合段的一端221連接饋入延伸段210，其中第二方向D 2垂直於第一方向D 1，藉以令饋入延伸段210與高頻耦合段220呈現一L形。 In detail, the first radiating part 200 may include a feeding extension section 210 and a high-frequency coupling section 220 . The feeding extension section 210 is arranged along a first direction D 1 and presents a straight strip shape. One end 211 of the feeding extension section is coupled to a feeding point (Feeding Point) F P . The feed point F P is coupled to one end of a signal source S and receives a feed signal. The signal source S may be a radio frequency (RF) module, which is used to excite the coupled antenna 100, and the other end of the signal source S is coupled to a ground point GP . The high-frequency coupling section 220 is arranged along a second direction D2 and presents a straight strip shape. One end 221 of the high-frequency coupling section is connected to the feed extension section 210, and the second direction D 2 is perpendicular to the first direction D 1 , so that the feed extension section 210 and the high-frequency coupling section 220 present an L shape.
第二輻射部300可包含一低頻延伸段310、一低頻耦合段320及一連接段330。低頻延伸段310沿第一方向D 1設置並呈現一直條形，且低頻延伸段310與第一輻射部200的饋入延伸段210間隔設置。低頻耦合段320沿第二方向D 2設置並呈現一直條形，且低頻耦合段的一端321連接低頻延伸段310，藉以令低頻延伸段310與低頻耦合段320呈現一L形。連接段330之二端分別連接於低頻耦合段320與接地部400之間。由於連接段330的長度小於等於0.5毫米，因此在產生第二頻帶的輻射場型時連接段330是可以被忽略不計的。 The second radiating part 300 may include a low frequency extension section 310 , a low frequency coupling section 320 and a connection section 330 . The low-frequency extension section 310 is arranged along the first direction D 1 and presents a straight strip shape, and the low-frequency extension section 310 is spaced apart from the feed extension section 210 of the first radiating part 200 . The low-frequency coupling section 320 is arranged along the second direction D 2 and presents a straight strip shape, and one end 321 of the low-frequency coupling section is connected to the low-frequency extension section 310 , so that the low-frequency extension section 310 and the low-frequency coupling section 320 present an L shape. The two ends of the connecting section 330 are respectively connected between the low-frequency coupling section 320 and the ground portion 400 . Since the length of the connecting section 330 is less than or equal to 0.5 mm, the connecting section 330 can be ignored when generating the radiation field pattern of the second frequency band.
特別的是，第二輻射部300的低頻耦合段320係與第一輻射部200的高頻耦合段220間隔設置，且低頻耦合段320相對於高頻耦合段220呈現平行，因此高頻耦合段220與低頻耦合段320之間可形成一耦合間隙CG。另外，第二輻射部300的第二長度L2與第一輻射部200的第一長度L1的一比值為1.5，藉以令第二輻射部300能夠產生第二頻帶的輻射場型。詳細地說，第一輻射部200的第一長度L1可介於10毫米至12毫米之間。第二輻射部300的第二長度L2可介於13毫米至18毫米之間。由第一輻射部200所產生第一頻帶可為一5G頻帶，且由第二輻射部300所產生的第二頻帶可為一2.4G頻帶，其中5G頻帶係介於5150MHz至5850MHz之間，2.4G頻帶係介於2400MHz至2500MHz之間。 In particular, the low-frequency coupling section 320 of the second radiating part 300 is spaced apart from the high-frequency coupling section 220 of the first radiating part 200, and the low-frequency coupling section 320 is parallel to the high-frequency coupling section 220, so the high-frequency coupling section A coupling gap C G can be formed between 220 and the low-frequency coupling section 320 . In addition, a ratio of the second length L 2 of the second radiating part 300 to the first length L 1 of the first radiating part 200 is 1.5, so that the second radiating part 300 can generate a radiation field pattern in the second frequency band. In detail, the first length L 1 of the first radiating part 200 may be between 10 mm and 12 mm. The second length L 2 of the second radiating part 300 may be between 13 mm and 18 mm. The first frequency band generated by the first radiating part 200 may be a 5G frequency band, and the second frequency band generated by the second radiating part 300 may be a 2.4G frequency band, where the 5G frequency band is between 5150MHz and 5850MHz, 2.4 The G-band is between 2400MHz and 2500MHz.
於第一實施例中，耦合式天線100的元件尺寸可如下列所述。第一輻射部200的第一長度L1可為10毫米，且其小於等於耦合式天線100的第一頻帶的0.25倍波長(即λ/4)。第二輻射部300的第二長度L2可為15毫米，且其小於等於耦合式天線100的第二頻帶的0.5倍波長(即λ/2)。耦合間隙CG的寬度可介於0.2毫米至3毫米之間。第一輻射部200與第二輻射部300在基板110所占的天線圖案空間約可為10毫米*10毫米，且天線銅箔的厚度可為2毫米。以上尺寸範圍係根據多次實驗結果而 求出，其有助於最佳化耦合式天線100的操作頻寬和阻抗匹配，但本發明不以此為限。 In the first embodiment, the component dimensions of the coupling antenna 100 may be as follows. The first length L 1 of the first radiating part 200 may be 10 mm, and is less than or equal to 0.25 times the wavelength of the first frequency band of the coupling antenna 100 (ie, λ/4). The second length L 2 of the second radiating part 300 may be 15 mm, and is less than or equal to 0.5 times the wavelength of the second frequency band of the coupling antenna 100 (ie, λ/2). The width of the coupling gap C G can be between 0.2 mm and 3 mm. The antenna pattern space occupied by the first radiating part 200 and the second radiating part 300 on the substrate 110 may be approximately 10 mm*10 mm, and the thickness of the antenna copper foil may be 2 mm. The above size range is obtained based on the results of multiple experiments, which helps to optimize the operating bandwidth and impedance matching of the coupled antenna 100, but the present invention is not limited thereto.
由此可見，本發明的耦合式天線100透過配置雙L形的第一輻射部200與第二輻射部300，可使得天線圖案在基板110所占的使用空間縮小，且第一輻射部200與第二輻射部300利用耦合方式來達到雙頻(即5G頻帶與2.4G頻帶)效果。再者，本發明的耦合式天線100可藉由改變耦合間隙CG的寬度，以調整耦合式天線100的阻抗匹配，進而提高天線增益。 It can be seen that by configuring the double L-shaped first radiating part 200 and the second radiating part 300 of the coupled antenna 100 of the present invention, the space occupied by the antenna pattern on the substrate 110 can be reduced, and the first radiating part 200 and the second radiating part 300 can be reduced. The second radiating part 300 uses a coupling method to achieve dual-band (ie, 5G frequency band and 2.4G frequency band) effect. Furthermore, the coupled antenna 100 of the present invention can adjust the impedance matching of the coupled antenna 100 by changing the width of the coupling gap CG , thereby improving the antenna gain.
請一併參照第1圖與第2圖，其中第2圖係繪示依照本發明的第二實施例的電子裝置500的俯視示意圖。如第2圖所示，電子裝置500可為一行動式電子裝置(Mobile Electronic Device)，例如：一智慧型手機(Smart Phone)、一平板電腦(Tablet Computer)，或者是一筆記型電腦(Notebook Computer)，且包含一系統主板510、一耦合式天線100以及複數環境元件(未另繪示)。耦合式天線100的基板110即為系統主板510的一部分，且系統主板510具有一撈空區域511與一環境元件區域512。環境元件區域512環繞撈空區域511。此些環境元件均設置於系統主板510的同一表面上，並位在環境元件區域512。耦合式天線100的基板110、第一輻射部200、第二輻射部300及接地部400均設置於系統主板510的前述表面上，在位在撈空區域511內。在其他實施例中，撈空區域可位在系統主板任何位置，因此本發明的撈空區域的配置位置不以第2圖所示為限。必須說明的是，第二實施例中的耦合式天線100可與第一實施例中的耦合式天線100相同或相似，且對應的元件及其配置在此不另贅述。Please refer to FIG. 1 and FIG. 2 together. FIG. 2 is a schematic top view of an electronic device 500 according to a second embodiment of the present invention. As shown in Figure 2, the electronic device 500 may be a mobile electronic device, such as a smart phone, a tablet computer, or a notebook computer. Computer), and includes a system motherboard 510, a coupling antenna 100 and a plurality of environmental components (not shown). The substrate 110 of the coupled antenna 100 is a part of the system motherboard 510, and the system motherboard 510 has a hollow area 511 and an environmental element area 512. The environmental element area 512 surrounds the hollow area 511 . These environmental components are all disposed on the same surface of the system motherboard 510 and are located in the environmental component area 512 . The substrate 110 , the first radiating part 200 , the second radiating part 300 and the grounding part 400 of the coupling antenna 100 are all disposed on the aforementioned surface of the system motherboard 510 and are located in the hollow area 511 . In other embodiments, the hollow area can be located at any position on the system motherboard. Therefore, the arrangement position of the hollow area of the present invention is not limited to that shown in Figure 2 . It must be noted that the coupled antenna 100 in the second embodiment may be the same as or similar to the coupled antenna 100 in the first embodiment, and the corresponding components and their configurations will not be described again here.
請一併參照第1圖、第2圖及第3圖，其中第3圖係繪示第2圖的電子裝置500中的耦合式天線100的模擬與實際量測的S參數(S Parameter)曲線圖。於第3圖中，橫軸代表頻率(MHz)，而縱軸代表S參數(dB)。當信號源S激發耦合式天線100時，第一輻射部200可涵蓋第一頻帶FB 1，且第二輻射部300可涵蓋第二頻帶FB 2。 Please refer to Figures 1, 2 and 3 together. Figure 3 shows the simulated and actual measured S parameter (S Parameter) curves of the coupled antenna 100 in the electronic device 500 in Figure 2. Figure. In Figure 3, the horizontal axis represents frequency (MHz), and the vertical axis represents S-parameter (dB). When the signal source S excites the coupled antenna 100, the first radiating part 200 may cover the first frequency band FB 1 , and the second radiating part 300 may cover the second frequency band FB 2 .
根據第3圖的S參數曲線圖，於第一頻帶FB 1的模擬中，耦合式天線100的隔離度(Isolation)(即S21參數的絕對值)約可達14.5 dB。於第一頻帶FB 1的實際量測中，耦合式天線100的隔離度約可達19.8 dB。另外，於第二頻帶FB 2的模擬中，耦合式天線100的隔離度約可達5.8 dB。於第二頻帶FB 2的實際量測中，耦合式天線100的隔離度約可達7.5 dB。由此可知，本發明的耦合式天線100可支援雙頻(即5G頻帶與2.4G頻帶)操作，且提供良好的射頻信號傳輸性能。 According to the S parameter curve in Figure 3, in the simulation of the first frequency band FB 1 , the isolation (Isolation) of the coupled antenna 100 (ie, the absolute value of the S21 parameter) can reach approximately 14.5 dB. In the actual measurement of the first frequency band FB 1 , the isolation of the coupled antenna 100 can reach approximately 19.8 dB. In addition, in the simulation of the second frequency band FB 2 , the isolation of the coupled antenna 100 can reach approximately 5.8 dB. In the actual measurement of the second frequency band FB 2 , the isolation of the coupled antenna 100 can reach approximately 7.5 dB. It can be seen from this that the coupled antenna 100 of the present invention can support dual-band (ie, 5G frequency band and 2.4G frequency band) operation and provide good radio frequency signal transmission performance.
下列表一列示出對耦合式天線100進行模擬與實際量測的天線增益(Peak Gain)，其中前述模擬係於電磁模擬分析軟體中進行，而電磁模擬分析軟體可為但不限於IE3D軟體、HFSS軟體或CST軟體。
表一
由表一可知，根據模擬或實際量測的結果，耦合式天線100在第一頻帶FB 1(即5150MHz至5850MHz)中的天線增益可大於5 dBi。另一方面，耦合式天線100在第二頻帶FB 2(即2400MHz至2500MHz)中的天線增益可大於2 dBi。由此可知，本發明的耦合式天線100除了可配置於電子裝置500的有限空間，以達到天線縮小化且降低生產成本，還能保持高天線增益並支援雙頻操作。 As can be seen from Table 1, according to simulation or actual measurement results, the antenna gain of the coupled antenna 100 in the first frequency band FB 1 (ie, 5150MHz to 5850MHz) can be greater than 5 dBi. On the other hand, the antenna gain of the coupled antenna 100 in the second frequency band FB 2 (ie, 2400 MHz to 2500 MHz) may be greater than 2 dBi. It can be seen from this that the coupled antenna 100 of the present invention can be configured in a limited space of the electronic device 500 to achieve antenna miniaturization and reduce production costs. It can also maintain high antenna gain and support dual-band operation.
請一併參照第4A圖、第4B圖、第5A圖及第5B圖，其中第4A圖係繪示第2圖的電子裝置500的耦合式天線100於第一頻帶FB 1下經由電磁模擬分析軟體量測後的遠場輻射場型圖；第4B圖係繪示第2圖的電子裝置500的耦合式天線100於第一頻帶FB 1下經由實際量測後的遠場輻射場型圖；第5A圖係繪示第2圖的電子裝置500的耦合式天線100於第二頻帶FB 2下經由電磁模擬分析軟體量測後的遠場輻射場型圖；以及第5B圖係繪示第2圖的電子裝置500的耦合式天線100於第二頻帶FB 2下經由實際量測後的遠場輻射場型圖。如圖所示，不論是模擬量測結果或實際量測結果均可以看出耦合式天線100的天線場型受到環境影響而變為指向性的遠場輻射場型圖，且遠場輻射場型的功率單位為分貝毫瓦(dBm)。 Please refer to Figures 4A, 4B, 5A and 5B together. Figure 4A illustrates the electromagnetic simulation analysis of the coupled antenna 100 of the electronic device 500 in Figure 2 under the first frequency band FB 1 . The far-field radiation pattern after software measurement; Figure 4B shows the far-field radiation pattern after actual measurement of the coupled antenna 100 of the electronic device 500 in Figure 2 under the first frequency band FB 1 ; Figure 5A shows the far-field radiation pattern measured by electromagnetic simulation analysis software under the second frequency band FB 2 of the coupled antenna 100 of the electronic device 500 in Figure 2; and Figure 5B shows the second The figure shows the far-field radiation pattern after actual measurement of the coupled antenna 100 of the electronic device 500 in the second frequency band FB 2 . As shown in the figure, whether it is a simulated measurement result or an actual measurement result, it can be seen that the antenna field pattern of the coupled antenna 100 is affected by the environment and becomes a directional far-field radiation field pattern, and the far-field radiation field pattern The power unit is decibel milliwatt (dBm).
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明的精神和範圍內，當可作各種的更動與潤飾，因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention is The scope shall be determined by the appended patent application scope.
100:耦合式天線 110:基板 200:第一輻射部 210:饋入延伸段 211:饋入延伸段的一端 220:高頻耦合段 221:高頻耦合段的一端 300:第二輻射部 310:低頻延伸段 320:低頻耦合段 321:低頻耦合段的一端 330:連接段 400:接地部 500:電子裝置 510:系統主板 511:撈空區域 512:環境元件區域 S:信號源 F P:饋入點 G P:接地點 C G:耦合間隙 D 1:第一方向 D 2:第二方向 L 1:第一長度 L 2:第二長度 FB 1:第一頻帶 FB 2:第二頻帶 100: Coupled antenna 110: Substrate 200: First radiating part 210: Feed extension section 211: One end of the feed extension section 220: High frequency coupling section 221: One end of the high frequency coupling section 300: Second radiation section 310: Low frequency extension section 320: low frequency coupling section 321: one end of the low frequency coupling section 330: connection section 400: grounding part 500: electronic device 510: system motherboard 511: hollow area 512: environmental component area S: signal source F P : feed Point G P : Ground point C G : Coupling gap D 1 : First direction D 2 : Second direction L 1 : First length L 2 : Second length FB 1: First frequency band FB 2 : Second frequency band
第1圖係繪示依照本發明的第一實施例的耦合式天線的俯視示意圖； 第2圖係繪示依照本發明的第二實施例的電子裝置的俯視示意圖； 第3圖係繪示第2圖的電子裝置中的耦合式天線的模擬與實際量測的S參數曲線圖； 第4A圖係繪示第2圖的電子裝置的耦合式天線於第一頻帶下經由電磁模擬分析軟體量測後的遠場輻射場型圖； 第4B圖係繪示第2圖的電子裝置的耦合式天線於第一頻帶下經由實際量測後的遠場輻射場型圖； 第5A圖係繪示第2圖的電子裝置的耦合式天線於第二頻帶下經由電磁模擬分析軟體量測後的遠場輻射場型圖；以及 第5B圖係繪示第2圖的電子裝置的耦合式天線於第二頻帶下經由實際量測後的遠場輻射場型圖。 Figure 1 is a schematic top view of a coupled antenna according to the first embodiment of the present invention; Figure 2 is a schematic top view of an electronic device according to a second embodiment of the present invention; Figure 3 is a graph showing simulated and actual measured S-parameter curves of the coupled antenna in the electronic device of Figure 2; Figure 4A shows the far-field radiation pattern measured by electromagnetic simulation analysis software under the first frequency band of the coupled antenna of the electronic device in Figure 2; Figure 4B shows the far-field radiation pattern after actual measurement under the first frequency band of the coupled antenna of the electronic device in Figure 2; Figure 5A shows the far-field radiation pattern of the coupled antenna of the electronic device in Figure 2 measured by electromagnetic simulation analysis software under the second frequency band; and Figure 5B shows the far-field radiation pattern after actual measurement under the second frequency band of the coupled antenna of the electronic device in Figure 2 .
100:耦合式天線 100: Coupled antenna
110:基板 110:Substrate
200:第一輻射部 200:First Radiation Department
210:饋入延伸段 210: Feed extension section
211:饋入延伸段的一端 211: Feed into one end of the extension
220:高頻耦合段 220: High frequency coupling section
221:高頻耦合段的一端 221: One end of the high frequency coupling section
300:第二輻射部 300:Second Radiation Department
310:低頻延伸段 310: Low frequency extension section
320:低頻耦合段 320: Low frequency coupling section
321:低頻耦合段的一端 321: One end of the low-frequency coupling section
330:連接段 330:Connection segment
400:接地部 400: Grounding part
S:信號源 S: signal source
FP:饋入點 F P :feed point
GP:接地點 G P :Ground point
CG:耦合間隙 C G : coupling gap
D1:第一方向 D 1 : first direction
D2:第二方向 D 2 : Second direction
L1:第一長度 L 1 : first length
L2:第二長度 L 2 : Second length
Claims (9)
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| CN202211089434.4A CN115663454A (en) | 2022-09-07 | 2022-09-07 | Coupling type antenna and electronic device |
| CN202211089434.4 | 2022-09-07 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080180333A1 (en) * | 2006-11-16 | 2008-07-31 | Galtronics Ltd. | Compact antenna |
| TW201324954A (en) * | 2011-12-08 | 2013-06-16 | Acer Inc | Multiband antenna |
| US20150236422A1 (en) * | 2014-02-20 | 2015-08-20 | Wistron Neweb Corporation | Broadband antenna |
| TW201944652A (en) * | 2018-04-16 | 2019-11-16 | 宏碁股份有限公司 | Antenna structure |
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- 2022-09-07 CN CN202211089434.4A patent/CN115663454A/en active Pending
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080180333A1 (en) * | 2006-11-16 | 2008-07-31 | Galtronics Ltd. | Compact antenna |
| TW201324954A (en) * | 2011-12-08 | 2013-06-16 | Acer Inc | Multiband antenna |
| US20150236422A1 (en) * | 2014-02-20 | 2015-08-20 | Wistron Neweb Corporation | Broadband antenna |
| TW201944652A (en) * | 2018-04-16 | 2019-11-16 | 宏碁股份有限公司 | Antenna structure |
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