TWI813215B - Bonding structure - Google Patents

Abstract

A bonding structure includes a transparent substrate, an identification module, and an adhesive component. A thickness of the identification module is equal to or less than 0.3 mm. The adhesive component is attached between the transparent substrate and the identification module. At least one of a 180 degree peeling adhesive strength between the adhesive component and the transparent substrate and a 180 degree peeling adhesive strength between the adhesive component and the identification module is less than 2 N/inch.

Description

Fitted structure

The present invention relates to a structure, and in particular to a conformable structure.

Generally speaking, the identification module is often fixed on one side of the light-transmitting substrate relative to the user, so that the identification module receives and interprets the user's operations through the light-transmitting substrate. In addition, the current technology of using a full-mounted method to fix the light-transmitting substrate and the recognition module can enable the recognition module to obtain a better image effect, thereby improving the accuracy of the recognition module.

However, the materials used in the full-attachment method often have high peeling strength, which makes rework difficult. If problems occur during the lamination process or abnormalities in the identification module are discovered after lamination, the light-transmitting substrate often needs to be scrapped, thereby increasing production costs. . Therefore, how to solve the heavy-duty difficulties of the full-laminated method and reduce production costs, so as to technically enhance the competitiveness of the full-laminated method, is the focus of current research.

The present invention provides a fit structure that can increase reworkability and reduce production costs.

The bonding structure of the present invention includes a light-transmitting substrate, an identification module and an adhesive component. The identification module has a thickness less than or equal to 0.3 mm. The adhesive component is pasted between the transparent substrate and the identification module. At least one of the 180-degree peel strength between the adhesive component and the light-transmitting substrate and the 180-degree peel strength between the adhesive component and the identification module is less than 2 Newton/inch.

In an embodiment of the present invention, the above-mentioned light-transmitting substrate is a display panel.

In an embodiment of the present invention, the above-mentioned adhesive component includes a base material layer and a pair of adhesive layers. The base material layer is disposed between the pair of adhesive layers. The pair of adhesive layers are arranged between the light-transmitting substrate and the identification module.

In an embodiment of the present invention, the projection area of the above-mentioned identification module on the light-transmitting substrate is larger than the projection area of the adhesive component on the light-transmitting substrate. The projection area of the adhesive component on the light-transmitting substrate is located within the projection area of the identification module on the light-transmitting substrate.

In an embodiment of the present invention, the projection area of the above-mentioned identification module on the light-transmitting substrate is smaller than the projected area of the adhesive component on the light-transmitting substrate. The projection area of the identification module on the light-transmitting substrate is located within the projection area of the adhesive component on the light-transmitting substrate.

In an embodiment of the present invention, at least one side of the above-mentioned adhesive component is retracted from the corresponding side of the identification module.

In an embodiment of the present invention, there is a distance between at least one side of the above-mentioned adhesive component and a corresponding side of the identification module. The spacing is between 0.3 mm and 5 mm.

In an embodiment of the present invention, at least one side of the above-mentioned adhesive component protrudes from the corresponding side of the identification module.

In an embodiment of the present invention, there is a distance between at least one side of the above-mentioned adhesive component and a corresponding side of the identification module. The spacing is between 1 mm and 10 mm.

In an embodiment of the present invention, the above-mentioned adhesive component has a handle area protruding from the identification module.

In an embodiment of the present invention, the above-mentioned identification module has a cross-section. The opposite ends of the section are two points respectively. The midpoint of the section is between the two points. When a vertical external force is applied to the midpoint of the cross-section of the identification module, the maximum vertical distance between the midpoint and the two points is greater than 1 mm.

Based on the above, the lamination structure of the present invention uses the identification module to have a thickness less than or equal to 0.3 mm, and has a 180-degree peel strength between the adhesive component and the light-transmitting substrate and a 180-degree peel strength between the adhesive component and the identification module. At least one of them is less than 2 Newton/inch, so that the light-transmitting substrate and the identification module will not be separated from the light-transmitting substrate and the identification module by reverse tearing due to the peeling strength of the adhesive component. Destroy the structure of the light-transmitting substrate and the identification module, and prevent residual glue from the adhesive components from remaining on the light-transmitting substrate or identification module. In this way, the reworkability of the identification module can be effectively increased and the production cost of the identification module can be reduced, thereby enhancing the competitiveness of the identification module in the full-attachment method.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

Figure 1 is a cross-sectional view of a fitting structure according to an embodiment of the present invention. It should be noted that the rectangular coordinates X-Y-Z are also provided here to facilitate the related description and reference of subsequent components. Moreover, the proportional relationships such as size and thickness of the light-transmitting substrate 110, the identification module 120 and the adhesive component 130 of the identification module 100 in the figure are only for illustration.

Please refer to FIG. 1 . The identification module 100 of this embodiment includes a light-transmitting substrate 110 , an identification module 120 and an adhesive component 130 . The adhesive component 130 is removably and directly attached between the light-transmitting substrate 110 and the identification module 120 along the Z-axis.

Here, it should be noted that in one embodiment, the light-transmitting substrate 110 is, for example, a display panel, but is not limited to this. In one embodiment, the identification module 120 is, for example, a fingerprint identification module. When the user's fingerprint (not shown) touches the light-transmitting substrate 110, the reflected light of the fingerprint can pass through the light-transmitting substrate 110 to allow the identification module 120 to To receive and interpret, but not limited to this. In one embodiment, the material of the adhesive component 130 is, for example, transparent low-adhesive glue such as silicone or acrylic glue, but is not limited thereto. In one embodiment, the adhesive component 130 is fully pasted between the light-transmitting substrate 110 and the identification module 120, but this is not a limitation.

Specifically, in this embodiment, the identification module 120 has a thickness D1 less than or equal to 0.3 mm, and the 180-degree peel strength between the adhesive component 130 and the light-transmitting substrate 110 is the same as that between the adhesive component 130 and the identification module 120 . At least one of the 180-degree peel strengths is less than 2 Newton/inch to increase the reworkability of the bonding of the light-transmitting substrate 110 and the identification module 120 .

Here, it should be noted that in one embodiment, the identification module 120 is, for example, an optical identification module composed of a circuit board and a sensor with a total thickness D1 of 0.3 mm, but is not limited to this. In other embodiments, the identification module 120 is, for example, an ultrasonic identification module or a capacitive identification module with a thickness D1 of 0.3 mm. The present invention does not limit the type of the identification module 120 . In one embodiment, the value of the 180-degree peel strength of the adhesive component 130 is obtained by testing in accordance with ASTM D3330, PSTC 101, GB T2792 or JIS Z0237, but is not limited thereto.

As mentioned above, the identification module 120 has a thickness D1 less than or equal to 0.3 mm, and the 180-degree peel strength between the adhesive component 130 and the light-transmitting substrate 110 and the 180-degree peel strength between the adhesive component 130 and the identification module 120 are used. At least one of them is less than 2 Newtons/inch, so that the light-transmitting substrate 110 and the identification module 120 will not be separated from the light-transmitting substrate 110 and the identification module by reverse tearing due to the peeling strength of the adhesive component 130 being too high. When disassembling the module 120 , the structure of the light-transmitting substrate 110 and the identification module 120 is destroyed, and the residual glue of the adhesion component 130 is prevented from remaining on the light-transmitting substrate 110 or the identification module 120 .

In this way, the reworkability of the identification module 100 can be effectively increased and the production cost of the identification module 100 can be reduced, thereby enhancing the competitiveness of the identification module 100 in the full-paste method.

FIG. 2 is a perspective cross-sectional view of the deformation of the identification module of the lamination structure of FIG. 1 . It should be noted that FIG. 2 uses a dotted line to indicate the deformed state of the recognition module 120 . In more detail, please refer to FIG. 2 . In this embodiment, the identification module 120 has a cross section 121 . In the Y-axis direction, the opposite ends of the cross section 121 are respectively two points 122, and the midpoint 123 of the cross section 121 is located between the two points 122. When a vertical external force F parallel to the Z-axis is applied to the midpoint 123 of the cross-section 121 of the identification module 120, the maximum vertical distance D2 between the midpoint 123 and the two points 122 in the Z-axis direction is greater than 1 mm.

That is to say, in this embodiment, when the thickness D1 of the identification module 120 is less than or equal to 0.3 mm, since the maximum deformation of the identification module 120 when subjected to the vertical external force F is greater than 1 mm, when When the identification module 120 is separated from the adhesive component 130 by an external force F as described above, the identification module 120 can utilize the characteristics of bending deformation to gradually separate from the adhesive component 130 at a small angle without damage.

FIG. 3 is a cross-sectional view of the identification module and the adhesive component separated by reverse tearing in the lamination structure of FIG. 1 . Further, please refer to FIG. 1 . In this embodiment, the projected area A1 of the identification module 120 on the light-transmitting substrate 110 is larger than the projected area A2 of the adhesive component 130 on the light-transmitting substrate 110 , and the adhesive component 130 is on the light-transmitting substrate 110 . The projection area A2 of the substrate 110 is located within the projection area A1 of the identification module 120 on the light-transmitting substrate 110 .

That is to say, as shown in FIGS. 1 and 3 , in this embodiment, the side S2 of the adhesive component 130 is retracted from the corresponding side S1 of the identification module 120 . Here, it should be noted that in this embodiment, there is a distance G1 between the side S2 of the adhesive component 130 and the corresponding side S1 of the identification module 120, and the distance G1 is between 0.3 mm and 5 mm. time, but not limited to this.

Therefore, as shown in FIG. 3 , taking the recognition module 120 being separated from the adhesive component 130 as an example, when an external force F is applied to the recognition module 120 (near the side S1 ), the side S2 of the adhesive component 130 shrinks inwards. The corresponding side S1 of the identification module 120, therefore the distance G1 between the side S2 of the adhesive component 130 and the corresponding side S1 of the identification module 120 is equivalent to the initial application of the external force F to the identification module 120. The force applying arm, and the connection 124 between the adhesive component 130 and the identification module 120 can be regarded as the force application fulcrum where the external force F is initially applied to the identification module 120 .

In this way, through the bending deformation characteristics of the identification module 120, as the identification module 120 is gradually separated from the adhesive component 130 at a small angle and without damage, the adhesive component 130 connects the connection point 124 of the identification module 120 with The distance G1 between the corresponding sides S1 of the identification module 120 will gradually increase, so that the force required to be applied by the identification module 120 will gradually decrease, thereby allowing the identification module 120 to be smoothly separated from the adhesive component 130 .

It must be noted here that the following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.

Figure 4 is a cross-sectional view of a fitting structure according to another embodiment of the present invention. FIG. 5 is a cross-sectional view of the identification module and the adhesive component separated by reverse tearing in the lamination structure of FIG. 4 . Please refer to FIG. 1 and FIG. 4 at the same time. The bonding structure 100A of this embodiment is similar to the bonding structure 100 of FIG. 1 . The difference between the two lies in the relative relationship between the identification module 120A and the adhesive component 130A.

Please refer to FIG. 4 . In this embodiment, the projection area A1 of the identification module 120A on the light-transmitting substrate 110 is smaller than the projection area A2 of the adhesive component 130A on the light-transmitting substrate 110 , and the projection area A1 of the identification module 120A on the light-transmitting substrate 110 The area A1 is located within the projection area A2 of the adhesive component 130A on the light-transmitting substrate 110 .

That is to say, as shown in FIGS. 4 and 5 , in this embodiment, the side S2 of the adhesive component 130A protrudes from the corresponding side S1 of the identification module 120A. Here, it should be noted that in this embodiment, there is a distance G1 between the side S2 of the adhesive component 130A and the corresponding side S1 of the identification module 120A, and the distance G1 is between 1 mm and 10 mm. time, but not limited to this.

Therefore, as shown in FIG. 5 , taking the identification module 120A being separated from the adhesive component 130A as an example, since the side S2 of the adhesive component 130A protrudes from the corresponding side S1 of the identification module 120A, it is necessary to pass through, for example, The adhesive remover 133 dissolves the adhesive component 130A (near the side S1 ), so that there is a gap G2 between the connection point 124 of the adhesive component 130A and the identification module 120A and the side S1 of the identification module 120A.

Therefore, when an external force F is applied to the identification module 120A (near the side S1), the distance G2 between the connection point 124 of the adhesive component 130A connecting the identification module 120A and the side S1 of the identification module 120A is equivalent to The external force F begins to be applied to the force-applying arm of the identification module 120A, and the connection 124 of the adhesive component 130A to the identification module 120A can be regarded as the force-application fulcrum where the external force F is initially applied to the identification module 120A.

In this way, due to the bending deformation characteristics of the identification module 120A, as the identification module 120A is gradually separated from the adhesive component 130A at a small angle and without damage, the adhesive component 130A connects the connection point 124 of the identification module 120A with The distance G2 between the corresponding sides S1 of the identification module 120A will gradually increase, so that the force required to be applied by the identification module 120A will gradually decrease, thereby allowing the identification module 120A to be smoothly separated from the adhesive component 130A.

Figure 6 is a cross-sectional view of a fitting structure according to another embodiment of the present invention. FIG. 7 is a bottom view of the identification module and adhesive component of the lamination structure of FIG. 6 . Please refer to FIG. 4 and FIG. 6 at the same time. The bonding structure 100B of this embodiment is similar to the bonding structure 100A of FIG. 4 . The difference between the two lies in the adhesive component 130B.

Please refer to FIG. 6 . In this embodiment, the adhesive component 130B includes a base material layer 131 and a pair of adhesive layers 132 . The base material layer 131 is disposed between the pair of adhesive layers 132 along the Z-axis, and the pair of adhesive layers 132 is disposed between the light-transmitting substrate 110 and the identification module 120A along the Z-axis.

Here, it should be noted that in one embodiment, the base material layer 131 is, for example, an optically transparent sheet, but is not limited to this. In one embodiment, the material of the pair of adhesive layers 132 is, for example, transparent low-adhesive glue such as silicone glue or acrylic glue, but is not limited thereto. In one embodiment, the pair of adhesive layers 132 are fully pasted between the light-transmitting substrate 110 and the identification module 120A, but this is not a limitation.

Specifically, in this embodiment, the pair of adhesive layers 132 is removable and directly attached between the light-transmitting substrate 110 and the identification module 120A. At least one of the 180-degree peel strength between one of the pair of adhesive layers 132 and the light-transmitting substrate 110 and the 180-degree peel strength between the other one of the pair of adhesive layers 132 and the identification module 120A is less than 2 Newton/inch to increase the reworkability of the lamination of the light-transmitting substrate 110 and the identification module 120A.

It should be noted that in one embodiment, the value of the 180-degree peel strength of each adhesive layer 132 is obtained by testing in accordance with ASTM D3330, PSTC 101, GB T2792 or JIS Z0237, etc., but it is not used as a basis. limit.

Further, please refer to FIG. 7 . In this embodiment, the adhesive component 130B has a handle area 134 protruding from the identification module 120A. It should be noted here that, as shown in FIG. 8 , in other embodiments, the handle area 134C of the adhesive component 130C may be partially protruded from the recognition module 120A, so as to facilitate the connection between the adhesive component 130C and the light-transmitting substrate 110 and the recognition module. Separation of Group 120A.

In this way, through the arrangement of the base material layer 131 and the handle area 134 of the adhesive component 130B, the base material layer 131 can provide the hardness and support force of the adhesive component 130B, so that the adhesive component 130B can directly pass through the handle area 134 and the light-transmitting substrate 110. The identification module 120A is separated without requiring additional separation tools (such as pulling tape).

Moreover, as mentioned above, at least one of the 180-degree peel strength between the pair of adhesive layers 132 and the light-transmitting substrate 110 and the 180-degree peel strength between the pair of adhesive layers 132 and the identification module 120A is less than 2 Newton/inch, so that The light-transmitting substrate 110 and the identification module 120A will not be damaged when the light-transmitting substrate 110 and the identification module 120A are separated by reverse tearing due to the peeling strength of the adhesive component 130B. structure of the assembly 120A, and prevent the residual glue of the pair of adhesive layers 132 of the adhesive component 130B from remaining on the light-transmitting substrate 110 or the identification module 120A.

To sum up, the lamination structure of the present invention uses the identification module to have a thickness of less than or equal to 0.3 mm, and the 180-degree peel strength between the adhesive component and the light-transmitting substrate and the 180-degree peeling strength between the adhesive component and the identification module At least one of the peel strengths is less than 2 Newtons/inch, so that the light-transmitting substrate and the identification module will not be separated by reverse tearing due to the peeling strength of the adhesive component being too high. When doing so, destroy the structure of the light-transmitting substrate and the identification module, and prevent the residual glue from the adhesive components from remaining on the light-transmitting substrate or the identification module. In this way, the reworkability of the identification module can be effectively increased and the production cost of the identification module can be reduced, thereby enhancing the competitiveness of the identification module in the full-attachment method.

Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.

100, 100A, 100B: identification module 110: Translucent substrate 120, 120A: Identification module 121: Section 122: Fulcrum 123:midpoint 124:Connection 130, 130A, 130B, 130C: adhesive components 131:Substrate layer 132:Adhesive layer 133:Glue remover 134, 134C: handle area A1, A2: Projection area D1:Thickness D2: distance G1, G2: spacing S1, S2: side F: external force X-Y-Z: Cartesian coordinates

Figure 1 is a cross-sectional view of a fitting structure according to an embodiment of the present invention. FIG. 2 is a perspective cross-sectional view of the deformation of the identification module of the lamination structure of FIG. 1 . FIG. 3 is a cross-sectional view of the identification module and the adhesive component separated by reverse tearing in the lamination structure of FIG. 1 . Figure 4 is a cross-sectional view of a fitting structure according to another embodiment of the present invention. FIG. 5 is a cross-sectional view of the identification module and the adhesive component separated by reverse tearing in the lamination structure of FIG. 4 . Figure 6 is a cross-sectional view of a fitting structure according to another embodiment of the present invention. FIG. 7 is a bottom view of the identification module and adhesive component of the lamination structure of FIG. 6 . FIG. 8 is a bottom view of an identification module and an adhesive component of a conforming structure according to another embodiment of the present invention.

100:Identification module

110: Translucent substrate

120:Identification module

130: Adhesive components

A1, A2: Projection area

D1:Thickness

G1: spacing

S1, S2: side

X-Y-Z: Cartesian coordinates

Claims (11)

A form-fitting structure consisting of: a light-transmissive substrate; an identification module having a thickness less than or equal to 0.3 mm; and An adhesive component is pasted between the light-transmitting substrate and the identification module, wherein the 180-degree peel strength between the adhesive component and the light-transmitting substrate and the 180-degree peeling between the adhesive component and the identification module At least one of the strengths is less than 2 Newtons/inch. The lamination structure of claim 1, wherein the light-transmitting substrate is a display panel. The lamination structure of claim 1, wherein the adhesive component includes a base material layer and a pair of adhesive layers, the base material layer is provided between the pair of adhesive layers, and the pair of adhesive layers is provided on the light-transmitting substrate and between the identification modules. The lamination structure of claim 1, wherein the projection area of the identification module on the light-transmitting substrate is greater than the projected area of the adhesive component on the light-transmitting substrate, and the projection area of the adhesive component on the light-transmitting substrate The identification module is located within the projection area of the light-transmitting substrate. The lamination structure as described in claim 1, wherein the projection area of the identification module on the light-transmitting substrate is smaller than the projected area of the adhesive component on the light-transmitting substrate, and the projection area of the identification module on the light-transmitting substrate The area is located within the projected area of the adhesive component on the light-transmitting substrate. The fitting structure as claimed in claim 1, wherein at least one side of the adhesive component is retracted from the corresponding side of the identification module. The lamination structure of claim 6, wherein there is a distance between the at least one side of the adhesive component and the corresponding side of the identification module, and the distance is between 0.3 mm and 5 mm. . The fitting structure as claimed in claim 1, wherein at least one side of the adhesive component protrudes from the corresponding side of the identification module. The lamination structure of claim 8, wherein there is a distance between at least one side of the adhesive component and the corresponding side of the identification module, and the distance is between 1 mm and 10 mm. . The fitting structure according to claim 1, wherein the adhesive component has a handle area protruding from the identification module. The laminated structure of claim 1, wherein the identification module has a cross-section, the opposite ends of the cross-section are respectively two points, and a midpoint of the cross-section is located between the two points. When the identification module When a vertical external force is applied to the midpoint of the cross section of the group, the maximum value of the vertical distance between the midpoint and the two points is greater than 1 mm.

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