TWI825147B - Article comprising puncture resistant laminate with ultra-thin glass layer - Google Patents

Abstract

An article including a laminate having a substrate and an ultra-thin cover glass layer bonded to a top surface of the substrate. The ultra-thin cover glass layer has a thickness in the range of 1 micron to 49 microns. The ultra-thin cover glass layer is bonded to the top surface of the substrate with an optically transparent adhesive layer having a thickness in the range of 5 microns to 50 microns.

Description

Objects containing puncture-resistant laminates with ultra-thin glass layers

This application claims priority rights under the patent law to U.S. Provisional Application Serial No. 62/722309 filed on August 24, 2018. The contents of this application are the basis of this article and are incorporated herein by reference in full.

This disclosure relates to puncture-resistant laminations. Specifically, the present disclosure relates to puncture- and fracture-resistant laminates including a glass layer bonded to a substrate with an adhesive layer.

Cover substrates for displays in electronic devices protect the display screen and provide an optically transparent surface through which a user can observe the display screen. Recent advances in electronic devices, such as handheld and wearable devices, have tended towards lighter devices with improved reliability. The weight of various components of these devices including protective components such as cover glass and substrate has been reduced to create lighter devices.

Additionally, the consumer electronics industry has focused on turning wearable and/or flexible concepts into consumer products for many years. Recently, plastic-based cover substrates for devices have shown some success in the market due to the continuous development and improvement of plastic films. However, inherent disadvantages of using plastic-covered substrates remain such as low moisture and/or oxidation resistance and low surface hardness, which can lead to device failure during use. The use of plastic substrates for their flexibility can in some cases increase weight, reduce optical clarity, reduce scratch resistance, reduce puncture resistance, and/or reduce the thermal durability of the substrate used to cover it.

Therefore, there continues to be a need for innovations in coatings for consumer products, such as cover substrates or glass used to protect display screens. And in particular, there is an ongoing need for cover glasses or cover substrates for consumer devices that include flexible components, such as flexible display screens.

The present disclosure is directed to flexible, puncture-resistant, and fracture-resistant laminates that include an ultra-thin cover glass layer bonded to a substrate with an adhesive. The ultra-thin cover glass layer has a thickness of less than 50 microns (μm or microns). Unexpectedly, an ultra-thin cover glass layer having a thickness of less than 50 microns provides suitable puncture and break resistance when bonded to a substrate with a suitably thick adhesive layer. Puncture and break resistance together with the flexibility of such ultra-thin cover glass layers (having a thickness of less than 50 microns) yield a desirable combination of properties for the laminates as described herein.

Some embodiments are directed to an article including a build-up layer having a substrate; a cover glass layer bonded to a top surface of the substrate, the cover glass layer having a thickness in the range of 1 micron to 49 microns; and An optically clear adhesive layer having a thickness in the range of 5 microns to 50 microns, the optically clear adhesive layer bonds the bottom surface of the cover glass layer to the top surface of the substrate.

In some embodiments, the article according to the previous paragraph may include a cover glass layer having a thickness in the range of 1 micron to 40 microns. In some embodiments, an article according to the previous paragraph may include a cover glass layer having a thickness in the range of 1 micron to 30 microns. In some embodiments, the article according to the previous paragraph may include a cover glass layer having a thickness in the range of 35 microns to 49 microns. In some embodiments, the article according to the previous paragraph may include a cover glass layer having a thickness in the range of 25 microns to 49 microns.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs can include an optically clear adhesive layer having a thickness in the range of 25 microns to 50 microns.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a cover glass layer bonded directly to the top surface of the substrate with the optically clear adhesive layer.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a build-up that may achieve a bend radius of 3 millimeters (mm).

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a laminate having the ability to avoid failure by the cover glass layer at a puncture load of 2.25 kg-force or greater in a puncture test. Capability limited impact resistance.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a laminate having impact resistance defined by the cover glass layer's ability to avoid failure at a drop height of 8 centimeters or greater. properties, where the pen drop height is measured according to the pen drop test.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a cover glass layer that is a redrawn glass layer drawn to the thickness of the cover glass layer.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a cover glass layer including an alkali-containing aluminosilicate glass.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs can include a cover glass layer including 55 to 70 mole % SiO ₂ , 10 to 20 mole % % Al ₂ O ₃ , and 10 to 20 mol % Na ₂ O.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a cover glass layer having a compressive stress at at least one of a top surface or a bottom surface of the cover glass layer, and different metal oxide concentrations at at least two points through the thickness of the cover glass layer.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a substrate including an electronic display having a display surface defining at least a portion of the top surface of the substrate.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a coating disposed on a top surface of the cover glass layer. In some embodiments, the coating may include a coating selected from the group consisting of: an anti-reflective coating, an anti-glare coating, an anti-fingerprint coating, an anti-fragment layer, an antimicrobial coating, and an easy-to-clean coating. coating.

In some embodiments, an article according to an embodiment of any of the preceding paragraphs may include a build-up layer lacking a polymeric hardcoat disposed on a top surface of the cover glass layer.

In some embodiments, an article according to any of the preceding paragraphs may be a consumer electronics product, and the substrate may include an electronic display, the consumer electronics product including a housing including a front surface, a rear surface, and a housing. surface and side surfaces; and electrical components at least partially within the housing, the electrical components including a controller, memory, and the electronic display at the front surface of the housing or Adjacent the front surface, the cover glass layer forms at least a portion of the housing.

Some embodiments are directed to an electronic display assembly including an electronic display including a display surface; a cover glass layer bonded to the display surface, the cover glass layer being included in the range of 1 micron to 49 microns. a thickness within; and an optically clear adhesive layer having a thickness in the range of 5 microns to 50 microns, the optically clear adhesive layer bonding the bottom surface of the cover glass layer to the electronic display the display surface.

In some embodiments, a display assembly according to embodiments of the previous paragraph may include a coating disposed on a top surface of the glass layer.

In some embodiments, a display assembly according to an embodiment of either of the two preceding paragraphs may include a cover glass layer bonded directly to the display surface of the electronic display with the optically clear adhesive layer.

Some embodiments are directed to a method of making a build-up including bonding a cover glass layer to a top surface of a substrate, the cover glass layer having a thickness in the range of 1 micron to 49 microns, wherein the bottom surface of the cover glass layer is optically A transparent adhesive layer is bonded to the top surface of the substrate, the optically clear adhesive layer having a thickness in the range of 5 microns to 50 microns.

In some embodiments, the method according to the embodiments of the previous paragraph may include forming the cover glass layer in a redraw process, wherein the redraw process includes redrawing the cover glass layer to the thickness of the cover glass layer .

In some embodiments, a method according to an embodiment of either of the two preceding paragraphs may include coating a top surface of the cover glass layer with a coating.

The following examples illustrate, but do not limit, the present disclosure. Other suitable modifications and adaptations of the types of conditions and parameters that are commonly encountered in the art and will be apparent to those skilled in the art are within the spirit and scope of this tip.

Cover substrates such as cover glass for consumer products may be used, inter alia, to reduce unwanted reflections, prevent the formation of mechanical defects (eg, scratches or cracks) in the glass, and/or provide a transparent surface that is easy to clean. The cover glass and laminates disclosed herein may be incorporated into another object, such as an object having a display (or display object) (e.g., consumer electronics including mobile phones, tablets, computers, navigation systems, Wearable devices (e.g., watches, etc.), structural objects, transportation objects (e.g., cars, trains, airplanes, marine vessels, etc.), appliance objects, may benefit from some transparency, scratch resistance, abrasion resistance, or any combination of them.

Exemplary articles incorporating any of the cover glass layers or laminates disclosed herein are consumer electronic devices including a housing having a front surface, a back surface, and side surfaces; electrical components, the like The electrical component is at least partially inside or completely within the housing and includes at least one controller, memory, and display at or adjacent the front surface of the housing; and a cover glass layer, the cover glass layer The front surface of the housing is at or on top of the display so that the cover glass layer is on it. In some embodiments, the cover glass layer may include any of the glass layers disclosed herein. In some embodiments, at least one of the housing or a portion of the display includes a cover glass layer or laminate as disclosed herein. As used herein, a "laminate" is a multilayer structure that includes at least a cover glass layer and a substrate bonded to an adhesive layer disposed between the cover glass layer and the substrate.

Cover substrates, such as cover glass, are also used to protect sensitive components of consumer products from mechanical damage (eg, punctures and impact forces). For consumer products that include flexible, foldable, and/or sharply curved portions (e.g., flexible, foldable, and/or sharply curved display screens), the cover substrate used to protect the display screen should maintain the Flexibility, foldability, and/or curvature also protect the screen. In addition, the cover substrate should resist mechanical damage such as scratches and cracks, allowing users to enjoy an unobstructed view of the display screen.

Thick monolithic glass layers can provide adequate mechanical properties, but these layers can be bulky and cannot be folded into tight radii for use in foldable, flexible, or sharply curved consumer products. And highly flexible cover substrates, such as plastic substrates, may not provide sufficient puncture resistance, scratch resistance, and/or break resistance desirable for consumer products.

As a cover substrate, glass provides a superior barrier to moisture (and oxygen) compared to plastic and provides stiffness properties to minimize scratches and deformation during use. And ultra-thin glass can be bent to a very small bending radius. The bending of an object or stack up into a tight bend radius is driven by the overall rigidity of the object or stack up. Due to the high glass modulus, the covering glass layer of an object or laminate mainly contributes to the rigidity of the object or laminate. Therefore, a thinner cover glass layer is required to facilitate the curvature of the object or laminate. Accordingly, a cover substrate defined by or including an ultra-thin glass layer that provides sufficient puncture resistance, scratch resistance, and/or break resistance can function as a cover substrate. This ultra-thin glass layer (having a thickness of less than 50 microns) reduces the number of layers required to produce a cover substrate with suitable mechanical properties.

Objects described herein include objects having a diameter less than 50 microns (microns) (i.e., 49 microns or less, such as 48 microns, or 47 microns, or 46 microns, or 45 microns, or 40 microns, or 35 microns, or 30 microns) , or 25 microns, or any and all sub-ranges therein), an ultra-thin cover glass layer with a thickness. Unexpectedly, a cover glass layer having a thickness of less than 50 microns provides advantages when bonded to a similar substrate with a similar adhesive layer compared to a cover glass layer having a thickness of 50 microns and bonded to a substrate with an adhesive. Puncture resistance and breakage resistance. Previously, it was believed that when the glass thickness is reduced below 50 microns, puncture resistance and breakage resistance will be similarly reduced due to the thinness of the glass layer. However, this is not the case for a cover glass layer that is adhesively bonded to the substrate with a suitably thick adhesive layer.

Specifically, unexpectedly, for ultra-thin cover glass layers having a thickness of less than 50 microns, the stress exhibited in the cover glass layer is inversely proportional to the stiffness of the layer bonded to the substrate. The high stresses that lead to failure of the cover glass during puncture or pen drop testing result from localized bending of the glass. Therefore, it was previously believed that the rigidity of cover glass is consistently and directly related to puncture and break resistance. This is understood since it is believed that the stresses exhibited in the cover glass layer due to puncture forces will always be inversely proportional to the stiffness of the glass layer. Therefore, it is believed that a relatively thicker, harder cover glass layer will always improve pen drop and puncture test performance, and therefore puncture and break resistance.

However, it has been found that a cover glass layer having a thickness of less than 50 microns can provide suitable puncture failure loading and pen drop performance for the laminate. As disclosed herein, a cover glass layer thickness of less than 50 microns exhibits better performance than a cover glass layer that is 50 microns thick. And when subjected to pen drop or quasi-static indentation loads (puncture forces), cover glass layer thicknesses less than 50 microns exhibit similar performance to cover glass layer thicknesses greater than 50 microns and up to about 100 microns. However, a cover glass layer thickness less than 50 microns will have superior flexibility and bending properties compared to a cover glass layer made of the same material with a thickness of 50 microns or more. The superior flexibility and bendability of such cover glass layers (having a thickness of less than 50 microns) allows the cover glass layers to be bent with smaller bending radii without failure. Additionally, these thinner cover glass layers may reduce manufacturing costs because they reduce the amount of raw materials used to make the cover glass layer that provides desirable protection.

Laminates that included a cover glass layer bonded to a substrate and had a thickness less than 50 microns performed better during pen drop performance testing than a comparable glass layer having a thickness of 50 microns and similarly bonded to a similar substrate. To confirm this unexpected behavior, further stacking was tested using an INSTRON® machine (a controlled puncture testing machine manufactured by Illinois Tool Works Inc.) using puncture testing under controlled load. Information regarding the initiation and propagation of damage can be obtained from the results of this puncture test. If this is not possible, this information is difficult to obtain through pen testing. Puncture testing allows monitoring of controlled fracture during quasi-static loading. In other words, the puncture test helps distinguish which layer of the build-up fails first because the puncture test can be stopped immediately after the first sensed break. The stop after the first sensed break helps distinguish failures in the cover glass layer and/or the substrate to which the cover glass layer is bonded. Puncture test results confirm that a cover glass layer having a thickness of less than 50 microns has superior puncture and break resistance compared to a comparable 50 micron thick cover glass layer.

Based on unexpected pen drop and puncture tests, the behavior of the laminate, including a cover glass layer bonded to a substrate, was modeled to evaluate the stress distribution produced by puncture forces imparted to the surface of the cover glass layer. Model results show that stress levels for cover glass layers with a thickness of less than 50 microns are collectively less than those for comparable cover glass layers with a thickness of 50 microns. These modeling results confirm that a cover glass layer having a thickness of less than 50 microns and bonded to a substrate with an appropriately thick adhesive is less susceptible to puncture or impact forces than a 50 micron thick cover glass layer similarly bonded to a similar substrate. Superior in resistance to failure. A less than 50 micron thick cover glass layer bonded to a substrate as described herein provides sufficient flexibility, puncture resistance, scratch resistance, and fracture resistance to serve as a protective component for the substrate and articles including the substrate .

Figure 1 illustrates an object 100 according to some embodiments. Article 100 includes a build-up 102 having a substrate 110 and a cover glass layer 120 bonded to the substrate 110 with an optically clear adhesive layer 130 . The cover glass layer 120 may cover all or part of the substrate 110 . Cover glass layer 120 may cover all or a portion of top surface 114 of substrate 110 . In some embodiments, cover glass layer 120 may cover the entirety of top surface 114 . In some embodiments, cover glass layer 120 may cover top surface 114 of substrate 110 between all opposing edges of top surface 114 but not the entirety of the top surface.

In some embodiments, substrate 110 may be an electronic display or an electronic display assembly including an electronic display. In some embodiments, all or a portion of the top surface 114 of the substrate 110 may be a display surface of an electronic display or electronic display component. In other words, the display surface may define all or a portion of the top surface 114 of the substrate 110 . Exemplary electronic displays include light emitting diode (LED) displays or organic light emitting diode (OLED) displays. In some embodiments, substrate 110 may be a non-electronic display device. For example, substrate 110 may be a display device displaying static or printed postal markings. In some embodiments, the substrate 110 may be a touch pressure sensor, such as a capacitive touch pressure sensor, a polarizer, or a battery.

In some embodiments, substrate 110, such as an electronic display or electronic display assembly, may be a flexible substrate. As used herein, a flexible layer, object, or substrate is a layer, object, or substrate that can independently achieve a bend radius of 10 mm or less. In some embodiments, the substrate 110 can achieve a bend radius of 5 mm or less. In some embodiments, the substrate 110 may achieve a bend radius of 4 mm or less. In some embodiments, the substrate 110 can achieve a bend radius of 3 mm or less. The substrate 110 achieves a bend radius of "X" if the substrate resists failure when the substrate 110 is held at a radius of "X" at about 25° C. and about 50% relative humidity for 60 minutes. Figure 9 illustrates the build-up 102 and the measurement of the bend radius 170 of the substrate 110.

The cover glass layer 120 is an ultra-thin glass layer having a thickness 126 of less than 50 microns. Cover glass layer 120 may have a thickness 126 measured from bottom surface 122 to top surface 124 of cover glass layer 120 in a range of 1 micron to 49 microns (microns, μm) including subranges therebetween. For example, the cover glass layer 120 may have a thickness of 1 micron, 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns, 46 microns, 47 microns, 48 microns, 49 microns, or the thickness 126 within a range having any two of these values as endpoints. In some embodiments, the thickness 126 may be from 1 micron to 40 microns, or from 2 microns to 35 microns, or from 3 microns to 30 microns, or from 4 microns to 30 microns, or from 5 microns to 30 microns, or from 6 microns to 25 microns, or from 7 microns to 20 microns, or from 10 microns to 20 microns, or from 15 microns to 20 microns, or from 15 microns to 25 microns, or from 15 microns to 30 microns, or from 15 microns to 35 microns, or from 15 microns to 40 microns, or from 15 microns to 45 microns, or from 15 microns to 49 microns. In some embodiments, thickness 126 may range from 1 micron to 30 microns. In some embodiments, thickness 126 may range from 35 microns to 49 microns. In some embodiments, thickness 126 may range from 25 microns to 49 microns. In some embodiments, thickness 126 may range from 15 microns to 49 microns. In some embodiments, thickness 126 may range from 5 microns to 49 microns.

The cover glass layer 120 can achieve a bending radius of 10 mm or less. In some embodiments, cover glass layer 120 may achieve a bend radius of 5 mm or less. In some embodiments, cover glass layer 120 may achieve a bend radius of 4 mm or less. In some embodiments, cover glass layer 120 may achieve a bend radius of 3 mm or less.

In some embodiments, cover glass layer 120 may include an alkali-containing aluminosilicate glass material. Other suitable materials for cover glass layer 120 include glass materials such as, but not limited to, soda-lime glass, alkali-containing borosilicate glass, and alkali aluminoborosilicate glass. In some variations, the glass material may be free of lithium oxide. In other embodiments, the glass material may contain lithium oxide.

In some embodiments, cover glass layer 120 may be a redrawn glass layer. In some embodiments, the cover glass layer 120 may be a glass layer formed using a process lacking a chemical thinning process (ie, the cover glass layer 120 may be a non-chemically thinned glass layer). As used herein, the term "redraw cover glass layer" means a layer of glass material that is drawn to its final thickness in a redraw process. For example, in a redraw process, the glass block can be heated to the desired draw temperature and passed through draw rollers (in non-quality areas, e.g., areas located inside the edges of the glass and/or intended to be used to make devices). area) to reduce the thickness of the glass block to the final thickness of the cover glass layer. After redrawing to final thickness, no additional fabrication steps are utilized to significantly change the thickness of the cover glass layer. Grinding or polishing may be used to shape and draw the edge of the covering glass layer, but this grinding or polishing is not considered to change the thickness of the layer. As used herein, the term "chemically thinned cover glass layer" means a layer of glass material that is subjected to one or more chemical etching processes to reduce its thickness to the final desired thickness of the glass layer. A chemically thinned (also called etched) glass layer will have different properties than a redrawn glass layer due to the etching process(es) used to reduce its thickness. For example, the surface of a redrawn glass layer may be significantly smoother than the surface of a chemically thinned glass layer. The surface roughness for the redrawn glass layer can be as small as about 0.1 nm (nanometer) to 0.2 nm, while the minimum surface roughness for the chemically thinned glass layer is about 2 nm to 3 nm.

In some embodiments, the cover glass layer 120 may be a strengthened glass layer, such as a glass layer that has been subjected to an ion exchange process or a thermal tempering process. For cover glass layer 120 subjected to an ion exchange process, cover glass layer 120 includes compressive stress at top surface 124 and/or bottom surface 122 and differential metal oxidation at at least two points through thickness 126 of cover glass layer 120 concentration of matter. In some embodiments, the cover glass layer 120 may be a non-strengthened glass layer, such as a glass layer that has not been subjected to an ion exchange process or a thermal tempering process.

Unless otherwise indicated, cover glass layer 120 is a single monolithic layer. As used herein, "single monolithic layer" means a single monolithic layer having a substantially consistent composition across its volume. A layer made by layering one or more layers or materials, or by mechanically attaching different layers, is not considered a single monolithic layer.

An optically clear adhesive layer 130 is disposed on the top surface 114 of the substrate 110 and bonds the cover glass layer 120 to the substrate 110 . In some embodiments, an optically clear adhesive layer 130 may be disposed on the top surface 114 of the substrate 110 . In such embodiments, the bottom surface 132 of the optically clear adhesive layer 130 is in direct contact with the top surface 114 of the substrate 110 . As used herein, "disposed on" means that the first layer and/or component is in direct contact with the second layer and/or component. The first layer and/or component "disposed on" the second layer and/or component may be deposited, formed, placed, or otherwise applied directly to the second layer and/or component. In other words, if a first layer and/or component is disposed on a second layer and/or component, there is no layer disposed between the first layer and/or component and the second layer and/or component. A description of a first layer and/or component being "joined to" a second layer and/or component means that the layer and/or component is joined by direct contact and/or bonding between the two layers and/or components or by adhesive The agent layers are bonded to each other. If a first layer and/or component is described as being "disposed above" a second layer and/or component, other layers may or may not be present between the first layer and/or component and the second layer and/or component.

Suitable optically clear adhesives for layer 130 include, but are not limited to, acrylic adhesives, such as 3M ^™ 8212 adhesive, or any optically clear liquid adhesive, such as Loctite® optically clear liquid adhesive. The optically clear adhesive layer 130 may have a thickness 136 in the range of 5 microns to 50 microns, inclusive, measured from the bottom surface 132 to the top surface 134 of the optically clear adhesive layer 130 . For example, the thickness 136 of the optically clear adhesive layer 130 may be 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns, 50 microns, or any other value thereof. any two of them as endpoints. In some embodiments, thickness 136 may range from 25 microns to 50 microns. In some embodiments, the thickness 136 can be from 5 microns to 49 microns, or from 5 microns to 45 microns, or from 5 microns to 40 microns, or from 5 microns to 35 microns, or from 5 microns to 30 microns, or from 5 microns to 25 microns, or from 5 microns to 20 microns, or from 5 microns to 15 microns, or from 5 microns to 48 microns, or from 10 microns to 45 microns, or from 15 microns to 45 microns, or from 20 microns to 45 microns, or from 25 microns to 45 microns, or from 30 microns to 45 microns, or from 35 microns to 45 microns, or from 6 microns to 48 microns, or from 10 microns to 42 microns, or from 15 microns to 37 Micron, or from 20 micron to 32 micron, or from 25 micron to 30 micron.

As used herein, "optically clear" means an average transmission of 70% or greater through a 1.0 mm thick sheet of material in the wavelength range of 400 nm to 700 nm. In some embodiments, the optically transparent material can have 75% or greater, 80% or greater, 85% or greater, or 90% passing through a 1.0 mm thick sheet of material in the wavelength range of 400 nm to 700 nm. or greater average transmittance. The average transmittance in the wavelength range of 400 nm to 700 nm is calculated by measuring the transmittance at integer wavelengths from about 400 nm to about 700 nm and averaging the measurements. Cover glass layer 120 may be optically clear.

In some embodiments, the bottom surface 122 of the cover glass layer 120 may be in direct contact with the top surface 134 of the optically clear adhesive layer 130 . In some embodiments, cover glass layer 120 may be bonded directly to top surface 114 of substrate 110 via optically clear adhesive layer 130 . In such embodiments, the bottom surface 122 of the cover glass layer and the top surface 114 of the substrate 110 are in direct contact with the top surface 134 and bottom surface 132 of the optically clear adhesive layer 130, respectively.

In some embodiments, top surface 124 of cover glass layer 120 may be the topmost outer, user-facing surface of build-up 102 and/or article 100 . As used herein, the terms "top surface" or "top-most surface" and "bottom surface" or "bottom-most surface" refer to a layer, component, or object as that layer, component, or object is to be oriented during its normal and intended use , or the top surface and bottom surface of the object, where the top surface is the surface facing the user. For example, when incorporated into a handheld consumer electronics product having an electronic display, the "top surface" of the object, layer, or laminate means the surface when held by a user viewing the electronic display through the object, layer, or layer The top surface of that object, layer, or layer when the object, layer, or layer is to be oriented.

In some embodiments, top surface 124 of cover glass layer 120 may be coated with one or more coatings (eg, coating 180) to provide desired properties. Such coatings include, but are not limited to, polymeric hard coatings, anti-reflective coatings, anti-glare coatings, anti-fingerprint coatings, anti-fragment coatings, antibacterial and/or antiviral coatings, and easy-to-clean coatings. In some embodiments, buildup 102 may lack a coating (eg, coating 180 ) disposed over or bonded to top surface 124 of cover glass layer 120 . In some embodiments, the build-up layer 102 may lack a polymeric hardcoat layer disposed over or bonded to the top surface 124 of the cover glass layer 120 . Polymeric hardcoats, such as the optically transparent polymeric (OTP) hardcoats described herein, are layers with significant hardness that are formulated to improve the puncture resistance and/or fracture resistance of the laminate. The cover glass layer 120 coated with one or more coatings, or not coated with any coating, may be referred to as a "cover substrate."

The object 100 and/or the laminate 102 may achieve a bend radius 170 of 10 mm or less. In some embodiments, the article 100 and/or the build-up 102 may achieve a bend radius 170 of 5 mm or less. In some embodiments, the article 100 and/or the build-up 102 may achieve a bend radius 170 of 4 mm or less. In some embodiments, the article 100 and/or the build-up 102 may achieve a bend radius 170 of 3 mm or less. Figure 9 illustrates a bending force 172 applied to the article 100 and/or the laminate 102 to bend the article and/or the laminate to a bend radius 170. As shown in Figure 9, the bend radius 170 can be measured relative to the bottom surface 112 of the substrate 110 with the top surface 124 of the glass layer 120 curved toward itself. Therefore, the substrate 110 has a bending radius 170 as shown in FIG. 9 , and the glass layer 120 has a bending radius smaller than the bending radius of the substrate 110 .

In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a pen drop height of 8 centimeters (cm) or greater as measured according to the "Pen Drop Test". In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a pen drop height of 9 cm or greater as measured according to the "Pen Drop Test." In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a pen drop height of 10 cm or greater as measured according to the "Pen Drop Test."

As described and referred to herein, the "Pen Drop Test" is performed such that laminated samples are tested with a load (i.e., from a pen dropped at a height) given to the top surface of the covering glass layer, with the bottom of the covering glass layer The surface is bonded to a 100-micron layer of polyethylene terephthalate (PET) with a 50-micron-thick layer of optically clear adhesive, which serves as a substrate for lamination. The PTE layer in the pen drop test is intended to simulate a flexible electronic display device (eg, OLED device). During testing, the cover glass layer bonded to the PET layer was placed on an aluminum plate (6063 aluminum alloy, as polished to surface roughness with 400 grit paper) and the PET layer was in contact with the aluminum plate. No straps are used on the side of the specimen resting on an aluminum plate.

Tubing is used in the pen drop test to guide the pen to the specimen, and the tubing is placed in contact with the top surface of the specimen such that the longitudinal axis of the tubing is substantially perpendicular to the top surface of the specimen. The tubing has an outside diameter of 1 inch (2.54 cm), an inside diameter of nine sixteenths of an inch (1.4 cm), and a length of 90 cm. Acrylonitrile butadiene ("ABS") spacers were used to hold the pen at the desired height for each test. After each drop, the tube is repositioned relative to the sample to guide the pen to different impact locations on the sample. The pen used in the pen drop test was a BIC® Easy Glide Pen with a 0.7 mm (0.68 mm) diameter tungsten carbide ball point tip and a weight of 5.73 grams (g) including cap (4.68 g without cap). , Fine.

For the pen drop test, the pen is dropped with the cap attached to the top end (ie, the end opposite the tip) so that the ball point can interact with the test sample. In the drop sequence according to the pen drop test, a pen drop is carried out at an initial height of 1 cm, followed by successive drops in increments of 0.5 cm up to 20 cm, and after 20 cm, increments of 2 cm up to the test specimen Fault. After each drop is performed, any observable fractures, failures, or other evidence of damage to the specimen are recorded along with the specific pen drop height. Using pen drop testing, multiple samples can be tested against the same drop sequence to produce a population with improved statistics. For the pen drop test, the pen will change to a new pen after every 5 drops and for each new sample tested. Additionally, all pen landings were performed at random locations on the sample at or near the center of the sample, and no pen landings were performed near or on the edges of the sample.

For the purposes of pen drop testing, "failure" means the formation of visible mechanical defects in the build-up. Mechanical defects may be cracks or plastic deformations (eg, surface depressions). Cracks can be surface cracks or through cracks. Cracks can form on the interior or exterior surfaces of the buildup. Cracks may extend through all or part of the layers of the lamination. Visible mechanical defects have a minimum size of 0.2 mm or greater. The graphs of Figures 2 and 3 show the drop height and cover glass layer thickness at the failure for various test specimens having configurations of test specimen 400 tested according to the pen drop test.

In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a puncture load of 2.25 kg-force or greater in a "puncture test." In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a puncture load of 2.5 kg-force or greater in a "puncture test." In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a puncture load of 2.75 kg-force or greater in a "puncture test." In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a puncture load of 3 kg-force or greater in a "puncture test." In some embodiments, the buildup 102 may have impact resistance defined by the ability of the cover glass layer 120 to avoid failure at a puncture load of 3.25 kg-force or greater in a "puncture test."

As described and referred to herein, "puncture testing" was performed such that laminated samples were subjected to a load test on the top surface of a cover glass layer bonded to the bottom surface of the cover glass layer with a 50 micron thick layer of optically clear adhesive. A 100-micron-thick layer of polyethylene terephthalate (PET) serves as a substrate for the build-up. The PTE layer in the puncture test is intended to simulate flexible electronic display devices (eg, OLED devices). During the puncture test, the top surface of the covering glass layer was loaded with a stainless steel pin with a flat bottom of 200 micron diameter. The puncture test according to the present disclosure was performed under displacement control at a crosshead speed of 0.5 mm/min. This quasi-static load test (indentation) was performed using an INSTRON® machine (a controlled puncture testing machine manufactured by Illinois Tool Works Inc.). During the test, the specimen is placed under the pin tip and the load is increased until failure is observed. At the failure site, record the puncture load measured in kilogram-force (kgf). The stainless steel pins were replaced with new pins after a specified number of tests (ie, 10 tests) to avoid misalignment that could result from deformation of the metal pins associated with the tests.

For the purposes of puncture testing, "failure" means the formation of visible mechanical defects in the build-up. Mechanical defects may be cracks or plastic deformations (eg, surface depressions). Cracks can be surface cracks or through cracks. Cracks can form on the interior or exterior surfaces of the buildup. Cracks may extend through all or part of the layers of the lamination. Visible mechanical defects have a minimum size of 0.2 mm or greater. The graphs of Figures 2 and 3 illustrate the indentation load and cover glass layer thickness at failure for various test specimens having a configuration of test specimen 400 as measured by puncture testing.

Each test sample 400 includes a cover glass layer 430 bonded to a 100 micron thick PTE substrate 410 with a 50 micron thick optically clear adhesive layer 420, as shown in Figure 4. The cover glass layer 430 tested included a redrawn cover glass layer (marked with "R" in Figures 2 and 3) and a chemically thinned cover glass layer (marked with "CT" in Figure 3). Each cover glass layer 430 is a glass layer including an alkali-containing aluminosilicate glass having the composition of Composition 1 in Table 1. Each cover glass layer 430 is a non-strengthened cover glass layer. Test sample 400 includes the following cover glass layers: (i) 25 micron thick redrawn cover glass layer 430, (ii) 35 micron thick redrawn cover glass layer 430, (iii) 50 micron thick chemically thinned cover glass glass layer 430, (iv) a 50 micron thick redrawn cover glass layer 430, (v) a 75 micron thick redrawn cover glass layer 430, and (vi) a 100 micron thick redrawn cover glass layer 430.

Although the test results reported in Figures 2 and 3 are the results of tests performed on glass layers having the composition of Composition 1, the trends illustrated in the results are not dependent on the specific aluminosilicate tested. Salt glass composition. Similar test results for other glass compositions, including compositions 2-5 in Table 1, show the same trend. Other suitable glass materials for the cover glass layer discussed herein include soda-lime glass, alkali-containing borosilicate glass, and alkali aluminoborosilicate glass. In some variations, the glass material may be free of lithium oxide. Such glass materials may be strengthened or non-strengthened.

In some embodiments, the glass compositions for the glass layers discussed herein may include 40 mole % to 90 mole % SiO ₂ (silicon oxide). In some embodiments, the glass composition may include 40 mol%, 45 mol%, 50 mol%, 55 mol%, 60 mol%, 65 mol%, 70 mol%, 75 mol% , 80 mole %, 85 mole %, or 90 mole % SiO ₂ , or any range of mole % having any two of these values as endpoints. In some embodiments, the glass composition may include 55 to 70 mole % _SiO2 . In some embodiments, the glass composition may include 57.43 mole % to 68.95 mole % _SiO2 .

In some embodiments, the glass compositions for the glass layers discussed herein may include 1 to 10 mole % B ₂ O ₃ (boron oxide). In some embodiments, the glass composition may include 1 mol%, 2 mol%, 3 mol%, 4 mol%, 5 mol%, 6 mol%, 7 mol%, 8 mol% , 9 mole %, or 10 mole % B ₂ O ₃ , or any range of mole % having either two of these values as endpoints. In some embodiments, the glass composition may include 3 to 6 mole % B ₂ O ₃ . In some embodiments, the glass composition may include 3.86 mole % to 5.11 mole % B ₂ O ₃ . In some embodiments, the glass composition may exclude B ₂ O ₃ .

In some embodiments, the glass compositions for the glass layers discussed herein may include 5 to 30 mole % Al ₂ O ₃ (aluminum oxide). In some embodiments, the glass composition may include 5 mol%, 10 mol%, 15 mol%, 20 mol%, 25 mol%, or 30 mol% Al ₂ O ₃ , or have Mol% of any range in which any two of the equal values are endpoints. In some embodiments, the glass composition may include 10 to 20 mole % Al ₂ O ₃ . In some embodiments, the glass composition may include 10.27 mol% to 16.10 mol% Al ₂ O ₃ .

In some embodiments, glass compositions for glass layers discussed herein may include 1 to 10 mole % P ₂ O ₅ (phosphorus oxide). In some embodiments, the glass composition may include 1 mol%, 2 mol%, 3 mol%, 4 mol%, 5 mol%, 6 mol%, 7 mol%, 8 mol% , 9 mole %, or 10 mole % P ₂ O ₅ , or any range of mole % having either two of these values as endpoints. In some embodiments, the glass composition may include 2 to 7 mole % P ₂ O ₅ . In some embodiments, the glass composition may include 2.47 mole % to 6.54 mole % P ₂ O ₅ . In some embodiments, the glass composition may exclude P ₂ O ₅ .

In some embodiments, the glass compositions for the glass layers discussed herein may include 5 to 30 mole % Na ₂ O (sodium oxide). In some embodiments, the glass composition may include 5 mol%, 10 mol%, 15 mol%, 20 mol%, 25 mol%, or 30 mol% Na ₂ O, or have a Mol% of any range in which any two of the values are endpoints. In some embodiments, the glass composition may include 10 to 20 mol% _Na2O . In some embodiments, the glass composition may include 10.82 to 17.05 mol% _Na2O .

In some embodiments, the glass compositions for the glass layers discussed herein may include 0.01 to 0.05 mole % K ₂ O (potassium oxide). In some embodiments, the glass composition may include 0.01 mol%, 0.02 mol%, 0.03 mol%, 0.04 mol%, or 0.05 mol% K ₂ O, or any two of these values. Mol% of any range as endpoint. In some embodiments, the glass composition may include 0.01 mole % _K2O . In some embodiments, the glass composition may exclude _K2O .

In some embodiments, glass compositions for glass layers discussed herein may include 1 to 10 mole % MgO (magnesium oxide). In some embodiments, the glass composition may include 1 mol%, 2 mol%, 3 mol%, 4 mol%, 5 mol%, 6 mol%, 7 mol%, 8 mol% , 9 mole %, or 10 mole % MgO, or any range of mole % having any two of these equivalent values as endpoints. In some embodiments, the glass composition may include 2 to 6 mol% MgO. In some embodiments, the glass composition may include 2.33 mol% to 5.36 mol% MgO. In some embodiments, the glass composition may not include MgO.

In some embodiments, the glass compositions for the glass layers discussed herein may include 0.01 to 0.1 mol% CaO (calcium oxide). In some embodiments, the glass composition may include 0.01 mol%, 0.02 mol%, 0.03 mol%, 0.04 mol%, 0.05 mol%, 0.06 mol%, 0.07 mol%, 0.08 mol% , 0.09 mol%, or 0.1 mol% CaO, or any range having as endpoints any two of these equivalent values. In some embodiments, the glass composition may include 0.03 mol% to 0.06 mol% CaO. In some embodiments, the glass composition may exclude CaO.

In some embodiments, glass compositions for glass layers discussed herein may include 0.01 to 0.05 mol% Fe ₂ O ₃ (iron oxide). In some embodiments, the glass composition may include 0.01 mol%, 0.02 mol%, 0.03 mol%, 0.04 mol%, or 0.05 mol% Fe ₂ O ₃ , or any of these values. Mol% of any range between two endpoints. In some embodiments, the glass composition may include 0.01 mole % Fe ₂ O ₃ . In some embodiments, the glass composition may exclude Fe ₂ O ₃ .

In some embodiments, glass compositions for glass layers discussed herein may include 0.5 to 2 mole % ZnO (zinc oxide). In some embodiments, the glass composition may include 0.5 mol%, 1 mol%, 1.5 mol%, or 2 mol% ZnO, or any range having any two of these values as endpoints Mol% within. In some embodiments, the glass composition may include 1.16 mole % ZnO. In some embodiments, the glass composition may not include ZnO.

In some embodiments, the glass compositions for the glass layers discussed herein may include 1 to 10 mole % Li ₂ O (lithium oxide). In some embodiments, the glass composition may include 1 mol%, 2 mol%, 3 mol%, 4 mol%, 5 mol%, 6 mol%, 7 mol%, 8 mol% , 9 mole %, 10 mole % Li ₂ O, or any range of mole % having any two of these equivalent values as endpoints. In some embodiments, the glass composition may include 5 to 7 mol% _Li2O . In some embodiments, the glass composition may include 6.19 mole % _Li2O . In some embodiments, the glass composition may not include _Li2O .

In some embodiments, the glass compositions for the glass layers discussed herein may include 0.01 mole % to 0.3 mole % SnO ₂ (tin oxide). In some embodiments, the glass composition may include 0.01 mol%, 0.05 mol%, 0.1 mol%, 0.15 mol%, 0.2 mol%, 0.25 mol%, or 0.3 mol% _SnO2 , or mole % of any range having any two of these values as endpoints. In some embodiments, the glass composition may include 0.01 to 0.2 mol% _SnO2 . In some embodiments, the glass composition may include 0.04 to 0.17 mol% SnO ₂ .

In some embodiments, the glass compositions for the glass layers discussed herein may include R ₂ O (alkali metal oxide(s)) + RO in the range of 10 mole % to 30 mole % (alkaline earth metal oxide(s)). In some embodiments, R ₂ O + RO can be 10 mol%, 15 mol%, 20 mol%, 25 mol%, or 30 mol%, or any two of these values as Mol% of any range from the endpoint. In some embodiments, R ₂ O + RO can range from 15 mol% to 25 mol%. In some embodiments, R ₂ O + RO can range from 16.01 mole % to 20.61 mole %. Table 1: Glass composition

Additionally, although the test results reported in Figures 2 and 3 are for sample 400 having a 50 micron thick optically clear adhesive layer, a thinner optically clear adhesive layer 420, such as 25 micron and 10 microns, will result in the same performance as the cover glass layer. However, significant amounts of adhesive allow for localized deformation of the cover glass layer at the location of the puncture force. In some embodiments, the relatively elastic optically clear adhesive layer allows the cover glass layer to locally deform at the location of the puncture force, and therefore absorb some of the puncture force. The minimum adhesive layer thickness of 5 microns allows for fully localized deformation of the covering glass layer.

Figure 2 shows a graph 200 of pen drop failure height and indentation failure load values for five different thicknesses of redrawn cover glass layer 430 (25 microns, 35 microns, 50 microns, 75 microns, and 100 microns). . Each point on graph 200 represents the average of 15-20 data points for each thickness of test sample 400. The pen drop height data points are shown as circles and the indentation failure load data points are shown as squares.

Pen Drop Height and Indentation Failure Load Results show that both pen drop height and indentation failure load decrease monotonically for cover glass layer 430 having a thickness that decreases from 100 microns to 50 microns. Then, unexpectedly, when the thickness of cover glass layer 430 is further reduced to less than 50 microns, the trends for both pen drop failure height and indentation failure load are reversed. The drop failure height and dent failure load values for the 35 micron test sample and the 25 micron test sample were higher than the values for the 50 micron test sample. This behavior demonstrates that the reliability (eg, puncture resistance and breakage resistance) of the cover glass layer can be increased by reducing the thickness of the cover glass layer below 50 microns relative to a 50 micron thick layer. This thickness reduction not only improves the reliability of the cover glass layer, but also increases the relative flexibility (bendability) of the cover glass layer due to the thickness reduction. Thinner cover glass layers tend to have increased flexibility compared to thicker cover glass layers made of the same material.

In addition to testing five thicknesses of the redrawn cover glass layer 430, one thickness of the chemically thinned cover glass layer 430 was tested to determine whether the chemically thinned glass layer would perform better or worse than the redrawn glass layer. . Figure 3 shows pen drop failure heights and indentations for the same five thicknesses of redrawn cover glass layer 430 shown in Figure 2, and one thickness (50 microns) of chemically thinned cover glass layer 430. Fault load value. Similar to Figure 2, in Figure 3, the pen drop fault height data points are shown as circles and the indentation fault load data points are shown as squares.

As shown in Figure 3, a cover glass layer formed using a chemical thinning process performed worse in both pen drop and puncture tests than a redrawn glass layer of the same thickness and made of the same material. . For example, the pen drop height and indentation load (less than 2.5 cm and less than 1.5 kgf, respectively) of the 50 micron chemically thinned sample in Figure 3 are lower than those of the 50 micron redrawn sample in Figures 2 and 3 The pen drop height and indentation load of the sample (greater than 8 cm and greater than 2.25 kgf respectively). It is believed that the etching process used to produce the chemically thinned cover glass layer introduces surface imperfections on the chemically thinned surface(s) of the cover glass layer. Therefore, chemically thinned glass layers are considered generally less reliable than corresponding redrawn cover glass layers of the same thickness.

Finite element analysis was used to evaluate why redrawn cover glass layers with thicknesses less than 50 microns unexpectedly performed better than chemically thinned cover glass layers in both pen drop and puncture tests. By modeling the stress imparted by the pen drop test, the extent of stress imparted on the cover glass layer by the puncture force can be analyzed to evaluate the failure mode of the cover glass layer. Figure 5 illustrates a finite element model 500 used to analyze these stresses.

Cover glass layer 510 in model 500 represents cover glass layer 430 of test sample 400 . The top surface 514 of the modeled cover glass layer 510 is a surface loaded with puncture force, and the bottom surface 512 of the modeled cover glass layer 510 is bonded to the surface of the substrate with a 50 micron thick layer of optically clear adhesive. In the model 500, the 512 corresponds to the thickness 516 of the modeled cover glass layer 510 of the top surface 514 . The pen drop height 530 is measured in the Z direction. For model 500 , pen 520 is modeled to impart a puncture load onto top surface 514 of modeled cover glass layer 510 . Pen 520 was modeled to replicate a BIC® with a 0.7 mm (0.68 mm) diameter (0.34 mm radius 524) tungsten carbide ball point tip 522 and a weight of 5.73 grams (this weight includes the weight of the cap of the BIC® Easy Glide Pen) Easy Glide Pen, Fine.

Figure 6 shows a graph 600 of the maximum principal stress distribution on the top surface 514 in the X direction of the model 500 for different cover glass layer 510 thicknesses and for a pen drop height 530 of 10 centimeters (cm). Figure 7 shows a graph 700 of the maximum principal stress distribution on the bottom surface 512 in the X direction of the model 500 for different cover glass layer 510 thicknesses and for a pen drop height 530 of 10 centimeters (cm). Both graphs 600 and 700 show modeled cover glass layer 510 thicknesses of 50 microns, 35 microns, and 25 microns. In graph 600 , a zero X-direction value is the point on top surface 514 where the center of modeled ball point tip 522 contacts top surface 514 . In graph 700, a zero X-direction value is a point on bottom surface 512 directly below the point on top surface 514 where the center of modeled ball point tip 522 contacts top surface 514 in the Z direction.

As shown in Figure 6, finite element analysis shows that the values of the maximum principal stress on the top surface 514 follow a similar trend for all three thicknesses. Similarly, as shown in Figure 7, finite element analysis shows that the values for the maximum principal stress on the bottom surface 512 follow similar trends for all three thicknesses.

By comparing Figures 6 and 7, it can be seen that the maximum difference between the maximum principal stress on the top surface 514 and the maximum principal stress on the bottom surface 512 (the "differential maximum stress") is located at the zero X value ( That is, the center of the modeled ball point tip 522 contacts the point on the top surface 514 where the top surface 514 is located. Figures 6 and 7 show that the glass layer 510 experiences the highest stress at this location, zero X value. Thus, in comparison, a 25 micron thick glass layer 510 has a minimum differential maximum stress at zero thickness). A modeled cover glass layer 510 having a thickness of 35 microns has a differential maximum stress greater than a 25 micron thick layer, but still less than a 50 micron thick layer. For a 25 micron thick glass layer 510, the maximum principal stress on the bottom surface 512 at X equal to zero is less than that for other glass thicknesses (35 microns and 50 microns). The maximum principal stress on the top surface 514 of the 25 micron thick glass layer 510 at X equal to zero is higher than that at other glass thicknesses. However, the maximum principal stress at the bottom surface 512 of the glass layer at Stress will most likely determine whether the glass layer fails during a puncture event.

The results shown in Figures 6 and 7 indicate that lower stress values exist throughout the thickness of the 25 micron and 35 micron thick cover glass layers 510 compared to those of the 50 micron thick cover glass layer 510. These lower stress values present throughout the thickness of the thinner cover glass layer 510 result in improved pen drop test and puncture test results as shown in Figure 2. In other words, similar falling energy creates relatively less stress through the thickness of a cover glass layer having a thickness of less than 50 microns compared to a glass layer that is 50 microns thick. This means that these thinner layers are better able to withstand a given puncture force than a 50 micron thick cover glass layer. As shown in Figures 6 and 7, reducing the cover glass layer thickness from 50 microns to 25 microns results in lower tensile stress on the bottom surface 512 and higher stress on the top surface 514. It is believed that this behavior indicates a shift in the glass failure mode as the glass thickness is reduced, and that the result of this shift is improved puncture and break resistance.

Furthermore, by comparing Figures 6 and 7, it can be seen that the maximum values of the principal stresses present on the bottom surface 512 of the cover glass layer 510 are significantly higher in magnitude than those on the top surface 514 . This is particularly true for values of Because model 500 exhibits the highest tensile principal stresses on bottom surface 512; these stresses are most likely to promote failure during pen drop testing and/or puncture testing. Therefore, a cover glass layer that results in a lower maximum principal stress on bottom surface 512 is more likely to have improved performance in pen drop and/or puncture tests.

Figure 8 shows a graph 800 for modeling the maximum principal stress on the bottom surface 512 of the cover glass layer 510 as a function of thickness 516 based on a drop height of 2 centimeters (cm). As shown in Figure 8, the greatest amount of principal stress on bottom surface 512 occurs in cover glass layer 510 having a thickness 516 of approximately 65 microns. Consistent with the results shown in Figures 6 and 7 and reducing the thickness of the cover glass layer below 50 microns results in lower values for the maximum principal stress on the bottom surface 512. And similar to the results in Figures 6 and 7, this behavior is unexpected.

Therefore, as shown in the test results in Figures 2 and 3 and the finite element model analysis results in Figures 6 through 8, the layers included in the build-up described herein have a thickness of less than 50 microns (e.g., 49 microns A cover glass layer having a thickness of 50 microns or less has superior and unexpected puncture and break resistance compared to a cover glass layer having a thickness of 50 microns included in a similar build-up. This behavior was unexpected because, generally, as the thickness of the glass decreases, puncture and fracture resistance to impact forces (eg, pen drop forces) is expected to decrease. The trend towards reduced puncture resistance and fracture resistance is demonstrated in the test results for 100 micron thick, 75 micron thick, and 50 micron thick test sample 400 in Figures 2 and 3. However, for thicknesses less than 50 microns, this trend is unexpectedly reversed. Test results for 35 micron and 25 micron thick test specimens 400 demonstrate that by reducing the thickness of the cover glass layer to less than 50 microns, the impact force can be increased relative to a comparable 50 micron thick cover glass layer (e.g. , pen falling force) puncture resistance and breakage resistance.

The unexpected and superior behavior of cover glass layers having a thickness of less than 50 microns was confirmed by finite element analysis showing that impact forces (e.g., pen drop forces) produce smaller amounts of vibration in such cover glass layers. stress. Because these stress values are smaller, such cover glass layers (having a thickness of less than 50 microns) can better resist punctures and/or fractures due to impact forces. In particular, smaller stress values on the bottom surface of a cover glass layer having a thickness of less than 50 microns results in a cover glass layer that is better suited to resist punctures and/or fractures due to impact forces.

In some embodiments, such as shown in FIG. 10 , the buildup 102 may be coated with a coating 180 having a bottom surface 182 , a top surface 184 , and a thickness 186 . In some embodiments, coating 180 may be bonded to top surface 124 of cover glass layer 120 . In some embodiments, coating 180 may be disposed on top surface 124 of cover glass layer 120 . In some embodiments, multiple coatings 180 of the same or different materials and/or thicknesses may be applied over the cover glass layer 120 , including on the top surface, and/or the bottom surface 112 .

In some embodiments, coating 180 may be an optically clear polymer (OTP) hard coating. Suitable materials for OTP hard coating include but are not limited to polyimide, polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (polymethyl methacrylate) ; PMMA), organic polymer materials, inorganic-organic hybrid polymer materials, and aliphatic or aromatic hexafunctional ethyl urethane acrylate. In some embodiments, the OTP hardcoat layer may consist essentially of organic polymeric materials, inorganic-organic hybrid polymeric materials, or aliphatic or aromatic hexafunctional urethane ethyl acrylate. In some embodiments, the OTP hardcoat layer may be composed of polyimide, organic polymeric materials, inorganic-organic hybrid polymeric materials, or aliphatic or aromatic hexafunctional ethyl amine formate acrylate.

As used herein, "organic polymeric material" means a polymeric material containing monomers having only organic components. In some embodiments, the OTP hard coating may include an organic polymer material manufactured by Gunze Limited and having a hardness of 9H, such as Gunze's "Highly Durable Transparent Film". As used herein, "inorganic-organic hybrid polymeric material" means a polymeric material containing monomers having both inorganic and organic components. Inorganic-organic hybrid polymers are obtained by the polymerization reaction between monomers having inorganic groups and organic groups. Inorganic-organic hybrid polymers are not nanocomposites containing separate inorganic and organic components or phases, such as inorganic particles dispersed within an organic matrix.

In some embodiments, the inorganic-organic hybrid polymeric material may include polymerized monomers containing inorganic silicyl groups, for example, silsesquioxane polymers. The silsesquioxane polymer may be, for example, an alkyl-silsesquioxane, an aryl-silsesquioxane, or an arylalkyl-silsesquioxane having the following chemical structure: (RSiO _{1 .5} )n, where R is an organic group, such as, but not limited to, methyl or phenyl. In some embodiments, the OTP hard coat may include a silsesquioxane polymer, such as SILPLUS manufactured by Nippon Steel Chemical Co., Ltd., combined with an organic matrix.

In some embodiments, the OTP hardcoat layer may include 90 wt% to 95 wt% aromatic hexafunctional ethyl acrylate (e.g., PU662NT (aromatic hexafunctional ethyl acrylate) manufactured by Miwon Specialty Chemical Co. Ethyl acrylate)) and 10 to 5 wt% of a photoinitiator having a hardness of 8H or greater (eg, Darocur 1173 manufactured by Ciba Specialty Chemicals Corporation). In some embodiments, OTP hardcoats containing aliphatic or aromatic hexafunctional amine ethyl formate acrylate can be obtained by spin coating the layer onto a polyethylene terephthalate (PET) substrate, curing the amine Ethyl formate acrylate, and the urethane acrylate layer is removed from the PET substrate to form an independent layer.

The OTP hardcoat layer may have a thickness 186 in the range of 10 microns to 120 microns, inclusive. For example, the OTP hard coat layer may have a thickness of 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, or the equivalent thereof. Any two of them serve as endpoints within the range of thickness 186. In some embodiments, the OTP hardcoat layer may be a single monolithic layer.

In some embodiments, the OTP hard coat layer may be a layer of inorganic-organic hybrid polymeric material or an organic polymeric material having a thickness in the range of 80 microns to 120 microns, including sub-ranges. For example, an OTP hardcoat layer comprising an inorganic-organic hybrid polymeric material or an organic polymeric material may have an endpoint of 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, or any two of these values. thickness within the range. In some embodiments, the OTP hard coating may have a thickness in the range of 10 microns to 60 microns, including, for example, 15 microns to 60 microns, or 20 microns to 60 microns, or 25 microns to 60 microns, or 30 microns to 60 microns. , or 45 microns to 60 microns, or 50 microns to 60 microns, or 10 microns to 55 microns, or 10 microns to 50 microns, or 10 microns to 45 microns, or 10 microns to 40 microns, or 10 microns to 35 microns, Or an aliphatic or aromatic hexafunctional urethane ethyl acrylate material layer with a thickness in the range of 10 microns to 30 microns, or 10 microns to 25 microns, or 10 microns to 20 microns. For example, an OTP hardcoat layer comprising an aliphatic or aromatic hexafunctional urethane acrylate material may have a thickness of 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, or any of these equivalent values. The thickness within the range of any two endpoints.

In some embodiments, coating(s) 180 may be an anti-reflective coating. Exemplary materials suitable for use in anti-reflective coatings include: SiO ₂ , Al ₂ O ₃ , GeO ₂ , SiO, AlO _x N _y , AlN, SiN _x , SiO _x N _y , Si _u Al _v O _x N _y , Ta ₂ O ₅ , Nb ₂ O ₅ , TiO ₂ , ZrO ₂ , TiN, MgO, MgF ₂ , BaF ₂ , CaF 2 , SnO ₂ , HfO _{2 ,} Y ₂ O ₃ , MoO ₃ , DyF ₃ , YbF ₃ , YF ₃ , CeF ₃ , polymer, fluoropolymer, plasma polymerized polymer, siloxane polymer, silsesquioxane, polyimide, fluorinated polyimide, polyetherimide , polyether styrene, polystyrene, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, acrylic polymer, urethane polymer, polymethyl methacrylate, and above Other materials cited as suitable for use in the anti-scratch layer. Anti-reflective coatings may include sub-layers of different materials.

In some embodiments, the anti-reflective coating may include a hexagonally filled nanoparticle layer, such as, but not limited to, the hexagonally filled nanoparticle layer described in U.S. Patent No. 9,272,947, issued on March 1, 2016. This article is hereby incorporated by reference in its entirety. In some embodiments, the anti-reflective coating may include a nanoporous silicon-containing coating, such as, but not limited to, the nanoporous silicon-containing coating described in WO2013/106629, published on July 18, 2013 by This is incorporated by reference in its entirety. In some embodiments, the anti-reflective coating may include a multi-layer coating, such as, but not limited to, WO2013/106638, published on July 18, 2013; WO2013/082488, published on June 6, 2013; and May 2016 The multi-layer coating is described in U.S. Patent No. 9,335,444 issued on the 10th, all of which are hereby incorporated by reference in their entirety.

In some embodiments, coating(s) 180 may be an easy-to-clean coating. In some embodiments, the easy-to-clean coating may include a coating selected from the group consisting of fluoroalkylsilane, perfluoropolyetheralkoxysilane, perfluoroalkylalkoxysilane, fluoroalkylsilane-(non-fluoroalkylsilane) copolymer material, and a mixture of fluoroalkylsilanes. In some embodiments, the easy-to-clean coating may include one or more materials that are selected types of silanes containing perfluorinated groups, for example, perfluoroalkyl silanes of the formula ( _RF ) _{ySiX4 -y} , where RF is _a linear C6- _C30 perfluoroalkyl group, X=CI, acetyloxy, _-OCH3 , and _-OCH2CH3 , and y=2 or 3. Perfluoroalkylsilanes are available from many vendors including Dow-Corning (e.g. Fluorocarbons 2604 and 2634), 3M Company (e.g. ECC-1000 and ECC-4000), and other fluorocarbon suppliers such as Daikin Corporation, Ceko ( South Korea), Cotec-GmbH (DURALON UltraTec material) and Evonik are commercially available. In some embodiments, the easy-to-clean coating may include an easy-to-clean coating as described in WO2013/082477, published June 6, 2013, which patent is hereby incorporated by reference in its entirety.

In some embodiments, coating(s) 180 may be an anti-glare layer formed on or disposed over top surface 124 of cover glass layer 120 . Suitable anti-glare layers include, but are not limited to, those provided by U.S. Patent Publications Nos. 2010/0246016, 2011/0062849, 2011/0267697, 2011/0267698, 2015/0198752, and 2012/0281292. Anti-glare layers prepared by processes described in , all of which are hereby incorporated by reference in their entirety.

In some embodiments, coating(s) 180 may be an anti-fingerprint coating. Suitable anti-fingerprint coatings include, but are not limited to, oil-repellent surface layers including gas-trapping features as described in, for example, U.S. Patent Application Publication No. 2011/0206903, published on August 25, 2011, and as described in, for example, 2013 The lipophilic coatings described in U.S. Patent Application Publication No. 2013/0130004 published on May 23, 2016, are composed of unorganized side chains that react with the surface of a glass or glass-ceramic substrate. A cured or partially cured siloxane coating precursor (eg, partially cured linear alkyl siloxane) is formed. The contents of U.S. Patent Application Publication No. 2011/0206903 and U.S. Patent Application Publication No. 2013/0130004 are incorporated herein by reference in their entirety.

In some embodiments, coating(s) 180 may be an antimicrobial and/or antiviral layer formed on or disposed over top surface 124 of cover glass layer 120 . Suitable antibacterial and/or antiviral layers include, but are not limited to, as described in, for example, U.S. Patent Application Publication No. 2012/0034435, published on February 9, 2012, and U.S. Patent Application Publication No. 2015, published on April 30, 2015. The antibacterial Ag+ zone described in /0118276 extends from the surface of the glass to the depth in the glass, and the antibacterial Ag+ zone has a suitable concentration of Ag+1 ions on the surface of the glass. The contents of U.S. Patent Application Publication No. 2012/0034435 and U.S. Patent Application Publication No. 2015/0118276 are incorporated herein by reference in their entirety.

In some embodiments, cover glass layer 120 may be 2D, 2.5D, or 3D cover glass. As used herein, "2D cover glass" includes cover glass having a peripheral edge with chamfered shapes on the top and/or bottom surfaces of the cover glass adjacent the peripheral edge. The chamfered shape on the top and/or bottom surfaces may be formed by, for example, finishing methods including mechanical grinding. The 2D cover glass can have the same or different chamfer shapes on the top and bottom surfaces of the cover glass.

As used herein, "2.5D cover glass" means cover glass that has a peripheral edge with a curved surface on its top (user-facing) side. The curved surface can be formed by, for example, mechanical polishing methods. The curved surface on the top side of 2.5D cover glass touches smoother than the chamfered surface of 2D cover glass. As used herein, "3D cover glass" means cover glass with curved peripheral edges forming a non-planar shape. The curved peripheral edge may be formed by, for example, thermoforming and/or cold forming. The 3D cover glass has a curved bottom surface and a curved top surface adjacent the peripheral edge of the cover glass. 3D cover glass refers to cover glass that maintains a 3D shape as described herein at room temperature (23°C) and when not subjected to external forces (eg, bending forces). Flexible films that can deform under their own weight at room temperature are not considered 3D cover glass as described herein. Both 2.5D and 3D cover glass have a topmost exterior surface that includes a substantially flat central area and a curved peripheral area disposed around all or part of the substantially flat central area. The 3D cover glass has a bottommost outer surface that includes a substantially flat central area and a curved peripheral area disposed around all or part of the substantially flat central area.

Figure 11A shows a 2D cover glass 1100 according to some embodiments. The cover glass 1100 includes a substantially flat central region 1102 and a chamfered peripheral region 1104. The peripheral region 1104 of the 2D cover glass 1100 may be finished by a mechanical grinding method on the top surface 1106 and/or the bottom surface 1108 of the cover glass 1100 Creates a chamfered shape. In some embodiments, the chamfer shapes on the top surface 1106 and the bottom surface 1108 of the cover glass 1100 may be the same.

Figure 11B shows a 2.5D cover glass 1110 according to some embodiments. The 2.5D cover glass 1110 includes a substantially flat central region 1112 and a curved peripheral region 1114 on a top surface 1116 of the cover glass 1110. The curved perimeter region 1114 may be finished by mechanical polishing methods to form a curved surface on the top surface 1116 . Thus, 2.5D cover glass 1110 may have a peripheral area 1114 with a flat bottom surface 1118 and a curved top surface 1116. In some embodiments, 2.5D cover glass can be produced by mechanically polishing peripheral areas of the glass layer.

Figure 11C shows a 3D cover glass 1120 according to some embodiments. The 3D cover glass 1120 includes a substantially flat central region 1122 and a curved peripheral region 1124. The 3D cover glass 1120 has a curved top surface 1126 and a curved bottom surface in the curved peripheral region 1124. 1128. 3D cover glass 1120 may be formed, for example, by molding a glass layer into a 3D shape.

Figure 12 shows a consumer electronic product 1200 according to some embodiments. Consumer electronics 1200 may include a housing 1202 having a front (user-facing) surface 1204 , a rear surface 1206 opposite the front surface 1204 , and side surfaces 1208 . Electrical components may be provided at least partially within housing 1202. Electrical components may include, among others, controller 1210, memory 1212, and display components, including display 1214. In some embodiments, display 1214 may be provided at or adjacent front surface 1204 of housing 1202 . Display 1214 may be, for example, a light emitting diode (LED) display or an organic light emitting diode (OLED) display.

As shown, for example, in Figure 12, consumer electronic product 1200 may include a cover substrate 1220. The cover substrate 1220 may be used to protect the display 1214 and other components of the electronic product 1200 (eg, the controller 1210 and the memory 1212) from damage. In some embodiments, cover substrate 1220 may be disposed over display 1214. In some embodiments, cover substrate 1220 may be bonded to display 1214. In some embodiments, cover substrate 1220 may be a cover glass defined in whole or in part by cover glass layer 120 discussed herein. Cover substrate 1220 may be a 2D, 2.5D, or 3D cover substrate. Cover substrate 1220 may define at least a portion of housing 1202. In some embodiments, cover substrate 1220 may define housing 1202 front surface 1204 . In some embodiments, the cover substrate 1220 may define all or a portion of the front surface 1204 of the housing 1202 and the side surfaces 1208 of the housing 1202 . In some embodiments, consumer electronics 1200 may include a cover substrate 1220 that defines all or a portion of rear surface 1206 of housing 1202 .

In some embodiments, the cover glass layer discussed herein may comprise a "glass-ceramic" material produced by controlled crystallization of glass. In such embodiments, the glass-ceramic has a crystallinity of about 30% to about 90%. Non-limiting examples of glass-ceramic systems that can be used include Li ₂ O × Al ₂ O ₃ × nSiO ₂ (also known as the LAS system), MgO × Al ₂ O ₃ × nSiO ₂ (also known as the MAS system), and ZnO × Al ₂ O ₃ × nSiO ₂ (also known as ZAS system). In one or more alternative embodiments, the glass layer may comprise a crystalline substrate such as a glass-ceramic substrate (which may be reinforced or non-reinforced), or may comprise a single crystal structure such as sapphire. In one or more specific embodiments, the glass layer may include an amorphous substrate (e.g., glass) and a crystalline cladding layer (e.g., a sapphire layer, a polycrystalline alumina layer, and/or a spinel (MgAl ₂ O ₄ ) layer ). In some embodiments, the cover glass layer discussed herein may not be composed of a glass-ceramic material.

As discussed herein, the cover glass layer is strengthened to form the strengthened layer. As used herein, the term "strengthened layer" may refer to a substrate that has been chemically strengthened, such as by ion exchange that exchanges smaller ions for larger ions in the surface of the layer. The reinforced layer can also be formed using other strengthening methods known in the art, such as thermal tempering, or using mismatches in thermal expansion coefficients between portions of the layer to create compressive stresses and a central tension zone .

Where a layer is chemically strengthened by an ion exchange process, ions in the surface layer of the layer are replaced by - or exchanged by - larger ions of the same valence or oxidation state. The ion exchange process is typically performed by immersing the layers in a molten salt bath containing larger ions that are intended to exchange with smaller ions in the substrate. Those skilled in the art will understand that the parameters used in the ion exchange process include, but are not limited to, bath composition and temperature, immersion time, number of immersions of the layer in the salt bath(s), the number of times the layer is immersed in the salt bath(s), and the number of immersions in the salt bath(s). Use, additional steps such as annealing, washing, and similar parameters, which are usually determined by the composition of the layers and the required compressive stress (CS) of the substrate due to the strengthening operation, the compressive stress layer depth (or layer depth) Decide. For example, ion exchange of the alkali metal-containing glass layer may be accomplished by immersion in at least one molten bath containing salts such as, but not limited to, nitrates, sulfates, and chlorides of larger alkali metal ions. The temperature of the molten salt bath typically ranges from about 380°C to up to about 450°C, and the immersion time varies from about 15 minutes to up to about 40 hours. However, temperatures and immersion times different from those described above may also be used.

Additionally, non-limiting examples of ion exchange processes in which glass layers are immersed in multiple ion exchange baths with washing and/or annealing steps between immersions are described in the following patent: Douglas C. Allan et al. 2009 U.S. Patent Application No. 12/500,650, filed on July 10, titled "Glass with Compressive Surface for Consumer Applications" and claiming priority from U.S. Provisional Patent Application No. 61/079,995 filed on July 11, 2008 No. 1, in which a glass substrate is strengthened by multiple, sequential, ion exchange treatments immersed in a salt bath of varying concentrations; and published by Christopher M. Lee et al. on November 20, 2012, with the title " Dual Stage Ion Exchange for Chemical Strengthening of Glass" and US Patent 8,312,739 claiming priority from US Provisional Patent Application No. 61/084,398 filed on July 29, 2008, in which the glass substrate is diluted with effluent ions Ion exchange in the first bath is enhanced by subsequent immersion in a second bath having a smaller concentration of effluent ions than the first bath. The contents of U.S. Patent Application No. 12/500,650 and U.S. Patent No. 8,312,739 are incorporated herein by reference in their entirety.

Although various embodiments have been described herein, these embodiments have been presented by way of example and not limitation. It should be understood that, based on the teachings and guidance presented herein, adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed embodiments. Accordingly, those skilled in the art will understand that various changes in form and details may be made to the embodiments disclosed herein without departing from the spirit and scope of the disclosure. Elements of the embodiments presented herein are not necessarily mutually exclusive, but may be interchanged to satisfy a variety of situations as those skilled in the art will appreciate.

Embodiments of the present disclosure are described in detail herein with reference to embodiments of the invention as illustrated in the accompanying drawings, in which like reference numerals are used to indicate identical or functionally similar elements. References to "one embodiment," "an embodiment," "some embodiments," "in a particular embodiment," etc. indicate that the described embodiment may include specific features, structures, or characteristics, but each implementation Examples may not necessarily include the specific feature, structure, or characteristic. Additionally, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with one embodiment, it is understood that the feature, structure, or characteristic will affect one skilled in the art in combination with other embodiments whether explicitly described or not. Within the understanding of this characteristic, structure, or characteristic.

The examples illustrate but do not limit the disclosure. Other suitable modifications and adaptations of the types of conditions and parameters commonly encountered in the art and that will be apparent to those skilled in the art are within the spirit and scope of this tip.

The indefinite article "a" and "an" used to describe an element or component means that one or at least one of these elements or components is present. Although these articles are conventionally used to indicate that the noun they modify is singular, as used herein, the article "a and an" also includes the plural unless otherwise stated in a particular case. Similarly, the definite article "the" as used herein also means that the noun it modifies may be singular or plural, again unless otherwise stated in a particular case.

As used in the scope of a patent application, "comprising" is an open transitional term. The list of elements following the transitional word "includes" is a non-exclusive list, such that elements other than those specifically stated in the list may be present. As used in the scope of a patent application, "consisting essentially of" or "consisting essentially of" limits the composition of a material to the specified material and those that do not materially affect the basic and novel characteristic(s) of the material. Wait. As used in a patent application, "consisting of" or "consisting entirely of" limits the composition of materials to the specified materials and excludes any materials not specified.

The term "wherein" is used as an open-ended transitional term to introduce a description of a series of properties of a structure.

Where numerical ranges are recited herein, they include both the upper and lower values and, unless otherwise stated in a particular instance, the range is intended to include its endpoints and all integers and decimals within the range. It is not intended that the scope of the claimed scope be limited to the specific values recited in defining the scope. Furthermore, when an amount, concentration, or other value or parameter is given as a range, one or more preferred ranges, or a list of upper and lower preferred values, this will be understood to specifically disclose a limitation by any upper range. or all ranges formed by any pair of the preferred value and any lower range limit or preferred value, regardless of whether such pairs are individually disclosed. Finally, when the term "about" is used to describe a value or an endpoint of a range, the present invention should be understood to include the specific value or endpoint referred to. Regardless of whether a range value or endpoint states "about," the range value or endpoint is intended to include both embodiments: one modified by "about" and one not modified by "about."

As used herein, the term "about" means that quantities, sizes, formulations, parameters, and other quantities and characteristics are not and need not be precise, but may be approximate and/or larger or smaller as appropriate, thereby reflecting Tolerances, conversion factors, rounding, measurement errors, etc., and other factors known to those skilled in the art.

As used herein, the terms "substantially," "substantially," and variations thereof are intended to mean that the described feature is equal or approximately equal to the value or description. For example, a "substantially planar" surface is intended to mean a planar or approximately planar surface. Furthermore, "substantially" is intended to mean that two values are equal or approximately equal. In some embodiments, "substantially" may mean values that are within about 10% of each other, such as within about 5% of each other or within about 2% of each other.

The embodiments presented have been described above with the aid of functional building blocks illustrating designated functions and relationships of the embodiment(s) presented. For ease of description, the boundaries of these functional building blocks have been arbitrarily limited herein. Alternative boundaries can be defined as long as their designated functions and relationships are appropriately performed.

It is to be understood that the phraseology or terminology used herein is for the purpose of description and not of limitation. The breadth and scope of the present disclosure should not be limited by any of the exemplary embodiments described above, but should be limited in accordance with the following claims and their equivalents.

100:Object 102:Layering 110:Substrate 112: Bottom surface 114:Top surface 120: Covering glass layer 122: Bottom surface 124:Top surface 126:Thickness 130: Optically clear adhesive layer 132: Bottom surface 132: Bottom surface 134:Top surface 136:Thickness 170:bending radius 172:Bending force 180:Coating 182: Bottom surface 184:Top surface 186:Thickness 400:Test sample 410:PTE substrate 420: Optically clear adhesive layer 430: Covering glass layer 500:Model 510: Covering glass layer 512: Bottom surface 514: Top surface 516:Thickness 518:Length 519:Width 520: pen 522: Tungsten carbide ball point tip 524:radius 200, 300, 600, 700, 800: Curve graph 1100:2D cover glass 1102: Substantially flat central area 1104: Chamfer surrounding area 1106: Top surface 1108: Bottom surface 1110:2.5D cover glass 1112: Substantially flat central area 1114:Bend surrounding area 1116: Top surface 1118: Flat bottom surface 1120:3D cover glass 1122: Substantially flat central area 1124:Bend surrounding area 1126: Curved top surface 1128: Curved bottom surface 1200:Consumer electronics 1202: Shell 1204: Front surface 1206:Rear surface 1208:Side surface 1210:Controller 1212:Memory 1214:Display 1220: Covering the substrate

The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present disclosure. Together with the description, the drawings further serve to explain the principles of the disclosed embodiments and to enable those skilled in the art to make and use the disclosed embodiments. These figures are intended to be illustrative and not limiting. Although the disclosure is described generally in the context of these embodiments, it should be understood that there is no intention to limit the scope of the disclosure to these specific embodiments. In the drawings, identical reference numbers indicate identical or functionally similar elements.

Figure 1 illustrates an article in accordance with some embodiments.

Figure 2 is a graph of pen drop failure height and indentation load for various test specimens having the test specimen configuration of Figure 4 with a redrawn cover glass layer.

Figure 3 is a graph of pen drop failure height and indentation load for various test specimens having the test specimen configuration of Figure 4 with a redrawn and chemically thinned cover glass layer.

Figure 4 illustrates the test sample configuration.

Figure 5 illustrates a finite element model used to simulate pen drop testing according to some embodiments.

Figure 6 is a graph of the maximum principal stress on the top surface of the cover glass layer as a function of distance on the top surface of the cover glass layer for modeling the build-up.

Figure 7 is a graph of the maximum principal stress on the bottom surface of the cover glass layer as a function of distance on the bottom surface of the cover glass layer for modeling the build-up.

Figure 8 is a graph of maximum stress on the bottom surface of a cover glass layer used to model build-up as a function of cover glass layer thickness.

Figure 9 illustrates a cross-sectional view of the object of Figure 1 when the object is bent.

Figure 10 illustrates an article including a coating in accordance with some embodiments.

Figures 11A-11C illustrate cover glass layers according to various embodiments.

Figure 12 illustrates a consumer product according to some embodiments.

Domestic storage information (please note in order of storage institution, date and number) without

Overseas storage information (please note in order of storage country, institution, date, and number) without

200: Curve graph

Claims (11)

A glass article comprising: a laminate comprising: a substrate; a cover glass layer bonded to a top surface of the substrate, the cover glass layer comprising a a thickness; and an optically clear adhesive layer, the optically clear adhesive layer comprising a thickness in the range of 5 microns to 50 microns, the optically clear adhesive layer bonding a bottom surface of the cover glass layer to the The top surface of the substrate, wherein the cover glass layer includes an alkali-containing aluminosilicate glass, the alkali-containing aluminosilicate glass including 0.01 mol% to 0.08 mol% SnO ₂ . The glass article of claim 1, wherein the cover glass layer is directly bonded to the top surface of the substrate with the optically clear adhesive layer. The glass article of claim 1, wherein at least one of the following: the laminate achieves a bending radius of 3 mm; the laminate includes 2.25 kg-force or greater in a puncture test by the cover glass layer Ability to avoid failure at the puncture load site an impact resistance as defined; or the laminate includes an impact resistance as defined by the ability of the cover glass layer to avoid failure at a drop height of 8 cm or greater, where the drop height is based on a drop height of 8 cm or greater Test measurements. The glass object according to any one of claims 1 to 3, wherein the cover glass layer contains: 55 mol% to 70 mol% SiO ₂ ; 10 mol% to 20 mol% Al ₂ O ₃ ; and 10 mol% to 20 mol% Na ₂ O, and wherein the cover glass layer includes a compressive stress at at least one of a top surface or the bottom surface of the cover glass layer, and at least A metal oxide concentration that is different at two points through the thickness of the cover glass layer. The glass article of any one of claims 1 to 3, comprising a coating disposed on a top surface of the cover glass layer, and wherein the coating comprises a group selected from the group consisting of One of the coatings: an anti-reflective coating, an anti-glare coating, an anti-fingerprint coating, an anti-fragment coating, an anti-bacterial coating and an easy-to-clean coating. The glass article of any one of claims 1 to 3, wherein the laminate lacks a polymeric hardcoat disposed on a top surface of the cover glass layer. The glass object according to any one of claims 1 to 3, wherein the object is a consumer electronic product and the substrate includes an electronic display, the consumer electronic product includes: a shell, the shell includes a front surface, a rear surface and side surfaces; and electrical components at least partially positioned within the housing, the electrical components including a controller, a memory and the electronic display, the electronic display being in the housing The front surface is at or adjacent to the front surface of the housing, wherein the cover glass layer forms at least a portion of the housing. The glass article of claim 1, wherein the alkali-containing aluminosilicate glass contains 0.04 mol% to 0.08 mol% SnO ₂ . A method of making a build-up, the method comprising the steps of bonding a cover glass layer to a top surface of a substrate, the cover glass layer comprising a thickness in the range of 1 micron to 49 microns, wherein the cover glass layer A bottom surface is bonded to the top surface of the substrate with an optically clear adhesive layer, the optically clear adhesive layer includes a thickness in a range of 5 microns to 50 microns, and wherein the cover glass layer includes a Alkali aluminosilicate glass, the alkali-containing aluminosilicate glass contains 0.01 mol% to 0.08 mol% SnO ₂ . The method of claim 9, further comprising the step of forming the cover glass layer in a re-drawing process, wherein the re-drawing process includes re-drawing the cover glass layer to the thickness of the cover glass layer. The method of claim 9 or 10, further comprising the step of coating a top surface of the cover glass layer with a coating.