TWI823601B - Probe assembly - Google Patents

Probe assembly Download PDF

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Publication number
TWI823601B
TWI823601B TW111137975A TW111137975A TWI823601B TW I823601 B TWI823601 B TW I823601B TW 111137975 A TW111137975 A TW 111137975A TW 111137975 A TW111137975 A TW 111137975A TW I823601 B TWI823601 B TW I823601B
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Taiwan
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contact
contact portion
probe head
aforementioned
probe
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TW111137975A
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Chinese (zh)
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TW202415957A (en
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林卓儀
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晝思有限公司
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  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

探針頭,包含:以第一方向為中心軸形成柱狀,並具有接觸面的本體;以及位於前述接觸面之上的至少一個接觸部;前述接觸部,具有與前述接觸面大致呈垂直且面向前述中心軸的截面;前述接觸部,在與前述截面的相反側具有與前述第一方向呈小於45度的傾斜的斜面;前述截面、前述斜面用以在進行電性檢測時接觸待測體。 The probe head includes: a body formed into a columnar shape with the first direction as the central axis and having a contact surface; and at least one contact portion located above the contact surface; the contact portion has a structure that is substantially perpendicular to the contact surface and A cross-section facing the central axis; the contact portion has an inclined surface with an inclination of less than 45 degrees to the first direction on the opposite side to the aforementioned cross-section; the aforementioned cross-section and the aforementioned inclined surface are used to contact the object to be measured during electrical testing .

Description

探針組件 Probe assembly

本發明係關於一種探針頭及探針頭的製造方法。 The invention relates to a probe head and a method for manufacturing the probe head.

在半導體製造產業中,半導體裝置在製造完成之後需進行電性檢測,以確認半導體裝置的可靠性並確保其可正常運作。在檢測期間,通常使用檢測裝置以及檢測插座來對半導體裝置進行檢測。其中檢測裝置包括接墊,而檢測插座則是用來將半導體裝置的端子連接至檢測裝置的接墊,藉此在半導體裝置端子與檢測裝置之間建立起電連接以進行電信號的交換。 In the semiconductor manufacturing industry, electrical testing of semiconductor devices is required after completion of manufacturing to confirm the reliability of the semiconductor device and ensure that it can operate normally. During testing, a testing device and a testing socket are typically used to test the semiconductor device. The detection device includes pads, and the detection socket is used to connect the terminals of the semiconductor device to the pads of the detection device, thereby establishing an electrical connection between the terminals of the semiconductor device and the detection device for the exchange of electrical signals.

通常,在檢測插座中設置有作為檢測件的探針陣列,該探針陣列包含多個探針組件,每一探針組件基本上包含探針頭、彈性構件、插棒、以及與探針頭結合的套管。作為一例,圖1示出習知的探針組件的分解立體圖,其包含探針頭91、與探針頭耦合的套管92、插棒94、及彈性構件93。如圖1所示,探針頭91包含本體以及形成在探針頭本體的一端的接觸部 911。如圖1所示,習知的探針頭91的接觸部911是角錐體結構。如圖2所示,當使用此種習知的探針頭來進行半導體裝置檢測時,探針頭91的接觸部911會以其錐體尖端來與待測體19接觸。 Usually, a probe array as a detection component is provided in the detection socket. The probe array includes a plurality of probe assemblies. Each probe assembly basically includes a probe head, an elastic member, an insert rod, and a probe head. Combined casing. As an example, FIG. 1 shows an exploded perspective view of a conventional probe assembly, which includes a probe head 91 , a sleeve 92 coupled with the probe head, a plunger 94 , and an elastic member 93 . As shown in FIG. 1 , the probe head 91 includes a body and a contact portion formed on one end of the probe head body. 911. As shown in FIG. 1 , the contact portion 911 of the conventional probe head 91 has a pyramid structure. As shown in FIG. 2 , when such a conventional probe head is used to detect a semiconductor device, the contact portion 911 of the probe head 91 will contact the object under test 19 with its cone tip.

從前,為了降低探針頭的接觸部的磨損並延長探針頭的使用壽命,接觸部通常都會使用具有高硬度及高耐磨性的材料來製造(例如鎳或鎳合金材料)。另一方面,待測體的表面通常會形成一層氧化物,在檢測過程中,彈性構件被施壓形變而產生探針所需的彈力,此彈力會傳遞到探針頭的接觸部,使接觸部對待測體施予正向力。藉此,接觸部能夠刺破待測體表面的氧化物以接觸到待測體,建立起電信號交換。 In the past, in order to reduce the wear of the contact portion of the probe head and extend the service life of the probe head, the contact portion was usually made of materials with high hardness and high wear resistance (such as nickel or nickel alloy materials). On the other hand, a layer of oxide is usually formed on the surface of the object to be tested. During the detection process, the elastic member is deformed under pressure to generate the elastic force required by the probe. This elastic force will be transmitted to the contact part of the probe head, making the contact The part exerts a positive force on the object to be measured. Thereby, the contact portion can penetrate the oxide on the surface of the object to be measured to contact the object to be measured, and establish electrical signal exchange.

但是,每當探針頭的接觸部與待測體接觸時,不只會在待測體的中心或中心區域形成破壞性的凹陷壓痕,還會殘留接觸時產生的殘屑。該破壞性的凹陷壓痕會破壞待測體的完整性,進而導致封裝良率不佳。又,殘留在待測體的表面的殘屑,會影響到電性檢測結果的一致性及可靠性。 However, whenever the contact portion of the probe head comes into contact with the object to be measured, not only will destructive depressions and indentations be formed in the center or central area of the object to be measured, but debris generated during the contact will also remain. This destructive dent indentation will destroy the integrity of the object under test, resulting in poor packaging yield. In addition, debris remaining on the surface of the object to be tested will affect the consistency and reliability of the electrical testing results.

又,習知的探針頭的接觸部一般會形成錐狀尖端,該尖端角度通常會大於60度。當探針頭的接 觸部接觸待測體進行檢測時,接觸部的尖端不易排屑,易堆積待測體的殘屑導致電阻過高而有造成融針的風險。 In addition, the contact portion of the conventional probe head generally forms a tapered tip, and the tip angle is usually greater than 60 degrees. When the probe tip is connected When the contact part contacts the object under test for inspection, the tip of the contact part is not easy to remove chips, and debris from the object under test is easily accumulated, resulting in excessive resistance and the risk of needle melting.

有鑑於上述問題,本發明的目的為提供探針頭及探針頭的製造方法,進行電性檢測時,不易破壞待測體的中心區域,且易於排除檢測時產生的殘屑,除提高封裝製程的良率,又可達到電性檢測結果的一致性及可靠性,且不易造成融針。 In view of the above problems, the object of the present invention is to provide a probe head and a manufacturing method of the probe head. When conducting electrical testing, it is not easy to damage the central area of the object to be tested, and it is easy to remove the debris generated during the testing. In addition to improving the packaging The yield of the manufacturing process can be achieved, and the consistency and reliability of electrical testing results can be achieved, and needle melting is less likely to occur.

本發明的探針頭,包含:以第一方向為中心軸形成柱狀,並具有接觸面的本體;以及位於前述接觸面之上的至少一個接觸部;前述接觸部,具有與前述接觸面大致呈垂直且面向前述中心軸的截面;前述接觸部,在與前述截面的相反側具有與前述第一方向呈小於45度的傾斜的斜面;前述截面、前述斜面用以在進行電性檢測時接觸待測體。 The probe head of the present invention includes: a body formed into a columnar shape with the first direction as the central axis and having a contact surface; and at least one contact portion located on the aforementioned contact surface; the aforementioned contact portion has a structure approximately the same as the aforementioned contact surface. A cross-section that is perpendicular and faces the central axis; the contact portion has an inclined surface with an inclination of less than 45 degrees to the first direction on the opposite side to the aforementioned cross-section; the aforementioned cross-section and the aforementioned inclined surface are used for contact during electrical detection The object to be tested.

又,本發明的探針頭,其中,前述第一接觸部,還具有與前述斜面連接,並大致垂直於前述接觸面的連接面。 Furthermore, in the probe head of the present invention, the first contact portion further has a connecting surface connected to the inclined surface and substantially perpendicular to the contact surface.

又,前述第一接觸部,在與前述截面的相反側,具有與前述接觸面接觸,並朝向前述本體的外側方向延伸的延伸部。 Furthermore, the first contact portion has an extension portion that is in contact with the contact surface and extends toward the outer direction of the main body on the opposite side to the cross section.

又,本發明的探針頭,其中,前述延伸部 延伸出前述本體之外。 Furthermore, in the probe head of the present invention, the extending portion Extend beyond the aforementioned ontology.

又,本發明的探針頭,其中,前述第一接觸部,具有墊高層及針尖層;前述針尖層的硬度大於前述墊高層的硬度。 Furthermore, in the probe head of the present invention, the first contact portion has a cushion layer and a needle tip layer; and the needle tip layer has a hardness greater than a hardness of the cushion layer.

又,本發明的探針頭,其中,前述本體具有第一本體部、第二本體部、及第三本體部。 Moreover, in the probe head of this invention, the said body has a 1st body part, a 2nd body part, and a 3rd body part.

又,本發明的探針頭,其中,前述第二本體部的外徑比前述第一本體部及前述第三本體部的外徑還大。 Furthermore, in the probe head of the present invention, the outer diameter of the second body part is larger than the outer diameters of the first body part and the third body part.

又,本發明的探針頭,其中,前述第一本體部、第二本體部、及第三本體部具有導電率大於或等於國際退火標銅的30%的材料。 Furthermore, in the probe head of the present invention, the first body part, the second body part, and the third body part have a material with a conductivity greater than or equal to 30% of international annealed standard copper.

又,本發明的探針頭,其中,前述接觸部的高度大於25微米。 Furthermore, in the probe head of the present invention, the height of the contact portion is greater than 25 microns.

又,本發明的探針頭,其中,前述接觸部的高度大於25微米。本發明的探針組件,包含:探針頭;套管;插棒;以及彈性構件;前述探針頭的前述本體插入前述套管的一端使得前述探針頭與前述套管耦合;前述插棒的插入前述套管的另一端;前述彈性構件設於前述套管中,並介於前述探針頭與前述插棒之間。 Furthermore, in the probe head of the present invention, the height of the contact portion is greater than 25 microns. The probe assembly of the present invention includes: a probe head; a sleeve; a plunger; and an elastic member; the body of the probe head is inserted into one end of the sleeve so that the probe head and the sleeve are coupled; the plunger The other end of the casing is inserted into the casing; the elastic member is provided in the casing and is between the probe head and the insertion rod.

本發明的探針頭的製造方法,包含:在離型基板形成至少一個凹部的工程;在前述離型基板上 及前述凹部中形成導電層的工程;在前述導電層上及前述凹部中形成光阻層,並在前述光阻層中形成孔部的工程;在前述孔部中形成針尖層的工程;在前述針尖層之上填滿前述孔部形成墊高層的工程;以與前述光阻層對齊的方式,將前述墊高層平坦化的工程;在前述光阻層與前述墊高層之上,再形成前述光阻層,並在前述光阻層中形成凹陷部的工程;填充前述凹陷部本體層的工程;以與前述光阻層對齊的方式,將前述本體層平坦化以形成探針頭的工程;以及將前述探針頭從前述離型基板剝離的工程。 The manufacturing method of the probe head of the present invention includes: forming at least one recessed portion on the release substrate; and the process of forming a conductive layer in the aforementioned recessed portion; the process of forming a photoresist layer on the aforementioned conductive layer and in the aforementioned recessed portion, and forming a hole in the aforementioned photoresist layer; the process of forming a tip layer in the aforementioned hole; in the aforementioned The process of filling the aforementioned holes on the needle tip layer to form a pad layer; the process of flattening the aforementioned pad layer in a manner aligned with the aforementioned photoresist layer; and the process of forming the aforementioned photoresist layer on the aforementioned photoresist layer and the aforementioned pad layer. resist layer, and the process of forming a recessed portion in the aforementioned photoresist layer; the process of filling the body layer of the aforementioned recessed portion; the process of planarizing the aforementioned body layer in a manner aligned with the aforementioned photoresist layer to form a probe head; and The process of peeling off the probe head from the release substrate.

又,本發明的探針頭的製造方法,其中,前述本體層具有第一本體部、第二本體部、及第三本體部。 Furthermore, in the method of manufacturing a probe head of the present invention, the body layer has a first body part, a second body part, and a third body part.

根據本發明的提供探針頭及探針頭的製造方法,進行電性檢測時,不易破壞待測體的中心區域,且易於排除檢測時產生的殘屑,除了提高封裝製程良率,又可達到電性檢測結果的一致性及可靠性,且不易造成融針。 According to the probe head and the manufacturing method of the probe head provided by the present invention, it is not easy to damage the central area of the object under test when performing electrical testing, and it is easy to remove the debris generated during the testing. In addition to improving the yield of the packaging process, it can also It achieves the consistency and reliability of electrical testing results and is less likely to cause needle melting.

91:探針頭 91:Probe head

92:套管 92: Casing

94:插棒 94:Insert rod

93:彈性構件 93: Elastic component

911:接觸部 911:Contact Department

1:探針頭 1: Probe head

11:接觸面 11: Contact surface

10:本體 10:Ontology

12:第一接觸部 12:First contact department

13:第二接觸部 13:Second Contact Department

14:第三接觸部 14:Third Contact Department

15:第四接觸部 15:Fourth Contact Department

16:針尖層 16: Needle tip layer

17:墊高層 17:Building the upper floor

19:待測體 19:Object to be tested

121:截面 121: Section

123:延伸部 123:Extension

122:斜面 122: Incline

124:連接面 124:Connection surface

301:離型基板 301: Release substrate

302:凹部 302: concave part

303:導電層 303:Conductive layer

304:光阻層 304: Photoresist layer

305:孔部 305: Hole

306:針尖層 306: needle tip layer

307:墊高層 307:Building the upper floor

308:凹陷部 308: Depression

309:本體層 309:Ontology layer

101:第一本體部 101:First Ontology Department

102:第二本體部 102:Second body part

103:第三本體部 103:The third body part

【圖1】習知的探針組件的分解立體圖。 [Figure 1] An exploded perspective view of a conventional probe assembly.

【圖2】習知的探針頭進行半導體裝置檢測的示意 圖。 [Figure 2] A schematic diagram of a conventional probe head for testing a semiconductor device Figure.

【圖3】第一實施形態的探針頭。圖3A為側視圖、圖3B為立體圖、圖3C為平面圖。 [Fig. 3] The probe head of the first embodiment. FIG. 3A is a side view, FIG. 3B is a perspective view, and FIG. 3C is a plan view.

【圖4】第二實施形態的探針頭。圖4A為側視圖、圖4B為立體圖、圖4C為平面圖。 [Fig. 4] A probe head according to the second embodiment. FIG. 4A is a side view, FIG. 4B is a perspective view, and FIG. 4C is a plan view.

【圖5】第三實施形態的探針頭。圖5A為側視圖、圖5B為立體圖、圖5C為平面圖。 [Fig. 5] A probe head according to the third embodiment. FIG. 5A is a side view, FIG. 5B is a perspective view, and FIG. 5C is a plan view.

【圖6】第四實施形態的探針頭。圖6A為側視圖、圖6B為立體圖、圖6C為平面圖。 [Fig. 6] A probe head according to the fourth embodiment. FIG. 6A is a side view, FIG. 6B is a perspective view, and FIG. 6C is a plan view.

【圖7】第一至第四實施形態的探針頭的剖面構造圖的一例。圖7A為第一實施形態的探針頭的剖面構造圖的一例、圖7B為第二實施形態的探針頭的剖面構造圖的一例、圖7C為第三實施形態的探針頭的剖面構造圖的一例、圖7D為第四實施形態的探針頭的剖面構造圖的一例。 [Fig. 7] An example of a cross-sectional structural diagram of the probe head according to the first to fourth embodiments. 7A is an example of a cross-sectional structural view of the probe head of the first embodiment, FIG. 7B is an example of a cross-sectional structural view of the probe head of the second embodiment, and FIG. 7C is a cross-sectional structural view of the probe head of the third embodiment. An example of the figure, FIG. 7D is an example of a cross-sectional structural diagram of the probe head according to the fourth embodiment.

【圖8】第一實施形態的第一變形例的探針頭。圖8A為側視圖、圖8B為立體圖、圖8C為平面圖。 [Fig. 8] A probe head according to a first modification of the first embodiment. FIG. 8A is a side view, FIG. 8B is a perspective view, and FIG. 8C is a plan view.

【圖9】第二實施形態的第一變形例的探針頭。圖9A為側視圖、圖9B為立體圖、圖9C為平面圖。 [Fig. 9] A probe head according to a first modification of the second embodiment. FIG. 9A is a side view, FIG. 9B is a perspective view, and FIG. 9C is a plan view.

【圖10】第三實施形態的第一變形例的探針頭。圖10A為側視圖、圖10B為立體圖、圖10C為平面圖。 [Fig. 10] A probe head according to a first modification of the third embodiment. FIG. 10A is a side view, FIG. 10B is a perspective view, and FIG. 10C is a plan view.

【圖11】第四實施形態的第一變形例的探針頭。圖11A為側視圖、圖11B為立體圖、圖11C為平面圖。 [Fig. 11] A probe head according to a first modification of the fourth embodiment. FIG. 11A is a side view, FIG. 11B is a perspective view, and FIG. 11C is a plan view.

【圖12】第一至第四實施形態的第一變形例的接觸部的配置示意圖。圖12A為非對稱配置、圖12B為寬度不同的配置、圖12C為高度不同的配置、圖12D為形狀不同的配置。 [Fig. 12] A schematic layout diagram of the contact portion in the first modification of the first to fourth embodiments. Figure 12A shows an asymmetric configuration, Figure 12B shows a configuration with different widths, Figure 12C shows a configuration with different heights, and Figure 12D shows a configuration with different shapes.

【圖13】第二變形例的探針頭。圖13A為側視圖、圖13B為立體圖、圖13C為平面圖。 [Fig. 13] A probe head according to the second modification. FIG. 13A is a side view, FIG. 13B is a perspective view, and FIG. 13C is a plan view.

【圖14】第三變形例的探針頭。圖14A為側視圖、圖14B為立體圖、圖14C為平面圖。 [Fig. 14] A probe head according to the third modification example. FIG. 14A is a side view, FIG. 14B is a perspective view, and FIG. 14C is a plan view.

【圖15】第四變形例的探針頭。圖15A為側視圖、圖15B為立體圖、圖15C為平面圖。 [Fig. 15] A probe head according to the fourth modification example. FIG. 15A is a side view, FIG. 15B is a perspective view, and FIG. 15C is a plan view.

【圖16】第一至第四實施形態的探針頭的製造流程圖。 [Fig. 16] A manufacturing flow chart of the probe heads according to the first to fourth embodiments.

【圖17】第一至第四實施形態的探針頭的製造流程。 [Fig. 17] The manufacturing flow of the probe heads according to the first to fourth embodiments.

【圖18】探針頭的本體的構造。 [Figure 18] The structure of the probe head body.

【圖19】探針組件的構造。 [Figure 19] Structure of the probe assembly.

以下的說明中,相同元件或具有相同機能的元件會使用相同符號來表示,並省略重複的說明。 In the following description, the same components or components with the same functions will be represented by the same symbols, and repeated descriptions will be omitted.

此外,應注意本說明書使用「垂直」、「直角」、「平行」等用語時,包含存在些許誤差,而非「完全垂直」、「完全直角」、「完全平行」的態樣。 In addition, it should be noted that when this manual uses terms such as "perpendicular", "right angle", and "parallel", there are slight errors, and it does not mean "completely vertical", "completely right-angled", and "completely parallel".

又,在以下的說明中用到的「第一方向」、「第 二方向」、「第三方向」雖是指「Z方向」、「Y方向」、「X方向」,但依據直角座標定義的方位,該等方向也可以任意變換。 In addition, the terms "first direction" and "third direction" used in the following explanation Although the "second direction" and "third direction" refer to the "Z direction", "Y direction", and "X direction", these directions can be arbitrarily transformed based on the orientation defined by the rectangular coordinates.

[第一實施形態] [First Embodiment]

圖3A~C示出本發明的第一實施形態的具有單接觸部的探針頭1。該探針頭1,包含:以第一方向(Z方向)為中心軸形成柱狀,並具有接觸面11的本體10、及位於接觸面11之上的第一接觸部12。其中,第一接觸部12,具有與接觸面11大致呈垂直且面向中心軸的截面121。又,該截面121不一定是完整的平面。其中,第一接觸部12的高度,例如,大於25微米。此外,第一接觸部12,在與截面121的相反側(亦即,朝向本體10的外側)具有以與第一方向(Z方向)夾角度θ的斜面122。其中,該角度θ例如為小於45度的角度,但該技術領域的通常知識者可以根據需求變更該角度θ。因此,如圖3A所示,從第二方向(Y方向)觀察第一接觸部12時,該第一接觸部12會大致呈三角形。但應注意的是該三角形並不一定是完美的三角形,可以存在些許誤差,該技術領域的通常知識者也可以視其需要變更該形狀。再來,如圖3A所示,截面121、斜面122用以在進行電性檢測時接觸待測體19。詳言之,在進行電性檢測時,截面121、斜面122會接觸待測體19的遠 離中心區域的側部。亦即,截面121、斜面122不會直接接觸待測體19的中心,而是從側面接觸待測體19。這是因為第一接觸部12並非錐狀尖端,而具有較小的角度,在進行電性檢測時,檢測位置會遠離待測體19的中心。因此,第一接觸部12不會在待測體19的中心或中心區域形成破壞性的凹陷壓痕,進而提高後段封裝的產品良率。 3A to 3C show the probe head 1 with a single contact part according to the first embodiment of the present invention. The probe head 1 includes a main body 10 that is cylindrical with the first direction (Z direction) as the central axis and has a contact surface 11 , and a first contact portion 12 located above the contact surface 11 . The first contact portion 12 has a cross section 121 that is substantially perpendicular to the contact surface 11 and faces the central axis. In addition, this cross section 121 does not necessarily have to be a complete plane. The height of the first contact portion 12 is, for example, greater than 25 microns. In addition, the first contact portion 12 has a slope 122 at an angle θ with the first direction (Z direction) on the opposite side to the cross section 121 (that is, toward the outside of the body 10 ). The angle θ is, for example, less than 45 degrees, but a person with ordinary knowledge in the technical field can change the angle θ according to needs. Therefore, as shown in FIG. 3A , when the first contact portion 12 is viewed from the second direction (Y direction), the first contact portion 12 will be substantially triangular in shape. However, it should be noted that the triangle is not necessarily a perfect triangle and may have some errors. A person with ordinary knowledge in the technical field may also change the shape as needed. Next, as shown in FIG. 3A , the cross section 121 and the inclined surface 122 are used to contact the object 19 during electrical testing. Specifically, during electrical testing, the cross section 121 and the inclined surface 122 will contact the far side of the object 19 under test. Sides away from the central area. That is, the cross section 121 and the inclined surface 122 do not directly contact the center of the object 19, but contact the object 19 from the side. This is because the first contact portion 12 is not a tapered tip, but has a smaller angle. When electrical detection is performed, the detection position will be far away from the center of the object 19 . Therefore, the first contact portion 12 will not form destructive concave indentations in the center or central area of the object under test 19 , thereby improving the product yield of subsequent packaging.

此外,圖3A~C雖示出截面121與接觸面11垂直的態樣,但截面121未必要垂直於接觸面11,可以存在些許誤差。又,該技術領域的通常知識者可以視其需要變更截面121與接觸面11的夾角。 In addition, although FIGS. 3A to 3C show the cross-section 121 being perpendicular to the contact surface 11 , the cross-section 121 is not necessarily perpendicular to the contact surface 11 , and there may be some errors. In addition, those skilled in the art can change the angle between the cross section 121 and the contact surface 11 as needed.

此外,因為第一接觸部12具有與第一方向(Z方向)小於45度的斜面122及垂直於該接觸面11的截面121,所以第一接觸部12接觸待測體19時產生的待測體19的殘屑,會沿著該斜面122與截面121排除,不易堆積於第一接觸部12的尖端,降低了電阻過高及融針的風險。 In addition, because the first contact portion 12 has an incline 122 less than 45 degrees with the first direction (Z direction) and a cross section 121 perpendicular to the contact surface 11 , the test object 19 is generated when the first contact portion 12 contacts the object 19 . The debris of the body 19 will be eliminated along the slope 122 and the cross section 121, and will not easily accumulate at the tip of the first contact portion 12, thereby reducing the risk of excessive resistance and needle melting.

[第二實施形態] [Second Embodiment]

接著,圖4A~C示出本發明的第二實施形態的具有單接觸部的探針頭1。如圖4A~C所示,第一接觸部12,還具有與斜面122連接,並大致垂直於接觸面11的連接面124,又,該連接面124不一定是完的平面。如圖4A的側視圖所示,從第二方向(Y方向) 觀察第一接觸部12時,該第一接觸部12會呈截面121與連接面124平行的梯形。但應注意的是該梯形並不一定是完美的梯形(即截面121與連接面124未必完全平行),可以存在些許誤差,該技術領域的通常知識者也可以視其需要變更該形狀。藉此,因為斜面122的長度較短,且具有近似垂直的該連接面124及該截面121,使殘屑可脫離的空間更大或停留的長度更短,所以從斜面122與截面121排除的待測體19的殘屑,更容易脫離第一接觸部12的表面。 Next, FIGS. 4A to 4C show the probe head 1 with a single contact part according to the second embodiment of the present invention. As shown in FIGS. 4A to 4C , the first contact portion 12 also has a connection surface 124 connected to the inclined surface 122 and substantially perpendicular to the contact surface 11 . In addition, the connection surface 124 is not necessarily a complete plane. As shown in the side view of Figure 4A, from the second direction (Y direction) When observing the first contact portion 12 , the first contact portion 12 has a trapezoidal shape with a cross section 121 parallel to the connecting surface 124 . However, it should be noted that the trapezoid is not necessarily a perfect trapezoid (that is, the cross section 121 and the connecting surface 124 may not be completely parallel), and there may be some errors. Those with ordinary knowledge in the technical field may also change the shape as needed. Therefore, because the length of the inclined surface 122 is shorter and has the approximately vertical connection surface 124 and the cross-section 121, the space for the debris to escape is larger or the length of stay is shorter, so the debris excluded from the inclined surface 122 and the cross-section 121 The debris of the object to be measured 19 is more likely to break away from the surface of the first contact portion 12 .

[第三實施形態] [Third Embodiment]

接著,圖5A~C示出本發明的第三實施形態的具有單接觸部的探針頭1。如圖5A~C所示,第一接觸部12,在與截面121的相反側,具有與接觸面11接觸,並朝向本體10的外側方向延伸的延伸部123。如此,如圖5A的側視圖所示,從第二方向(Y方向)觀察第一接觸部12時,該第一接觸部12,會呈在矩形基底上堆疊三角形而成的形狀。但應注意的是該矩形及三角形並不一定是完美的矩形及三角形,可以存在些許誤差,該技術領域的通常知識者也可以視其需要變更該形狀。藉由該延伸部123,增加了與接觸面11的接觸面積,能夠使第一接觸部12與接觸面11的連接更為穩固,使得第一接觸部12不易從本體10脫落。 Next, FIGS. 5A to 5C show the probe head 1 with a single contact part according to the third embodiment of the present invention. As shown in FIGS. 5A to 5C , the first contact portion 12 has an extension portion 123 that contacts the contact surface 11 and extends toward the outer direction of the body 10 on the opposite side to the cross section 121 . In this way, as shown in the side view of FIG. 5A , when the first contact portion 12 is viewed from the second direction (Y direction), the first contact portion 12 will have a shape in which triangles are stacked on a rectangular base. However, it should be noted that the rectangles and triangles are not necessarily perfect rectangles and triangles, and there may be slight errors. Those with ordinary knowledge in the technical field may also change the shapes according to their needs. The extension portion 123 increases the contact area with the contact surface 11 , making the connection between the first contact portion 12 and the contact surface 11 more stable, making the first contact portion 12 less likely to fall off from the body 10 .

[第四實施形態] [Fourth Embodiment]

圖6A~C示出本發明的第四實施形態的具有單接觸部的探針頭1。如圖6所示,從第一方向(Z方向)朝向接觸面11看時,延伸部123延伸出本體10之外。又,延伸部123延伸出本體10之外的長度,可以經由該技術領域的通常知識者視其需求自由調整。藉此,在組裝探針頭1時,能夠以延伸出本體10之外的延伸部123作為基準,進行對位、整列、放置。 6A to 6C show a probe head 1 with a single contact part according to the fourth embodiment of the present invention. As shown in FIG. 6 , when viewed from the first direction (Z direction) toward the contact surface 11 , the extension portion 123 extends out of the body 10 . In addition, the length of the extension portion 123 extending beyond the body 10 can be freely adjusted by a person with ordinary skill in the art according to his or her needs. Thereby, when assembling the probe head 1 , the extension portion 123 extending out of the body 10 can be used as a reference for alignment, alignment, and placement.

以上所述的第一至第四實施形態的探針頭1,該第一接觸部12以單一種材料形成。但是,如圖7A~7D所示,以上所述的第一至第四實施形態的探針頭1的第一接觸部12,至少以墊高層17及針尖層16形成也可以。其中,針尖層16的硬度大於墊高層17的硬度,但墊高層17的硬度大於針尖層16的硬度也可以。因為針尖層16用來接觸待測體19,採用硬度較大的材料,能夠降低探針頭1尖端的耗損,增加使用壽命。其中,從接觸面11朝第一方向(Z方向)依序形成墊高層17與針尖層16即可,從第二方向(Y方向)觀察時,墊高層17與針尖層16的接觸面可以是水平面、也可以是斜面,該技術領域的通常知識者可以視其所需進行調整。此外,墊高層17的厚度與針尖層16的厚度,亦可因應需要自由調整。 In the probe head 1 of the first to fourth embodiments described above, the first contact portion 12 is formed of a single material. However, as shown in FIGS. 7A to 7D , the first contact portion 12 of the probe head 1 of the above-described first to fourth embodiments may be formed of at least the pad layer 17 and the tip layer 16 . The hardness of the needle tip layer 16 is greater than the hardness of the cushion layer 17 , but the hardness of the cushion layer 17 may be greater than the hardness of the needle tip layer 16 . Because the needle tip layer 16 is used to contact the object to be measured 19, using a material with greater hardness can reduce the wear and tear on the tip of the probe head 1 and increase the service life. Wherein, it suffices to form the cushion layer 17 and the needle tip layer 16 sequentially from the contact surface 11 toward the first direction (Z direction). When viewed from the second direction (Y direction), the contact surface of the cushion layer 17 and the needle tip layer 16 can be The horizontal plane may also be an inclined plane, and a person with ordinary knowledge in this technical field can adjust it as needed. In addition, the thickness of the cushion layer 17 and the thickness of the needle tip layer 16 can also be freely adjusted according to needs.

此外,以上所述的第一至第四實施形態的探針頭,僅是為了易於理解而例示者,該技術領域的通常知識者可以任意調整或組合第一至第四實施形態的各種組態。 In addition, the probe heads of the first to fourth embodiments described above are only exemplified for ease of understanding, and those skilled in the art can arbitrarily adjust or combine the various configurations of the first to fourth embodiments. .

[第一變形例] [First modification]

圖8A~C示出本發明的第一變形例的具有雙接觸部的探針頭1。如圖8A~C所示,探針頭1,還具有位於接觸面11之上的第二接觸部13。如圖8C所示,從第一方向(Z方向)觀察時,第一接觸部12與第二接觸部13在第三方向(X方向)上對稱排列,且第一接觸部12的截面與第二接觸部13的截面在第二方向(Y方向)上對向,且面向中心軸。如圖8A所示,第一接觸部12與第二接觸部13,與接觸面11會形成容置空間,在進行電性檢測時,第一接觸部12及第二接觸部13接觸待測體19,使得待測體19的一部分位於容置空間內。亦即,第一接觸部12與第二接觸部13不會直接接觸待測體19的中心,而是從側面包夾接觸待測體19。藉此,能夠增加待測體19的被接觸數量,且以不同方位接觸待測體19進行檢測,使降低探針接觸待測體19時進而的接觸電阻,減少融針狀況,其中,接觸部以對向排列具有較穩定的檢測效果。而且,即便第一接觸部12及第二接觸部13其中之一損壞,也能夠利用另一個接觸部進行檢 測。 8A to 8C show a probe head 1 with double contact parts according to a first modification of the present invention. As shown in FIGS. 8A to 8C , the probe head 1 also has a second contact portion 13 located above the contact surface 11 . As shown in FIG. 8C , when viewed from the first direction (Z direction), the first contact portion 12 and the second contact portion 13 are symmetrically arranged in the third direction (X direction), and the cross section of the first contact portion 12 is the same as that of the second contact portion 13 . The cross-sections of the two contact parts 13 are opposite in the second direction (Y direction) and face the central axis. As shown in FIG. 8A , the first contact part 12 and the second contact part 13 form an accommodation space with the contact surface 11 . During electrical detection, the first contact part 12 and the second contact part 13 contact the object to be measured. 19, so that a part of the object 19 is located in the accommodation space. That is to say, the first contact part 12 and the second contact part 13 do not directly contact the center of the object 19, but encircle and contact the object 19 from the sides. In this way, the number of objects under test 19 that are contacted can be increased, and the objects under test 19 can be contacted at different directions for detection, thereby reducing the contact resistance when the probe contacts the object under test 19 and reducing the needle melting situation, in which the contact portion Arranging them in opposite directions has a more stable detection effect. Moreover, even if one of the first contact part 12 and the second contact part 13 is damaged, the other contact part can be used for inspection. Test.

此外,圖8A~C所示的第一接觸部12與第二接觸部13,是對照第一實施形態(圖3)的第一接觸部的形狀,但第一變形例的第一接觸部12與第二接觸部13不限於第一實施形態的第一接觸部的形狀。例如,圖9A~C所示的第一接觸部12與第二接觸部13,對照第二實施形態(圖4)的第一接觸部的形狀。圖10A~C所示的第一接觸部12與第二接觸部13,對照第三實施形態(圖5)的第一接觸部的形狀。圖11A~C所示的第一接觸部12與第二接觸部13,對照第四實施形態(圖6)的第一接觸部的形狀。 In addition, the first contact portion 12 and the second contact portion 13 shown in FIGS. 8A to 8C are similar to the shapes of the first contact portion in the first embodiment (FIG. 3). However, the first contact portion 12 in the first modification example The second contact portion 13 is not limited to the shape of the first contact portion in the first embodiment. For example, the first contact portion 12 and the second contact portion 13 shown in FIGS. 9A to 9C compare with the shape of the first contact portion in the second embodiment (FIG. 4). The first contact portion 12 and the second contact portion 13 shown in FIGS. 10A to 10C compare with the shape of the first contact portion in the third embodiment (FIG. 5). The first contact portion 12 and the second contact portion 13 shown in FIGS. 11A to 11C compare with the shape of the first contact portion in the fourth embodiment (FIG. 6).

又,上述第一變形例的各種探針頭1的第一接觸部12及第二接觸部13,同樣至少具有墊高層17及針尖層16也可以,在此不再詳述。 In addition, the first contact portion 12 and the second contact portion 13 of the various probe heads 1 of the above-mentioned first modification example may also have at least the cushion layer 17 and the tip layer 16, which will not be described in detail here.

又,上述第一變形例中的第一接觸部12與第二接觸部13也可以呈非對稱。具體而言,如圖12A所示,第一接觸部12與第二接觸部13未以本體10為中心軸對稱,亦即第一接觸部12與本體10的中心軸的距離也可以不同於第二接觸部13與本體10的中心軸的距離。其中,第一接觸部12接觸待測體19的相對中心位置,能夠確保電性交換。另一方面,第二接觸部13接觸待測體19的相對外側,能夠強化電性穩定性並減少待測體19中心區域的檢測痕跡及 殘屑產生。還有,如圖12B所示,第一接觸部12的寬度也可以不同於第二接觸部13的寬度,當兩個接觸部寬度不同時,可以將殘屑導向預先設計的排屑方向。再來,如圖12C所示,第一接觸部12的高度也可以不同於第二接觸部13的高度。進行檢測時,第一接觸部12與第二接觸部13位於待測體19中心的兩側,且第一接觸部12與本體10的中心的距離和第二接觸部13與本體10的中心的距離不同,第一接觸部12的高度與第二接觸部13的高度也不同,使得第一接觸部12及第二接觸部13接觸待測體19的時點有先後差異,藉此在進行檢測時第一接觸部12與第二接觸部13對待測體19產生的檢測痕跡大小會有所不同,能夠增加探針的檢測壽命。最後,如圖12D所示,第一接觸部12的形狀不同於第二接觸部13的形狀也可以,例如,第一接觸部12採用第一實施形態的第一接觸部的形狀,第二接觸部13採用第二實施形態的第一接觸部的形狀也可以。該技術領域的通常知識者可以視其需要改變第一接觸部12與第二接觸部13的佈局、高度、寬度、形狀。 In addition, the first contact portion 12 and the second contact portion 13 in the first modification example may be asymmetric. Specifically, as shown in FIG. 12A , the first contact part 12 and the second contact part 13 are not symmetrical about the central axis of the body 10 , that is, the distance between the first contact part 12 and the central axis of the body 10 may also be different from the first contact part 12 and the second contact part 13 . The distance between the two contact parts 13 and the central axis of the body 10. Among them, the first contact part 12 contacts the relative center position of the object to be measured 19, which can ensure electrical exchange. On the other hand, the second contact portion 13 contacts the opposite outer side of the object 19, which can enhance the electrical stability and reduce detection traces and traces in the center area of the object 19. Debris is generated. In addition, as shown in FIG. 12B , the width of the first contact portion 12 may also be different from the width of the second contact portion 13 . When the widths of the two contact portions are different, the debris can be directed to a pre-designed chip removal direction. Furthermore, as shown in FIG. 12C , the height of the first contact part 12 may also be different from the height of the second contact part 13 . During detection, the first contact part 12 and the second contact part 13 are located on both sides of the center of the object 19, and the distance between the first contact part 12 and the center of the body 10 is equal to the distance between the second contact part 13 and the center of the body 10. The distance is different, and the height of the first contact part 12 and the height of the second contact part 13 are also different, so that the time points when the first contact part 12 and the second contact part 13 contact the object to be measured 19 are different, so that when performing detection, The first contact part 12 and the second contact part 13 will have different sizes of detection marks produced on the object to be measured 19, which can increase the detection life of the probe. Finally, as shown in FIG. 12D , the shape of the first contact part 12 may be different from the shape of the second contact part 13 . For example, the first contact part 12 adopts the shape of the first contact part in the first embodiment, and the second contact part 13 adopts the shape of the first contact part 13 in the first embodiment. The portion 13 may adopt the shape of the first contact portion of the second embodiment. Those skilled in the art can change the layout, height, width, and shape of the first contact portion 12 and the second contact portion 13 as needed.

[第二變形例] [Second modification]

接著,圖13A~C示出本發明的第二變形例的具有雙接觸部的探針頭1。如圖13A~C所示,探針頭1,還具有位於接觸面11之上的第二接觸部13,第 二變形例與第一變形例的差異在於第二接觸部13的排列位置。如圖13C所示,從第一方向(Z方向)觀察時,第一接觸部12與第二接觸部13在第二方向(Y方向)上對稱排列。如圖13A所示,在進行電性檢測時,第一接觸部12與第二接觸部13不會直接接觸待測體19的中心區域,而是從側面的不同位置接觸待測體19,與單一接觸部(圖3A~C)相比,檢測時電性更接穩定。 Next, FIGS. 13A to 13C show a probe head 1 with double contact portions according to a second modification of the present invention. As shown in Figures 13A~C, the probe head 1 also has a second contact portion 13 located above the contact surface 11. The difference between the second modification example and the first modification example lies in the arrangement position of the second contact portions 13 . As shown in FIG. 13C , when viewed from the first direction (Z direction), the first contact portion 12 and the second contact portion 13 are symmetrically arranged in the second direction (Y direction). As shown in FIG. 13A , during electrical detection, the first contact part 12 and the second contact part 13 do not directly contact the central area of the object under test 19 , but contact the object under test 19 from different positions on the side. Compared with the single contact part (Figure 3A~C), the electrical connection is more stable during detection.

此外,圖13A~C所示的第一接觸部12與第二接觸部13,是對照第一實施形態(圖3)的第一接觸部的形狀,但第一接觸部12與第二接觸部13,也可以是第二至第四實施形態的第一接觸部的形狀,在此不再詳述。 In addition, the first contact portion 12 and the second contact portion 13 shown in FIGS. 13A to C are similar to the shapes of the first contact portion in the first embodiment (FIG. 3). However, the first contact portion 12 and the second contact portion 13 have different shapes. 13. It may also be the shape of the first contact portion in the second to fourth embodiments, which will not be described in detail here.

又,上述第二變形例的各種探針頭1的第一接觸部12及第二接觸部13,同樣至少具有墊高層17及針尖層16也可以,在此不再詳述。 In addition, the first contact portion 12 and the second contact portion 13 of the various probe heads 1 of the above-mentioned second modification example may also have at least the cushion layer 17 and the tip layer 16, which will not be described in detail here.

又,該技術領域的通常知識者也可以視其需要改變第二變形例的第一接觸部12與第二接觸部13的佈局、高度、寬度、形狀,在此不再詳述。 In addition, those skilled in the art can also change the layout, height, width, and shape of the first contact portion 12 and the second contact portion 13 of the second modification according to their needs, which will not be described in detail here.

[第三變形例] [Third modification]

接著,圖14A~C示出本發明的第三變形例的具有四接觸部的探針頭1。如圖14A~C所示,探針頭1,還具有位於接觸面11之上的第二接觸部13、第 三接觸部14、及第四接觸部15。如圖14C所示,從第一方向(Z方向)觀察時,第一接觸部12與第二接觸部13在第三方向(X方向)上對稱排列、第三接觸部14與第四接觸部15在第三方向(X方向)上對稱排列,而且第一接觸部12與第三接觸部14在第二方向(Y方向)上對稱排列、第二接觸部13與第四接觸部15在第二方向(Y方向)上對稱排列。亦即,第三變形例中,第一接觸部12的截面與第二接觸部13的截面在第三方向(X方向)上對向、第三接觸部14的截面與第四接觸部15的截面在第三方向(X方向)上對向。當然,上述各接觸部呈非對稱排列也可以。又,如圖14A所示,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,與接觸面11會形成容置空間,在進行電性檢測時,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15接觸待測體19,使得待測體19的一部分位於容置空間內。亦即,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15不會直接接觸待測體19的中心區域,而是從待測體19的側面四個不同位置包夾接觸待測體19。藉此,能夠將待測體19包覆在容置空間中,使接觸穩定,增加檢測成功率。而且,即便第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15其中之一損壞,也能夠利用其 他接觸部進行檢測。 Next, FIGS. 14A to 14C show a probe head 1 having four contact parts according to a third modification of the present invention. As shown in Figures 14A to 14C, the probe head 1 also has a second contact portion 13 and a third contact portion located above the contact surface 11. The third contact part 14 and the fourth contact part 15. As shown in FIG. 14C , when viewed from the first direction (Z direction), the first contact portion 12 and the second contact portion 13 are symmetrically arranged in the third direction (X direction), and the third contact portion 14 and the fourth contact portion 15 are symmetrically arranged in the third direction (X direction), and the first contact portion 12 and the third contact portion 14 are symmetrically arranged in the second direction (Y direction), and the second contact portion 13 and the fourth contact portion 15 are in the third direction (Y direction). Arranged symmetrically in two directions (Y direction). That is, in the third modification, the cross section of the first contact part 12 and the cross section of the second contact part 13 are opposite in the third direction (X direction), and the cross section of the third contact part 14 and the fourth contact part 15 are opposite to each other in the third direction (X direction). The sections face each other in the third direction (X direction). Of course, the above-mentioned contact portions may also be arranged asymmetrically. In addition, as shown in FIG. 14A , the first contact part 12 , the second contact part 13 , the third contact part 14 and the fourth contact part 15 form an accommodation space with the contact surface 11 . When performing electrical detection, The first contact part 12 , the second contact part 13 , the third contact part 14 and the fourth contact part 15 contact the object to be measured 19 so that a part of the object to be measured 19 is located in the accommodation space. That is to say, the first contact part 12 , the second contact part 13 , the third contact part 14 and the fourth contact part 15 do not directly contact the central area of the object under test 19 , but from four sides of the object under test 19 The body under test 19 is surrounded and contacted at different positions. In this way, the object to be measured 19 can be covered in the accommodation space, making the contact stable and increasing the detection success rate. Moreover, even if one of the first contact part 12, the second contact part 13, the third contact part 14, and the fourth contact part 15 is damaged, it can still be used. He contacted the ministry for testing.

此外,圖14A~C所示的第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,是對照第一實施形態(圖3)的第一接觸部的形狀,但第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,也可以是第二至第四實施形態的第一接觸部的形狀,在此不再詳述。 In addition, the first contact portion 12, the second contact portion 13, the third contact portion 14, and the fourth contact portion 15 shown in FIGS. 14A to C are compared with the first contact portion of the first embodiment (FIG. 3). shape, but the first contact part 12, the second contact part 13, the third contact part 14, and the fourth contact part 15 may also have the shape of the first contact part in the second to fourth embodiments, which will not be repeated here. Elaborate.

又,上述第三變形例的各種探針頭1的第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,同樣至少具有墊高層17及針尖層16也可以,在此不再詳述。 In addition, the first contact portion 12, the second contact portion 13, the third contact portion 14, and the fourth contact portion 15 of the various probe heads 1 of the third modification example also have at least the cushion layer 17 and the tip layer 16. Okay, no more details here.

又,該技術領域的通常知識者也可以視其需要改變第三變形例的第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15的佈局、高度、寬度、形狀,在此不再詳述。 In addition, those skilled in the art may also change the layout, height, and width of the first contact portion 12 , the second contact portion 13 , the third contact portion 14 , and the fourth contact portion 15 of the third modification as needed. , shape will not be described in detail here.

[第四變形例] [Fourth modification]

接著,圖15A~C示出本發明的第四變形例的具有四接觸部的探針頭1。如圖15A~C所示,探針頭1,還具有位於接觸面11之上的第二接觸部13、第三接觸部14、及第四接觸部15。如圖15C所示,從第一方向(Z方向)觀察時,第一接觸部12與第二接觸部13在第三方向(X方向)上對稱排列、第三接觸部14與第四接觸部15在第二方向(Y方向)上對稱排 列。第四變形例與第三變形例的差異點在於第一接觸部12的截面與第二接觸部13的截面在第三方向(X方向)上對向、第三接觸部14的截面與第四接觸部15的截面在第二方向(Y方向)上對向,且第一接觸部12與第二接觸部13的連線,會和第三接觸部14與第四接觸部15的連線交於本體10的中心。又,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15各自的截面都面向中心軸。如圖15A所示,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,與接觸面11會形成容置空間,在進行電性檢測時,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15接觸待測體19,使得待測體19的一部分位於容置空間內。亦即,第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15不會直接接觸待測體19的中心,而是從待測體19的前後左右四個不同位置圍繞接觸待測體19,即使待測體19分佈位置有所偏移,未完全與探針中心呈一直線,也不影響待測體19與接觸部的電性交換,而接觸部數量增至四個,因各朝向中心的平面為近似垂直接觸面的不連續平面,能夠使接觸部與待測體19兩者之間有較大的容置空間,因此待測體19的殘屑可藉由各接觸部的各斜面及此容置空間排除。而且,即便第一接觸部12、第二接觸部 13、第三接觸部14、及第四接觸部15其中之一損壞,也能夠利用其他接觸部進行檢測。 Next, FIGS. 15A to 15C show a probe head 1 having four contact parts according to a fourth modification of the present invention. As shown in FIGS. 15A to 15C , the probe head 1 also has a second contact portion 13 , a third contact portion 14 , and a fourth contact portion 15 located above the contact surface 11 . As shown in FIG. 15C , when viewed from the first direction (Z direction), the first contact portion 12 and the second contact portion 13 are symmetrically arranged in the third direction (X direction), and the third contact portion 14 and the fourth contact portion are arranged symmetrically in the third direction (X direction). 15 are arranged symmetrically in the second direction (Y direction) List. The difference between the fourth modification and the third modification is that the cross section of the first contact part 12 and the second contact part 13 are opposite in the third direction (X direction), and the cross section of the third contact part 14 is opposite to the fourth The cross-sections of the contact portions 15 are opposite in the second direction (Y direction), and the line connecting the first contact portion 12 and the second contact portion 13 intersects with the line connecting the third contact portion 14 and the fourth contact portion 15 at the center of the body 10. In addition, the cross sections of the first contact part 12 , the second contact part 13 , the third contact part 14 and the fourth contact part 15 all face the central axis. As shown in FIG. 15A , the first contact part 12 , the second contact part 13 , the third contact part 14 and the fourth contact part 15 form an accommodation space with the contact surface 11 . When performing electrical detection, the first contact part 14 and the fourth contact part 15 form an accommodation space. The contact part 12, the second contact part 13, the third contact part 14, and the fourth contact part 15 contact the object to be measured 19, so that a part of the object to be measured 19 is located in the accommodation space. That is to say, the first contact part 12 , the second contact part 13 , the third contact part 14 and the fourth contact part 15 do not directly contact the center of the object to be measured 19 , but from the front, rear, left and right sides of the object to be measured 19 The body under test 19 is contacted at different positions. Even if the distribution position of the body under test 19 is offset and not completely in a straight line with the center of the probe, the electrical exchange between the body under test 19 and the contact parts will not be affected, and the number of contact parts will increase. to four. Since each plane toward the center is a discontinuous plane that is approximately a vertical contact surface, there can be a larger accommodation space between the contact part and the object to be measured 19. Therefore, the debris of the object to be measured 19 can be It is eliminated by the inclined surfaces of each contact part and the accommodation space. Moreover, even if the first contact portion 12 and the second contact portion 13. If one of the third contact part 14 and the fourth contact part 15 is damaged, the other contact part can also be used for detection.

此外,圖15A~C所示的第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,是對照第一實施形態(圖3)的第一接觸部的形狀,但第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,也可以是第二至第四實施形態的第一接觸部的形狀,在此不再詳述。 In addition, the first contact part 12, the second contact part 13, the third contact part 14, and the fourth contact part 15 shown in FIGS. 15A to 15C are compared with the first contact part of the first embodiment (FIG. 3). shape, but the first contact part 12, the second contact part 13, the third contact part 14, and the fourth contact part 15 may also have the shape of the first contact part in the second to fourth embodiments, which will not be repeated here. Elaborate.

又,上述第四變形例的各種探針頭1的第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15,同樣至少具有墊高層17及針尖層16也可以,在此不再詳述。 In addition, the first contact portion 12, the second contact portion 13, the third contact portion 14, and the fourth contact portion 15 of the various probe heads 1 of the fourth modification example also have at least the cushion layer 17 and the tip layer 16. Okay, no more details here.

又,該技術領域的通常知識者也可以視其需要改變第四變形例的第一接觸部12、第二接觸部13、第三接觸部14、及第四接觸部15的佈局、高度、寬度、形狀,在此不再詳述。 In addition, those skilled in the art may also change the layout, height, and width of the first contact portion 12 , the second contact portion 13 , the third contact portion 14 , and the fourth contact portion 15 of the fourth modification according to their needs. , shape will not be described in detail here.

最後,雖以上第一至第四變形例分別示出具有兩個及四個接觸部的探針頭1,但接觸部的數量和排列方式沒有限定,該技術領域的通常知識者可以自由變更接觸部的數量及排列方式。 Finally, although the first to fourth modification examples above show the probe head 1 with two and four contact parts respectively, the number and arrangement of the contact parts are not limited, and those skilled in the art can freely change the contact parts. The number and arrangement of parts.

[探針頭的製造方法] [Probe head manufacturing method]

以下,說明製造本發明的第一實施形態的探針頭的方法。參照圖16及圖17,第一實施形態的探 針頭的製造方法,採用微機電製程,具有下述工程。 Hereinafter, a method of manufacturing the probe head according to the first embodiment of the present invention will be described. Referring to Figures 16 and 17, the exploration of the first embodiment The manufacturing method of the needle adopts micro-electromechanical process and has the following engineering.

首先,在離型基板301形成至少一個凹部302(S01)。其中,該凹部302的形狀、尺寸、數量、位置,可以因應所欲形成的接觸部的形狀、尺寸、數量、位置進行任意調整。又,形成凹部302的方法通常經由蝕刻形成,但不以此為限。 First, at least one recess 302 is formed in the release substrate 301 (S01). The shape, size, quantity, and position of the recessed portions 302 can be adjusted arbitrarily according to the shape, size, quantity, and position of the contact portion to be formed. In addition, the method of forming the recessed portion 302 is usually through etching, but is not limited thereto.

接著,在離型基板301上及凹部302中形成導電層303(S02)。其中,該導電層303是用以在後續的工程中在其之上形成金屬層。又,形成該導電層303的方法通常是經由濺鍍,但不以此為限。 Next, the conductive layer 303 is formed on the release substrate 301 and in the recessed portion 302 (S02). The conductive layer 303 is used to form a metal layer thereon in subsequent processes. In addition, the method of forming the conductive layer 303 is usually through sputtering, but is not limited thereto.

再來,在導電層303上及凹部302中形成光阻層304,並在光阻層304中形成孔部305(S03)。其中,該孔部305的形狀、尺寸、數量、位置,如此前述,可以因應所欲形成的接觸部的形狀、尺寸、數量、位置進行任意調整。又,形成該光阻層304的方法通常是經由旋轉塗佈,但不以此為限。又,形成孔部305的方法通常經由光蝕刻形成,但不以此為限。 Next, a photoresist layer 304 is formed on the conductive layer 303 and in the recess 302, and a hole 305 is formed in the photoresist layer 304 (S03). As mentioned above, the shape, size, quantity, and position of the holes 305 can be adjusted arbitrarily according to the shape, size, quantity, and position of the contact portion to be formed. In addition, the method of forming the photoresist layer 304 is usually spin coating, but is not limited thereto. In addition, the method of forming the hole portion 305 is usually through photolithography, but is not limited thereto.

接著,在孔部305中形成針尖層306(S04)。其中,該針尖層306的材料將於後述。此外,形成針尖層306的方法,通常是經由電鍍,但不以此為限。又,在沒有形成墊高層的情形中,針尖層相當於接觸部。 Next, the tip layer 306 is formed in the hole portion 305 (S04). The material of the tip layer 306 will be described later. In addition, the method of forming the tip layer 306 is usually through electroplating, but is not limited thereto. In addition, when the pad layer is not formed, the tip layer corresponds to the contact portion.

再來,在針尖層306之上填滿孔部305形成墊 高層307。其中,若不需要墊高層307的情形,直接在孔部305中填滿(S04)中的針尖層306亦可。又,形成墊高層307的方法,通常是經由電鍍,但不以此為限。 Next, fill the holes 305 on the needle tip layer 306 to form a pad. High-rise 307. Among them, if the cushion layer 307 is not needed, the hole portion 305 can be directly filled with the needle tip layer 306 in (S04). In addition, the method of forming the pad layer 307 is usually through electroplating, but is not limited thereto.

接著,以與光阻層304對齊的方式,將墊高層307平坦化(S06)。其中,平坦化的方法,通常是使用研磨法,但不以此為限。另外,在未形成墊高層307的情形中,則是將針尖層306平坦化。 Next, the pad layer 307 is planarized in a manner aligned with the photoresist layer 304 ( S06 ). Among them, the planarization method usually uses grinding method, but it is not limited to this. In addition, when the pad layer 307 is not formed, the tip layer 306 is planarized.

再來,在光阻層304與墊高層307之上,再形成光阻層304,並在光阻層304中形成凹陷部308(S07)。其中,凹陷部308的形狀可因應所欲形成的本體10的形狀進行任意調整。又,形成該光阻層304的方法通常是經由旋轉塗佈,但不以此為限。又,形成凹陷部308的方法通常經由光蝕刻形成,但不以此為限。 Next, a photoresist layer 304 is formed on the photoresist layer 304 and the pad layer 307, and a recessed portion 308 is formed in the photoresist layer 304 (S07). The shape of the recessed portion 308 can be adjusted arbitrarily according to the desired shape of the body 10 . In addition, the method of forming the photoresist layer 304 is usually spin coating, but is not limited thereto. In addition, the method of forming the recessed portion 308 is usually through photolithography, but is not limited thereto.

接著,填充凹陷部308形成本體層309(S08)。其中,該本體層309會成為本體10。又,填充本體層309的方法,通常是經由電鍍,但不以此為限。 Next, the recessed portion 308 is filled to form the body layer 309 (S08). Among them, the body layer 309 will become the body 10 . In addition, the method of filling the body layer 309 is usually through electroplating, but it is not limited to this.

接著,以與光阻層304對齊的方式,將本體層309平坦化以形成探針頭(S09)。其中,平坦化的方法,通常是使用研磨法,但不以此為限。 Next, the body layer 309 is planarized in a manner aligned with the photoresist layer 304 to form a probe head (S09). Among them, the planarization method usually uses grinding method, but it is not limited to this.

最後,將探針頭從離型基板301剝離(S10)。藉此,即可形成第一實施形態的探針頭。 Finally, the probe head is peeled off from the release substrate 301 (S10). Thereby, the probe head of the first embodiment can be formed.

另一方面,以上雖說明形成第一實施形態的具有單接觸部的探針頭,但若欲形成第一變形例的具有複數接觸部的探針頭時,只要在形成凹部302的工程(S01)中,形成複數凹部302,並在形成孔部305的工程(S04)中,形成複數孔部305即可。此外,該技術領域的通常知識者,可以因應接觸部的數量及排列方式,自由調整凹部302及孔部305的數量、位置、配列。 On the other hand, although the formation of the probe head having a single contact portion in the first embodiment has been described above, if it is desired to form the probe head having a plurality of contact portions in the first modification, it is only necessary to perform the process of forming the recessed portion 302 ( S01 ), the plurality of recessed portions 302 may be formed, and the plurality of hole portions 305 may be formed in the step of forming the hole portions 305 ( S04 ). In addition, those skilled in the art can freely adjust the number, position, and arrangement of the recessed portions 302 and the hole portions 305 according to the number and arrangement of the contact portions.

又,本體層具有第一本體部、第二本體部、及第三本體部。 Moreover, the body layer has a first body part, a second body part, and a third body part.

[接觸部的材質] [Contact part material]

以下,說明關於上述各實施形態及變形例的探針頭的各接觸部材料。又,在以下說明中,為了方便,將第一、第二接觸部統稱為「接觸部」。又,若接觸部是由針尖層與墊高層形成的情形,在以下關於接觸部的材質的說明中,可以將「接觸部」讀成「針尖層」。 Hereinafter, materials for each contact portion of the probe heads of the above-described embodiments and modifications will be described. In addition, in the following description, for convenience, the first and second contact parts are collectively referred to as "contact parts". In addition, if the contact part is formed by the tip layer and the cushion layer, in the following description of the material of the contact part, the "contact part" can be read as the "tip layer".

在上述各實施形態及變形例中,因為接觸部是以近似垂直於接觸面的截面接觸待測體,降低接觸部尖端與待測體之間的摩擦,進而提高接觸部的耐磨性。換言之,接觸部在具有較佳或相同的耐磨性情形下,可採用比鎳或鎳合金硬度較低的材料,且兼具除耐磨性以外的功能,進而滿足更多樣性的 檢測需求。 In the above embodiments and modifications, because the contact portion contacts the object to be measured with a cross section that is approximately perpendicular to the contact surface, the friction between the tip of the contact portion and the object to be measured is reduced, thereby improving the wear resistance of the contact portion. In other words, when the contact part has better or the same wear resistance, it can be made of a material with a lower hardness than nickel or nickel alloy, and has functions other than wear resistance, thereby satisfying a more diverse range of applications. Testing requirements.

更詳言之,在不降低接觸部的耐磨性的前提下,接觸部可從高耐磨性的鎳或鎳合金材料,改為較低耐磨性的鈀或鈀合金材料。鈀或鈀合金材料除了具有不沾黏待測體的特性外,亦無鎳或鎳合金材料的磁吸效應,可滿足高頻檢測需求。因此,形成具有耐磨性及高頻性的接觸部,可同時滿足耐磨性及高頻性的檢測需求。 In more detail, without reducing the wear resistance of the contact portion, the contact portion can be changed from nickel or nickel alloy material with high wear resistance to palladium or palladium alloy material with lower wear resistance. Palladium or palladium alloy materials not only have the property of not sticking to the object to be measured, but also have no magnetic attraction effect of nickel or nickel alloy materials, which can meet the needs of high-frequency detection. Therefore, a contact portion with wear resistance and high frequency is formed, which can meet the detection requirements of wear resistance and high frequency at the same time.

此外,接觸部可具有500維氏硬度(Hv)或大於500維氏硬度的硬度。接觸部可包含鎳或鎳合金,且鎳合金包含鎳(Ni)以外,亦可選自由以下組成的群組中的至少一種合金元素:鐵(Fe)、鎢(W)、銅(Cu)、硼(B)、碳(C)、鈷(Co)、銀(Ag)、錳(Mn)、鈀(Pd)、及銠(Rh)。 Furthermore, the contact portion may have a hardness of 500 Vickers hardness (Hv) or greater than 500 Vickers hardness. The contact part may include nickel or nickel alloy, and the nickel alloy may include at least one alloying element from the following group in addition to nickel (Ni): iron (Fe), tungsten (W), copper (Cu), Boron (B), carbon (C), cobalt (Co), silver (Ag), manganese (Mn), palladium (Pd), and rhodium (Rh).

又,接觸部亦可包含鈀或鈀合金,且鈀合金包含鈀(Pd)以外,亦可選自由以下組成的群組中的至少一種合金元素:鎳(Ni)、鉬(Mo)、銅(Cu)、銦(In)、碳(C)、鈷(Co)、銀(Ag)、及錳(Mn)。 In addition, the contact portion may also include palladium or a palladium alloy, and the palladium alloy may include, in addition to palladium (Pd), at least one alloying element from the following group: nickel (Ni), molybdenum (Mo), copper ( Cu), indium (In), carbon (C), cobalt (Co), silver (Ag), and manganese (Mn).

[探針頭的本體] [Probe head body]

以下,說明關於探針頭的本體10的構造。如圖18所示,本體10,通常具有依序層積的第一本體部101、第二本體部102、及第三本體部103。其中,接觸面11形成於第一本體部101上。 Hereinafter, the structure of the main body 10 of the probe head will be described. As shown in FIG. 18 , the body 10 usually has a first body part 101 , a second body part 102 , and a third body part 103 laminated in sequence. The contact surface 11 is formed on the first body part 101 .

此外,第一本體部101的硬度大於或等於接觸部的硬度。換言之,第一本體部101為剛性較強的結構,能夠降低接觸部在檢測作動中的機械衝擊,具有較穩定的接觸電信號。當然,第一本體部101的硬度也可以小於接觸部的硬度。在本實施例中,第一本體部具有約700至1200維氏硬度。 In addition, the hardness of the first body part 101 is greater than or equal to the hardness of the contact part. In other words, the first body part 101 has a relatively strong rigid structure, which can reduce the mechanical impact of the contact part during the detection operation and provide a relatively stable contact electrical signal. Of course, the hardness of the first body part 101 may also be smaller than the hardness of the contact part. In this embodiment, the first body portion has a Vickers hardness of about 700 to 1200.

又,第一本體部101、第二本體部102及第三本體部103具有導電率大於或等於國際退火標銅的30%的材料,藉此在與管件鉚合時能夠提供較佳的導電性。 In addition, the first body part 101, the second body part 102 and the third body part 103 are made of materials with a conductivity greater than or equal to 30% of the international annealed standard copper, thereby providing better conductivity when riveted with pipe fittings. .

另外,第二本體部102的外徑較第一本體部101及第三本體部103的外徑還大,藉此能夠形成凸緣。第一本體部101及第三本體部103藉由該凸緣構造,能夠形成具有可限位牢固第二本體部102的限位空間。例如,在將探針頭1鉚合至探針組件的中空管件的一端時,可藉由將中空管件形變凹陷於第一本體部101及第三本體部103的限位空間,藉以限制探針頭1在中空管件的相對運動並鉚合至該中空管件。 In addition, the outer diameter of the second body part 102 is larger than the outer diameters of the first body part 101 and the third body part 103, thereby forming a flange. Through the flange structure, the first body part 101 and the third body part 103 can form a limiting space that can firmly limit the second body part 102 . For example, when the probe head 1 is riveted to one end of the hollow pipe of the probe assembly, the hollow pipe can be deformed and recessed in the limiting space of the first body part 101 and the third body part 103 to limit the probe. The head 1 moves relative to the hollow pipe and is riveted to the hollow pipe.

又,雖在圖中示出本體10為圓柱狀的構造,但本體10也可以是角形的柱狀,可以是三角柱、四角柱、五角柱等的多角柱,該技術領域的通常知識者可以任意變更本體10的形狀。 In addition, although the main body 10 is shown to have a cylindrical structure in the figure, the main body 10 may also be in the shape of an angular column, or a polygonal prism such as a triangular prism, a quadrangular prism, a pentagonal prism, etc., and a person of ordinary skill in the technical field may make any configuration. The shape of the main body 10 is changed.

[探針組件] [Probe assembly]

接著,說明本發明的探針組件。如圖19所示,本發明的探針組件,包含:如上述實施形態或變形例中的任一種探針頭1、套管92、插棒94、以及彈性構件93。探針頭1的本體會插入套管92的一端使得探針頭1與套管92耦合,且插棒94插入套管92的另一端。又,彈性構件93設於套管92中,並介於探針頭1與插棒94之間。 Next, the probe assembly of the present invention will be described. As shown in FIG. 19 , the probe assembly of the present invention includes the probe head 1 of any of the above embodiments or modifications, a sleeve 92 , a plunger 94 , and an elastic member 93 . The body of the probe head 1 is inserted into one end of the cannula 92 so that the probe head 1 is coupled with the cannula 92 , and the insertion rod 94 is inserted into the other end of the cannula 92 . In addition, the elastic member 93 is provided in the sleeve 92 and between the probe head 1 and the plunger 94 .

以上,就本發明的探針頭的實施形態及實施例參考圖式進行說明。但應注意這並不表示本發明僅侷限於以上所描述及圖式中所示的特徵及結構。上述各實施形態及實施例僅為例示,該技術領域的通常知識者,可以將上述各實施形態及實施例的內容進行變更、相互組合。本發明的所有其它可能的變化及組合都落入申請專利範圍及其等效物所界定的本發明的範圍。 As above, embodiments and examples of the probe head of the present invention have been described with reference to the drawings. However, it should be noted that this does not mean that the present invention is limited to the features and structures described above and shown in the drawings. The above-mentioned embodiments and examples are only examples, and a person with ordinary knowledge in the technical field can change the contents of the above-mentioned embodiments and examples and combine them with each other. All other possible changes and combinations of the present invention fall within the scope of the present invention as defined by the patent application and its equivalents.

1:探針頭 1: Probe head

11:接觸面 11: Contact surface

10:本體 10:Ontology

12:第一接觸部 12:First contact department

19:待測體 19:Object to be tested

121:截面 121: Section

122:斜面 122: Incline

Claims (9)

一種探針組件,包含:探針頭;套管;插棒;以及彈性構件;前述探針頭的本體插入前述套管的一端使得前述探針頭與前述套管耦合;前述插棒插入前述套管的另一端;前述彈性構件設於前述套管中,並介於前述探針頭與前述插棒之間;其中,前述探針頭,包含:以第一方向為中心軸形成柱狀,並具有接觸面的所述本體;以及位於前述接觸面之上的至少一個接觸部;前述接觸部,具有與前述接觸面大致呈垂直且面向前述中心軸的截面;前述接觸部,在與前述截面的相反側具有與前述第 一方向呈小於45度的傾斜的斜面;前述截面、前述斜面用以在進行電性檢測時遠離待測體的中心從側面接觸前述待測體。 A probe assembly, including: a probe head; a sleeve; a plunger; and an elastic member; the body of the probe head is inserted into one end of the sleeve so that the probe head is coupled with the sleeve; the plunger is inserted into the sleeve The other end of the tube; the elastic member is provided in the sleeve and is between the probe head and the plunger; wherein the probe head includes: a columnar shape with the first direction as the central axis, and The body having a contact surface; and at least one contact portion located on the aforementioned contact surface; the aforementioned contact portion has a cross-section that is substantially perpendicular to the aforementioned contact surface and faces the aforementioned central axis; the aforementioned contact portion is at a distance from the aforementioned cross-section. The opposite side has the same An inclined plane with an inclination of less than 45 degrees in one direction; the aforementioned cross section and the aforementioned inclined plane are used to contact the aforementioned object under test from the side away from the center of the object under test during electrical testing. 如請求項1記載的探針組件,其中,前述接觸部,還具有與前述斜面連接,並大致垂直於前述接觸面的連接面。 The probe assembly according to claim 1, wherein the contact portion further has a connecting surface connected to the inclined surface and substantially perpendicular to the contact surface. 如請求項2記載的探針組件,其中,前述接觸部,在與前述截面的相反側,具有與前述接觸面接觸,並朝向前述本體的外側方向延伸的延伸部。 The probe assembly according to claim 2, wherein the contact portion has an extension portion in contact with the contact surface on the opposite side to the cross section and extending toward an outer direction of the body. 如請求項3記載的探針組件,其中,前述延伸部延伸出前述本體之外。 The probe assembly according to claim 3, wherein the extension part extends out of the main body. 如請求項1至4中任一項記載的探針組件,其中,前述接觸部,具有墊高層及針尖層;前述針尖層的硬度大於前述墊高層的硬度。 The probe assembly according to any one of claims 1 to 4, wherein the contact portion has a cushion layer and a needle tip layer; the hardness of the needle tip layer is greater than the hardness of the cushion layer. 如請求項1至4中任一項記載的探針組件,其中,前述本體具有第一本體部、第二本體部、及第三本體部。 The probe assembly according to any one of claims 1 to 4, wherein the body has a first body part, a second body part, and a third body part. 如請求項6記載的探針組件,其中,前述第二本體部的外徑比前述第一本體部及前述第三本體部的外徑還大。 The probe assembly according to claim 6, wherein the outer diameter of the second body part is larger than the outer diameters of the first body part and the third body part. 如請求項6記載的探針組件,其中,前述第一本體部、第二本體部、及第三本體部具有導電率大於或等於國際退火標銅的30%的材料。 The probe assembly according to claim 6, wherein the first body part, the second body part, and the third body part have a material with a conductivity greater than or equal to 30% of the international annealed standard copper. 如請求項1至4中任一項記載的探針組件頭,其中,前述接觸部的高度大於25微米。 The probe assembly head according to any one of claims 1 to 4, wherein the height of the contact portion is greater than 25 microns.
TW111137975A 2022-10-06 2022-10-06 Probe assembly TWI823601B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207400A (en) * 2010-08-04 2012-02-16 Univ Nat Cheng Kung Probe
TW201905467A (en) * 2017-06-28 2019-02-01 南韓商Isc股份有限公司 Probe assembly for pogo pin connector, method of manufacturing the same, and pogo pin connector including the same
TW202120932A (en) * 2019-10-01 2021-06-01 日商日本麥克隆尼股份有限公司 Electrical Contactor, Electrical Connecting Structure and Electrical Connecting Apparatus
TWM613499U (en) * 2021-01-05 2021-06-21 精賀科技有限公司 Probe device and probe device set
TW202124971A (en) * 2019-12-24 2021-07-01 南韓商Isc股份有限公司 Contact device for electrical test

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207400A (en) * 2010-08-04 2012-02-16 Univ Nat Cheng Kung Probe
TW201905467A (en) * 2017-06-28 2019-02-01 南韓商Isc股份有限公司 Probe assembly for pogo pin connector, method of manufacturing the same, and pogo pin connector including the same
TW202120932A (en) * 2019-10-01 2021-06-01 日商日本麥克隆尼股份有限公司 Electrical Contactor, Electrical Connecting Structure and Electrical Connecting Apparatus
TW202124971A (en) * 2019-12-24 2021-07-01 南韓商Isc股份有限公司 Contact device for electrical test
TWM613499U (en) * 2021-01-05 2021-06-21 精賀科技有限公司 Probe device and probe device set

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