TWI817647B - Probing device - Google Patents

Abstract

A probing device includes a probe station. The probe station has a platform having an opening and a plurality of column members supporting the platform. Each of the plurality of column members has one end connected with the platform and an opposite end connected with a moving part. The probing device also includes a manipulator on the platform and a socket configured to support a DUT. The manipulator has a probe. The moving part is configured to allow the probe station to be moved with respect to the DUT.

Description

Detection device

This application claims priority to U.S. Patent Application Nos. 17/738,155 and 17/738,827 (that is, the priority date is "May 6, 2022"), the contents of which are incorporated herein by reference in their entirety.

The present disclosure relates to a detection device. In particular, it relates to a detection device with a hollow platform.

Developments in semiconductor technology have resulted in increasing demand for multiple intensive memory operations and high-speed semiconductor memory devices, such as dynamic random access memory (DRAM) devices.

A detection device (such as a wafer probe) is used to test the electronic characteristics of a device under test (DUT) (such as an integrated circuit (IC) device) to check whether the DUT meets product specifications. As memory speed increases, signal attenuation or signal loss has become a technical bottleneck of detection devices. .

The above description of "prior art" only provides background technology, and does not admit that the above description of "prior art" reveals the subject matter of the present disclosure. It does not constitute prior art of the present disclosure, and any description of the above "prior art" does not constitute the prior art of the present disclosure. should not be used as any part of this case.

An embodiment of the present disclosure provides a detection device. The detection device includes a Probe station. The probe station has a platform with an opening; and a plurality of cylindrical components supporting the platform. Each cylindrical component has one end connected to the platform and an opposite end connected to a moving part. The detection device also includes a robotic arm disposed on the platform; and a slot configured to support a component under test. The robotic arm has a probe. The moving part is configured to allow the probe station to move relative to the device under test.

Another embodiment of the present disclosure provides a detection device. The detection device has a probe station. The probe station has a platform with an opening. The detection device also includes a robotic arm, which is disposed on the platform. The robotic arm has a probe. The detection device also includes a test head; and a slot provided on the test head and configured to support a component under test. The test head has a moving part configured to allow the component under test to move relative to the probe station.

Yet another embodiment of the present disclosure provides a detection method. The testing method includes providing a component under test, and a slot supporting the component under test; and arranging the component under test and the slot on a test head. The testing method also includes providing a probe station having a platform having an opening; and moving the probe station or the test head to position the component under test in the opening.

By providing a probe station having a platform with an opening and a moving portion for allowing the DUT to be positioned in the opening, a socket (and the DUT supported thereon) can be positioned in a Test the head. Therefore, there is no need for a long cable between the DUT and the test head (which may be as long as about 1.5 meters). Can eliminate or reduce signal attenuation or signal loss problems. A high-speed test of the DUT can be completed. For example, a signal with a frequency greater than approximately 4267 megahertz (MHz) may be provided to test the electronic characteristics of the DUT.

The technical features and advantages of the present disclosure have been summarized rather broadly in order to facilitate the following This article reveals detailed descriptions to gain a better understanding. Other technical features and advantages that constitute the subject matter of the patentable scope of the present disclosure will be described below. It should be understood by those of ordinary skill in the art that the concepts and specific embodiments disclosed below can be easily used to modify or design other structures or processes to achieve the same purposes of the present disclosure. Those with ordinary knowledge in the technical field to which the present disclosure belongs should also understand that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined in the appended patent application scope.

1:Detection device

2:Detection device

10:Probe station

10c: Cylindrical component

10c1:end

10c2:end

10ch:length

10h: Open your mouth

10m:Mobile part

10p:Platform

10ph:Thickness

11: Robotic arm

11p: probe

12:Observation device

13:Screen

14:Test head

14i: Interconnect layer

15:Slot

15h: height

15h1: height

15h2: height

15i: Contact pin

16: Component under test

17: Support frame

18: Signal source

19:Cable wire

30:Detection method

S31: Steps

S32: Steps

S33: Steps

S34: Steps

S35: Steps

S36: Steps

S37: Steps

φ: rotation angle

A more complete understanding of the present disclosure can be obtained by referring to the detailed description and claimed claims. The present disclosure should also be understood to be associated with the drawing element numbering, which represents similar elements throughout the description.

FIG. 1A is an appearance schematic diagram illustrating a detection device according to some embodiments of the present disclosure.

FIG. 1B is an appearance schematic diagram illustrating a detection device according to some embodiments of the present disclosure.

FIG. 1C is a top view schematic diagram illustrating a portion of a detection device according to some embodiments of the present disclosure.

FIG. 1D is a schematic side view illustrating a portion of a detection device according to some embodiments of the present disclosure.

FIG. 2A is an appearance schematic diagram illustrating a detection device according to some embodiments of the present disclosure.

FIG. 2B is an appearance schematic diagram illustrating a detection device according to some embodiments of the present disclosure.

Figure 3 is a schematic flowchart illustrating a detection method according to some embodiments of the present disclosure.

Specific language will now be used to describe the embodiments or examples of the present disclosure illustrated in the drawings. It should be understood that the scope of the present disclosure is not intended to be limited thereby. Any modifications or improvements to the described embodiments, as well as any further applications of the principles described in this document, are within the realm of ordinary skill in the art. Element numbering may be repeated throughout the embodiments, but this does not necessarily mean that a feature of one embodiment applies to another embodiment, even if it They share the same part number.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or sections, These elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, a "first element", "component", "region", "layer" or "section" discussed below may be referred to as a second device , component, region, layer or portion without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that when the terms "comprises" and/or "comprising" are used in this specification, these terms specify the stated features, integers, steps, operations, elements, and/or components. exists, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups of the above.

FIG. 1A is an appearance schematic diagram illustrating a detection device 1 according to some embodiments of the present disclosure.

The detection device 1 can be used to test the electronic characteristics of a device under test (DUT) to check whether the DUT meets product specifications. The detection device 1 can also be called a detection equipment. Examples of DUT may include a whole wafer, a wafer fragment, a semiconductor substrate, a circuit, a memory cell (such as a dynamic random access memory cell (DRAM cell)), a printed circuit board mounted with a plurality of electronic components Circuit boards (PCB), etc., but are not limited to this. The DUT may also include a package component, such as a semiconductor package, a ball grid array (BGA) package, a pin grid array (PGA) package. installation, a memory package, etc. In order to test electronic characteristics, the detection device and the detection method disclosed in the present disclosure can be applied to any DUT.

Please refer to Figure 1. The detection device 1 may include a probe station 10, a robot arm 11, an observation device 12, a screen 13, a test head 14, a slot 15, a support frame 17, a signal source 18 and One cable 19. The slot 15 can support, accommodate or receive a device under test (DUT) 16 .

Although there are ten units or components in the detection device 1, the disclosure is not limited thereto. For example, in some embodiments, there may be any number of units in the detection device 1 . For example, in some embodiments, the detection device 1 may also include (or interact with) other hardware and/or software units not depicted in FIG. 1A , such as a processing unit, a sensing unit, a Memory unit, a communication unit, etc.

The probe station 10 may include a platform 10p and a plurality of cylindrical components (or cylindrical components) 10c supporting the platform 10p. The platform 10p may have an opening (or a through hole) 10h. The opening 10h can pass through the platform 10p. Therefore, when the test head 14 , the socket 15 and the DUT 16 are disposed under the probe station 10 (as shown in FIG. 1B ), the DUT 16 can be exposed from the opening 10 h and observed through the observation device 12 .

In some embodiments, the opening 10h may be provided at a central portion of the platform 10p. However, in some other embodiments, the opening 10h may be close to an edge or side of the platform 10p to make room for placing the viewing device 12 and the screen 13.

The opening 10h may have four sides and four right angles. The opening 10h may be rectangular. However, in some other embodiments, the opening 10h may have a hexagon, a pentagon, a square, a triangle, a circle, an ellipse, or any other shape.

Platform 10p may have a thickness 10ph. The thickness of the platform 10p can be 10ph Consistent or even. For example, the thickness of one inner wall of the opening 10h may be substantially equal to the thickness 10ph. The platform 10p may be thick enough to provide structural support for the robotic arm 11, the viewing device 12, and the screen 13.

The cylindrical components 10c may each be adjacent to a corner of the platform 1Op. The cylindrical assemblies 10c may be spaced apart from each other. There can be four cylindrical assemblies 10c. However, the number and position of the columnar components of the probe station 10 can be adjusted according to design needs and is not limited thereto.

As shown in the figure, the four columnar components 10c are connected by three beams to increase the structural stability of the probe station 10. For example, the three beams correspond to the three sides or edges of the platform 10p. The two cylindrical components 10c are not connected by beams to allow the test head 14, the slot 15 and the DUT 16 to pass through and be placed under the probe station 10.

One end 10c1 of the columnar component 10c is connected to the platform 10p, and the other end 10c2 is connected to a moving part 10m.

The length 10ch of each cylindrical component 10c may be adjustable. For example, column assembly 10c may include an expansion column or an extension column. For example, cylindrical assembly 10c may include a screw drive, sprockets, belts, chains, and/or other objects or mechanisms for raising and lowering platform 10p. By adjusting the length 10ch of each cylindrical component 10c, the distance between the DUT 16 and the platform 10p along a z-direction (or z-axis) can be adjusted. For example, when the test head 14, the slot 15 and the DUT 16 are disposed under the probe station 10, the platform 10p can move toward or away from the DUT 16 (as shown in FIG. 1B). The z-direction (or a z-axis) can be generally perpendicular to the ground.

In some embodiments, cylindrical assembly 10c may be connected to and driven by a single motor or a single drive mechanism. In this way, only one motor is needed to adjust the length 10ch, and each columnar component 10c can simultaneously lift and lower the platform 10p by the same amount. Examples of motors may include stepper motors, servo motors, or the like.

However, in an alternative form, each column assembly 10c may be configured to have its own motor or drive mechanism. Thus, each cylindrical assembly 10c is operable independently of the other cylindrical assemblies. With such a configuration, the cylindrical assembly 10c can not only be used to raise and lower the platform 10p in the z-direction, but can also perform a deflection/tilt function to deflect/tilt the platform 10p.

In some embodiments, the motor or drive mechanism of the cylindrical assembly 10c may be controlled by the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 .

The moving part 10m may include a roller, a wheel, or other objects or mechanisms that can move the probe station 10 . For example, the moving part 10m may be configured to allow the probe station 10 to move in the x and y directions (or x and y axes). For example, the moving part 10m may be configured to allow the probe station 10 to change the direction of movement or rotation, such as a rotation angle φ in a spherical coordinate system. The x and y directions (or x and y axes) can each be generally parallel to the ground.

For example, moving portion 10m may be configured to allow probe station 10 to move relative to test head 14, socket 15, and DUT 16. For example, moving portion 10m may be configured to allow probe station 10 to be easily moved toward and/or away from test head 14, socket 15, and DUT 16.

In some embodiments, the moving part 10m may include a ball joint or a universal joint. For example, the moving part 10m may be universal. In some embodiments, the moving part 10m may include a motor driven wheel. For example, the moving part 10m can be driven by a motor or a driving mechanism.

In some embodiments, the motor or the driving mechanism of the moving part 10m may be controlled by the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 .

One or more robotic arms 11 may be provided on the platform 10p. The robot arm 11 may be positioned adjacent to the opening 10h. Each robot arm 11 may have a probe 11p or a conductive part in the form of a probe. Opening 10h may provide access to DUT 16 for probe 11p. For example, The probe 11p of the robot arm 11 can extend into the opening 10h to contact the DUT 16.

The robotic arm 11 may have or utilize a magnetic mounting base or a vacuum/suction mounting base to attach to the platform 1Op. For example, the robot arm 11 may have a mounting base made of magnetic material, and the mounting base can fix the robot arm 11 to the platform 10p made of magnetic material, such as metal. However, in some other embodiments, in order to provide structural stability for accurate detection, the robotic arm 11 may be hard mounted (eg, screwed) to the platform 1Op.

Robotic arm 11 may be configured to position probe 11p. For example, the robotic arm 11 may be configured to move the probe 11p along the x, y, and z directions (or x, y, and z axes). In some embodiments, robotic arm 11 may also be configured to adjust the angle (eg, attack angle) between probe 11p and DUT 16.

In some embodiments, the robot arm 11 may be connected to and driven by a motor or a driving mechanism. In some embodiments, the motor or the driving mechanism of the robotic arm 11 may be controlled by the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 .

In some embodiments, the moving portion 10m and the cylindrical assemblies 10c may be configured to generally position the DUT 16 in the opening 10h and position the desired portion of the DUT 16 below the viewing device 12 . Additionally, robotic arm 11 may be configured to physically position probe 11p over a desired location or test site of DUT 16 (eg, a desired conductive path mark).

In some embodiments, placement of probe 11p on DUT 16 may include using the sensing unit of detection device 1 or a sensing unit that interacts with detection device 1 . The sensing unit may include various motion control mechanisms or feedback mechanisms. For example, a sensing unit can be connected to the cylindrical assembly 10c and the robotic arm 11 to track the drift along the z-axis over time. The sensing unit avoids DUT 16 is inadvertently damaged by probe 11p. In some embodiments, the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 may be connected to the sensing unit to stop the cylindrical assemblies 10c when sufficient probe ground contact has occurred. and/or the movement of the robot arm 11 along the z-axis.

Although two robotic arms are shown, the detection device 1 can be configured to handle additional multiple robotic arms. For example, six or more robotic arms may be used to configure the detection equipment.

The viewing device 12 may be disposed on the platform 1Op and allows a user of the probing device 1 to view the DUT 16 and ensure that the probe is in contact with the DUT 16 .

In some embodiments, observation device 12 may include an optical microscope. In some embodiments, probe station 10 may include a high-resolution microscope, such as a scanning electron microscope (SEM), a focused ion beam (FIB) system, or the like. In some embodiments using SEM and/or FIB, the detection device 1 can implement the inspection method through a non-contact detection process. For example, current path tracing testing can be performed through electron beam induced current (EBIC) analysis and optical beam induced current (OBIC) analysis.

In some embodiments, observation device 12 may include a camera configured to capture an image of DUT 16 . In some embodiments, the camera may be configured to capture an image of the DUT 16 during the inspection method of the present disclosure. In some embodiments, the camera may be configured to capture an image of the DUT 16 in situ.

In some embodiments, the camera may include one or more lenses (such as objective lens, zoom lens, relay lens, imaging lens, condenser lens, etc.), one or more light sources (such as a low-power light source, an external light source, an near-infrared light source, etc.), a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS) imaging sensor, or one or more signal converter (such as a type of analog-to-digital (A/D) converter). In some embodiments, the camera may be omitted.

In some embodiments, multiple images may be transmitted or updated to a memory unit of the detection device 1 or a memory unit interacting with the detection device 1 . In some embodiments, these images may be transmitted or updated to screen 13.

Screen 13 can be configured on platform 10p. Screen 13 may include a display, a panel or a monitor. Screen 13 may be configured to display multiple images from viewing device 12 .

In some embodiments, the detection device 1 may be configured with a software for controlling the movement of the probe 11p. The software interface of the software can be displayed via screen 13 . The software interface may allow a user of the detection device 1 to manipulate the position of the probe 11p. For example, the software interface may allow a user of the probing device 1 to indicate a desired position or test position on the DUT 16 and control the movement of the probe 11p. For example, the control and operation of the probe 11p can be performed through cursor manipulation on the screen.

In some embodiments, the computer interface control element or input device associated with the screen 13 may include, for example, a keyboard, mouse, joystick, touch screen, switch, or the like.

In some embodiments, moving the cursor may cause a relative position or a relative movement between probe 11p and DUT 16. In some embodiments, the software used to control the movement of probe 11p may be programmed to operate robotic arm 11 to move probe 11p in the x, y, and z directions.

The test head 14 may be supported by a support frame 17 . Test head 14 may provide an electronic path between signal source 18 and DUT 16 . For example, the test head 14 may have a connector (not shown) connected to the cable 19 and a protruding or exposed end of one of the contact pins of the socket 15 (such as the contact pin 15i in FIG. 1D). An interconnect layer (such as interconnect layer 14i in FIG. 1D) is connected.

Slot 15 may be provided on test head 14 . In some embodiments, socket 15 may be hard mounted (eg, screwed) to test head 14 . For example, socket 15 may be securely connected to test head 14 .

In some embodiments, a height 15h of the slot 15 may be equal to or greater than a thickness 10ph of the platform 10p. In some embodiments, the height 15h of the slot 15 may be adapted to the thickness 10ph of the platform 10p; therefore, when the DUT 16 is disposed in the opening 10h, an upper surface of the DUT 16 is coplanar with an upper surface of the platform 10p. Therefore, the probe 11p and/or the DUT 16 can be protected from damage.

In some embodiments, the socket 15 may have a contact pin (such as the contact pin 15i in FIG. 1D ) that is electrically connected to the test head 14 . In some embodiments, there may be no cables that may be present in conventional devices, such as long cables (which may be as long as about 1.5 meters). A detailed description will be provided below for Figure 1D.

DUT 16 may be supported, housed or received by slot 15 . Therefore, the DUT 16 may be disposed on the test head 14.

The support frame 17 can support the test head 14 and keep the test head 14 away from the ground. Therefore, in some embodiments, the connector for connecting the test head 14 to the cable 19 may be located on the lower surface of the test head 14 facing the ground. In some embodiments, the connectors used to connect the cable 19 to the test head 14 of the DUT 16 may at least partially overlap in a direction generally perpendicular to the ground to reduce the electrical path between the signal source 18 and the DUT 16 .

The signal source 18 may be electrically coupled to the test head 14 via, for example, a cable 19 . Examples of cable wire 19 may include a BNC/coaxial cable, a triaxial cable, a conduit cable, a conduit connector, etc.

Signal source 18 may be configured to provide signals (eg, electronic signals) to test DUT 16 . In the detection method of the present disclosure, the signal source 18 can generate multiple electronic signals and The cable 19, the test head 14 (eg, the interconnect layer 14i in FIG. 1D), and the contact pins of the socket 15 (eg, the contact pins 15i in FIG. 1D) are transmitted to corresponding terminals of the DUT 16.

The processing unit of the detection device 1 or a processing unit that interacts with the detection device 1 can be connected with the motors or driving mechanisms of the columnar components 10c, the motors or driving mechanisms of the moving part 10m, and the motors or driving mechanisms of the robotic arm 11. Connected. The processing unit can control the movement of the columnar components 10c, the movement of the moving part 10m, and the movement of the robotic arm 11.

In some embodiments, the processing unit can control the movement of the columnar components 10c, the movement of the moving part 10m, and the movement of the robotic arm 11 independently, individually or separately. For example, the processing unit can simultaneously or continuously control the movement of the columnar components 10c, the movement of the moving part 10m, and the movement of the robotic arm 11 as needed.

The processing unit may be configured to perform the inspection method or inspection procedure of the present disclosure. The processing unit may be configured to execute algorithms or computer-executable instructions stored in a memory such as a memory unit of the detection device 1 or another medium. For example, the processing unit may be configured to perform a series of operational steps on the detection device 1 or other programmable device to generate a computer executable program such that a plurality of instructions are provided for performing the operations specified in the flowchart. program (described corresponding to Figure 3).

In some embodiments, the processing unit may include (or may be) a processor such as a central processing unit (CPU), a graphics processing unit (GPU), a microprocessing unit (MCU), a special integrated circuit (ASIC or similar) or a controller.

The sensing unit of the detection device 1 or a processing unit interacting with the detection device 1 can communicate with the processing unit. In some embodiments, the sensing unit can also communicate with the column components 10c, the moving part 10m and the robotic arm 11.

In some embodiments, the sensing unit may be configured to detect the cylindrical groups The displacement, tilt, rotation or other movement of each of the member 10c, the moving part 10m and the robot arm 11. For example, the sensing unit may be configured to detect the movement of the cylindrical components 10c relative to the DUT 16, the movement of the moving part 10m relative to the DUT 16, and the movement of the robotic arm 11 relative to the DUT 16.

In some embodiments, the sensing unit may be configured to transmit the detection result to the processing unit via the communication unit. In some embodiments, the processing unit may be configured to receive the detection result, and then adjust the movement of the columnar components 10c, the movement of the moving part 10m, and the movement of the robotic arm 11 according to the detection result. For example, the processing unit may be configured to adjust the moving direction, angle, and distance of each of the cylindrical components 10c, the moving part 10m, and the robotic arm 11.

In some embodiments, the sensing unit may include a rangefinder, LiDAR, or other motion control mechanism or feedback mechanism configured to detect information about an environment of the DUT 16 and output the information.

The memory unit of the detection device 1 or a processing unit interacting with the detection device 1 may be configured to store algorithms or computer-executable instructions of the processing unit. The memory unit can also be configured to store data, such as the movement trajectories of the cylindrical components 10c, the movement trajectories of the moving part 10m, and the movement trajectories of the robotic arm 11. The memory unit may also be configured to store the detection result of the sensing unit.

In some embodiments, the memory unit may include random access memory (RAM), read only memory (ROM), hard disk, and removable memory components, which may include memory sticks, memory cards, flash Memory, external hard drive, etc.

The communication unit of the detection device 1 or a processing unit that interacts with the detection device 1 may be configured to communicate via wired or wireless technologies (such as Wi-Fi, cellular network, Bluetooth or The analogue sends data to the detection device 1 or receives data from the detection device 1 . In some embodiments, the communication unit may include a wireless communication transceiver. For example, the communication unit may include a transmitter, a receiver, an antenna, and so on.

The disclosure may be implemented in a system, method, computer program, or any combination thereof. Accordingly, the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, microcoding, etc.), or an embodiment that combines software and hardware aspects, which embodiments are collectively referred to herein as as "unit", "module" or "system". Furthermore, the disclosure may take the form of a computer program embodied in any tangible medium of expression that includes computer-usable program code.

The present disclosure may be described in the general context of algorithms or computer-executable instructions (eg, programs) executed by a computer. Typically, programs include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present disclosure can also be implemented in a distributed computing environment, where tasks are performed by remote processing devices linked by a communication network. In a distributed computing environment, programs may be located on local and remote computer storage media, including memory storage devices.

FIG. 1B is an appearance schematic diagram illustrating the detection device 1 according to some embodiments of the present disclosure. As shown in the figure, the test head 14 , the slot 15 and the DUT 16 are arranged below the probe station 10 . The test head 14, the slot 15 and the DUT 16 are arranged below the platform 10p.

In some embodiments, test head 14 , slot 15 , and DUT 16 may each be physically separated from platform 10 p to eliminate or reduce errors caused by test head 14 (eg, a fan or a cooling unit of test head 14 ). of vibration.

In some embodiments, probe station 10 may include one or more stoppers. The stopper can be disposed below the platform 10p and block the edge of the test head 14 and limit the test. Movement of the test head 14 in the x-direction and/or the y-direction. In some embodiments, the stop prevents displacement of the test head 14 during operation.

In a comparative embodiment, the socket 15 is provided on the probe station 10 , and a long cable can be used to electrically connect the socket 15 to the test head 14 . As the memory speed increases, signal attenuation or signal loss caused by the long cable becomes a technical bottleneck of detection equipment.

In addition, the long cable is easily separated from the socket 15 or the test head 14, which will reduce the structural stability and structural reliability of the detection device during transportation and inspection procedures.

By providing a probe station 10 with a platform 10p having an opening 10h and a moving part 10m for allowing the DUT 16 to be disposed in the opening 10h, the slot 15 (and the DUT 16 supported thereby) can be disposed on the test head. 14. Therefore, no long cable runs are needed between the socket 15 (and the DUT 16 supported thereby) and the test head 14 . Can eliminate or reduce signal attenuation or signal loss problems. High-speed testing of DUT 16 can be completed. For example, a signal with a frequency equal to or greater than about 4267MHz may be provided to test the electronic characteristics of the DUT 16 . For example, a training signal with a frequency equal to or greater than approximately 5600 MHz may be provided to test the electronic characteristics of the DUT 16 .

FIG. 1C is a schematic top view illustrating a part of the detection device 1 according to some embodiments of the present disclosure.

As shown in the figure, when the socket 15 and the DUT 16 are disposed under the platform 10p, the socket 15 and the DUT 16 may be exposed from the opening 10h. For example, at least a portion of the upper surface of DUT 16 may be exposed from opening 10h. For example, the upper surface of DUT 16 may be fully exposed from opening 10h. Opening 10h may provide access to DUT 16 for probe 11p. For example, probe 11p of robot arm 11 may extend into opening 10h to contact DUT 16.

A gap may be provided between the slot 15 and the platform 10p to eliminate or reduce vibration caused by the test head (such as a fan or a cooling unit of the test head 14 shown in FIG. 1A). For example, a gap may surround slot 15 from a top view.

FIG. 1D is a schematic side view illustrating a part of the detection device 1 according to some embodiments of the present disclosure.

In some embodiments, the test head 14 may have an interconnect layer 14i connected to the contact pins 15i of the socket 15.

In some embodiments, interconnect layer 14i may include an isolation board, such as a PCB, with a plurality of interconnect patterns formed therein. In some embodiments, interconnect layer 14i may include a plurality of contact pads that are compatible with the pin configuration of contact pins 15i. For example, each contact pad may be in electrical contact with the corresponding contact pin 15i. For example, the distribution of the contact pads of the interconnect layer 14i and the distribution of the contact pins 15i of the socket 15 may be substantially the same.

When the interconnection layer 14i is disposed between the socket 15 and the test head 14, the contact pads of the interconnection layer 14i are also disposed between the socket 15 and the test head 14.

As mentioned above, the socket 15 may be provided on the test head 14. In some embodiments, socket 15 may be hard mounted (eg, screwed) to test head 14 . For example, the slot 15 can be firmly connected to the test head 14, and the overall structure is shown in Figure 1.

The slot 15 may include a base and a frame extending upward along a periphery of an upper surface of the base. The base and the frame may define a recess for receiving the DUT 16 . In some embodiments, a plurality of electrical contact points may be disposed on the base and connected to the contact pins 15 i of the socket 15 . When the DUT 16 is received in the recess, the electrical contact points provided on the base can be aligned and in contact with the electrical contact points of the DUT 16 . A signal source (such as signal source 18 in FIG. 1A ) may be connected to the DUT 16 via a connector (not shown) of the test head 14 Electrical contact points are used to connect the signal source, the contact pads of the interconnection layer 14i, and the contact pins 15i of the slot 15. Therefore, a signal can be provided to the DUT 16 from the signal source.

In some embodiments, socket 15 may include an isolation material such as polytetrafluoroethylene (PTTE), any other suitable polymer material, ceramic material, or the like. In some embodiments, the electrical contacts, the contact pads of the interconnect layer 14i, and the contact pins 15i of the socket 15 may include conductive materials, such as aluminum, copper, gold, and the like.

In some embodiments, the height of slot 15 may be the thickness of the base of slot 15 (eg, height 15h1). However, in some embodiments, the height of slot 15 may be a distance between the bottom of the base and the uppermost surface of the frame (eg, height 15h2).

In some embodiments, the socket 15 may also include one or more securing components for securing the DUT 16 to the base to prevent the DUT 16 from being separated from the socket 15 during an inspection.

FIG. 2A is an appearance schematic diagram illustrating the detection device 2 according to some embodiments of the present disclosure. The detection device 2 of Figure 2A is similar to the detection device 1 of Figure 1A except for the differences described below.

The test head 14 of the detection device 2 may have one or more moving parts 14m.

The moving part 14m may include a roller, a wheel, or other objects or mechanisms that can move the test head 14. For example, the moving portion 14m may be configured to allow the test head 14 to move in the x and y directions (or x and y axes). For example, the moving portion 14m may be configured to allow the test head 14 to change the direction of movement or rotation, such as by an angle φ in a spherical coordinate system.

For example, moving portion 14m may be configured to allow test head 14, socket 15, and DUT 16 to move relative to probe station 10. For example, moving portion 14m may be configured to allow test head 14, socket 15, and DUT 16 to be easily moved toward and/or away from probe station 10.

In some embodiments, moving portion 14m may include a ball joint or a universal joint. For example, the moving part 14m may be universal. In some embodiments, moving portion 14m may include a motor driven wheel. For example, the moving part 14m can be driven by a motor or a driving mechanism.

In some embodiments, the motor or the driving mechanism of the moving part 14m may be controlled by the processing unit of the detection device 2 or a processing unit interacting with the detection device 2 .

The support frame 17 supporting the test head 14 may be omitted. Therefore, the connector (not shown) of the test head 14 for connecting to the cable 19 can be disposed on one side surface of the test head 14 .

FIG. 2B is an appearance schematic diagram illustrating the detection device 2 according to some embodiments of the present disclosure. As shown in the figure, the test head 14 , the slot 15 and the DUT 16 are arranged below the probe station 10 . The test head 14, the slot 15 and the DUT 16 are arranged below the platform 10p.

In some embodiments, test head 14 , slot 15 , and DUT 16 may each be physically separated from platform 10 p to eliminate or reduce errors caused by test head 14 (eg, a fan or a cooling unit of test head 14 ). of vibration.

In some embodiments, probe station 10 may include one or more stoppers. The stopper may be disposed below the platform 10p and block an edge of the test head 14 and limit the movement of the test head 14 in the x direction and/or the y direction. In some embodiments, the stop prevents displacement of the test head 14 during operation.

FIG. 3 is a schematic flowchart illustrating a detection method 30 according to some embodiments of the present disclosure.

In some embodiments, the inspection method 30 may be performed by the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 . In some embodiments, the inspection method 30 may be performed by the processing unit of the detection device 2 or a process that interacts with the detection device 2 unit is carried out.

Step or operation S31 is providing a DUT supported by a socket. For example, as shown in FIGS. 1A and 1D , DUT 16 may be supported, accommodated or received by slot 15 .

In some embodiments, the socket 15 may also include one or more securing components for securing the DUT 16 to the base to prevent the DUT 16 from becoming separated from the socket 15 during an inspection procedure.

Step or operation S32 is arranging the DUT and the socket on a test head. For example, as shown in FIGS. 1A and 1D , the DUT 16 and the slot 15 can be disposed on the test head 14 .

In some embodiments, socket 15 may be hard mounted (eg, screwed) to test head 14 . For example, the socket 15 can be firmly connected to the test head 14 and can strengthen the overall structure shown in Figure 1D.

Step or operation S33 is to provide a probe station having a platform with an opening. For example, as shown in FIG. 1A , the platform 10p of the probe station 10 may have an opening (or a through hole) 10h. The opening 10h can pass through the platform 10p.

In some embodiments, opening 10h may be located at the center of platform 10p. However, in some other embodiments, the opening 10h may be close to an edge or side of the platform 10p, freeing up space for placing other units (such as the viewing device 12 and the screen 13 in FIG. 1A). The opening 10h may have four sides and four right angles. The opening 10h may be rectangular. However, in some other embodiments, the opening 10h may include a hexagon, a pentagon, a square, a triangle, a circle, an oval, or any other shape.

Step or operation S34 is to move the probe station or the test head to position the DUT in the opening.

For example, as shown in FIG. 1B , the probe station 10 can be moved through the moving part 10m. For test head 14, slot 15 and DUT 16 move. Therefore, the test head 14 , the socket 15 and the DUT 16 can be disposed below the probe station 10 . The test head 14, the slot 15 and the DUT 16 can be arranged below the platform 10p. Slot 15 and DUT 16 may be exposed from opening 10h. For example, at least a portion of the upper surface of DUT 16 may be exposed from opening 10h. For example, the upper surface of DUT 16 may be fully exposed from opening 10h.

For example, as shown in FIG. 2B , the test head 14 , the socket 15 and the DUT 16 can move relative to the probe station 10 via the moving part 14 m. Therefore, the test head 14 , the socket 15 and the DUT 16 can be disposed below the probe station 10 . The test head 14, the slot 15 and the DUT 16 can be arranged below the platform 10p. Slot 15 and DUT 16 may be exposed from opening 10h. For example, at least a portion of the upper surface of DUT 16 may be exposed from opening 10h. For example, the upper surface of DUT 16 may be fully exposed from opening 10h.

In some embodiments, the motor or driving mechanism of the moving part 10 m or the moving part 14 m may be controlled by the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 .

In some embodiments, probe station 10 may include one or more stoppers. The stopper may be disposed below the platform 10p and block an edge of the test head 14 and limit the movement of the test head 14 in the x direction and/or the y direction. In some embodiments, the stop prevents displacement of the test head 14 during operation.

Step or operation S35 is adjusting a length of each cylindrical component to move the platform relative to the DUT.

For example, as shown in FIG. 2B , by adjusting the length 10ch of each cylindrical component 10c, the distance between the DUT 16 and the platform 10p along a z direction (or z-axis) can be adjusted.

In some embodiments, the motors or drive mechanisms of the cylindrical assemblies 10c may It is controlled by the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 .

In some embodiments, the moving portion 10m and the cylindrical assemblies 10c may be configured to position the DUT 16 generally within the opening 10h and position the desired portion of the DUT 16 below the viewing device 12 .

Step or operation S36 provides a signal with a frequency greater than approximately 4267 MHz through a signal source electrically coupled to the DUT. For example, a signal with a frequency equal to or greater than about 5600 MHz may be provided to test the electronic characteristics of the DUT 16 .

For example, as shown in FIG. 1D , a signal source (such as signal source 18 in FIG. 1A ) may be connected via the contact pads used to connect the signal source, the interconnect layer 14 i and the contacts of the slot 15 . The connector (not shown) of the test head 14 at pin 15i is connected to the electrical contacts of the DUT 16. Therefore, a signal can be provided to the DUT 16 from the signal source.

Step or operation S36 is moving the probe into the opening to contact the DUT.

For example, opening 10h may provide probe 11p access to DUT 16, as shown in FIG. 1C. For example, probe 11p of robot arm 11 may extend into opening 10h to contact DUT 16.

In some embodiments, step S36 and step S37 may be repeated multiple times at intervals. For example, the order and number of these steps may be different from the above-mentioned order and may be adjusted as needed.

Additionally, the robotic arm 11 shown in FIG. 1A may be configured to physically position the probe 11p over the desired location of the DUT 16 or the test site (eg, a desired conductive path mark).

In some embodiments, placement of probe 11p on DUT 16 may include using The sensing unit of the detection device 1 may be a sensing unit that interacts with the detection device 1 . The sensing unit may include various movement control mechanisms or feedback mechanisms. For example, a sensing unit can be connected to the cylindrical components 10c and the robotic arm 11 to track the drift along the z-axis over time. This sensing unit can prevent the DUT 16 from being accidentally damaged by the probe 11p. In some embodiments, the processing unit of the detection device 1 or a processing unit interacting with the detection device 1 may be connected to the sensing unit, so that when sufficient contact of the probe with the ground occurs, the cylinders are stopped. Movement of component 10c and/or robot arm 11 along the z-axis.

Any reference to a method in the specification shall apply mutatis mutandis to a system capable of executing the method. Any reference in the specification to a system shall apply mutatis mutandis to a method executable by that system.

Although the detection device and the inspection method disclosed herein focus on a probe station that can be used for high-speed (or high-frequency) detection and testing applications, the configuration and application of the detection device and the inspection method are not limited thereto. . For example, the detection device can have any configuration (e.g., open air, vacuum enclosure, etc.) and have any of a variety of features (e.g., thermal elements, environmental controls, optical elements, microscopes, etc.) to conduct electrical testing of the DUT. and/or reliability testing.

An embodiment of the present disclosure provides a detection device. The detection device includes a probe station. The probe station has a platform with an opening; and a plurality of cylindrical components supporting the platform. Each cylindrical component has one end connected to the platform and an opposite end connected to a moving part. The detection device also includes a robotic arm disposed on the platform; and a slot configured to support a component under test. The robotic arm has a probe. The moving part is configured to allow the probe station to move relative to the device under test.

Another embodiment of the present disclosure provides a detection device. The detection device has a probe station. The probe station has a platform with an opening. The detection device also includes A mechanical arm is provided on the platform. The robotic arm has a probe. The detection device also includes a test head; and a slot provided on the test head and configured to support a component under test. The test head has a moving part configured to allow the component under test to move relative to the probe station.

Yet another embodiment of the present disclosure provides a detection method. The testing method includes providing a component under test, and a slot supporting the component under test; and arranging the component under test and the slot on a test head. The testing method also includes providing a probe station having a platform having an opening; and moving the probe station or the test head to position the component under test in the opening.

By providing a probe station having a platform with an opening and a moving portion for allowing the DUT to be positioned in the opening, a socket (and the DUT supported thereon) can be positioned in a Test the head. Therefore, there is no need for a long cable between the DUT and the test head (which may be as long as about 1.5 meters). Can eliminate or reduce signal attenuation or signal loss problems. A high-speed test of the DUT can be completed. For example, a signal with a frequency greater than approximately 4267 megahertz (MHz) may be provided to test the electronic characteristics of the DUT.

Although the disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and substitutions can be made without departing from the spirit and scope of the disclosure as defined by the claimed claims. For example, many of the processes described above may be implemented in different ways and replaced with other processes or combinations thereof.

Furthermore, the scope of the present application is not limited to the specific embodiments of the process, machinery, manufacture, material compositions, means, methods and steps described in the specification. Those skilled in the art will understand from the disclosure of this disclosure that existing or future devices may be used in accordance with this disclosure to perform the same function or achieve substantially the same results as the corresponding embodiments described herein. process, machinery, manufacture, material composition, means, method, or step. Accordingly, such processes, machines, manufacturing, material compositions, means, methods, or steps are included in the patent scope of this application.

1:Detection device

10:Probe station

10c: Cylindrical component

10c1:end

10c2:end

10ch:length

10h: Open your mouth

10m:Mobile part

10p:Platform

10ph:Thickness

11: Robotic arm

11p: probe

12: Observation device

13:Screen

14:Test head

15:Slot

15h: height

16: Component under test

17: Support frame

18: Signal source

19:Cable wire

Claims (11)

A detection device includes: a probe station having: a platform having an opening; and a plurality of cylindrical components supporting the platform, wherein each cylindrical component has an end connected to the platform and connected to a moving part an opposite end; a robotic arm disposed on the platform, and the robotic arm has a probe; a slot configured to support a component under test; a signal source electrically coupled to the component under test and configured to provide a signal at a frequency greater than approximately 4267 megahertz (MHz); and a test head electrically coupled to the device under test and configured to provide a signal between the signal source and the device under test an electronic path therebetween, wherein the moving part is configured to allow the probe station to move relative to the component under test. The detection device as claimed in claim 1, wherein a height of the slot is equal to or greater than a thickness of the platform. The detection device as claimed in claim 1, wherein a length of each cylindrical component is adjustable. The detection device as claimed in claim 1, wherein the moving part includes a motor driving wheel. The detection device of claim 1, wherein the slot and the component under test are physically separated from the probe station. The detection device of claim 1, wherein the component under test includes a dynamic random access memory component. The detection device as described in claim 1 further includes: an observation device arranged on the platform and above the opening; and a screen arranged on the platform. The detection device as claimed in claim 1, wherein the slot and the component under test are provided on the test head. The detection device of claim 8, wherein the test head is configured to be disposed below the platform. The detection device of claim 1, wherein the component to be tested is configured to be disposed in the opening. The detection device of claim 1, wherein the robotic arm is configured to move the probe into the opening and contact the component under test.