TWI826327B - Manufacturing method of electronic device - Google Patents

Abstract

An electronic device includes a display module, a protection cover, a first light shielding layer, a light guide plate, a light source, a touch sensitive film, a first optical adhesive, a light shielding element, and a second light shielding layer. The protection cover is above the display module. The first light shielding layer connects a bottom surface of the protection cover, and is configured to define a non-visible area of the electronic device. The light guide plate is located on the display module and overlaps the non-visible area. The light source is located on the display module and adjacent to the light guide plate. The touch sensitive film is above the light guide plate. The first optical adhesive is located between the touch sensitive film and the protection cover. The light shielding element is located on the display module and overlaps the non-visible area. The second light shielding layer is located on the touch sensitive film and overlaps the light shielding element. The second light shielding layer is configured to absorb light transmitted in the touch sensitive film and the first optical adhesive in the non-visible area.

Description

Manufacturing method of electronic device

The present disclosure relates to an electronic device and a manufacturing method of the electronic device.

Touch display modules have been used in various types of electronic devices, such as smartphones, tablets and digital cameras. The aforementioned electronic device may have a visible area of the screen and a non-visible area surrounding the visible area. The non-visible area can be provided with icons for users to touch to operate the electronic device.

However, in order to allow users to easily identify the position of the icon, a backlight module is usually provided below the icon. However, in addition to lighting up the icon, the light from the backlight module may also pass through the touch-sensitive film above the backlight module. The optical glue is transferred laterally to the viewing area of the screen, causing light leakage in the viewing area, affecting product yield and product competitiveness, and is not conducive to the user's visual experience.

One technical aspect of the present disclosure is an electronic device.

According to some embodiments of the present disclosure, an electronic device includes a display module, a protective cover, a first light-shielding layer, a light guide plate, a light source, a touch-sensitive film, a first optical glue, a light-shielding member, and a second light-shielding layer. The protective cover is located above the display module. The first light-shielding layer is connected to the bottom surface of the protective cover. The first light-shielding layer is configured to define a non-visible area of the electronic device. The light guide plate is located on the display module and overlaps in the non-visible area. The light source is located on the display module and adjacent to the light guide plate. The touch-sensitive film is located above the light guide plate. The first optical glue is located between the touch sensing film and the protective cover. The light-shielding component is located on the display module and overlaps the non-visible area. The second light-shielding layer is located on the touch-sensitive film and overlaps the light-shielding member. The second light-shielding layer is configured to absorb light transmitted in the touch-sensitive film and the first optical glue in the non-visible area.

In some embodiments, the second light-shielding layer is located between the first optical glue and the touch-sensitive film.

In some embodiments, the second light-shielding layer is surrounded by the first optical glue and is located between the first light-shielding layer and the touch-sensitive film.

In some embodiments, the electronic device further includes a third light-shielding layer. The third light-shielding layer is located in the non-visible area, and the touch-sensitive film is located between the second light-shielding layer and the third light-shielding layer.

In some embodiments, the second light-shielding layer and the third light-shielding layer are respectively located on the top surface and the bottom surface of the touch-sensitive film.

In some embodiments, the second light-shielding layer and the third light-shielding layer at least partially overlap.

In some embodiments, the top surface of the light-shielding member is in contact with the third light-shielding layer.

In some embodiments, the width of the third light-shielding layer is substantially the same as the width of the second light-shielding layer.

In some embodiments, the above-mentioned light guide plate is located between the light shielding member and the light source.

In some embodiments, the above-mentioned first light-shielding layer has an icon opening. The icon opening is located above the light guide plate and configured to allow light from the light guide plate to pass through.

In some embodiments, the first optical glue is located between the first light-shielding layer and the second light-shielding layer.

In some embodiments, the top surface of the light shielding member is higher than the top surface of the light guide plate and the top surface of the light source.

In some embodiments, the electronic device further includes a flexible circuit board. The flexible circuit board is located on the display module, and the light shield, light guide plate and light source are located on the flexible circuit board.

In some embodiments, the electronic device further includes a second optical glue. The second optical glue is located between the display module and the touch-sensitive film, and the light shielding member is located between the second optical glue and the light guide plate.

In some embodiments, the width of the second light-shielding layer is greater than the width of the light-shielding member.

Another technical aspect of the present disclosure is a manufacturing method of an electronic device.

According to some embodiments of the present disclosure, a manufacturing method of an electronic device includes forming a first light-shielding layer on a protective cover; forming a first optical glue and a second light-shielding layer on a touch-sensitive film; using the first optical glue to affix the protective cover to Close the touch-sensitive film so that the first optical glue is located between the touch-sensitive film and the protective cover; and fit the touch-sensitive film to the display module.

In the above embodiments of the present disclosure, since the second light-shielding layer is located on the touch-sensitive film and overlaps with the light-shielding member, when the light source emits light, although the touch-sensitive film and the first optical glue above the light guide plate will transmit light laterally, However, it will be absorbed by the second light-shielding layer in the non-visible area and will not be transmitted to the visible area of the electronic device. In this way, it can be ensured that the light of the light guide plate passes through the icon opening of the light-shielding layer and will not enter the visible area and cause light leakage in the visible area. This can improve product yield and product competitiveness, and is beneficial to the user's vision. experience. In addition, the second light-shielding layer located on the touch-sensitive film will not affect the circuit design of the touch-sensitive film.

The following disclosure of embodiments provides many different implementations, or examples, for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present application. Of course, these examples are examples only and are not intended to be limiting. Additionally, reference symbols and/or letters may be repeated in each instance. This repetition is for simplicity and clarity and does not by itself specify a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as “below,” “below,” “lower,” “above,” “upper,” and the like may be used herein for convenience of description, to describe The relationship of one element or feature to another element or feature is illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

FIG. 1 illustrates a top view of an electronic device 100 according to an embodiment of the present disclosure. Figure 2 illustrates a cross-sectional view of the electronic device 100 of Figure 1 along line 2-2. Referring to Figures 1 and 2 at the same time, the electronic device 100 includes a display module 110, a protective cover 120, a first light-shielding layer 130, a light source 140, a light guide plate 150, a touch-sensitive film 160, a first optical glue 170, and a light-shielding member. 180 and the second light-shielding layer 130a. The protective cover 120 is located above the display module 110 . The first light-shielding layer 130 is connected to the bottom surface 122 of the protective cover 120 . The first light-shielding layer 130 is configured to define the non-visible area 104 of the electronic device 100, such as the area on the right side of the dotted line L in Figure 2. In this article, the non-visible area 104 means an area overlapping the first light-shielding layer 130 . In addition, the electronic device 100 has a visible area 102 surrounded by a non-visible area 104, such as the area to the left of the dotted line L in Figure 2, for displaying images. The light guide plate 150 is located on the display module 110 and overlaps the non-visible area 104 . The light source 140 is located on the display module 110 and adjacent to the light guide plate 150 . The touch-sensitive film 160 is located above the light guide plate 150 . The first optical glue 170 is located between the touch-sensitive film 160 and the protective cover 120 . The light-shielding member 180 is located on the display module 110 and overlaps the non-visible area 104 . The second light-shielding layer 130a is located on the touch-sensitive film 160 and overlaps the light-shielding member 180 . In this embodiment, the second light-shielding layer 130a is located between the first optical glue 170 and the touch-sensitive film 160, and can absorb the light transmitted between the first optical glue 170 and the touch-sensitive film 160.

In addition, the first light-shielding layer 130 has an icon opening 132 . The icon opening 132 is located above the light guide plate 150 and can be pressed by the user to cause the touch-sensitive film 160 to transmit corresponding signals to control the electronic device 100 . In Figure 1, the second light-shielding layer 130a is located between the viewing area 102 and the icon opening 132.

Figure 3 shows a schematic diagram of the optical path of the electronic device 100 in Figure 2 when used. Referring to Figures 2 and 3 at the same time, when the light source 140 emits light, the light guide plate 150 can receive the light from the light source 140 and emit light from its light emitting surface (such as the top surface 152). The light guide plate 150 can emit upward light L1 and oblique light L2 and L3. The icon opening 132 of the first light-shielding layer 130 allows the light L1 of the light guide plate 150 to pass through, so that users outside the protective cover 120 can see the lit icon opening 132 . In addition, the first light-shielding layer 130 and the second light-shielding layer 130a can absorb the light L2 transmitted in the first optical glue 170 in the non-visible area 104, and the second light-shielding layer 130a can further absorb the light L2 transmitted in the touch-sensitive film 160. of ray L3.

Specifically, since the second light-shielding layer 130a is located on the touch-sensitive film 160 and overlaps with the light-shielding member 180, when the light source 140 emits light, although the touch-sensitive film 160 and the first optical glue 170 above the light guide plate 150 will respectively The light L3 and L2 are laterally transmitted, but will be absorbed by the second light-shielding layer 130a in the non-visible area 104, and will not be transmitted to the visible area 102 of the electronic device 100. In this way, it can be ensured that the light of the light guide plate 150 passes through the icon opening 132 of the first light-shielding layer 130 and will not enter the visible area 102 and cause light leakage in the visible area 102, which can improve product yield and product competitiveness. And it is beneficial to the user’s visual experience. In addition, the second light-shielding layer 130a located on the touch-sensitive film 160 will not affect the circuit design of the touch-sensitive film 160.

In this embodiment, the electronic device 100 may further include a third light-shielding layer 130b. The third light-shielding layer 130b is located in the non-visible area 104, and the touch-sensitive film 160 is located between the second light-shielding layer 130a and the third light-shielding layer 130b. The second light-shielding layer 130a and the third light-shielding layer 130b are respectively located on the top surface 162 and the bottom surface 164 of the touch-sensitive film 160. When the light source 140 emits light, the third light-shielding layer 130b can further absorb the light L3 transmitted in the touch-sensitive film 160. In addition, the top surface 182 of the light shielding member 180 can contact the third light shielding layer 130b, which can effectively prevent the light from the light guide plate 150 from being transmitted laterally and directly entering the viewing area 102.

In this embodiment, the light source 140 may be a light emitting diode. The light-shielding member 180 may be light-shielding foam, such as black foam, to block light and absorb light. The display module 110 may be a liquid crystal (LCD) module. The protective cover 120 may be a glass piece. The first light-shielding layer 130 may be black ink, which is printed on the bottom surface 122 of the protective cover 120 to define the non-visible area 104 of the electronic device 100 . The second light-shielding layer 130a may be black ink, which is printed on the touch-sensitive film 160. The touch-sensitive film 160 and the first optical glue 170 are both transparent and allow light to pass through. The first optical adhesive 170 may be optical clear adhesive (Optical clear adhesive; OCA). The above materials are not intended to limit the present disclosure. In other implementations, different materials with similar functions can be selected according to design requirements. The electronic device 100 can be a smart phone, a tablet computer or a digital camera, but is not limited to the above devices.

In addition, the light guide plate 150 is located between the light shielding member 180 and the light source 140 to ensure that the light emitted from the side of the light guide plate 150 does not directly enter the viewing area 102 . In this embodiment, the top surface 182 of the light shielding member 180 is higher than the top surface 152 of the light guide plate 150 and the top surface 142 of the light source 140 , which can effectively prevent light from being transmitted laterally to the viewing area 102 . The first optical glue 170 is located between the first light-shielding layer 130 and the second light-shielding layer 130a, so that the second light-shielding layer 130a is attached by the first optical glue 170.

In addition, the electronic device 100 further includes a flexible circuit board 190 . The flexible circuit board 190 is located on the display module 110 , in which the light shielding member 180 , the light guide plate 150 and the light source 140 are located on the flexible circuit board 190 . The flexible circuit board 190 is electrically connected to the light source 140 to power the light source 140 . In this embodiment, the electronic device 100 further includes a second optical glue 170a. The second optical glue 170a is located between the display module 110 and the touch-sensitive film 160, and is used to attach the touch-sensitive film 160 to the display module 110. The light-shielding member 180 is located between the second optical glue 170a and the light guide plate 150 to prevent light from the light guide plate 150 from being transmitted to the second optical glue 170a in the visible area 102 and causing light leakage.

Referring to Figures 1 and 2 at the same time, the width W1 of the second light-shielding layer 130a is greater than the width W of the light-shielding member 180. Therefore, the second light-shielding layer 130a can be extended to a position above the light guide plate 150 near the icon opening 132 to increase the light absorption range. . The second light shielding layer 130a and the third light shielding layer 130b at least partially overlap. In this embodiment, the width W2 of the third light-shielding layer 130b is substantially the same as the width W1 of the second light-shielding layer 130a. Through the above design, the second light-shielding layer 130a and the third light-shielding layer 130b in Figure 1 can have the same outline.

It should be understood that the connection relationships, materials and functions of the components that have been described will not be repeated and will be explained first. In the following description, other types of electronic devices will be described.

FIG. 4 illustrates a cross-sectional view of an electronic device 100a according to another embodiment of the present disclosure, and its cross-sectional position is the same as that of FIG. 2 . Figure 5 shows a schematic diagram of the optical path of the electronic device 100a in Figure 4 when used. Referring to Figures 4 and 5 at the same time, the electronic device 100a includes a display module 110, a protective cover 120, a first light-shielding layer 130, a light source 140, a light guide plate 150, a touch-sensitive film 160, a first optical glue 170, and a light-shielding member. 180 and the second light-shielding layer 130c. The difference between this embodiment and the embodiment in Figure 2 is that the second light-shielding layer 130c is surrounded by the first optical glue 170. In this embodiment, the second light-shielding layer 130c is located between the first light-shielding layer 130 and the touch-sensitive film 160, and the second light-shielding layer 130c is in contact with the bottom surface of the first light-shielding layer 130. In this embodiment, the second light-shielding layer 130c may be black optical glue or black tape (such as double-sided tape).

Through the above design, when the light source 140 emits light, the second light-shielding layer 130c can prevent the light (such as the light L2 in Figure 3) transmitted in the first optical glue 170 from being formed. In addition, although the touch-sensitive film 160 above the light guide plate 150 will transmit the light L3 laterally, it will be absorbed by the second light-shielding layer 130c in the non-visible area 104 and will not be transmitted to the visible area 102 of the electronic device 100a. In this way, it can be ensured that the light of the light guide plate 150 passes through the icon opening 132 of the first light-shielding layer 130 and will not enter the visible area 102 and cause light leakage in the visible area 102, which can improve product yield and product competitiveness. And it is beneficial to the user’s visual experience.

In addition, in other embodiments, a third light-shielding layer 130b as shown in Figure 2 can also be disposed between the touch-sensitive film 160 and the light-shielding member 180 of the electronic device 100a in Figure 4.

In the following description, a method of manufacturing an electronic device will be described.

FIG. 6 illustrates a flow chart of a manufacturing method of an electronic device according to an embodiment of the present disclosure. The manufacturing method of the electronic device includes the following steps. In step S1, a first light-shielding layer is formed on the protective cover. Then in step S2, a first optical glue and a second light-shielding layer are formed on the touch-sensitive film. Subsequently in step S3, the first optical glue is used to attach the protective cover to the touch-sensitive film, so that the first optical glue is located between the touch-sensitive film and the protective cover. Then in step S4, the touch-sensitive film is attached to the display module. In some embodiments, the manufacturing method of the electronic device is not limited to the above-mentioned steps S1 to S4. For example, other steps may be further included between the two previous and subsequent steps. For example, steps S1 to S4 may also include multiple more detailed steps respectively. . In the following description, each step of the manufacturing method of the above-mentioned electronic device will be described.

Referring to FIG. 2 , the first light-shielding layer 130 may be formed on the protective cover 120 . In addition, the first optical glue 170 and the second light-shielding layer 130a may be formed on the touch-sensitive film 160. In this embodiment, the second light-shielding layer 130a can be black ink, which can be printed on the touch-sensitive film 160 first, and then the first optical glue 170 is attached to cover the second light-shielding layer 130a and the touch-sensitive film 160. Then, the first optical glue 170 can be used to attach the protective cover 120 to the touch-sensitive film 160 so that the first optical glue 170 is located between the touch-sensitive film 160 and the protective cover 120 . In subsequent processes, the second optical glue 170a can be used to bond the touch-sensitive film 160 to the display module 110.

Please refer to FIG. 4 . The difference from the formation method of the electronic device 100 in FIG. 3 lies in the formation method of the first optical glue 170 and the second light-shielding layer 130 c of the electronic device 100 a on the touch-sensitive film 160 . In this embodiment, the second light-shielding layer 130c may be black optical glue or black tape (such as double-sided tape).

When the second light-shielding layer 130c is black optical glue, the liquid second light-shielding layer 130c can be coated on the touch-sensitive film 160 first, and then the liquid first optical glue 170 can be coated on the touch-sensitive film 160, so that The first optical glue 170 is adjacent to the second light-shielding layer 130c. After the coating is completed, the first optical glue 170 and the second light-shielding layer 130c can be cured by ultraviolet light irradiation or heating. In some embodiments, the second light-shielding layer 130c can be cured before applying the liquid first optical glue 170, which is not intended to limit this disclosure.

In another embodiment, when the first optical glue 170 is in the form of a film and the second light-shielding layer 130c is a black optical glue, the first optical glue 170 can be attached to the touch-sensitive film 160 first, and then the second light-shielding layer 130c can be coated. The light-shielding layer 130c is on the touch-sensitive film 160, so that the second light-shielding layer 130c is adjacent to the first optical glue 170. After the coating is completed, the second light-shielding layer 130c can be cured by ultraviolet light irradiation or heating.

In another embodiment, when the second light-shielding layer 130c is a black tape, the second light-shielding layer 130c can be attached to the touch-sensitive film 160 first, and then the liquid first optical glue 170 can be applied to the touch-sensitive film. 160, the first optical glue 170 is adjacent to the second light-shielding layer 130c. After the coating is completed, the first optical glue 170 can be cured by ultraviolet light irradiation or heating.

Through the above steps, the first optical glue 170 and the second light-shielding layer 130c can be formed on the touch-sensitive film 160. Then, the first optical glue 170 can be used to attach the protective cover 120 to the touch-sensitive film 160 so that the first optical glue 170 is located between the touch-sensitive film 160 and the protective cover 120 . In subsequent processes, the second optical glue 170a can be used to bond the touch-sensitive film 160 to the display module 110.

FIG. 7 illustrates a top view of an electronic device 100b according to yet another embodiment of the present disclosure. The difference from the embodiment of FIG. 1 is that the electronic device 100b further includes icon openings 132a and 132b in addition to the icon opening 132, and the lengths of the second light-shielding layer 130a and the third light-shielding layer 130b are longer. In this embodiment, the second light-shielding layer 130a and the third light-shielding layer 130b extend at least from the left side of the icon opening 132 to the right side of the icon opening 132b. In this way, the second light-shielding layer 130a and the third light-shielding layer 130b are located between any one of the icon openings 132, 132a, 132b and the viewable area 102. With such a design, when one or more of the icon openings 132, 132a, and 132b are lit, only the single second light-shielding layer 130a and the single third light-shielding layer 130b can be used to absorb the light transmitted in the non-visible area 104. Save manufacturing and assembly costs.

In addition, the configuration of the second light-shielding layer 130a can be replaced by the configuration of the second light-shielding layer 130c in Figure 4, depending on the design requirements, and is not intended to limit the present disclosure.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can be variously changed, substituted, and altered herein without departing from the spirit and scope of the present disclosure.

100,100a,100b: Electronic devices 102:Visual area 104:Non-visible area 110:Display module 120:Protective cover 122: Bottom surface 130: First light shielding layer 130a, 130c: second light-shielding layer 130b: The third light-shielding layer 132,132a,132b: Icon opening 140:Light source 142:Top surface 150:Light guide plate 152:Top surface 160:Touch sensitive film 162:Top surface 164: Bottom 170:The first optical glue 170a: Second optical glue 180: Shading parts 182:Top surface 190:Flexible circuit board 2-2: Line segment L: dashed line L1, L2, L3: light S1, S2, S3, S4: steps W, W1, W2: Width

Aspects of the present disclosure are best understood from the following description of implementations when read in conjunction with the accompanying figures. Note that in accordance with standard practice in this industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Figure 1 illustrates a top view of an electronic device according to an embodiment of the present disclosure. Figure 2 shows a cross-sectional view of the electronic device in Figure 1 along line 2-2. Figure 3 shows a schematic diagram of the optical path of the electronic device in Figure 2 when used. FIG. 4 illustrates a cross-sectional view of an electronic device according to another embodiment of the present disclosure. The cross-sectional position is the same as that of FIG. 2 . Figure 5 shows a schematic diagram of the optical path of the electronic device in Figure 4 when used. FIG. 6 illustrates a flow chart of a manufacturing method of an electronic device according to an embodiment of the present disclosure. FIG. 7 illustrates a top view of an electronic device according to another embodiment of the present disclosure.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100: Electronic devices

102:Visual area

104:Non-visible area

110:Display module

120:Protective cover

122: Bottom surface

130: First light shielding layer

130a: Second light shielding layer

130b: The third light-shielding layer

132:Icon opening

140:Light source

142:Top surface

150:Light guide plate

152:Top surface

160:Touch sensitive film

162:Top surface

164: Bottom

170:The first optical glue

170a: Second optical glue

180: Shading parts

182:Top surface

190:Flexible circuit board

L: dashed line

W, W1, W2: Width

Claims (10)

A method of manufacturing an electronic device, including: forming a first light-shielding layer on a protective cover; forming a first optical glue and a second light-shielding layer on a touch-sensitive film; using the first optical glue to seal the protective cover Fit the touch-sensitive film so that the first optical glue is located between the touch-sensitive film and the protective cover; and fit the touch-sensitive film to a display module, with a light-shielding member located on the on the display module and overlaps with the second light-shielding layer. The manufacturing method of an electronic device as claimed in claim 1, wherein the second light-shielding layer is black ink, and forming the first optical glue and the second light-shielding layer on the touch-sensitive film includes: printing the second light-shielding layer layered on the touch-sensitive film. The manufacturing method of an electronic device according to claim 2, wherein forming the first optical glue and the second light-shielding layer on the touch-sensitive film further includes: attaching the first optical glue to cover the second light-shielding layer with this touch-sensitive membrane. The manufacturing method of an electronic device as claimed in claim 1, wherein the second light-shielding layer is black optical glue, and forming the first optical glue and the second light-shielding layer on the touch-sensitive film includes: Coating the liquid second light-shielding layer on the touch-sensitive film; and coating the liquid first optical glue on the touch-sensitive film so that the first optical glue is adjacent to the second light-shielding layer. The method of manufacturing an electronic device according to claim 4 further includes: coating the first optical glue in a liquid state on the touch-sensitive film, and curing the first optical glue and the second light-shielding layer with ultraviolet light. The manufacturing method of an electronic device as claimed in claim 4, further comprising: coating the liquid second light-shielding layer on the touch-sensitive film and coating the liquid first optical glue on the touch-sensitive film. Before, the second light-shielding layer is cured with ultraviolet light. The manufacturing method of an electronic device as claimed in claim 1, wherein the first optical glue is in the form of a film and the second light-shielding layer is black optical glue, and the first optical glue and the second light-shielding layer are formed in the contact The sensing film includes: attaching the first optical glue to the touch-sensitive film; and coating the second light-shielding layer on the touch-sensitive film so that the second light-shielding layer is adjacent to the first optical glue. The manufacturing method of the electronic device as described in claim 7, further It includes: after coating the second light-shielding layer on the touch-sensitive film, curing the second light-shielding layer with ultraviolet light. The manufacturing method of an electronic device as claimed in claim 1, wherein the second light-shielding layer is a black tape, and forming the first optical glue and the second light-shielding layer on the touch-sensitive film includes: affixing the second a light-shielding layer on the touch-sensitive film; and coating the liquid first optical glue on the touch-sensitive film so that the first optical glue is adjacent to the second light-shielding layer. The method of manufacturing an electronic device according to claim 9 further includes: coating the first optical glue in a liquid state on the touch-sensitive film, and curing the first optical glue with ultraviolet light.

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