TWI816069B - Manufacturing method of switch, manufacturing method of optical unit - Google Patents

Abstract

The present invention provides a manufacturing method of a switch, a manufacturing method of an optical unit, a switch and an operating device, which can reduce man-hours related to manufacturing. The present invention performs the following processes: a lead frame pressing process (step S1), a molding process of resin molding the lead frame by insert molding (step S2), and a die bonding process of connecting the optical chip to the lead frame (step S3). , the wire bonding process of connecting the optical chip and the lead frame by wire bonding (step S4), the resin coating process of applying the resin (step S5), and the curing process of curing the applied resin (step S6). . Then, a finishing process of manufacturing a plurality of optical units using the hardened semi-finished product is performed (step S7). Furthermore, an assembly process of assembling each optical unit and other components into the housing is performed (step S8) to manufacture the switch.

Description

Manufacturing method of switch, manufacturing method of optical unit

The present invention relates to a manufacturing method of a switch, a manufacturing method of an optical unit that can be assembled into the switch, a switch and an operating device.

As input devices for electronic equipment such as computers, operating devices such as mice including switches such as micro switches are becoming popular. Especially nowadays, various characteristics are required for mice used in computer games called electronic sports. For example, Patent Document 1 discloses a micro switch that can be used as a mouse switch. The microswitch disclosed in Patent Document 1 uses an optical chip used for opening and closing of a non-contact circuit.

[Prior art documents]

[Patent Document]

[Patent Document 1] International Publication No. 2016/112842

Since the micro switch disclosed in Patent Document 1 uses an optical chip, the optical chip needs to be joined and assembled. However, Patent Document 1 does not fully disclose the manufacturing process of the optical wafer. Optical wafers are processed, for example, as a result of lead frame pressing, die bonding, hardening, wire bonding, silicon infusion, true Optoelectronic parts manufactured through various processes such as air processing, hardening, molding, hardening, deburring, deburring finishing, cutting, and inspection are assembled into micro switches.

However, in the above-mentioned manufacturing method, the optical chip is mounted on the lead frame through processes such as die bonding and wire bonding and then is molded. Therefore, the man-hours are long and the processing cost is also high. problem.

The present invention was made in view of the above-mentioned circumstances, and an object thereof is to provide a manufacturing method of a switch that can reduce man-hours and suppress processing costs.

In addition, another object of the present invention is to provide a manufacturing method of an optical unit.

In addition, another object of the present invention is to provide a switch.

In addition, another object of the present invention is to provide an operating device.

In order to solve the above-mentioned problems, the manufacturing method of the switch described in this application performs the following steps: a molding step, and a lead frame having a mounting portion for mounting the optical chip and a wiring portion for bonding. Resin molding is performed by insert molding with molding resin in a state where the molding resin is exposed; in the die bonding process, the optical chip is placed on the mounting portion exposed from the molding resin and connected; in the wire bonding process, the wires are connected to between the bonding portion exposed from the molding resin and the optical chip placed on the mounting portion; an optical unit finishing process to manufacture an optical unit from a semi-finished product after connecting the optical chip and bonding wires; and an assembling process to assemble the optical unit Optical unit manufactured in the unit finishing process.

In addition, in the manufacturing method of the switch, in the die bonding process After the wire bonding process, a resin coating process is performed to apply resin to the exposed parts of the self-molding resin. The optical unit finishing process is to manufacture an optical unit from the semi-finished product after the resin coating process is performed.

In addition, in the manufacturing method of the switch, the molding step is a step of molding the resin into a shape in which a recessed portion where the mounting portion and the connecting portion are exposed is formed on the inner bottom surface, and the resin in the resin coating step is Coating is a process of filling the recessed portion with resin.

In addition, in the manufacturing method of the switch, the resin coating step is performed multiple times by coating the resin.

In addition, in the manufacturing method of the switch, the resin used in the molding process becomes opaque after curing.

Furthermore, the manufacturing method of the optical unit described in this application is a manufacturing method of manufacturing an optical unit that can be assembled into a switch. The manufacturing method performs the following steps: a molding step, and a mounting part for mounting the optical chip and a wiring The lead frame of the wiring portion is resin molded by insert molding with molding resin in a state where the mounting portion and the wiring portion are exposed; in the die bonding process, the optical chip is placed on the mounting portion where the self-molding resin is exposed parts and connect them; the wire bonding process, which connects the wire between the bonding portion exposed from the molded resin and the optical chip placed on the mounting portion; and the finishing process, which consists of connecting the optical chip and the semi-finished product with the wire Fabrication of optical units.

Furthermore, the switch described in this application is manufactured by performing the following steps: a molding step, and a lead having a mounting portion for mounting the optical chip and a wiring portion for wiring. In the wire frame, resin molding is performed by insert molding using molding resin with the mounting portion and the wiring portion exposed; in the die bonding process, the optical chip is placed on the mounting portion exposed by the self-molding resin and Connection; wire bonding process, connecting the wire between the bonding portion exposed from the molded resin and the optical chip placed on the mounting portion; optical unit finishing process, manufacturing optics from the semi-finished product after connecting the optical chip and the wire unit; and an assembly process for assembling the optical unit manufactured in the optical unit finishing process.

Furthermore, the operation device described in this application includes: a push operation part that accepts a push operation from the outside; and the switch that transmits the push operation accepted by the push operation part in the form of a push from the outside. , and the switch output is based on the transmitted pressing signal from the outside.

In the manufacturing method of the switch, the manufacturing method of the optical unit, the switch and the operating device described in this application, the optical chip is connected after the lead frame is molded by insert molding.

In the manufacturing method of the switch, the manufacturing method of the optical unit, the switch and the operating device of the present invention, after the lead frame is molded by insert molding, the optical chip is connected. This can reduce manufacturing man-hours and achieve excellent effects such as suppressing processing costs.

1: Operating device

2: switch

10: Press the operation part

11: Rotating operation part

12:Signal line

20:Frame

20a: base

20b: cover

21: Press component

22:Fixed terminal

23:Optical unit

23a:Unit terminal

23b: Optical chip

23c: concave part

24:The first blocking piece

25:Second blocking piece

26: Fixed components

27: Movable components

200:Insert hole

230:Light-emitting unit

230a: First unit terminal

230b:Light-emitting component

231: Light receiving unit

231a: Second unit terminal

231b:Light-receiving element

232:Lead frame

233:Threading

260:Visor

261:Through hole

262: First contact part

263: Second contact part

270: Movable contact part

271:Swing pivot

272:Light shield

273:Through the window

274: Department of force application

2320: First lead frame

2320a: Placing part

2321: Second lead frame

2321a: Knotting part

S1, S2, S3, S4, S5, S6, S7, S7a, S7b, S8: Steps

FIG. 1 is a schematic perspective view showing an example of the appearance of the operating device described in the present application. body diagram.

FIG. 2 is a schematic perspective view showing an example of the appearance of the switch described in this application.

3 is a schematic exploded perspective view showing an example of the switch described in this application.

FIG. 4 is a schematic cross-sectional view showing an example of the cross-section of the switch described in this application.

FIG. 5 is a schematic cross-sectional view showing an example of the cross-section of the switch described in this application.

FIG. 6 is a flowchart showing an example of the manufacturing method of the switch described in this application.

7A is a schematic external view showing an example of a lead frame used in the optical unit described in this application.

7B is a schematic external view showing an example of a lead frame used in the optical unit described in this application.

8 is a partially enlarged schematic external view showing an example of a lead frame used in the optical unit described in this application.

9 is a schematic external view showing an example of a lead frame used in the optical unit described in this application.

FIG. 10A is a schematic external view showing an example of a prototype of the optical unit described in this application.

FIG. 10B is a schematic external view showing an example of a prototype of the optical unit described in this application.

FIG. 11 is a partially enlarged schematic external view showing an example of the prototype of the optical unit described in this application.

FIG. 12 is a schematic external view showing an example of a prototype of the optical unit described in this application.

FIG. 13 is a schematic external view showing an example of a prototype of the optical unit described in this application.

FIG. 14 is a schematic external view showing an example of a prototype of the optical unit described in this application.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Application example>

The operating device described in this application is used, for example, as an operating device such as a mouse used in operating a personal computer (hereinafter referred to as a personal computer). In addition, the switch described in this application is used as a micro switch in various electronic equipment including operating devices. Hereinafter, the operating device 1 and the switch 2 illustrated in the drawings will be described with reference to the drawings.

<Operating device 1>

First, the operating device 1 will be described. FIG. 1 is a schematic perspective view showing an example of the appearance of the operating device 1 described in this application. FIG. 1 shows an example in which the operating device 1 described in this application is applied to a mouse used for operating electronic equipment such as a personal computer. The operating device 1 includes: a pressing operation part 10 such as a mouse button, which accepts operations pressed by the user's fingers; and a rotating operation part 11, such as a mouse wheel, which accepts operations performed by the user's fingers. The operation of turning the user's finger. Furthermore, the rotation operation part 11 is configured to accept not only the rotation operation but also the pressing operation, and also functions as the pressing operation part 10 . In addition, the operating device 1 is connected to a signal line 12 that outputs an electrical signal to an external device such as a personal computer. Furthermore, the operating device 1 is not limited to wired communication using the signal line 12, and can output electrical signals through various communication methods such as wireless communication.

Inside the operating device 1 , a switch 2 described below is housed in each of the push operation part 10 and the rotation operation part 11 . When the push operation part 10 is pressed, the inside of the push operation part 10 is Press the corresponding switch 2. The switch 2 outputs a signal based on the pressing condition from the signal line 12 to an external electronic device such as a personal computer.

That is, the operation device 1 described in this application includes a push operation part 10 that accepts a push operation from the outside, a rotation operation part 11 that accepts operations such as a rotation operation, and further includes a switch 2 inside. Furthermore, the operating device 1 transmits the pressing operation accepted by the pressing operation part 10 and/or the turning operation part 11 to the switch 2 in the form of pressing from the outside, and outputs a signal based on the operation of the switch 2 to the external electronic device. .

<Structure of switch 2>

Next, the switch 2 described in this application will be described. FIG. 2 is a schematic perspective view showing an example of the appearance of the switch 2 described in this application. In addition, in the description of this application, regarding the direction of the switch 2, the front left side toward the front in FIG. 2 will be expressed as front, the inner right side will be expressed as rear, the inner left side will be expressed as left, and the front right side will be expressed as right. , the upper part is expressed as upper, and the lower part is expressed as lower, but for the convenience of explanation The direction does not limit the assembly direction of the switch 2. As described above, the switch 2 is stored as a micro switch inside an electronic device such as the operating device 1, and receives a pressing operation received by the pressing operation part 10 and other parts of the operating device 1 in the form of pressing from the outside.

The switch 2 includes a substantially rectangular parallelepiped-shaped frame 20 . The frame 20 is formed of a lower base 20a and an upper cover 20b. A rectangular insertion hole 200 through which the pressing member 21 is inserted is opened on the upper surface of the frame 20 at a position to the left from the center when viewed from the front. The pressing member 21 inserted into the insertion hole 200 is a member that is pressed from the outside of the frame 20 and moves up and down in a range from a first position above to a second position below. The upper end of the pressing member 21 extends from the frame 20 . The upper surface of the body 20 protrudes.

Furthermore, two fixed terminals 22 and four unit terminals 23 a for fixing the switch 2 to an external member such as a substrate protrude from the lower surface of the housing 20 . The fixed terminal 22 protrudes from the left end side and near the center of the lower surface of the frame 20 . The unit terminals 23a protrude from the right end side of the lower surface of the housing 20 so as to be arranged in the front, rear, left and right directions. The unit terminal 23a extends from the optical unit 23 (refer to FIG. 3 etc.) accommodated in the housing 20 . As the optical unit 23, a light-emitting unit 230 (see FIG. 3 etc.) and a light-receiving unit 231 (see FIG. 3 etc.) are accommodated in the housing 20 . Among the four unit terminals 23 a protruding from the lower surface of the frame 20 , a rear pair of first unit terminals 230 a extends from the light-emitting unit 230 , and a front pair of second unit terminals 231 a extends from the light-receiving unit 231 .

In the switch 2 formed in this way, the external pressing operation accepted by the operating device 1 is applied to the pressing member 21 in the form of pressing from the outside of the housing 20 . pass. The pressing member 21 is pressed from the outside and moves from the first position on the upper side to the second position on the lower side. When the pressing from the outside is released, the pressing member 21 moves from the second position on the lower side to the first position on the upper side.

Next, the internal structure of the switch 2 will be described. FIG. 3 is a schematic exploded perspective view showing an example of the switch 2 described in this application. 4 and 5 are schematic cross-sectional views showing an example of the cross-section of the switch 2 described in this application. FIG. 4 shows a cross-section taken along a vertical plane including the line segment A-B shown in FIG. 2 , viewed from the front. FIG. 5 shows a cross-section taken along a vertical plane including line segment C-D shown in FIG. 2 , viewed from the right. 4 and 5 show a state in which the pressing member 21 is pressed from the outside.

In the housing 20 of the switch 2, an area is secured as a storage chamber for accommodating an opening and closing mechanism that opens and closes the electrical circuit. An insertion hole 200 penetrating from the outside of the frame 20 is opened on the upper surface of the storage chamber, and the pressing member 21 is inserted into the insertion hole 200 .

The opening and closing mechanism stored in the storage room will be explained. In the storage room, as an opening and closing mechanism, in addition to the optical unit 23 mentioned above, a first locking piece 24, a second locking piece 25, a fixed member 26, and a movable member 27 are also provided. The optical unit 23 is arranged in the form of a light receiving unit 231 and a light emitting unit 230 at the front and rear of the lower right side of the storage room. The first locking piece 24 is arranged on the lower left side of the storage room, and the second locking piece 25 is arranged on the lower center side of the storage room. The first locking piece 24 and the second locking piece 25 are integrally formed with the fixed terminal 22 protruding from the left end side of the lower surface of the frame 20 . The fixing member 26 is disposed between the light-receiving unit 231 and the light-emitting unit 230 on the right side of the storage room, and is integrally formed with the fixing terminal 22 protruding from near the center of the lower surface of the frame 20 . The movable member 27 is arranged to extend left and right in the storage chamber, and is locked by the first locking piece 24 and the second locking piece 25 .

The optical unit 23 includes a light-emitting unit 230 that emits light and a light-receiving unit 231 that receives the light emitted from the light-emitting unit 230 . The light emitting unit 230 is configured using a light emitting element 230b such as a light emitting diode (LED), and has a pair of first unit terminals 230a. The light-receiving unit 231 is configured using a light-receiving element 231b such as a photodiode (PD) or a phototransistor (PT), and has a pair of second unit terminals 231a. The light-emitting element 230b of the light-emitting unit 230 and the light-receiving element 231b of the light-receiving unit 231 are arranged to face each other at opposite positions, so that the light-receiving unit 231 receives the light emitted from the light-emitting unit 230. By energizing the light-emitting unit 230 through the first unit terminal 230a, the light-emitting element 230b of the light-emitting unit 230 emits light. The light-receiving element 231b of the light-receiving unit 231 changes the energization condition when light is detected, and therefore outputs an on signal based on the change in the energization condition due to light reception from the second unit terminal 231a.

The fixing member 26 is in the shape of a thin plate erected with the normal direction becoming the front-rear direction, and is erected in front of the light-emitting unit 230 of the optical unit 23 and behind the light-receiving unit 231 , away from the light-emitting unit 230 and the light-receiving unit 231 . settings. The upper part of the fixing member 26 is bent like an arm to form a substantially U-shape with an open left side. The lower part of the fixing member 26 serves as a light shielding plate 260 having a substantially circular transmission hole 261 for transmitting light from the optical unit 23 . The fixed member 26 is disposed so that the movable contact portion 270 on the right end side of the movable member 27 is sandwiched from above and below by the U-shaped opening in the upper portion. The inner upper part of the opening of the fixing member 26 becomes the first contact The first contact portion 262 is for the movable contact portion 270 of the movable member 27 to contact when the pressing member 21 is in the first position and the movable member 27 is not pressed by the pressing member 21 . The inner lower part of the opening of the fixed member 26 becomes the second contact portion 263. The second contact portion 263 provides a space for the movable member 27 to move when the pressing member 21 is in the second position and the movable member 27 is pressed by the pressing member 21. The movable contact portion 270 touches. The movable contact portion 270 of the movable member 27 extends to enter between the first contact portion 262 and the second contact portion 263 of the fixed member 26 . For the first contact portion 262 of the fixed member 26, the front end extending to the left protrudes downward so that the unpressed movable member 27 can easily touch the movable member 27 from below relative to the first contact portion 262. Abut. The central portion of the second contact portion 263 of the fixed member 26 protrudes upward so that the pressed movable member 27 can easily contact the second contact portion 263 . The movable member 27 contacts the second contact portion 263 from above. In order to generate a suitable click sound, the fixing member 26 is preferably formed of a metal material, but may also be formed of a material such as organic rubber, inorganic rubber, hard resin, or the like. In addition, for example, in order to adapt the click sound, the fixing member 26 can be replaced appropriately.

The movable member 27 is a metal member such as stainless steel (Stainless Steel, SUS) that is plate-shaped and extends in the left-right direction within the storage chamber. The left end side of the movable member 27 serves as a fixed end that is locked to the first locking piece 24 and functions as a swing fulcrum 271 . The right end side of the movable member 27 is a movable contact portion 270 that moves up and down as a free end between the first contact portion 262 and the second contact portion 263 of the fixed member 26 . In addition, the right end side of the movable member 27 is located downward from the movable contact portion 270 The light-shielding sheet 272 is a square-curved substantially rectangular shape. The light-shielding sheet 272 is formed so that the normal direction becomes the front-rear direction, and has a substantially rectangular transmission window 273 for transmitting light from the optical unit 23 . The light-shielding sheet 272 is located in front of the fixing member 26 and behind the light-receiving unit 231 , away from the fixing member 26 and the light-receiving unit 231 , and at a position entering between the fixing member 26 and the light-receiving unit 231 . Furthermore, the movable member 27 is formed with a biasing portion 274 that is punched and bent into an arc shape near the center and functions as a return spring. The front end of the biasing portion 274 is locked near the center of the storage room. The second locking piece 25 is formed. The urging portion 274 generates a reaction force against the pressing by the pressing member 21 .

In the opening and closing mechanism configured in this way, the pressing member 21 receives pressure from the outside and moves downward to press the movable member 27 . By pressing down the movable member 27 , the movable contact portion 270 and the light-shielding sheet 272 on the right end side, which is the free end of the movable member 27 , are lowered. As the light-shielding sheet 272 of the movable member 27 descends, the light path from the light-emitting element 230b of the light-emitting unit 230 to the light-receiving element 231b of the light-receiving unit 231 passes through the transmission window 273 opened on the light-shielding sheet 272. Therefore, as shown by the arrow in FIG. 5 , the light emitted from the light-emitting element 230 b of the light-emitting unit 230 passes through the transmission hole 261 opened in the light-shielding plate 260 of the fixed member 26 , and then passes through the light-shielding sheet 272 of the movable member 27 The light-receiving element 231b of the light-receiving unit 231 is reached through the opened transmission window 273 . When the light-receiving element 231b receives the light from the light-emitting element 230b, the circuit is closed and the switch 2 outputs an on-signal to an external electronic device. In addition, as the movable contact portion 270 of the movable member 27 descends, the movable contact portion 270 contacts the second contact portion 263 of the fixed member 26 . by gold The movable contact portion 270 of the metal movable member 27 collides with the second contact portion 263 of the fixed member 26, thereby generating a metallic sound. The user recognizes the metallic sound generated by the movable member 27 touching the fixed member 26 as a click sound.

When the pressing force of the pressing member 21 is released, the movable member 27 is biased upward due to the reaction force of the biasing portion 274 . When the movable member 27 is urged upward, the pressing member 21 moves upward. When the movable member 27 is biased upward by the biasing portion 274 , the movable contact portion 270 and the light-shielding sheet 272 located on the right end side of the movable member 27 rise, and the light of the optical unit 23 is blocked by the light-shielding sheet 272 . The disconnected state in which a circuit is open. In addition, the movable contact portion 270 located on the right end side of the movable member 27 rises and contacts the first contact portion 262 of the fixed member 26 .

<Manufacturing method of switch 2>

Next, the manufacturing method of the switch 2 described in this application will be described focusing on the optical unit 23 . FIG. 6 is a flowchart showing an example of the manufacturing method of the switch 2 described in this application. In the manufacturing process of the optical unit 23 assembled into the switch 2 described in this application, a lead frame pressing process is first performed (step S1). The lead frame pressing process in step S1 is a process in which a conductive metal thin plate is punched by press processing to form prototypes of a plurality of lead frames 232 (see FIG. 7A and the like).

7A and 7B are schematic external views showing an example of the lead frame 232 used in the optical unit 23 described in this application. FIG. 8 is a partially enlarged schematic external view showing an example of the lead frame 232 used in the optical unit 23 described in this application. 7A, 7B, and 8 illustrate an example of the lead frame 232 punched out in the lead frame pressing process of step S1. Figure 7A is a view from the normal direction. The dots represent a plan view of the metal sheet, and Figure 7B is a front view. FIG. 8 is an enlarged plan view showing a part of FIG. 7A . Figures 7A, 7B and 8 show examples of punching out multiple sets of lead frames (N×M sets) arranged in N columns and M rows (N and M are natural numbers above 2) from a single metal sheet. . The metal sheet punched out in the lead frame pressing process of step S1 forms multiple sets of lead frames 232. However, the formed lead frames 232 are not cut off from the metal sheet at the stage of step S1, but are partially connected to the metal sheet. .

FIG. 9 is a schematic external view showing an example of the lead frame 232 used in the optical unit 23 described in this application. FIG. 9 is a perspective view showing a state in which a set of lead frames 232 is cut off from the metal sheet punched out in the lead frame pressing process of step S1. As illustrated in FIG. 9 , the optical unit 23 such as the light-emitting unit 230 and the light-receiving unit 231 uses two substantially linear lead frames 232 with different lengths as a set. The set of lead frames 232 includes a longer first lead frame 2320 and a shorter second lead frame 2321. A mounting portion 2320a capable of mounting an optical chip 23b (see FIG. 14 etc.) such as the light-emitting element 230b and the light-receiving element 231b is formed on one end side of the substantially linear first lead frame 2320, and the other end side serves as the unit terminal 23a. . A bonding portion 2321a to which the bonding wire 233 (see FIG. 14 and the like) can be connected is formed on one end side of the substantially linear second lead frame 2321, and the other end side becomes the unit terminal 23a.

Returning to the flowchart of FIG. 6 , a molding process of molding a part of the lead frame 232 (resin molding) using molding resin by insert molding is performed on the metal sheet punched out in the lead frame pressing process (step S2 ). . The model of step S2 The manufacturing process is a process of performing insert molding on the lead frame 232 formed on a thin metal plate in a state where the mounting portion 2320a and the wiring portion 2321a are exposed.

10A and 10B are schematic external views showing an example of a prototype of the optical unit 23 described in this application. FIG. 11 is a partially enlarged schematic external view showing an example of the prototype of the optical unit 23 described in this application. 10A, 10B, and 11 show an example of the prototype of the optical unit 23 molded in the molding process of step S2. Figures 10A and 10B and Figure 11 correspond to Figures 7A and 7B and Figure 8 respectively. 10A, 10B, and 11 illustrate an example in which a plurality of groups of respective lead frames 232 are formed on one metal plate and are molded by insert molding. In addition, in the molding process, insert molding may be performed after performing a pre-process of silver plating the entire part to be the lead frame 232 or the part to be the unit terminal 23a. Among the plurality of lead frames 232 formed on the metal sheet, some of them are molded, but are not cut off from the metal sheet at step S2 and are partially connected to the metal sheet.

12 and 13 are schematic external views showing an example of a prototype of the optical unit 23 described in this application. 12 and 13 are schematic external views showing the prototype of one optical unit 23 cut off from the metal sheet molded in the molding process of step S2. FIG. 12 is a plan view, and FIG. 13 is a perspective view. In step S2, resin molding is performed to mold the lead frame 232 by insert molding. The molded product formed by resin molding has a substantially prism shape, and when assembled into the switch 2 , a pair of lead frames 232 protrudes from a surface that becomes the bottom surface of the switch 2 . The protruded lead frame 232 becomes the unit terminal 23 a of the switch 2 . In addition, it is roughly ridged One of the bottom sides of the columnar molded product is opened in the form of a recessed portion 23c surrounded by side walls that become the side surfaces of the prism, and the mounting portion 2320a and the wiring portion 2321a of the lead frame 232 are formed from the inner bottom surface of the recessed portion 23c. exposed. That is, the molding process of step S2 is a process of molding the lead frame 232 by insert molding using molding resin (resin molding) in a state where the mounting portion 2320a and the bonding portion 2321a are exposed.

By molding by insert molding, the molded resin becomes a case that protects the optical chip 23b such as the light-emitting element 230b and the light-receiving element 231b, and the lead frame 232. In addition, if necessary, a dye is mixed with the molding resin used in the insert molding mold so that it becomes opaque at least after hardening. By using opaque molded resin as the housing, interference light can be prevented from intruding into the housing and irradiating the optical chip 23b.

Returning to the flowchart of FIG. 6 , the optical chip 23b such as the light-emitting element 230b and the light-receiving element 231b is placed on the mounting portion 2320a that is exposed from the prototype of the optical unit 23 molded in the molding process, and is connected to the lead frame 232 The die bonding process (step S3). Furthermore, a wire bonding process is performed to connect the bonding portion 2321a exposed from the prototype of the optical unit 23 molded in the molding process to the optical chip 23b through the bonding wire 233 (step S4). Die bonding and wire bonding are performed on the prototypes of the plurality of optical units 23 formed on the metal thin plate. However, in the stages of steps S3 and S4, they are not cut off from the metal thin plate and are partially connected to the metal thin plate.

FIG. 14 is a schematic external view showing an example of the prototype of the optical unit 23 described in this application. FIG. 14 shows a state in which the prototype of the optical unit 23 wired in the die bonding process of step S3 and the wire bonding process of step S4 is cut from the metal sheet. state expression. Figure 14 corresponds to Figure 12 and is shown in plan view. In step S3, the optical chip 23b such as the light-emitting element 230b and the light-receiving element 231b is placed on the mounting portion 2320a exposed from the molding resin used for molding, and the terminals of the optical chip 23b are connected to each other in a mounting form such as surface mounting. The mounting portion 2320a of the first lead frame 2320 is connected by die bonding. Through die bonding, the optical chip 23b is electrically connected to the mounting portion 2320a of the first lead frame 2320. In step S4, conductive silver paste is applied to the optical chip 23b, and wire bonding is performed by connecting the optical chip 23b to the bonding portion 2321a exposed from the molded resin by the conductive bonding wire 233. Through wire bonding, the optical chip 23b is electrically connected to the wiring portion 2321a of the second lead frame 2321. As the wire 233 for wire bonding, for example, a gold wire with a diameter of 25 μm is used. Through the die bonding process of step S3 and the wire bonding process of step S4, the first lead frame 2320 having the unit terminal 23a, the optical chip 23b, and the second lead frame 2321 having the unit terminal 23a are electrically connected. Thereby, the wiring of the electronic circuit portion that receives power supply from the unit terminal 23a and emits light, or receives light and outputs a signal from the unit terminal 23a is completed on the inner bottom surface of the recessed portion 23c of the optical unit 23.

Returning to the flowchart of FIG. 6 , a resin coating step of applying resin to the prototype of the optical unit 23 wired in the die bonding step and the wire bonding step is performed (step S5 ). Furthermore, a curing step of curing the applied resin is performed (step S6). Step S5 is a step of applying resin with high light transmittance such as epoxy resin to the portion exposed from the molded resin of the electronic circuit portion formed in the recessed portion 23c of the optical unit 23 to fill the recessed portion 23c. The resin is applied by filling the recessed portion 23c of the optical unit 23 with the liquid resin. The exposed portion of the electronic circuit portion formed on the inner bottom surface of the recessed portion 23c is molded. The resin coating in step S5 is performed multiple times.

By coating the resin, components such as the optical chip 23b and the bonding wires 233 can be protected and can be reinforced against external forces. The coating resin is, for example, mixed with a two-liquid resin, and is made of a material that does not block the light path of the optical chip 23b for emitting or receiving light at least after curing. However, it is ideal to use opaque resin in areas deviating from the light path to prevent the intrusion of interfering light. The prototype of the optical unit 23 after hardening in step S6 is transported to the next process as a semi-finished product.

Molding is performed again, and a finishing process of manufacturing the plurality of optical units 23 from the hardened semi-finished product is performed (step S7). As the finishing process of step S7, a cutting process of cutting each optical unit 23 from a metal sheet (step S7a) and an inspection process of inspecting the quality of the cut optical units 23 (step S7b) are performed.

Then, the assembly process of assembling each optical unit 23 and other components after the finishing process into the housing 20 is performed (step S8), and the switch 2 is completed. The completed switch 2 is assembled into the operating device 1 after quality inspection, and is shipped as the operating device 1 after further quality inspection.

As described above, in the manufacturing method of the switch 2 described in this application, after the lead frame 232 is molded by insert molding, the optical chip 23b is connected and filled with resin. More specifically, the optical unit 23 is manufactured through processes such as lead frame pressing, molding by insert molding, die bonding, wire bonding, resin coating, hardening, cutting, and inspection. Then, the optical unit 23 is assembled to the switch 2 . For example, in previous manufacturing methods, through lead frame pressing, die bonding, The optical unit 23 is manufactured through complex processes such as hardening, wire bonding, silicon casting, vacuum processing, hardening, molding by insert molding, hardening, deburring, deburring finishing, cutting, and inspection. That is, the manufacturing method of the optical unit 23 and the switch 2 described in this application omits or simplifies multiple processes such as hardening treatment and deburring compared with the previous manufacturing method, thereby achieving reduction in man-hours. This can estimate various effects such as suppression of processing costs and shortening of production cycle.

In addition, since the optical unit 23 described in this application is molded with an opaque resin around the optical chip 23b after curing, it has high light-shielding properties and prevents the intrusion of interference light. Therefore, it is expected to achieve quality improvements such as preventing malfunctions. Excellent results.

In addition, by performing insert molding, the optical unit 23 having excellent strength can be manufactured in various shapes.

The present invention is not limited to each embodiment described above, and can be developed in various other forms. Therefore, the described embodiments are merely illustrative in all respects and are not to be construed restrictively. The technical scope of the present invention is explained by the scope of the patent application and is not subject to any limitation by the text of the specification. Furthermore, all modifications and changes that fall within the equivalent range of the claimed scope are within the scope of the present invention.

For example, in the above-mentioned embodiment, the form in which the recessed portion 23c is formed by insert molding and the optical chip 23b is placed on the inner bottom surface of the recessed portion 23c is shown. However, the present invention is not limited to this, and the optical chip 23b can also be used. It can be deployed in various forms such as prominent placement.

In addition, in the above-described embodiment, as the optical unit 23, there is shown The present invention is not limited to the form of the transmission type optical unit 23 in which the other circuit receives the light emitted from one of the circuits, and can be developed in various forms such as using the reflection type optical unit 23.

Furthermore, in the above embodiment, a mouse is exemplified as the operating device 1 including the switch 2, but the present invention is not limited to this, and the switch 2 can be mounted on various products such as keyboards and other electronic equipment.

S1, S2, S3, S4, S5, S6, S7, S7a, S7b, S8: Steps

Claims (6)

A method of manufacturing a switch, which performs the following steps: molding a lead frame having a mounting portion for mounting an optical chip and a bonding portion for bonding, in a state where the mounting portion and the bonding portion are exposed Next, the molding resin is used to perform resin molding by insert molding; the die bonding process is to place the optical chip on the exposed mounting part of the self-molding resin and connect it; the wire bonding process is to connect the wires to the self-molding resin between the exposed wiring portion and the optical chip placed on the mounting portion; an optical unit finishing process to manufacture an optical unit from a semi-finished product after connecting the optical chip and bonding wires; and an assembly process to assemble the optical unit to a fine Optical unit manufactured in the machining process. The manufacturing method of the switch according to claim 1, wherein after the die bonding process and the wire bonding process, a resin coating process of applying resin to a portion exposed from the molded resin is performed, and the optical unit The finishing process is to manufacture an optical unit from the semi-finished product after performing the resin coating process. The manufacturing method of a switch according to claim 2, wherein the molding step is a step of molding resin into a shape in which the placement portion and the recessed portion exposed by the connecting portion are formed on an inner bottom surface, and the resin The resin coating in the coating step is to fill the recessed portion with the resin. process. The manufacturing method of a switch according to claim 2 or claim 3, wherein the resin coating step is performed multiple times by coating the resin. The method of manufacturing a switch according to claim 2 or claim 3, wherein the resin used in the molding process becomes opaque after hardening. A method for manufacturing an optical unit that can be assembled into an optical unit of a switch. The method performs the following steps: a molding step, and a lead having a mounting portion for mounting an optical chip and a bonding portion for bonding. The frame is resin-molded by insert molding using molding resin in a state where the mounting portion and the wiring portion are exposed; and the die bonding step is to mount the optical chip on the mounting portion where the self-molding resin is exposed. parts and connect them; a wire bonding process, connecting the wire between the bonding part exposed from the molded resin and the optical chip placed on the mounting part; and a finishing process, after connecting the optical chip and the wire Semi-finished products are used to manufacture optical units.

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