TWI825292B - Wafer surface particle cleaning nozzle - Google Patents

Abstract

The invention provides a wafer surface particle cleaning nozzle including a liquid delivery pipe and an atomization device. The liquid delivery pipe is connected to the atomization device. The atomization device is used to atomize the cleaning liquid delivered by the liquid delivery pipe into droplets. , to apply droplets directly to the wafer surface. The above-mentioned atomization device atomizes the cleaning liquid transported by the above-mentioned liquid transport pipe into droplets to directly act on the wafer surface, avoiding the use of droplet transport equipment, reducing the complexity of the equipment, and at the same time reducing the amount of liquid in the wafer surface. The mutual combination during the transfer process can ensure the size of the droplets, and the droplet speed can be adjusted by adjusting the hydraulic pressure in the liquid delivery pipe. The droplet speed adjustment is accurate and convenient.

Description

Wafer surface particle cleaning nozzle

The invention relates to the technical field of wafer cleaning, and in particular to a wafer surface particle cleaning nozzle.

Wafer cleaning is an important process in the field of wafer manufacturing. The effect of wafer cleaning determines the yield of wafer manufacturing.

In the field of wafer manufacturing, the manufacturing yield of wafers below 90 nanometers has begun to decline. The main reason is that particles on the wafer are difficult to clean. As the semiconductor process moves from 2D to 3D, cleaning wafers with patterned structures is much more difficult than cleaning wafers with flat surfaces. Moreover, as the line width decreases and the depth ratio increases, the difficulty of cleaning the wafer increases greatly. In the existing technology, there are two types of wafer cleaning nozzles. One is an ordinary wafer cleaning nozzle. This nozzle needs to be equipped with an atomization device independent of the nozzle, but the droplets are easy to combine with each other during the transportation process, causing the size of the droplets to change. It is too large and cannot achieve the ideal cleaning effect; another type of wafer cleaning nozzle has a liquid delivery pipe and a gas delivery pipe. The inert gas delivered by the gas delivery pipe atomizes the cleaning liquid delivered by the liquid delivery pipe, but the droplet size is not easy to control. , unable to achieve the ideal cleaning effect.

Therefore, it is necessary to provide a new type of wafer surface particle cleaning nozzle to solve the above problems existing in the prior art.

The object of the present invention is to provide a wafer surface particle cleaning nozzle that facilitates the generation of droplets and the control of the droplet speed to ensure the cleaning effect.

In order to achieve the above object, the above-mentioned wafer surface particle cleaning nozzle of the present invention includes a liquid delivery pipe and an atomization device. The above-mentioned liquid delivery pipe is connected to the above-mentioned atomization device. The above-mentioned atomization device is used to transport the cleaning liquid transported by the above-mentioned liquid delivery pipe. Atomize into droplets and apply the droplets directly to the wafer surface.

The beneficial effect of the present invention is that the above-mentioned wafer surface particle cleaning nozzle includes a liquid delivery pipe and an atomization device. The above-mentioned atomization device atomizes the cleaning liquid delivered by the above-mentioned liquid delivery pipe into droplets, so that the droplets can be directly applied to the wafer. surface, avoids the use of droplet transport equipment, reduces the complexity of the equipment, and reduces the mutual combination of liquids during the transfer process, which can ensure the size of the droplets, and by adjusting the hydraulic pressure in the above-mentioned liquid transport pipe. The droplet speed can be adjusted accurately and conveniently.

According to one embodiment, the above-mentioned wafer surface particle cleaning nozzle further includes a shell and a sealing part. The above-mentioned shell and the above-mentioned sealing part are connected to form a built-in space. The above-mentioned atomizing device is provided in the above-mentioned built-in space, and the above-mentioned liquid delivery pipe is provided in the above-mentioned sealing part. superior. The beneficial effect is that the above-mentioned outer shell and the above-mentioned sealing part are connected to form a built-in space, which can protect the atomization device and prevent damage due to collision.

According to another embodiment, the built-in space is also provided with a gas-liquid mixing guide part and a gas-liquid mixing part that are connected to each other. The sealing part is also provided with a gas delivery pipe, and the gas delivery pipe is connected with the gas guide part. The gas The guide part communicates with the gas-liquid mixing part, and the gas-liquid mixing part communicates with the outside of the housing. The beneficial effect is that it is convenient to further adjust the speed of the droplets by introducing inert gas.

According to another embodiment, the sealing part includes an inner shell and an upper pressure block, and the upper pressure block is detachably connected to the inner shell. The beneficial effect is that the above-mentioned upper pressing block can fix the inner shell.

According to yet another embodiment, the inner shell is threadedly connected to the outer shell. The beneficial effect is that it is convenient to disassemble the above-mentioned inner shell and the above-mentioned outer shell to clean the interior.

According to another embodiment, the inner shell is provided with a temporary liquid storage tank, and the temporary liquid storage tank is connected to the liquid delivery pipe and the atomization device. The beneficial effect is that by connecting the temporary liquid storage tank to the atomization device, it is only necessary to match the temporary liquid storage tank with the atomization device, and there is no need to match the liquid delivery pipe with the atomization device. , can reduce the cross-sectional area of the above-mentioned liquid delivery pipe and save space.

According to another embodiment, the above-mentioned sealing part is further provided with a loop part, the above-mentioned loop part includes a first loop part and a second loop part connected to each other, and a pipe valve is provided on one end of the above-mentioned first loop part , one end of the second loop portion is connected to the temporary liquid storage tank. The beneficial effect is that the above-mentioned loop part facilitates the discharge of foam or residual cleaning liquid generated by the above-mentioned atomization device in the above-mentioned temporary liquid storage tank.

According to another embodiment, the inner shell is further provided with a liquid delivery pipe sleeve and a gas delivery pipe sleeve. The liquid delivery pipe sleeve is sleeved on the outside of the liquid delivery pipe, and the gas delivery pipe sleeve is sleeved on the outside of the gas delivery pipe. . The beneficial effect is that it is convenient to respectively fix the liquid delivery pipe and the gas delivery pipe, and prevent the liquid delivery pipe and the gas delivery pipe from shaking during use.

According to yet another embodiment, the gas-liquid mixing guide part is provided with a dripping liquid transport pipe, and the dripping liquid transporting pipe communicates with the atomizing device and the gas-liquid mixing part. The beneficial effect is that the cleaning liquid is atomized into droplets before entering the gas-liquid mixing part, so that the speed of the droplets can be adjusted in the gas-liquid mixing part.

According to another embodiment, the gas-liquid mixing part is provided with x air inlets, the air inlets are connected to the gas-liquid mixing guide part, and x is a natural number greater than 0. The beneficial effect is that: x air inlets can allow inert gas to enter the gas-liquid mixing part from multiple angles, reducing the influence of the inner wall of the gas-liquid mixing part on the velocity of the inert gas.

According to another embodiment, the above-mentioned atomization device includes a porous plate, and the above-mentioned porous plate is provided with n through holes, where n is a natural number greater than 0. The beneficial effect is that the size of the droplets generated is determined by the size of the above-mentioned through holes, which can meet the cleaning requirements of particles on the wafer surface.

According to yet another embodiment, the size types of the above-mentioned through holes are m, and the above-mentioned m is a natural number greater than 0. The beneficial effect is that droplets of different sizes can be generated according to the size of the through hole to clean the wafer surface of particles of various sizes.

According to another embodiment, the arrangement of the above-mentioned through holes is one of annular arrangement, circular arrangement or linear arrangement.

According to another embodiment, the above-mentioned atomization device includes an arc-shaped plate, the above-mentioned arc-shaped plate is provided with n through holes, and the arrangement of the above-mentioned through holes is a honeycomb arrangement.

10: Wafer surface particle cleaning nozzle

11: Shell

111:First installation department

1111:Outer jet port

112: Second installation department

113: The third installation department

1131: Housing sealing ring notch

11311: Shell sealing ring

12: Gas-liquid mixing section

121: First tapered part

1211:Inner jet port

122:Cylinder part

123: round cone part

1231:Air inlet

13: Gas-liquid mixing guide part

131: Yuantaikou

132:Boss

133:Atomizer device installation port

134:Drip delivery pipeline

135:Atomizer device gasket

14:Atomization device

141:Through hole

1412: First through hole

1413: Second through hole

15:Sealing part

151:Inner shell

1511: Temporary reservoir

1512: Matching the boss

1513: Fluid storage seal ring groove

1514: Liquid delivery pipe sleeve

1515: Gas delivery pipe sleeve

1516: Annular groove

152: Upper pressure block

1521: Ring-shaped embedded part

1522: Gas delivery pipe sleeve crimping part

1523: Liquid delivery pipe sleeve crimping part

1524: Liquid delivery pipe extension pipe

1525: Gas delivery pipe extension pipe

153:Loop Department

1531:First Circle Department

15311:Pipe valve

1532:Second Circle Department

16:Liquid delivery pipe

17:Gas delivery pipe

18:Nozzle mounting rod

Figure 1 is a schematic cross-sectional structural view of a wafer surface particle cleaning nozzle according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structural view of a housing according to an embodiment of the present invention; Figure 3 is a structure of a gas-liquid mixing section according to an embodiment of the present invention. Schematic diagram; Figure 4A is a schematic cross-sectional structural diagram of a gas-liquid mixing guide part according to an embodiment of the present invention; Figure 4B is a top view of Figure 4A; Figure 5 is a schematic structural diagram of a porous plate according to an embodiment of the present invention; Figure 6 is a schematic cross-sectional structural view of the inner shell according to one embodiment of the present invention; Figure 7 is a schematic cross-sectional structural view of the upper pressure block according to one embodiment of the present invention; Figure 8 is another schematic view of the wafer surface particle cleaning nozzle according to one embodiment of the present invention. A schematic cross-sectional view of the angle.

In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are part of the present invention. Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making any progressive efforts fall within the scope of protection of the present invention. Unless otherwise defined, technical or scientific terms used herein shall have their ordinary meaning understood by one of ordinary skill in the art to which this invention belongs. The use of "comprising" and similar words herein means that the elements or things appearing before the word include the elements or things listed after the word and their equivalents, without excluding other elements or things.

In order to solve the problems existing in the prior art, embodiments of the present invention provide a wafer surface particle cleaning nozzle. Referring to Figure 1, the above-mentioned wafer surface particle cleaning nozzle 10 includes a liquid delivery pipe 16 and an atomization device 14. The liquid delivery pipe 16 Connected to the above-mentioned atomization device 14, the above-mentioned atomization device 14 is used to atomize the cleaning liquid transported by the above-mentioned liquid delivery pipe 16 into liquid droplets, and directly act on the wafer surface with the liquid droplets.

In some embodiments of the present invention, referring to Figure 1, the above-mentioned wafer surface particle cleaning nozzle 10 also includes a housing 11, a gas-liquid mixing part 12, a gas-liquid mixing guide part 13 and a sealing part 15. The above-mentioned housing 11 and the above-mentioned sealing part 15 connected to form a built-in space (not marked in the figure), the above gas The liquid mixing part 12, the gas-liquid mixing guide part 13 and the atomizing device 14 are arranged in the built-in space. The sealing part 15 is provided with a liquid delivery pipe 16, and the liquid delivery pipe 16 is connected to the atomizing device 14. The atomization device 14 is connected to the gas-liquid mixing part 12, the gas delivery pipe 17 is provided on the sealing part 15, the gas delivery pipe 17 is connected to the gas-liquid mixing guide part 13, and the gas-liquid mixing guide part 13 is connected to the gas-liquid mixing guide part 13. The gas-liquid mixing part 12 is connected, and the gas-liquid mixing part 12 communicates with the outside of the housing 11 .

In some embodiments of the present invention, referring to FIG. 1 , the above-mentioned sealing part 15 includes an inner shell 151 and an upper pressure block 152 , and the above-mentioned upper pressure block 152 is detachably connected to the above-mentioned inner shell 151 .

In some embodiments of the present invention, referring to FIG. 1 , the sealing part 15 is also provided with a nozzle mounting rod 18 , and the nozzle mounting rod 18 is used to install the wafer surface particle cleaning nozzle 10 at a designated place according to needs.

In some embodiments of the present invention, referring to Figure 1, the gas delivery pipe 17 is used to connect inert gas. The inert gas enters the gas-liquid mixing guide 13 through the gas delivery pipe 17, and then enters the gas-liquid mixing guide 13. In the part 12, the above-mentioned liquid transport pipe 16 is used to connect the cleaning liquid. The above-mentioned cleaning liquid enters the above-mentioned atomization device 14 through the above-mentioned liquid transport pipe 16. After passing through the above-mentioned atomization device 14, droplets with a certain initial speed are generated, and the liquid droplets have a certain initial speed. The droplets of liquid at a high speed enter the gas-liquid mixing part 12 and are mixed with the inert gas. The inert gas also has a certain speed when injected. After the inert gas and the droplets of the two speeds are mixed, the speed will be adjusted. effect.

Figure 2 is a schematic cross-sectional structural view of the housing in some embodiments of the present invention. Referring to Figures 1 and 2, the above-mentioned housing 11 includes a first mounting part 111, a second mounting part 112 and a third mounting part 113 connected in sequence from bottom to top. The inside of the first mounting part 111 is a conical groove, and the above-mentioned The second mounting part 112 and the third mounting part 113 are both cylindrical, and the first cone angle (not shown in the figure) of the conical groove is directed downward. The lower side inside the third mounting portion 113 A housing sealing ring recess 1131 is provided, a housing sealing ring 11311 is provided in the housing sealing ring recess 1131, and an outer injection port 1111 is provided on the lower side of the first mounting part 111. The first mounting part 111 is fixedly or detachably connected to the gas-liquid mixing part 12; the second mounting part 112 is fixedly or detachably connected to the gas-liquid mixing guide part 13; the third mounting part 113 is connected to the inner Shell 151 is threaded.

Figure 3 is a schematic structural diagram of a gas-liquid mixing section in some embodiments of the present invention. Referring to FIGS. 2 and 3 , the gas-liquid mixing part 12 includes a first tapered part 121 , a cylindrical part 122 and a truncated cone part 123 connected in sequence from bottom to top. The first tapered part 121 has a conical shape, and the cylindrical part 121 has a conical shape. The portion 122 has a cylindrical shape, and the truncated cone portion 123 has a truncated cone shape. The cone angle (not shown in the figure) of the first tapered portion 121 is directed downward, the first tapered portion 121 is installed in the conical groove of the first mounting portion 111, and the first tapered portion 121 The size is the same as the size of the above-mentioned conical groove, and an inner injection port 1211 is provided on the above-mentioned cone angle. The above-mentioned inner injection port 1211 communicates with the above-mentioned outer injection port 1111. During the transportation process of droplets, the above-mentioned first conical portion The cross-sectional area of 121 becomes smaller and smaller from top to bottom, so as to facilitate the gathering of droplets mixed with inert gas and ensure the concentration of the droplets; the conical bottom surface (not shown in the figure) of the above-mentioned first conical portion 121 is upward, and the above-mentioned The cone bottom surface has the same area as the cylindrical bottom surface (not shown in the figure) of the cylindrical portion 122; the truncated cone bottom surface (not shown in the figure) of the truncated cone portion 123 faces downward, and the area of the truncated cone bottom surface is the same as the cylindrical bottom surface. The area of the cylindrical upper bottom surface (not labeled in the figure) of the cylindrical portion 122 is the same, and the area of the bottom surface (not labeled in the figure) of the cylindrical cone portion 123 is smaller than the area of the lower bottom surface of the cylindrical cone portion 123. The cross-sectional area becomes larger and larger from top to bottom to prevent the liquid droplets just generated by the above-mentioned atomization device 14 from combining with each other and becoming larger, and to ensure the size of the liquid droplets. Specifically, the above-mentioned gas-liquid mixing part 12 is a cavity.

Referring to FIGS. 2 and 3 , x air inlets 1231 are evenly distributed on the side wall of the truncated cone portion 123 , and x is a natural number greater than 0. The above air inlet 1231 can make the inert gas Entering the gas-liquid mixing part 12 from multiple angles reduces the influence of the inner wall of the gas-liquid mixing part 12 on the velocity of the inert gas, and facilitates the adjustment of the velocity of the droplets by the inert gas.

Figure 4A is a schematic cross-sectional structural diagram of a gas-liquid mixing guide in some embodiments of the present invention. 3 and 4A, a truncated cone opening 131 is provided on the lower side of the gas-liquid mixing guide portion 13, and an air outlet matching the air inlet 1231 is provided on the inner wall of the truncated cone opening 131 (not shown in the figure). (marked), the size of the above-mentioned truncated cone opening 131 matches the size of the above-mentioned truncated cone portion 123, so that the above-mentioned truncated cone portion 123 can be installed in the above-mentioned truncated cone opening 131, so that the side walls of the above-mentioned truncated cone portion 123 are in contact with the above-mentioned truncated cone opening 123. The inner walls of 131 are in contact with each other, and the above-mentioned air outlet corresponds to the above-mentioned air inlet 1231 one-to-one. Specifically, the inside of the above-mentioned gas-liquid mixing guide part 13 is a cavity.

Referring to Figures 1 and 4A, a boss 132 is provided on the upper side of the gas-liquid mixing guide portion 13, and an atomization device installation port 133 is provided in the middle of the boss 132. The atomization device 14 is installed in the atomization device installation port 133. Inside, a dripping liquid delivery pipe 134 is provided in the middle of the truncated cone opening 131 , and the dripping liquid delivery pipe 134 communicates with the atomizing device 14 and the gas-liquid mixing part 12 .

In some embodiments of the present invention, referring to Figure 4A, an atomization device sealing gasket 135 is installed between the atomization device 14 and the atomization device installation port 133, and the atomization device sealing gasket 135 is annular. The above-mentioned atomization device sealing gasket 135 is a known technology in the art, and will not be described again here.

Figure 4B is a top view of Figure 4A. Referring to FIG. 4B , the above-mentioned boss 132 , the above-mentioned droplet transport pipe 134 and the above-mentioned atomization device 14 are all cylindrical.

In some specific embodiments of the present invention, the above-mentioned atomization device is an ultrasonic atomization device.

In some specific embodiments of the present invention, the atomization device is a vibrating diaphragm.

In some embodiments of the present invention, the atomization device includes a porous plate and a driver. The driver is used to drive the porous plate to vibrate. The porous plate has a planar structure. specific Ground, the above-mentioned porous plate is provided with n through holes, n is a natural number greater than 0, and the above-mentioned driver is a piezoelectric ceramic. The size of the droplets generated is determined by the size of the above-mentioned through holes, which can meet the cleaning needs of particles on the wafer surface.

In some embodiments of the present invention, the vibration frequency of the porous plate under the action of the driver is 20KHz-5MHz. In order to match the vibration frequency of the porous plate, the injection pressure of the cleaning liquid is 0.02Mpa-1Mpa.

In some embodiments of the present invention, the material of the above-mentioned porous plate is a material that does not chemically react with the cleaning solution. According to yet another embodiment, the porous plate is made of ceramic.

In some embodiments of the present invention, the size types of the above-mentioned through holes are m, and the above-mentioned m is a natural number greater than 0. Droplets of different sizes can be generated according to the size of the through holes to clean the wafer surface of particles of various sizes.

In some embodiments of the present invention, the arrangement of the above-mentioned through holes is one of annular arrangement, circular arrangement or linear arrangement. The above-mentioned annular arrangement is conducive to the dispersion of the droplets, the above-mentioned circular arrangement is conducive to the concentration of the droplets, and the above-mentioned linear arrangement is conducive to the linear distribution of the droplets.

In some embodiments of the present invention, the above-mentioned atomization device includes an arc-shaped plate. The above-mentioned arc-shaped plate is provided with n through holes. The arrangement of the above-mentioned through holes is a honeycomb arrangement. The middle part of the above-mentioned arc-shaped plate protrudes downward. , the above-mentioned through holes are distributed on the above-mentioned protrusions. Among them, the above-mentioned honeycomb arrangement is conducive to making the droplets denser.

In some embodiments of the present invention, the size of the above-mentioned through hole is 1 μm-250 μm.

In some specific embodiments of the present invention, the size of the through holes is one type, that is, the n through holes on the porous plate all have the same size.

Figure 5 is a schematic structural diagram of a porous plate in some embodiments of the present invention. Referring to Figure 5, the above-mentioned through hole 141 includes a first through hole 1412 and a second through hole 1413. The above-mentioned first through hole 1412 The size is smaller than the size of the above-mentioned second through hole 1413, that is, the size of the above-mentioned through hole 141 is two types.

Figure 6 is a schematic cross-sectional structural diagram of the inner shell in some embodiments of the present invention. 4A and 6 , a temporary liquid storage tank 1511 and a matching boss 1512 are provided on the lower side of the inner shell 151. The temporary liquid storage tank 1511 is located in the middle of the matching boss 1512. There is a temporary liquid storage tank 1511 and a matching boss 1512 on the lower side of the inner shell 151. Liquid storage sealing ring groove 1513. The liquid storage sealing ring groove 1513 is annular and surrounds the temporary liquid storage tank 1511. A liquid storage sealing ring 15131 is provided in the liquid storage sealing ring groove 1513. The liquid storage sealing ring is The ring 15131 surrounds the outside of the temporary liquid storage tank 1511. The inner shell 151 is located on the upper side of the gas-liquid mixing guide 13 , and the matching boss 1512 corresponds to the boss 132 so that the temporary liquid storage tank 1511 communicates with the atomizing device 14 and the liquid delivery pipe 16 . The temporary liquid storage tank 1511 is connected to the atomization device 14. It is only necessary to match the temporary liquid storage tank 1511 with the atomization device 14. There is no need to match the liquid delivery pipe 16 with the atomization device 14. The cross-sectional area of the liquid delivery pipe 16 can be reduced to save space.

Referring to Figures 1 and 6, the inner shell 151 is also provided with a liquid delivery pipe sleeve 1514, a gas delivery pipe sleeve 1515 and an annular groove 1516, and the liquid delivery pipe sleeve 1514 is located in the center of the annular groove 1516 At , the above-mentioned liquid delivery pipe sleeve 1514 is placed on the outside of the above-mentioned liquid delivery pipe 16 for fixing the above-mentioned liquid delivery pipe 16, and the above-mentioned gas delivery pipe sleeve 1515 is placed on the outside of the above-mentioned gas delivery pipe 17 for fixing the above-mentioned gas delivery pipe. 17.

Figure 7 is a schematic cross-sectional structural view of the upper pressing block in some embodiments of the present invention. Referring to Figures 6 and 7, the lower side of the upper pressure block 152 is provided with an annular embedded portion 1521 and a gas delivery pipe sleeve crimping portion 1522. The liquid delivery pipe sleeve crimping portion 1523 is formed in the middle of the annular embedded portion 1521. The above-mentioned The upper pressure block 152 is installed on the upper side of the inner shell 151 so that the annular embedded part 1521 is embedded in the annular groove 1516 so that the liquid delivery pipe sleeve crimping part 1523 Press on the liquid delivery pipe sleeve 1514, and press the gas delivery pipe sleeve retaining portion 1522 on the gas delivery pipe sleeve 1515.

Referring to Figures 1, 6 and 7, the upper pressure block 152 is provided with a liquid delivery pipe extension pipe 1524 and a gas delivery pipe extension pipe 1525. The liquid delivery pipe extension pipe 1524 is connected to the liquid delivery pipe sleeve crimping portion 1523. , and the liquid delivery tube 16 extends to the outside of the upper pressure block 152 through the liquid delivery tube extension tube 1524, the gas delivery tube extension tube 1525 is connected to the gas delivery tube sleeve clamping portion 1522, and the gas delivery tube 17 The extension pipe 1525 extends through the gas delivery pipe to the outside of the upper pressure block 152 .

8 is a schematic cross-sectional structural diagram of a wafer surface particle cleaning nozzle from another angle in some embodiments of the present invention. Referring to Figure 8, the sealing part 15 is also provided with a loop part 153. The loop part 153 includes a first loop part 1531 and a second loop part 1532 that are connected to each other. One end of the first loop part 1531 is A pipe valve 15311 is provided, and one end of the second loop portion 1532 is connected to the temporary liquid storage tank 1511 . After the pipe valve 15311 is opened, the pressure in the temporary liquid storage tank 1511 will cause the foam or residual cleaning liquid generated by the atomization device 14 to be discharged through the circulation part 153 .

Although the embodiments of the present invention have been described in detail above, it will be obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the invention as described in the claims. Furthermore, the invention described herein is capable of other embodiments and of being practiced or carried out in various ways.

10: Wafer surface particle cleaning nozzle

11: Shell

12: Gas-liquid mixing section

13: Gas-liquid mixing guide part

14:Atomization device

15:Sealing part

151:Inner shell

152: Upper pressure block

16:Liquid delivery pipe

17:Gas delivery pipe

18:Nozzle mounting rod

Claims (9)

A wafer surface particle cleaning nozzle includes: a liquid delivery pipe and an atomization device. The liquid delivery pipe is connected to the atomization device. The atomization device is used to atomize the cleaning liquid delivered by the liquid delivery pipe into droplets, and The droplets are directly applied to the wafer surface, where the atomization device includes a porous plate provided with a plurality of through holes; and a shell and a sealing part, the shell and the sealing part are connected to form a built-in space, and the atomization device The device is arranged in the built-in space, and the liquid delivery pipe is set on the sealing part; the built-in space is further provided with an interconnected gas-liquid mixing guide part and a gas-liquid mixing part, and the sealing part is further provided with a gas delivery pipe , the gas delivery pipe is connected to the gas-liquid mixing guide part, the gas-liquid mixing guide part is connected to the gas-liquid mixing part, the gas-liquid mixing part is connected to the outside of the housing; wherein the gas-liquid mixing part is provided with a plurality of An air inlet is connected with the gas-liquid mixing guide part. The wafer surface particle cleaning nozzle according to claim 1, wherein the sealing part includes an inner shell and an upper pressure block, and the upper pressure block is detachably connected to the inner shell. The wafer surface particle cleaning nozzle according to claim 2, wherein the inner shell is threadedly connected to the outer shell. The wafer surface particle cleaning nozzle according to claim 2, wherein a temporary liquid storage tank is provided on the inner shell, and the temporary liquid storage tank communicates with the liquid delivery pipe and the atomization device. The wafer surface particle cleaning nozzle according to claim 4, the sealing part is further provided with a loop part, the loop part includes a first loop part and a second loop part connected to each other, the first loop part A pipe valve is provided at one end of the second loop portion, and one end of the second loop portion is connected to the temporary liquid storage tank. As for the wafer surface particle cleaning nozzle described in claim 4, the inner shell is further provided with a liquid delivery pipe sleeve and a gas delivery pipe sleeve, the liquid delivery pipe sleeve is sleeved on the outside of the liquid delivery pipe, and the gas delivery pipe The pipe sleeve is placed on the outside of the gas delivery pipe. The wafer surface particle cleaning nozzle according to claim 3, wherein the gas-liquid mixing guide part is provided with a droplet conveying pipe, and the droplet conveyance pipe communicates with the atomizing device and the gas-liquid mixing part. The wafer surface particle cleaning nozzle according to claim 1, wherein the through holes have at least two types of sizes. The wafer surface particle cleaning nozzle according to claim 1, wherein the arrangement of the through holes is one of annular arrangement, circular arrangement or linear arrangement.

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