TWI808967B - Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle - Google Patents

Abstract

The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet can be fluidly isolated from the chamber exhaust outlet.

Description

Collection Chamber Equipment for Separation of Multiple Liquids in Semiconductor Wafer Processing Cycles

The present invention relates generally to wafer processing apparatus, and more particularly to providing a means of separating and collecting various fluids during wafer processing for reuse.

In particular, the present invention relates to silicon wafer processing in which various fluids are used during processes for cleaning, etching, or performing other wet process operations. Fluids are often expensive and it is desirable to be able to reuse them until exhausted.

Normal wafer processing utilizes a collection chamber to separate a specific fluid from the waste water discharge and to allow recirculation of the fluid.

It is an object of the present invention to have multiple independent collection chambers with the ability to separate multiple different fluids for recirculation and reuse.

A wafer processing system includes a chamber enclosure. The system also includes a rotatable wafer support for supporting a wafer, and a plurality of independently movable catch trays disposed around the peripheral edge of the wafer support. The collection trays are arranged in a stacked configuration, wherein each collection tray has a collection area for collecting fluid. At least one of the collection pans has a drain in fluid communication with the collection area for draining collected fluid.

A drive mechanism is provided for selectively and independently moving one or more of the catch trays to a raised position above the wafer support to define the at least one raised catch tray and a A collection chamber between lowered collection pans. The collection chamber is configured to collect fluid drained from the wafer during wafer processing and to direct the collected fluid through the drain port of the lowered collection tray.

The system includes a chamber exhaust formed in the housing to exhaust gases from inside the housing to outside the collection trays, and a chamber exhaust formed in the housing to exhaust gas flowing through the collection chamber to the chemical exhaust port. One of the gas chemical vents. The chemical vent is fluidly isolated from the chamber vent.

According to another aspect of the present invention, the collection chamber device (fluid collection device) is composed of multiple (n+1) circular collection trays, which are stacked and sealed when not in use, and multiple (n) circular collection trays are formed as required. Unique collection chamber and drainage system.

According to one embodiment, a wafer processing system includes a fluid collection device configured to separate and collect fluids during wafer processing for reuse. The wafer processing system includes a rotatable wafer support for supporting a wafer, and a plurality of independently movable collection trays disposed around the peripheral edge of the wafer support. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough for collecting fluid. The inner wall portion is closer to the wafer support than the outer wall portion. At least some of the collection pans have an outlet in fluid communication with a sump for discharging collected fluid, wherein the bottommost edge (A) of the sump defines the bottommost point of the collection pan, and the inner wall portion has a top edge (B) and the outer wall portion has a top edge (C).

A driving mechanism is provided for selectively moving one or more of the collection trays to a raised position above the wafer support to define a gap formed between the raised collection tray and the lowered collection tray. A collection room. The collection chamber is configured to collect during wafer processing from the Wafer draining fluid and directing the collected fluid through the outlet of the lowered collection tray.

To eliminate or substantially reduce splashing from fluid expelled into the collection chamber, the bottom edge (A) of the raised collection pan is lower than the top edge (B) of the inner wall portion of the lowered collection pan, and The bottom edge (A) of the raised collection tray is at a level equal to or lower than the top edge (C) of the outer wall portion of the lowered collection tray.

1: collection room

2: collection room

22: excess fluid

23: Fluid

24: drip groove

25: path

26: Fluid

29: seat

28: pin

30: path

32: Fluid

33: position

34: Gap

36: Second collection chamber (gap)

37: Third collection chamber (gap)

42: path

100: Collection room equipment

110: Rotary Chuck

112: motor

115: Wafer

119: fluid

120: distribution arm

130, 140, 150, 160: collection tray

131, 141, 151, 161: central opening

132, 142, 152, 162: Collect tracks

133, 143, 153, 163: flange area

134, 144, 154, 164: opening

135, 145, 155, 165: opening

136, 146, 156, 166: exit

147, 157, 167: fluid conduit parts

199: Fluid pool

200: Manifold

201, 202, 203: Entrance

210: drain pipe

260: Drain

300: Piston

307, 308: shoulder

310: Piston

320: Piston

321: stop piece

400: Collection disk configuration

401: The first collection room

405: collection cover

413, 423, 433, 443: inner wall

414, 424, 434, 444: outer wall

415, 425, 435, 445: groove

410: The first collection plate

420: the second collection plate

427: inner top edge

428: outer top edge

430: The third collection plate

440: The fourth collection plate

450: collection tray housing

452: partition wall

454: top edge

457: bottom wall

460: first compartment

462: inner wall

463: top edge

470: second compartment

472: outer wall

476: top wall

480: First opening or passage

490: Second opening or passage

500: Collection disk configuration

501: collection tray shell

503: splashback

510: The first collection plate

515: Outer cover

520: the second collection plate

530: The third collection plate

540: The fourth collection plate

550: inner wall

555: Slot

551: inner top edge

560: Outer wall

561: outer top edge

600: Collection disk configuration

601: collection tray housing

602: inner wall

603: partition wall

604: top edge

605: first compartment

606: bottom wall

607: second compartment

608: outer wall

609: top wall

610: The first collection plate

613: convex part

615: Outer cover

620: the second collection plate

630: The third collection plate

640: The fourth collection plate

650: inner wall

655: slot

657: drain conduit (pipe)

660: Outer wall

659: upright inner wall

700: Collection disk configuration

701: collection tray housing

703: partition wall

705: first compartment

706: bottom wall

707: second compartment

708: outer wall

709: top wall

710: The first collection plate

715: Outer cover

720: the second collection plate

730: The third collection plate

750: inner wall

755: slot

760: Outer wall

800: Collection disk configuration

801: collection tray housing

803: partition wall

805: first compartment

806: bottom wall

807: second compartment

808: outer wall

809: top wall

810: The first collection plate

815: Outer cover

820: the second collection plate

830: The third collection plate

840: The fourth collection plate

850: inner wall

851: inner top edge

855: slot

860: Outer wall

861: outer top edge

900: Collection disk configuration

901: collection tray housing

903: partition wall

905: first compartment

906: bottom wall

907: second compartment

908: outer wall

909: top wall

910: The first collection plate

915: Outer cover

920: the second collection plate

930: The third collection plate

940: The fourth collection plate

950: inner wall

955: slot

960: Outer wall

1000: Wafer processing chamber

1010: shell

1011: bottom plate

1012: lower wall

1014: upper wall

1016: side wall

1020:Filter fan unit

1030: rotating shield

1035: Diffuser

1040: Rotary Chuck

1050: Splash guard

1060: Fluid Collector

1061: outer cover

1070: chamber vent

1080: chemical vent

1100: Collection disk configuration

1102: splash guard

1104: outer wall

1105: inner wall

1106: Inward sloped wall

1120: the first collection plate (cup)

1122: outer wall

1123: inner wall

1125: the first slot area

1126: bottom

1127: Inclined floor wall

1130: the second collection tray (cup)

1132, 1134, 1136: wall

1135: the second slot area

1140: the third collection plate (cup)

1142, 1144: wall

1145: The third slot area

1200: Collection disk configuration

1202: collection cover

1204: outer wall

1205: inner wall

1206: Inward sloped wall

1220: The first collection plate

1222: outer wall

1223: inner wall

1225: the first slot area

1226: bottom

1230: Multi-chamber collection tray

1232, 1234, 1236: wall

1235: the second slot area

1237: The third slot

1240: inner ring

1900: Exhaust system

1910: Exhaust Duct

1920: Splashback

1922: top sloping wall

1924: Vertical outer wall

1930: Collection cover

1940: First collection cup

1950: Second collection cup

1960: The third collection cup

1970: Exhaust channels

V1: the first valve

V2: the second valve

Fig. 1 is an isometric view of a collection chamber apparatus according to the invention; Fig. 2A is a perspective view showing four collection trays of the apparatus in a stacked loading wafer position; Fig. 2B is a top plan view of the apparatus; Fig. Figure 2C is a section taken along line A-A of Figure 2B; Figure 2D is an enlarged section of a part of the stacked collection tray shown in Figure 2C; Figure 2E is a section taken along line B-B of Figure 2B Sectional view; Figure 3A is a section through the device, with a collection chamber at the first fluid collection location; Figure 3B is a section through the drain channel through the collection chamber in the same position as Figure 3A, depicting a delimitation Figure 3C is the same cross-section as Figure 3A, showing an alternate flow path and multiple underside drip troughs for conveying fluid; Figure 3D shows the lifting rod and the collection plate to limit the movement of the collection tray A section of the support on which the tray can be seated; Figure 4 shows a section of the collection tray in the second fluid collection position; Figure 5 shows a section of the collection tray in the third fluid collection location; Figure 6 shows a section through the cylinder and collection tray, depicting how one cylinder lifts the two trays to the desired position and provides the correct chamber gap to define the collection chamber space; Figure 7 is an enlarged section view of the stacked collection tray, which includes A recess is left between the collection trays to reduce fluid splashing when the collection trays are closed; Figure 8 is a perspective view of the device shown in the first fluid collection position; Figure 9 is the device shown in the second fluid collection position Figure 10 is a perspective view of the apparatus shown in a third fluid collection position; Figure 11 is a cross-sectional side view of an exemplary semiconductor wafer processing chamber according to another embodiment; Figure 12A is A sectional side view of the processing chamber of Fig. 11 in an operating position; Fig. 12B is a sectional side view of the processing chamber of Fig. 11 in a second operating position; Fig. 12C is a sectional side view of the processing chamber of Fig. 11 in a third operating position 11 is a cutaway side view of the processing chamber of FIG. 11; FIG. 12D is a cutaway side view of the processing chamber of FIG. 11 in a fourth operating position; FIG. 13A is a top plan view of an exemplary configuration of stackable collection trays (cups) , depicting its drainage characteristics; Figure 13B is a bottom plan view of a stackable collection tray (cup), illustrating its drainage characteristics; Figure 14A is a collection defined by a plurality of collection trays according to another embodiment of the present invention A cutaway view of a portion of chamber equipment showing the upper cover and first collection tray in a raised position (first fluid collection position); Figure 14B is a cross-sectional view of the upper cover and collection tray of Figure 14A in the closed position (down position); Figure 15 is a collection chamber defined by a plurality of collection trays according to another embodiment of the present invention Sectional view of a portion of the device showing the upper cover and the first collection tray in the closed position (lowered position); Fig. 16A is a collection chamber device defined by a plurality of collection trays according to another embodiment of the present invention A cutaway view of a portion of Figure 16B showing the upper cover and first collection tray in the raised position (first fluid collection position); Figure 16B is the upper cover and first collection tray of Figure 16A in the closed position (lower position) Sectional view of collection tray; Figure 17A is a section view of a portion of a collection chamber apparatus defined by a plurality of collection trays according to another embodiment of the present invention, shown in a raised position (first fluid collection position) Upper outer cover and first collecting tray; Figure 17B is a cross-sectional view of the upper outer cover and collecting tray of Figure 17A in the closed position (down position); Figure 18A is a sectional view of the upper outer cover and collecting tray according to another embodiment of the present invention Sectional view of a portion of the collection chamber apparatus defined by a plurality of collection trays, showing the upper cover and first collection tray in the raised position (first fluid collection position); Figure 18B in the closed position (lowered position) Among them, the sectional view of the upper outer cover and the collection tray of Fig. 18A; Fig. 19A is a sectional view of a part of the collection chamber equipment defined by a plurality of collection trays according to another embodiment of the present invention, showing that it is raised position (first fluid collection position) with the upper cover and first collection tray; Figure 19B is the upper cover of Figure 19A in the closed position (lowered position) Figure 20 is a top plan view of an exemplary collection pan showing the varying radii of curvature associated with the grooves; Figure 21 is a partial cross-sectional view of yet another pan configuration; Figures 22A to 22D are views in different positions Partial cutaway view of another pan configuration shown; Figure 23A is a cutaway view of an alternative exhaust system showing only one exhaust port and the splash guard in the open position to allow air to bypass the splash guard plate into the exhaust port; and Figure 23B is a cross-sectional view of the exhaust system of Figure 23A with the splash guard in the closed position.

Figure 1 is an overview of the collection chamber apparatus 100 of the present invention, showing collection trays 130, 140, 150, 160 in a stacked wafer position 33 (see Figures 2 and 2A for more details), where additional Or remove the wafer 115 . These four plates surround wafer 115 . It should be understood that the ensuing discussion is merely an example of one implementation of the invention and does not limit the scope of the invention, as other implementations are possible as discussed subsequently. As described herein, by creating discrete collection chambers that can be sealed relative to each other, any spray from different treatment chemicals can be collected in different chambers. For example, providing a collection chamber for collecting a first chemical substance; providing a collection chamber for collecting a second chemical substance, and so on. Since each collection chamber is sealed relative to the others, cross-contamination of chemicals is avoided.

The first fluid separation location will serve as an example for illustration of typical operation for each of the three fluids. Referring to Figures 3 and 6 and according to one mode of operation, a pair of pistons 300 (such as air cylinders) (a drive mechanism) raises the collection pans 130 and 140 to form a gap 34 (i.e., the gap (distance) between the plates). The first collection room. Figure 6 shows the unique piston design in more detail, Both raise discs 130 and 140 to vertical level 38 and form desired collection chamber gap 34 through shoulders 307 and 308 . In particular, when the piston 300 is actuated, its first region passes through all the openings 134, 144, 154, 164 formed in the collection tray; its second region passes through only the openings 144, 154, 164. ; and its third region only passes through the openings 154,164. When the piston 300 completes its extended stroke, the underside of the catch pan 130 seats on the shoulder 307 and the underside of the catch pan 140 sits on the shoulder 308 . Gap 34 (collection chamber) can be controlled and defined by the distance between shoulders 307 and 308 and the thickness of the plate, and further, the gap distance can be controlled and defined by pin 28 as discussed below.

Next, referring back to FIG. 3A, the motor 112 rotates the wafer 115 on the spin chuck 110, and the dispensing arm 120 is then centered over the wafer 115 and dispenses the first fluid into the process. The motor 112 increases RPM to spread the fluid over the wafer surface, excess fluid is thrown by centrifugal force to the peripheral edge of the spin chuck 110 and onto the underside of the sloped wall of the disc 130, see FIG. 3B. With respect to flow path 22 , gravity causes the fluid to drop into collection tray 140 (eg, into its collection track), from where it flows into outlet 146 and fluid conduit 147 , and ultimately into manifold 200 . From there, the fluid flows into drain 210 and to a discrete tank (not shown) for storage and reuse, from where it is dispensed during the next wafer cycle.

Figure 3C shows an alternative flow path 30 in which the fluid 23 can flow down the underside of the pan 130, and includes a plurality of drip grooves 24 to stop the flow and direct the fluid down to the desired collection pan 140 (which is located in the pan 140). 130 below).

FIG. 3D shows a cross-sectional view of a riser pin 28 . A pair of pins 28 extend through openings 135, 145, 155, 165 of opposing flange portions of the collection tray. Pin 28 is configured to lift bottom pans 150 and 160 off a seat 29 and against collection pan 140 to seal them from splashes while still maintaining chamber gap 34 . The pins 28 are thus designed to hold the bottommost collection pan in contact with the other pans to provide a seal between the collection pans in contact with each other. As shown, the pin 28 includes a radial protrusion or the like at or near the bottom end (and also at or near the top end) which supports the bottommost disc.

Figures 4 and 9 show an apparatus 100 with discs 130, 140, 150, 160 forming a second collection chamber 36 (gap) positioned by a pair of pistons 310 (second piston) in conjunction with the pair of pistons 300 (first piston). ), the piston pair 300 is also actuated and in its fully extended state. When the piston 310 is actuated and moved upwards, the stepped configuration of the piston 310 causes the collection pans 130 and 140 to be supported by the first shoulder of the piston 310 (causing the pans 130 and 140 to seal against each other) and the pans 150 and 160 to sit against the second shoulder of the piston 310 . As shown, piston 320 is not actuated. The second discrete fluid 26 flows through the chamber 36 , following the normal path 25 , where the fluid flows to the outlet 156 and fluid conduit 157 and finally into the manifold 200 . From there the fluid flows into drain 210 and to a discrete pool (not shown) for storage and reuse, from where it is dispensed in the next wafer cycle.

Figures 5 and 10 show an apparatus 100 with discs 130, 140, 150, 160 forming a third collection positioned by a piston pair 320 (third piston) in conjunction with piston pairs 300 and 310 (first and second pistons). Chamber 37 (gap), piston pair 300 and 310 is also actuated and in its fully extended state. When the piston 320 is actuated and moves upward, the stepped configuration of the piston 320 causes the collection pans 130, 140, 150 (the top three pans) to be supported by the first shoulder of the piston 320 (causing the pans 130, 140, 150 are in mutual sealing state) and disc 160 (lowermost disc) sits against the second shoulder of piston 320 . The third discrete fluid 32 flows through the chamber 37 , following the normal path 42 , where the fluid flows to the outlet 166 and fluid conduit 167 and finally into the manifold 200 . From there the fluid flows into drain 210 and to a discrete tank (not shown) for storage and reuse, from where it is dispensed in the next wafer cycle.

The distance between two collection trays defining a particular selected collection chamber remains the same regardless of which two collection trays 130, 140, 150, 160 define that collection chamber. This is due to the configuration of the piston, such as the shoulder formed in it, and its controlled travel distance.

As shown in FIGS. 8-10 , the top end of each piston 300 includes a stopper 321 in the form of a protrusion to limit the upward movement of the collecting tray 130 (the uppermost collecting tray). It will be understood that the uppermost position of the collecting tray 130 will cause the collecting tray 130 to sit against the stopper 321 . The stops 321 thus help hold the collection tray assembly together.

Additional details and advantages of the present invention include, but are not limited to: (1) the collection device is capable of collecting multiple different fluids without cross-contamination of each other and directing each fluid to a separate drain, (2) it contains The number of collection trays determined by the amount of fluid plus one, (3) The collection trays have the ability to stack each other to prevent other fluids from splashing into them, so cross-contamination is avoided, (4) The cylinder with shoulders is designed to be vertical Locate and set the gap between the two pans, thereby forming the collection chambers, (5) design multiple drip grooves in the underside of each pan to direct the fluid into the desired drain of the lower pan, (6) When the collection trays are stacked together, there is a gap between the upper and lower trays to reserve space for fluids that have not flowed out of the trays, thereby preventing splashing of fluids, and (7) each fluid is discharged to a unique drain.

Referring again to FIGS. 1-10 and with further reference to the above discussion, it will be appreciated that the collection chamber device 100 includes a number of actuatable working members as described below to place the collection chamber device 100 in different operating positions, and in detail , creating a defined collection chamber and a correspondingly defined fluid flow path that allows for the collection of liquids used in wafer processing.

The collection chamber apparatus 100 includes a wafer support 110 on which a wafer 115 is placed during wafer processing. A wafer support is also known as a spin chuck and will be referred to using this term. The spin chuck 110 is operatively connected to a motor 112 that is configured to rotate the spin chuck 110 at a selected speed in revolutions per minute (RPM). The spin chuck 110 is operated by conventional methods.

Fluid dispensing arm 120 represents one means for dispensing fluid 119 onto wafer 115 . The fluid dispensing arm 120 can be any number of different types of conventional fluid dispensing components, including the arm 120 shown in the figures. As described herein, during wafer processing, fluid is dispensed onto the surface of wafer 115 , and during rotation of wafer 115 , the fluid is forced radially outward and away from wafer 115 by centrifugal force.

According to the present invention, the collection chamber assemblies of the apparatus 100 are arranged along the circumference of the spin chuck 110 and thus along the circumference of the wafer 115 . As noted above, the collection chamber components include a plurality of collection trays that not only collect fluid that is pushed radially outward from the wafer 115 during processing, but also direct the fluid to an outlet to facilitate collection of the fluid.

In the illustrated embodiment, which is exemplary in nature, there are four different collection trays 130, 140, 150, 160 arranged in a stacked configuration. However, it is understood that fewer or more than four collection trays may be used in apparatus 100 . It will be appreciated that the addition of a collection pan will result in a corresponding increase in the number of separate collection chambers for collecting fluid. This aspect can be easily understood from the following discussion and illustrations.

The collection trays 130, 140, 150, 160 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, the collection tray 130 is generally annular with a central opening 131 that receives the spin chuck 110 and the wafer 115 . The collection pan 130 has a main area that defines an annular collection track 132 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom. Alternative chassis designs are also possible and the designs shown are merely exemplary in nature.

As shown in FIG. 1 , the collection tray 130 also has a pair of outwardly extending flange areas 133 . The flange areas 133 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 134 formed therein. Openings 134 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 134 which receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 135 formed in each flange area 133 . The openings 134 and 135 may be configured such that the two openings 134 are adjacent to each other and the third opening 134 is spaced apart from the pair of openings 134 , wherein the opening 135 is disposed between the pair of openings 134 and the spaced third opening 134 .

Collection tray 130 also includes an outlet 136 that is in fluid communication with fluid collection track 132 . The outlet 136 may be in the form of an outflow slot extending radially outward from the main area between the flange areas 133 . In the illustrated embodiment, the outlet 136 is generally V-shaped and extends outwardly from the main region, thus A groove is provided along which the collected fluid may flow. The bottom of outlet 136 is in fluid communication with the bottom (floor) of fluid collection track 132 so fluid can flow from fluid collection track 132 into outlet 136 . As will be described below, the outlet of each collection tray is in fluid communication with the manifold structure 200 for channeling the collected fluid.

The collection tray 140 is similar to the collection tray 130 and is generally ring-shaped, having a central opening 141 for receiving the spin chuck 110 and the wafer 115 . The collection pan 140 has a main area that defines an annular collection track 142 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom.

The collecting tray 140 also has a pair of flange areas 143 extending outward. The flange areas 143 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 144 formed therein. Openings 144 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 144 which receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 145 formed in each flange area 143 . The openings 144 and 145 may be configured such that the two openings 144 are adjacent to each other and the third opening 144 is spaced from the pair of openings 144 , wherein the opening 145 is disposed between the pair of openings 144 and the spaced third opening 144 .

Collection tray 140 also includes an outlet 146 that is in fluid communication with fluid collection track 142 . The outlet 146 may be in the form of an outflow slot extending radially outward from the main area between the flange areas 133 . In the illustrated embodiment, the outlet 146 is generally V-shaped and extends outwardly from the main region, thus providing a channel along which collected fluid can flow. The bottom of outlet 146 is in fluid communication with the bottom (floor) of fluid collection track 142 so fluid can flow from fluid collection track 142 into outlet 146 .

The collection tray 150 is similar to other collection trays and is generally ring-shaped with a central opening 151 for receiving the spin chuck 110 and the wafer 115 . The collection tray 150 has a main area that defines an annular collection track 152 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom.

The collecting tray 150 also has a pair of flange areas 153 extending outward. The flange regions 153 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 154 formed therein. Openings 154 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 154 that receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 155 formed in each flange area 153 . The openings 154 and 155 may be configured such that the two openings 154 are adjacent to each other and the third opening 154 is spaced from the pair of openings 154 , wherein the opening 155 is disposed between the pair of openings 154 and the spaced third opening 154 .

Collection tray 150 also includes an outlet 156 that is in fluid communication with fluid collection track 152 . The outlet 156 may be in the form of an outflow slot extending radially outward from the main area between the flange areas 153 . In the illustrated embodiment, the outlet 156 is generally V-shaped and extends outwardly from the main region, thus providing a channel along which collected fluid may flow. The bottom of outlet 156 is in fluid communication with the bottom (floor) of fluid collection track 152 so fluid can flow from fluid collection track 152 into outlet 156 .

The collecting tray 160 is generally ring-shaped and has a central opening 161 for receiving the spin chuck 110 and the wafer 115 . The collection tray 160 has a main area that defines an annular collection track 162 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom.

The collecting tray 160 also has a pair of flange areas 163 extending outward. The flange regions 163 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 164 formed therein. Openings 164 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 164 that receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 165 formed in each flange area 163 . The openings 164 and 165 may be configured such that the two openings 164 are adjacent to each other and the third opening 164 is spaced from the pair of openings 154 , wherein the opening 165 is disposed between the pair of openings 164 and the spaced third opening 164 .

Collection tray 160 also includes an outlet 166 that is in fluid communication with fluid collection track 162 . The outlet 166 may be in the form of an outflow slot radially outward from the main area between the flange areas 163 extend. In the illustrated embodiment, the outlet 166 is generally V-shaped and extends outwardly from the main region, thus providing a channel along which collected fluid may flow. The bottom of outlet 166 is in fluid communication with the bottom (floor) of fluid collection track 162 so fluid can flow from fluid collection track 162 into outlet 166 .

As noted above, the collection trays 130, 140, 150, 160 are configured in a stacked configuration so that individual flange areas are stacked on top of each other and are configured to mate with each other and individual outlets are positioned on top of each other as shown. Show like.

The outlets 136, 146, 156, 166 thus resemble inclined troughs/outflows which allow fluid to flow downward by gravity. As best shown in Figures 3A and 3B, the outlets 146, 156 and 166 each include a fluid conduit member 147, 157, 167 descending therefrom, respectively. As shown, the fluid conduit members 147, 157, 167 may each have a tubular structure that communicates at the top open end with the bottom of the respective outlet. The fluid conduits 147 , 157 , 167 can be positioned vertically so that fluid flows from the respective outlets to a separate manifold 200 by gravity. As shown in Figures 4 and 5, fluid conduit members 147, 157, 167 are slidably received in respective inlets 201, 202, 203 of the manifold to establish fluid connections. The manifold 200 includes a drain 210 in fluid communication with each of the fluid conduits so that fluid flowing through the fluid conduits flows into the manifold and into the drain 210 . The drain pipe 210 guides the fluid to a predetermined location, such as a location where a collection tank for collecting the fluid is provided.

The collection aspect of the apparatus 100 is based on the fact that the individual collection trays 130, 140, 150, 160 can each be moved to a predetermined position to define a discrete collection chamber configured to collect and push out during processing. Wafer Fluid. It will be appreciated that different means for moving the collection tray may be used and that described herein is merely exemplary in nature. In the embodiment shown, pneumatic means are used to control the movement of the plates, in particular using pistons in the form of cylinders. To move several (eg 4) collecting trays, there are several pistons, in particular according to one embodiment, 2*(n-1) pistons when the device comprises n collecting trays. Furthermore, it will be appreciated that each plate may be moved by one or more pistons, so while the illustrated embodiment shows pistons arranged in pairs, other variations are equally possible. For example, a triplet of pistons may be used to move the collection pan. To provide proper support, it is desirable to have at least two pistons for moving an individual collection pan (eg, three or more pistons can be used for each collection pan, as described).

As shown, there is a pair of first pistons 300 , a pair of second pistons 310 , and a pair of third pistons 320 . Pistons 300 , 310 , 320 are disposed under the flanged area of the collection pan and are axially aligned with selected ones of openings 134 , 144 , 154 , 164 . The openings 134, 144, 154, 164 are axially aligned with one another and differ in size (ie, diameter) thereby allowing at least a portion of the piston to pass through selected openings. Each piston 300, 310, 320 includes a stepped configuration to cause interference with the selection of a plate, thereby causing the selected plate to rise.

To illustrate and as described below, a first pair of pistons 300 is designed to raise collection pans 130 and 140; a second pair of pistons 300 is designed to raise collection pans 140 and 150; and a third pair of pistons 300 is designed to lift collection pans 150 and 150. 160 up. In other words, each pair of pistons is designed to raise two catch pans; however, in conjunction with other pairs of pistons being actuated, move beyond two catch pans.

As best shown in FIG. 6 , the stepped configuration of the first piston 300 is defined by a first shoulder 307 and a second shoulder 308 . The second shoulder 308 has a larger outer diameter than the first shoulder 307 . Piston 300 thus has a varying diameter, in particular comprising a first region of the top end between the first shoulder 307 and having a first outer diameter, a second region between the two shoulders and having a second outer diameter. region, and a third region below the second shoulder 308 and having a third diameter, wherein the first outer diameter<second outer diameter<third outer diameter. The openings 134, 144, 154, 164 are purposefully sized so that only one or more regions are free to pass through them, and the shoulders 307 and 308 create rising surfaces for raising selected collection pans.

As shown in Figure 7, the collection tray is configured to include a splash-proof feature. In particular, a fluid pool 199 is formed between adjacent closed collection pans to reduce fluid splashing when closing the collection pans. In detail, when two plates are stacked, the underside of a collection tray and the collection tray directly below The upper side will leave a fluid pool 199 therebetween. The fluid pool prevents fluid from being squeezed or spilled between the plates when the plates are closed. FIG. 7 shows the collection trays 130 , 140 , 150 in the closed position, with one fluid pool 199 formed between the collection trays 130 and 140 and another fluid pool 199 formed between the collection trays 140 and 150 .

Figures 14A and 14B illustrate a collection chamber apparatus according to another exemplary embodiment of the present invention. It will be appreciated that Figures 14A and 14B are only partial cross-sectional views of the arrangement of the collection trays which are part of the collection chamber apparatus. The collection trays shown in Figures 14A and 14B can thus be implemented in collection chamber devices similar to those disclosed in Figures 1-10. In particular and as detailed below, the collection chamber apparatus includes an arrangement of collection trays that are independently moveable in a controlled manner around a wafer placed on a rotatable chuck.

As in the previous embodiments, by creating discrete collection chambers that can be sealed relative to each other, any sprays from different treatment chemistries can be collected in different collection chambers. For example, collection chamber 1 is configured to collect a first chemical species, collection chamber 2 is configured to collect a second chemical species, and so on. Since the collection chambers are sealed relative to each other, cross-contamination of chemicals is avoided.

FIG. 11 is an overview of a wafer processing apparatus configured for wet processing of sheet-like items (ie, wafers), and in particular, shows a semiconductor wafer processing chamber 1000 defined by an enclosure 1010 . Housing 1010 has a hollow interior in which the working components of the wafer processing apparatus discussed herein are located. Housing 1010 is thus bounded by a lower wall (floor) 1012 , an opposing upper wall 1014 , and side walls 1016 extending between lower wall 1012 and upper wall 1014 . Housing 1010 may be square or rectangular, and thus includes four side walls 1016 . Housing 1010 includes several venting features as discussed herein for dispersing and venting gases.

The housing 1010 may include a filter fan unit (FFU-ULPA) 1020 disposed along the upper wall 1014 of the housing 1010 in fluid communication with the hollow interior of the housing 1010 . The filter fan unit 1020 is configured to generate airflow within the hollow interior, so exhaust/ventilation as described below part of the system. The filter fan unit 1020 preferably utilizes ULPA filtration with an ISO Class 1 output target and an ISO Class 1000 inlet supply air. In other words, filter fan unit 1020 has a filter member and a fan member. The fan unit is a variable speed fan, in conjunction with an exhaust throttle valve, to maintain the enclosure at a net positive or negative pressure relative to the surrounding environment. The filter fan unit 1020 has a pressure detection feature that indicates when the filter media needs to be replaced or is faulty. In particular, a computer module operatively connected to the filter fan unit 1020 monitors the various pressures to detect when the filter media needs to be replaced or there is a system failure. A differential pressure transmitter is connected between the interior of the filter fan unit and the interior of the chamber (housing 1010).

Also shown in the figures, a diffuser 1035 may be positioned below the filter fan unit 1020 . The diffuser 1035 may consist of a plate and cleaning nozzles (eg, ambient deionized (DI) water) around the perimeter edge between the plate and the filter fan unit 1020 for the purpose of rinsing the entire interior surface of the outer walls of the chamber 1000 clean. The diffuser 1035 can also accommodate the mount of the camera.

The semiconductor wafer processing chamber 1000 also includes a rotatable spin chuck 1040 . Any number of different spin chucks 1040 may be used in accordance with the present invention, and thus the configuration of the spin chuck 1040 will vary with the type of spin chuck 1040 implemented. For example, the spin chuck 1040 is configured to hold and rotate the wafer and includes gas supply means for directing gas to the wafer side facing the spin chuck, wherein the gas supply means includes gas nozzles that rotate with the spin chuck, Used to provide an air cushion between sheet goods and the rotary chuck. Such chucks are often referred to as Bernoulli chucks because sheet-like items are pulled toward the chuck by a vacuum created by an aerodynamic paradox known as the Bernoulli effect. Such Bernoulli chucks consist of radially movable pins which firmly hold the sheet even without pressurized gas to provide the Bernoulli effect.

It is understood that other types of spin chucks 1040 may be used including, but not limited to, air bearing, hermetic, pedestal, and vacuum chucks.

The spin chuck 1040 is centered in the housing 1010 under the spin shield 1030 Square, and in the case of a Bernoulli-type chuck, as shown, fluidly connected to one or more fluids (gas and/or liquid). A spindle is provided and operatively coupled to the spin chuck 1040 to control the chuck's rotation under the action of a motor, such as a frameless three-phase servo motor, with a rotor directly coupled to the spin chuck 1040 . The spin shield 1030 is used to prevent redeposition of fluid on the spin chuck 1040 . The rotating shield 1030 can be positioned not only in the fully raised and fully lowered positions, but also in the partially raised position.

The semiconductor wafer processing chamber 1000 preferably also includes a movable splash guard 1050 . The splash guard 1050 is disposed outside the spin chuck 1040 , in particular, the splash guard 1050 surrounds the spin chuck 1040 .

Splash guard 1050 is operatively coupled to an actuator to allow controlled raising and lowering of splash guard 1050 . In other words, the splash guard 1050 moves within the housing 1010 in a vertical direction between a raised position and a retracted position. The splashback 1050 may thus have an outer wall portion and an inwardly sloped top wall portion. The free end of the inwardly inclined top wall portion is disposed near the outer edge of the spin chuck 1040 .

The splash guard 1050 also plays a role in the dynamics of fluid flow within the housing 1010, as described below, ie, the gas flow path within the chamber interior is at least partially determined by the position of the splash guard 1050. In particular, there may be two separate flow paths inside the enclosure for exhausting gases (fumes) generated inside the enclosure during wafer processing. It is desirable to be able to vent this gas, as unwanted gas buildup inside the enclosure may cause condensation to form on the wafer. to illustrate the two separate gas flow paths.

The semiconductor collection chamber apparatus 100 also preferably includes a plurality of fluid collectors 1060, which may be in the form of fluid collection (disk) cups, configured to collect fluid (chemicals) discharged from the top of the spinning wafer due to centrifugal force. The fluid collector 1060 is generally in the form of a stacked ring collector having a collection space like a trough and independently movable between a raised position and a lowered position. Fluid collectors 1060 are configured to nest within each other, as shown. A fluid collection chamber is defined Between one or more raised fluid collectors 1060 and one or more lowered fluid collectors 1060 . Fluid collector 1060 surrounds spin chuck 1040 and is disposed between splash guards 1050 . Fluid collectors 1060 each include one or more drains that allow collected fluid to be channeled away from fluid collectors 1060, and in particular, out of a collection chamber for collection and reuse, among other things.

There may also be a fluid collector cover 1061 that is positioned over the uppermost fluid collector 1060 and covers its basin area. In one embodiment, there are two or more fluid collectors 1060, in particular, there are three or more fluid collectors 1060 (eg, four fluid collectors). It can also be appreciated that a fluid collection chamber can be defined between the outer cover 1061 and the uppermost fluid collector 1060 .

Any number of techniques may be used to independently move the outer cover 1061 and fluid collector 1060, including but not limited to the drive mechanisms described with respect to FIGS. 1-10. The drive mechanism may thus be in the form of an independently guided stepper-driven lead screw with a position feedback encoder. When actuated, the drive mechanism results in the controlled lifting of one or more fluid collectors 1060 . As noted, the fluid collectors 1060 can be nested such that when the latter fluid collector 1060 is actuated, it pushes up and disengages the previous fluid collector 1060 from its respective actuator. The nesting allows no overspray to occur in the fluid collector 1060 or at the location where the fluid collector 1060 drains. Where three fluid collectors 1060 are used, the lower and upper fluid collectors 1060 are provided with recirculation, while the middle fluid collector 1060 is used for chemical purge between steps.

The semiconductor wafer processing chamber 1000 includes two separate exhaust ports, namely, a chamber exhaust port 1070 and a chemical exhaust port 1080 , which can be throttled independently. The chamber exhaust 1070 and chemical exhaust 1080 are separated by a splash guard 1050 and a splash guard stray to create separate and independent flow paths within the chamber interior. By incorporating valves into each of the chamber vent 1070 and chemical vent 1080, the respective flow rates can be varied.

Chamber exhaust 1070 is located at the outer circumference of the chamber and exhausts air through the chemical dispensing arm (not shown) in the lowered and stowed position. It will be appreciated that the chemical dispensing arm is configured to Fluid is dispensed onto the wafer surface during wafer processing operations. As shown in FIG. 11 , the chamber exhaust 1070 may be in the form of an opening in the sidewall of the housing 1010 at a location outside the splash guard 1050 . Fluid flows to the chamber exhaust port 1070 by flowing up and around the splash guard 1050 to a dedicated exhaust port 1070 as described herein. A plurality of chamber exhaust ports may be formed along the sidewall of the housing 1010 . Alternatively, a single vent may be provided as described herein with respect to other embodiments, such as those disclosed in Figures 23A and 23B. It is understood that the chamber exhaust port 1070 includes not only an outlet formed in the housing 1010 , but also an outer conduit that may be disposed along the interior of the housing 1010 .

The chamber exhaust port 1070 includes an independent first valve member V1 configured to control flow through the chamber exhaust port 1070 . Any number of different types of valves may be used as the first valve member V1. For example, the first valve member V1 may have the form of a butterfly valve or a throttle valve.

The chamber vent 1070 thus vents gas within the chamber from a region generally outside of the fluid collector 1060 .

Chemical vent 1080 vents gas flowing through splash guard 1050 and chemical collector (cup) to a chemical vent (outlet), which may be formed along the sidewall of enclosure 1010 but is fluidly isolated from chamber vent 1070 . The chemical exhaust port 1080 may be located next to the chamber exhaust port 1070 . As shown, a floor 1011 within housing 1010 may separate each chamber exhaust port 1070 from each chemical exhaust port 1080 . In particular, chemical vent 1080 is only reached by flow inside splash guard 1050 and/or by flow inside fluid collector 1060 . The chemical vent 1080 thus vents gases that may accumulate in the splash guard and/or fluid collector area.

The chemical vent 1080 includes an independent second valve member V2 configured to control flow through the chemical vent 1080 . Any number of different types of valves can be used as the second valve member V2. For example, the second valve member V2 may have the form of a butterfly valve or a throttle valve. Valves V1 and V2 can be the same or different. Alternatively and as shown in Figures 23A and 23B, no chemical vent is provided nor is there a labyrinth in the form of an annular ring radially outward relative to the splash guard. In this example, the The height of the splash guard is adjusted to throttle flow from the outside of the splash guard and the inside of the splash guard with the collection cup through the exhaust port.

12A-12D show various exhaust gas flow patterns according to various positions of splash guard 1050 and fluid collector 1060 . Figure 12A shows the splash guard 1050 in the retracted (lowered) position and the outer cover 1061 and fluid collector 1060 in the lowered position. As indicated by the arrows indicating fluid flow, the fluid (air) is released by flowing through the retracted dispensing arms (see FIG. be discharged. With the collector cover 1061 retracted, along with all collectors 1060 , and splash guard 1050 , fluid does not flow into fluid collector 1060 to chemical vent 1080 . Figure 12B shows splash guard 1050 in a raised position and outer cover 1061 and fluid collector 1060 in a retracted (lowered) position. As shown, a part of the exhaust gas (air) flows up through the splash guard 1050 to the chamber exhaust port 1070, while another part of the exhaust gas is introduced into the space between the splash guard 1050 and the outer cover 1061 , and from there to the chemical vent 1080. Figure 12C shows the splash guard 1050 and collector cover 1061 in a raised position with the fluid collector 1060 in a lowered position. A part of the exhaust gas (air) flows up through the splash guard 1050 to the chamber exhaust port 1070, and another part of the exhaust gas is introduced into the space between the collector cover 1061 and the uppermost fluid collector 1060 (first collection chamber), and then flow from there to the chemical exhaust port 1080. It will be appreciated that the degree to which the splash guard 1050 is raised affects the amount of gas flow to the chemical exhaust port 1080 . Figure 12D shows the position with splash guard 1050, collector cover 1061, and three of the four fluid collectors 1060 in the raised position. Only the fourth fluid collector 1060, representing the lowermost fluid collector, is in the retracted (descended) position, thereby defining a fluid chamber for collecting fluid expelled from the spinning wafer. A part of the exhaust gas (air) flows up through the splash guard 1050 to the chamber exhaust port 1070, and another part of the exhaust gas is introduced into the fourth collection chamber (defined between the third and fourth fluid collectors ), and then flow from there to chemical vent 1080.

As shown in Figures 12A-12D, the chamber may include a plurality of pressure sensors (P) located throughout the chamber, including at or near the chamber exhaust port 1070 and the chemical exhaust port 1080. The pressure sensor measurements can be used as part of the process to monitor the internal airflow and control the operation of valves V1 and V2. Additionally, feedback from the pressure sensor can be used to control the speed of the filter fan unit 1020 .

It should also be appreciated that the source of gas exhausted through these two exhaust ports 1070 and 1080 could be through the filter fan unit 1020 or could simply be ambient air around the room (only the room below when there is no filter fan unit 1020) . Note that the gas source can be air or any suitable gas such as filtered air or nitrogen or other gases.

As discussed above with respect to the embodiments of FIGS. 1-10 , when the motor 112 rotates the wafer 115 on the spin chuck 110 , the dispensing arm 120 is then centered over the wafer 115 and dispenses the first fluid in process. The motor 112 increases RPM to disperse the fluid over the wafer surface. Excess fluid 22 is centrifuged to the peripheral edge of the spin chuck 110 and onto the underside of a collection tray 130 where gravity causes the fluid to fall. It falls into the collection pan below and from there flows into the outlet and eventually into the manifold 200 . From there, the fluid flows into drain 210 and to a discrete tank (not shown) for storage and reuse, and from where it is distributed during the next wafer cycle. Although the embodiments shown in Figures 1-10 perform satisfactorily, at times, fluid may still be splashed between the spaced collection pans. For example, in the collection pan position shown in Figure 3A, fluid may travel laterally between the raised collection pan and the stacked collection pan below and splash off the peripheral edge of the collection pan. This not only leads to a potentially messy situation but also to wasted fluid.

Figures 13A, 13B, 14A, and 14B provide a solution to the above disadvantages. Figure 13A shows a top view of a plurality of stacked fluid collectors (collection trays or cups) showing the drainage features. In the embodiments shown in Figures 1-10, the drainage conduits are in the form of each collecting pan having an outlet (outflow slot) extending radially outward from the main area between the flange areas of the collecting pan. In 13A and In the embodiment shown in FIG. 13B, the drain pipe (drain conduit) of each collecting tray extends tangentially rather than radially as shown in FIGS. 1-10. The drainage channels (drain conduits) of the collection pans may still be in stacked relationship; however, each arc along the circumference of the main area of the collection pan as shown. Also unlike the embodiments shown in Figures 1-10, each drain duct is bounded by an outer edge (E2) having the same height as the outer edge (E1) of the main area of the collecting pan. This relationship ensures that fluid does not spill from the catch pan to the drain conduit.

Figures 11, 12A, and 12B schematically show fluid collector 1060 in any number of different forms, including the collection trays discussed with respect to Figures 1-10. In addition, the fluid collector 1060 can be in the form of a fluid collector (collection tray or cup) as shown in FIGS. 14A-20 , which will be described later.

14A and 14B illustrate a localized portion of a semiconductor wafer processing chamber, such as wafer processing chamber 1000 (FIG. 11 ). As shown, the peripheral edge of the chuck 1040 can be seen. The collection chamber apparatus of this embodiment includes a collection tray arrangement or assembly 400 and a collection tray housing 450 in which the collection tray arrangement 400 is disposed. The collecting tray housing 450 surrounds the hollow portion of the chuck 1040 in a circumferential manner. As shown, the collection tray housing 450 can include an inner divider wall 452 that divides the hollow interior of the collection tray housing 450 into a first compartment 460 and a second compartment 470 disposed radially outward from the first compartment 460 ( The first compartment 460 is thus located beside the peripheral edge of the chuck 1040, while the second compartment 470 is spaced radially therefrom). It should be appreciated that the collection tray housing 450 thus has an annular shape and that both the first and second compartments 460 and 470 have an annular shape.

The first compartment 460 is configured to support the collection pan arrangement 400 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection pan. Although the first compartment 460 is shown to have a larger area than the second compartment 470, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 460 and 470 are not limited to those shown in the figures. Show. As shown, the first compartment 460 is bounded by an inner wall 462 near the outer edge of the wafer 115 and terminating at a top edge 463 . The height of the partition wall 452 is small At the height of the inner wall 462 , the top edge 454 is lower than the top edge 463 . Top edges 454 and 463 may be beveled as shown or may be flat. The bottom wall 457 defines the bottom of the compartment, thus acting as a floor.

The second compartment 470 is defined by the outer wall 472 and the partition wall 452 , and the bottom of the second compartment 470 is defined by the bottom wall 457 . The outer wall 472 is parallel to the partition wall 452 . The second compartment 470 is also defined by a top wall portion 476 having a first leg extending toward the first compartment 460 and a second leg parallel thereto between the outer wall 472 and the partition wall 452 . Top wall portion 476 is configured and positioned to define a first opening or channel 480 and a second opening or channel 490 . The first opening 480 is defined between the first foot of the top wall portion 476 and the top edge 454 of the divider wall 452 , thereby defining a flow path from the first compartment 460 to the second compartment 470 .

A second opening 490 is defined between the second foot of the top wall portion 476 and the outer wall 472 and defines an exit or exit opening from the second compartment 470 .

The collection tray configuration 400 is similar to that described with respect to FIGS. 1-10 in that the configuration 400 is defined by a plurality of stacked collection trays (cups) constructed to allow nesting within each other. In particular, each of the collection trays is configured to be controllable within the first compartment 460 and to be raised or lowered independently. The collection tray not only serves to collect fluid that is pushed radially off the wafer 115 during wafer processing, but also directs the fluid to the outlet to facilitate collection of the fluid.

In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 410, a second collection tray 420, a third collection tray 430, And the fourth collection tray 440. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

The collection trays 410, 420, 430, and 440 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, the first collection tray 410 is generally annular and has a central opening for receiving the spin chuck 110 and the wafer 115 . The first collection tray 410 has a ring that defines a collection The main area of the collection track is defined by an inner wall portion 413 and an outer wall portion 414 that intersect each other to define a groove 415 . As shown in FIGS. 14A and 14B , the main collecting portion of the first collecting tray 410 is roughly V-shaped.

The bottom of the groove 415 is bounded by point A, the inner top edge of the inner wall portion 413 is bounded by point B, and the outer top edge of the outer wall portion 414 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first collection pan 410 . The relationship between points A, B, and C is an important aspect of this embodiment. As seen, the inner wall portion 413 may have a larger size than the outer wall portion 414, in detail, the inner wall portion 413 may have a larger width than the outer wall portion 414, and more importantly, the inner wall portion 413 may have a larger width than the outer wall portion 414. Section 414 is greater in height.

As shown in the figure, the collecting cover 405 covers the annular concave fluid collecting track (defined between the inner wall portion 413 and the outer wall portion 414 ) of the first collecting tray 410 . The collecting cap 405 thus has a downwardly extending protrusion, which is arranged within this annular recessed fluid collecting track of the first collecting pan 410 . Collection cap 405 thus effectively covers groove 415 and prevents any fluid from flowing into groove 415 . While there may be space between the collection cover 405 and the first collection tray 410 in an outer radial position, it can be seen that along the innermost edge closest to the wafer, there is no space between the collection cover 405 and the first collection tray 410. Spatial, thus preventing the fluid drained from the wafer 115 from flowing between them.

As shown in the figure, the first collection tray includes a throat in the form of an overhang that seals the collector (cup) when the collection tray is closed, thereby preventing liquid from entering the collection chamber (cup). As shown, the throat slopes downward and has a pointed portion that seats against the inner rim of the lower collection cup. It should be appreciated that other collection pans have similar throats, although not specifically identified with reference characters.

As with each collection tray, the collection cover 405 is independently movable relative to the collection tray.

It should also be understood that the bottom point of the collection cover 405 is also equivalent to point A in the case where the fluid collection chamber is defined between the raised collection cover 405 and the lowered first collection tray 410 . Relevant points B and C are part of the first collection tray 410 .

Although not shown in the cross-sectional view of FIGS. 14A and 14B, the first collection pan 410 may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of the collection pan 130 (FIG. 10). . The flange regions are preferably oppositely disposed (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10.

An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

The collecting pan 140 includes an outlet (drain conduit) formed at one of its positions, and particularly, the outlet may be similar to the outlet 136 of the collecting pan 130 . As such, the outlet is in fluid communication with the slot 415 . The outlet may be in the form of an outflow trough or a drain conduit, as described above, extending tangentially along the circumferential length of the collecting pan, as shown in FIG. 13 . The outlet is located at a low point of the collecting pan, allowing the fluid in the groove 415 of the collecting pan to flow to the outlet.

An outlet (drain conduit) may provide another channel along which collected fluid may flow. As in the embodiment of FIGS. 1-10, the outlet of each collection tray may be in fluid communication with a manifold structure, such as manifold structure 200 of FIGS. 1-10, to direct collected fluid away from the chuck.

The second collection tray 420 is similar to the first collection tray 410 and has a substantially ring shape, and has a central opening for receiving the spin chuck 110 and the wafer 115 . The second collecting pan 420 has a main area defining an annular collecting track, which is defined by an inner wall portion 423 and an outer wall portion 424 which meet each other to define a slot 425 . As shown in Figures 14A and 14B, the main collection portion of the second collection pan 420 is generally V-shaped and has a complementary shape to the first collection pan 410 to allow nesting therewith.

The bottom of the slot 425 is bounded by point A, the inner top edge 427 of the inner wall portion 423 is bounded by point B, and the outer top edge 428 of the outer wall portion 424 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the second collection pan 420 . The relationship between points A, B, and C is an important aspect of this embodiment Sample. As can be seen, the inner wall portion 423 may have a larger size than the outer wall portion 424, in detail, the inner wall portion 423 may have a larger width than the outer wall portion 424, and more importantly, the inner wall portion 423 may have a larger width than the outer wall portion 424. Section 424 is greater in height.

Like the first collection pan 410 , the second collection pan 420 may have the same outwardly extending flange area to allow controlled raising and lowering of the second collection pan 420 . The second collection pan 420 also has an outlet like the first collection pan 410 to allow the collected fluid to drain.

As shown, the second collection pan 420 is located directly below the first collection pan 410 .

The third collecting tray 430 is the same or similar to the second collecting tray 420 and has a substantially ring shape, and has a central opening for receiving the spin chuck 110 and the wafer 115 . The third collecting pan 430 has a main area defining an annular collecting track defined by an inner wall portion 433 and an outer wall portion 434 which intersect each other to define a slot 435 . As shown in Figures 14A and 14B, the main collection portion of the third collection pan 430 is generally V-shaped and has a complementary shape to the second collection pan 420 to allow nesting therewith.

As indicated in the figure, the bottom of the groove 435 is bounded by point A, and the inner top edge of the inner wall portion 433 is bounded by point B, and the outer top edge of the outer wall portion 434 is bounded by point C. Point A thus represents the lowest point of the third collection pan 430 . The relationship between points A, B, and C is an important aspect of this embodiment. As can be seen, the inner wall portion 433 may have a larger size than the outer wall portion 434, in detail, the inner wall portion 433 may have a larger width than the outer wall portion 434, and more importantly, the inner wall portion 433 may have a larger width than the outer wall portion 434. Section 434 is greater in height.

Like the other catch pans, the third catch pan 430 may have the same outwardly extending flange area to allow controlled raising and lowering of the third catch pan 430 . The third collection tray 430 also has an outlet like the other collection trays to drain the collected fluid. The third collecting tray 430 is directly below the second collecting tray 420 .

The fourth collection tray 440 is similar to the second and third collection trays 420 and 430 and is approximately It is ring-shaped and has a central opening for accommodating the spin chuck 110 and the wafer 115 . The fourth collecting pan 440 has a main area defining an annular collecting track defined by an inner wall portion 443 and an outer wall portion 444 which intersect each other to define a slot 445 . As shown in Figures 14A and 14B, the main collection portion of the fourth collection pan 440 is generally V-shaped and has a complementary shape to the third collection pan 430 to allow nesting therewith.

The bottom of the groove 445 is bounded by point A, the inner top edge of the inner wall portion 443 is bounded by point B, and the outer top edge of the outer wall portion 444 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the fourth collection pan 440 . The relationship between points A, B, and C is an important aspect of this embodiment. As can be seen, the inner wall portion 443 may have a larger size than the outer wall portion 444, in detail, the inner wall portion 443 may have a larger width than the outer wall portion 444, and more importantly, the inner wall portion 443 may have a larger width than the outer wall portion 444. Section 444 is greater in height.

Like the other collection pans, the fourth collection pan 440 may have the same outwardly extending flange area to allow controlled raising and lowering of the fourth collection pan 440 . The fourth collection tray 440 also has an outlet like the other collection trays to drain the collected fluid.

As in the embodiment of FIGS. 1-10, the first, second, third, and fourth collection trays 410, 420, 430, and 440 define discrete collection chambers in which wafers can be captured and collected. Fluid breaks away during rotation, thereby avoiding splashing of fluid.

FIG. 14A shows the first collection chamber 401 defined between the raised outer cover 405 /first collection pan 410 and the lowered second, third, and fourth collection pans 420 , 430 , and 440 . It should also be appreciated that the first collection chamber may in fact be disposed between the raised outer cover 405 and the lowered first collection pan 410; however, for purposes of discussion only, the first collection chamber will be described as being formed on the first collection pan 410 and the second collection tray 420.

As can be seen from Figure 14A, when the outer cover 405 and the first collection tray are raised to the raised position, the outer wall portion 414 is disposed near the first foot of the top wall portion 476, thereby defining the first channel 480. Putting the first collection chamber in fluid communication with the second compartment 470. The second channel 490 may act as an exhaust conduit in which exhaust gas (gas, such as air) is drawn through the first collection chamber (the space bounded by the collection pan) through the first channel 480 to the second compartment 470 and then through the second channel 490 exits from where the exhaust may be directed to chemical exhaust 1080 (FIG. 11). Air can therefore be drawn through the collection pan (collection cup) as part of the ventilation process. Also, a chamber vent 1070 (FIG. 11) may be provided to vent gas outside the collection chamber.

It should be appreciated that the first collection chamber 401 is drained through the drain (outlet) in conjunction with the groove 425 of the second collection pan 420 . Figure 13 shows an exemplary drain conduit.

According to the present invention, the position of the bottom (point A) of the groove 415 of the first collecting tray 410 raised is lower than the point B (inner top edge of the inner wall portion 423) of the second collecting tray 420 and point A is preferably the same as point A. C (the top edge of the outer wall portion 424) is at the same height or lower. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashing outside the first collection chamber 401 . This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

As in the previous embodiments of FIGS. 1-10 , the second collection tray 420 is raised to contact the raised first collection tray 410 while the third and fourth collection trays 430 and 440 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). Raising the third collection pan 430 into contact with the raised second collection pan 420 while the fourth collection pan 440 in the lowered position defines a fluid for collecting fluid drained from the wafer (as used for the first and second collection chambers). A third collection chamber for different fluids (chemicals).

It should be appreciated that any number of different means for raising and lowering the collection trays 410, 420, 430, 440 may be used, including the use of stepper motors that controllably raise different guides similar in construction to the piston 300, to Allows controlled independent raising and lowering of each guide. Alternatively, the pneumatic piston arrangement discussed with respect to Figures 1-10 can also be used to raise and lower each collection pan (by engaging the flange portion of the disc) to define each collection chamber.

When both the second and third collection chambers are created, exhaust gas (air flow) is allowed to flow through (through) the respective collection chamber, through the first channel 480 to the second compartment 470 , and then exit through the second channel 490 .

Additionally, a movable splash guard may also be used with the collection pan configuration of Figures 14A and 14B. The splash guard can be lowered and raised relative to the collection pan configuration.

Figure 14B shows the outer cover 405 and all four collection trays 410, 420, 430, 440 in the lowered position. Exhaust gas (air gas) may flow through the top of the collection pan housing 450, through the first channel 480 to the second compartment 470, and then exit through the second channel 490 to the chemical exhaust port 1080 (FIG. 11).

Reference is now made to Figures 14A-14B and Figure 20, which illustrate another aspect of the present invention. Figure 20 shows a schematic diagram (top view) of a collection tray (410, 420, 430, 440). The collecting tray includes first and second drains D1 and D2 spaced apart from each other (for example, D1 and D2 are separated by 180 degrees). As mentioned above, drains D1 and D2 are in fluid communication with grooves formed in the collection pan to drain collected fluid. As before, the collecting pan has an annular shape with a first annular area between the two drains D1 and D2 and an opposite second annular area between the two drains D1 and D2. The first and second annular regions are each constructed with a varying radius of curvature, in particular the angle between the inner wall portion and the outer wall portion varies along the annular region in the direction towards one of the drains D1 and D2. For example, the largest radius (R1) can be located between (eg, equidistant from) drains D1 and D2 and the reduced radius (R2) is located in the area of largest radius (R1) in relation to a drain D1 and Between D2. By providing an area of reduced radius (R2) next to each drain D1 and D2, fluid will flow naturally from the area of maximum radius (R1) to drains D1 and D2 (due to the change in slope of the collection pan - its funnel direct the fluid to drains D1 and D2). This configuration thus ensures fluid flow within the grooves of the collection chamber to the drains D1 and D2. However, it should be understood that no changing radius is required, where the cross-section can remain the same and only the elevation needs to be changed to drive fluid to drain. Also, this can be achieved with a single drain and a higher elevation on the opposite side of the cup trough, causing the fluid to be gravity driven to the drain. For example, if the radius of the groove/base of the collection cup in Fig. 11 is changed from large to small, it will cause a change in elevation. Conversely, if the radius of the groove/base of the collection cup in Fig. 22A~B is changed from larger to smaller, there will be no change in elevation, because the elevation of the bottom plate has not changed. In this case, the bottom plate needs to be machined from Thicker to the drain and thinner to direct liquid from the opposite side of the cup to the drain.

It will also be appreciated that although Figure 20 shows a pair of drains D1 and D2, there may be a single drain D1, in which case the area of the collection pan directly opposite the single drain D1 represents the high point of the tank area and is close to The area of drain D1 represents a low point for fluid to flow towards and to drain D1. More than two drains may be formed in the collection pan.

Figure 15 shows a localized portion of another collection tray apparatus similar to the previous one, so not all components are described and shown. As shown, the peripheral edge of the chuck 110 is visible. The collection chamber apparatus of this embodiment comprises a collection tray arrangement or assembly 500 and an outer collection tray housing 501 in which the collection tray arrangement 500 is disposed. A movable splash guard 503 is disposed within the housing 501 and is vertically movable from a raised position to a lowered position (shown in Figure 15).

In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 510, a second collection tray 520, a third collection tray 530, And the fourth collection tray 540. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

Collection trays 510, 520, 530, and 540 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of the collection trays 510 , 520 , 530 , and 540 is generally ring-shaped and has a central opening for receiving the spin chuck 110 and the wafer 115 . Each collection tray has a main area defining an annular collection track defined by an inner wall portion 550 and an outer wall portion 560 , the two wall portions intersect each other to define a groove 555 . As shown in Figure 15, the main collection portion of the collection tray is generally V-shaped.

The bottom of the groove 555 is bounded by point A, the inner top edge 551 of the inner wall portion 550 is bounded by point B, and the outer top edge 561 of the outer wall portion 560 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of a given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

As shown in the figure, the first collection tray 510 also includes an outer cover portion 515 covering the annular recessed fluid collection track defined between the inner wall portion 550 and the outer wall portion 560 . The outer cover part 515 thus has a downwardly extending protrusion arranged within this annular recessed fluid collecting track of the first collecting pan 510 . The outer cover portion 515 thus effectively covers the slot 555 and prevents any fluid from flowing into the slot 555 .

Although not shown in the cross-sectional view of FIG. 15 , each collection pan may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of collection pan 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

The collecting trays each include an outlet (drainage conduit) formed at one of its positions, and in particular, the outlet may be similar to the outlet 136 of the collecting tray 130 . As such, the outlet is in fluid communication with the slot 555 . The outlet may be in the form of an outflow trough or a drain conduit, as described above, extending tangentially along the circumferential length of the collecting pan (see Figure 13). The outlet can provide another channel along which the collected fluid can flow. The bottom of the outlet can be in fluid communication with the bottom (floor) of the groove 555 so fluid can flow from the groove 555 into the outlet. The outlet of each collection tray can be in fluid communication with a manifold structure, such as the manifold structure 200 in FIGS. 1-10, so as to guide the collected fluid away from the chuck.

According to the present invention, the bottom of the groove 555 of the raised first collection tray 510 (point A) is lower than point B (the inner top edge of the inner wall portion 550 ) of the second collecting tray 520 and point A is preferably at the same height as or lower than point C (the top edge of the outer wall portion 560 ). The inventors have found that the relationship of points (areas) A, B, C described above eliminates or substantially reduces any spray splashing outside the first collection chamber 501 . This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

As in the previous embodiments of FIGS. 1-10 , the second collection tray 520 is raised to contact the raised first collection tray 510 while the third and fourth collection trays 530 and 540 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). Raising the third collection pan 530 into contact with the raised second collection pan 520 while the fourth collection pan 540 is in the lowered position defines a fluid drain from the wafer (as used for the first and second collection chambers). A third collection chamber for different fluids (chemicals).

The collection trays 510, 520, 530, 540 may be individually and independently raised and lowered using one of the mechanisms described herein.

Exhaust (air) may be drawn through the collection chamber and directed down the splash guard 503 to an exhaust/vent such as chemical exhaust 1070 (FIG. 11).

It should also be understood that the collection pans 510, 520, 530, 540 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

When the splash guard 503 is in the lowered position, exhaust gases can be exhausted through the chamber exhaust port 1070 (FIG. 11).

Figures 16A and 16B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment comprises a collection tray arrangement or assembly 600 and an outer collection tray housing 601 in which the collection tray arrangement 600 is disposed.

The catch tray housing 601 has a hollow that circumferentially surrounds the chuck 1040 and the wafer 115 . As shown, the collection tray housing 601 may include an inner divider wall 603 that divides the hollow interior of the collection tray housing 601 into a first compartment 605 and a second compartment 607 disposed radially outward from the first compartment 605 ( The first compartment 605 is thus located by the peripheral edge of the wafer 115, while the second compartment 607 is spaced radially therefrom). It should be appreciated that the collection tray housing 601 thus has an annular shape and that both the first and second compartments 605 and 607 have an annular shape.

The first compartment 605 is configured to support the collection tray arrangement 600 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection tray. Although the first compartment 605 is shown to have a larger area than the second compartment 607, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 605 and 607 are not limited to those shown in the figures. Show. As shown, the first compartment 605 is bounded by an inner wall 602 near the outer edge of the wafer 115 and terminating at a top edge 604 . The height of the partition wall 603 is smaller than that of the inner wall 602 , so the top edge of the partition wall 603 is lower than the top edge 604 . The bottom wall 606 defines the bottom of the compartment, thus acting as a floor.

The second compartment 607 is defined by the outer wall 608 and the partition wall 603 , and the bottom of the second compartment 607 is defined by the bottom wall 606 . The outer wall 608 is parallel to the partition wall 603 . The second compartment 607 is also defined by a top wall portion 609 having a first leg extending toward the first compartment and a second leg parallel thereto between the outer wall and the partition wall 603 . The top wall portion 609 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 609 and the top edge of the partition wall 603, thus defining a flow path from the first compartment to the second compartment. A second channel is defined between the second foot of the top wall portion 609 and the outer wall 608 and defines an exit or exit opening from the second compartment and preferably leads to a chemical exhaust port 1080 (FIG. 11).

The bottom wall 606 includes a plurality of holes or openings to accommodate drains associated with individual collection trays, as described below. Each hole receives a drain tube in a sealed manner while allowing vertical movement of the drain tube.

In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 610, a second collection tray 620, a third collection tray 630, And the fourth collection tray 640. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

The collection trays 610, 620, 630, and 640 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 610 , 620 , 630 , and 640 is generally annular and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection tray has a main area defining an annular collection track defined by an inner wall portion 650 and an outer wall portion 660 that meet each other to define a slot 655 . As shown in Figures 16A and 16B, the slot 655 has an opening fluidly connected to a drain conduit (pipe) 657 passing through the opening.

Along the underside of each collection tray there is a downwardly extending protrusion 613 surrounding the aperture. The second, third, and fourth collection trays 620, 630, and 640 also each include an opening for receiving and allowing the drain pipe 657 to pass through. Surrounding the opening in the slot is an upstanding inner wall 659 which surrounds the opening and prevents fluid from flowing into the opening. As shown, the upstanding inner walls 659 are received within the downwardly extending protrusions 613 when the collection trays are nested within one another.

The bottom of the groove 655 is bounded by point A, the inner top edge of the inner wall portion 650 is bounded by point B, and the outer top edge of the outer wall portion 660 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

As shown in the figure, the first collection tray 610 also includes an outer cover portion 615 covering the annular recessed fluid collection track defined between the inner wall portion 650 and the outer wall portion 660 . The outer cover part 615 thus has a downwardly extending protrusion arranged within this annular recessed fluid collecting track of the first collecting pan 610 . The outer cover portion 615 thus effectively covers the slot 655 and prevents any fluid from flowing into the slot 655 .

Although not shown in the cross-sectional views of Figures 16A and 16B, each collection tray may have a The outwardly extending flange areas are similar to the pair of outwardly extending flange areas 133 of the collecting tray 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

The collecting trays each include an outlet (drainage conduit) formed at one of their positions, and in particular, each collecting tray includes one or more drains for discharging the fluid collected in the grooves of the collecting tray. As shown, the lower collection pan has a trough area with openings formed therein to allow passage of the drain associated with the upper collection pan. The drains are thus circumferentially spaced from each other and each collecting tray may comprise two drains arranged opposite each other.

FIG. 16A shows the first collection pan 610 and the outer cover portion 615 in the raised position, and the first collection chamber defined between the raised first collection pan 610 and the lowered second collection pan 620 . As with the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 607 and then exit through the second channel.

Figure 16 shows all collection trays and outer cover portion 615 in the lowered position. Exhaust gas (air) can still flow over the outer cover portion 615, through the first channel into the second compartment 607, and then exit through the second channel. Exhaust gases thus bypass drain 657 and can flow to chemical vent 1080 (FIG. 11).

According to the present invention, the bottom (point A) of the groove 655 of the raised first collecting tray 610 is lower than the point B (the inner top edge of the inner wall portion 650) of the second collecting tray 620, and point A is preferably the same as point C (the top edge of the outer wall portion 660) the same height or lower than it. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan, where point A of the raised catch pan is lower than that of the lowered catch pan directly below. Point B and point A of the raised collecting pan have an equal or smaller height to point C.

As in the previous embodiments of FIGS. 1-10 , the second collection tray 620 is raised to contact the raised first collection tray 610 while the third and fourth collection trays 630 and 640 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). Raising the third collection pan 630 into contact with the raised second collection pan 620 while the fourth collection pan 640 in the lowered position defines a fluid for collecting fluid drained from the wafer (as used for the first and second collection chambers). A third collection chamber for different fluids (chemicals).

The collection trays 610, 620, 630, 640 may be individually and independently raised and lowered using one of the mechanisms described herein.

It should also be understood that the collection pans 610, 620, 630, 640 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

Figures 17A and 17B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment includes a collection tray arrangement or assembly 700 and an outer collection tray housing 701 in which the collection tray arrangement 700 is disposed.

The catch tray housing 701 has a hollow that circumferentially surrounds the chuck 110 and the wafer 115 . As shown, the collection tray housing 701 can include an inner divider wall 703 that divides the hollow interior of the collection tray housing 701 into a first compartment 705 and a second compartment 707 disposed radially outward from the first compartment 705 ( The first compartment 705 is thus located beside the peripheral edge of the chuck 110 and wafer 115, while the second compartment 707 is spaced radially therefrom). It should be appreciated that the collection tray housing 701 thus has an annular shape and that both the first and second compartments 705 and 707 have an annular shape.

The first compartment 705 is configured to support the collection tray arrangement 700 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection tray. Although the first compartment 705 is shown as Having a larger area than the second compartment 707 is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 705 and 707 are not limited to what is shown in the figure. The second compartment 707 is defined by the outer wall 708 and the partition wall 703 , and the bottom of the second compartment 707 is defined by the bottom wall 706 . The outer wall 708 is parallel to the partition wall 703 . The second compartment 707 is also defined by a top wall portion 709 having a first leg extending toward the first compartment and a second leg parallel thereto between the outer wall and the partition wall 703 . The top wall portion 709 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 709 and the top edge of the partition wall 703, thus defining a flow path from the first compartment to the second compartment. A second channel is defined between the second foot of the top wall portion 709 and the outer wall 708 and defines an exit or exit opening from the second compartment.

In the illustrated embodiment, which is exemplary in nature, there are three different collection trays, namely, a first collection tray 710, a second collection tray 720, and a third collection tray 730 arranged in a stacked configuration. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

Collection trays 710, 720, and 730 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 710 , 720 , and 730 is generally ring-shaped and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection pan has a main area defining an annular collection track defined by an inner wall portion 750 and an outer wall portion 760 that meet each other to define a slot 755 . As shown in Figures 17A and 17B, the tank 755 has one or more drain ports fluidly connected to a drain.

The bottom of the groove 755 is bounded by point A, the inner top edge of the inner wall portion 750 is bounded by point B, and the outer top edge of the outer wall portion 760 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

As shown in the figure, the first collecting tray 610 also includes an outer cover portion 715, which covers and defines An annular recessed fluid collection track between the inner wall portion 750 and the outer wall portion 760 . The outer cover part 715 thus has a downwardly extending protrusion which is arranged within this annular recessed fluid collecting track of the first collecting pan 710 . The outer cover portion 715 thus effectively covers the slot 755 and prevents any fluid from flowing into the slot 755 .

Although not shown in cross-section in FIGS. 17A and 17B , each collection pan may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of collection pan 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10.

An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

FIG. 17A shows the first collection pan 710 and the outer cover portion 715 in the raised position, and the first collection chamber defined between the raised first collection pan 710 and the lowered second collection pan 720 . As with the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 707 and then exit through the second channel.

Figure 17B shows all collection trays and outer cover portion 715 in the lowered position. Exhaust gas (air) can still flow over the outer cover portion 715, through the first channel into the second compartment 707, and then exit through the second channel.

According to the present invention, the position of the bottom (point A) of the groove 755 of the raised first collection tray 710 is lower than the point B (inner top edge of the inner wall portion 750) of the second collection tray 720 and point A is preferably the same as point C (the top edge of the outer wall portion 760) the same height or lower than it. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

As in the previous embodiments of FIGS. 1-10 , the second collection tray 720 is raised to contact the raised first collection tray 710 while the third and fourth collection trays 730 and 740 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber).

Collection trays 710, 720, and 730 may be individually and independently raised and lowered using one of the mechanisms described herein.

It should also be appreciated that collection pans 710, 720, and 730 may have a configuration as shown in FIG. 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

Figures 18A and 18B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment includes a collection tray arrangement or assembly 800 and an outer collection tray housing 801 in which the collection tray arrangement 800 is disposed.

The catch tray housing 801 has a hollow that circumferentially surrounds the chuck 110 and the wafer 115 . As shown, the collection tray housing 801 can include an inner divider wall 803 that divides the hollow interior of the collection tray housing 801 into a first compartment 805 and a second compartment 807 disposed radially outward from the first compartment 805 ( The first compartment 805 is thus located alongside the peripheral edge of the chuck 1040 and wafer 115, while the second compartment 807 is spaced radially therefrom). It should be appreciated that the collection tray housing 801 thus has an annular shape and that both the first and second compartments 805 and 807 have an annular shape.

The first compartment 805 is configured to support the collection tray arrangement 800 in a manner, as described below, that enables movement (ie, raising or lowering) of each collection tray. Although the first compartment 805 is shown to have a larger area than the second compartment 807, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 805 and 807 are not limited to those shown in the figures. Show. The second compartment 807 is defined by the outer wall 808 and the partition wall 803 , and the bottom of the second compartment 807 is defined by the bottom wall 806 . The outer wall 808 is parallel to the partition wall 803 . The second compartment 807 is also delimited by a top wall portion 809 having a The extended first leg and the second leg between the outer wall and the partition wall 803 are parallel to it. The top wall portion 809 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 809 and the top edge of the partition wall 803, thus defining a flow path from the first compartment to the second compartment. A second channel is defined between the second foot of the top wall portion 809 and the outer wall 808 and defines an exit or exit opening from the second compartment.

In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 810, a second collection tray 820, a third collection tray 830, And the fourth collection tray 840. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

Collection trays 810, 820, 830, and 840 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 810 , 820 , 830 , and 840 is generally ring-shaped and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection pan has a main area defining an annular collection track defined by an inner wall portion 850 and an outer wall portion 860 that meet each other to define a slot 855 . As shown in Figures 18A and 18B, the tank 855 has one or more drains fluidly connected to a drain.

As indicated in the figure, the bottom of the slot 855 is bounded by point A, and the inner top edge of the inner wall portion 850 is bounded by point B, and the outer top edge of the outer wall portion 860 is bounded by point C. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

As shown in the figure, the first collection tray 810 also includes an outer cover portion 815 covering the annular recessed fluid collection track defined between the inner wall portion 850 and the outer wall portion 860 . The outer cover part 815 thus has a downwardly extending protrusion arranged within this annular recessed fluid collecting track of the first collecting pan 810 . The outer cover portion 815 thus effectively covers the slot 855 and prevents any fluid from flowing into the slot 855 .

Although not shown in the cross-sectional views of Figures 18A and 18B, each collection tray may have a The outwardly extending flange areas are similar to the pair of outwardly extending flange areas 133 of the collecting tray 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

Figure 18A shows the first collection tray 810 and outer cover portion 815 in the raised position, and defined between the raised first collection tray 810/outer cover portion 815 and the lowered collection trays 820, 830, and 840 The first collection room. As with the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 807 and then exit through the second channel.

Figure 18B shows all collection trays and outer cover portion 815 in the lowered position. Exhaust gases (air) can still flow over the outer cover portion 815, through the first channel into the second compartment 807, and then exit through the second channel to the chemical exhaust port 1080 (FIG. 11).

According to the present invention, the position of the bottom (point A) of the groove 855 of the first collecting tray 810 raised is lower than the point B (the inner top edge 851 of the inner wall portion 850) of the second collecting tray 820 and point A is preferably the same as point A. C (the top edge 861 of the outer wall portion 860) is at the same height or lower. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

As in the previous embodiments of FIGS. 1-10, the second collection tray 820 is raised to contact the raised first collection tray 810 while the third and fourth collection trays 830 and 840 are defined in the lowered position for collecting A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). A third collection chamber may be defined between the raised trays 810 , 820 , and 830 and the lowered fourth collection tray 840 .

Collection trays 810, 820, 830, and 840 may be individually and independently raised and lowered using one of the mechanisms described herein.

It should also be appreciated that collection pans 810, 820, 830, and 840 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

Figures 19A and 19B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment comprises a collection tray arrangement or assembly 900 and an outer collection tray housing 901 in which the collection tray arrangement 900 is disposed.

The catch tray housing 901 has a hollow that circumferentially surrounds the chuck 110 and the wafer 115 . As shown, the collection tray housing 901 can include an inner divider wall 903 that divides the hollow interior of the collection tray housing 901 into a first compartment 905 and a second compartment 907 disposed radially outward from the first compartment 905 ( The first compartment 905 is thus located beside the peripheral edge of the chuck 110 and the wafer 115, while the second compartment 907 is spaced radially therefrom). It should be appreciated that the collection tray housing 901 thus has an annular shape and that both the first and second compartments 905 and 907 have an annular shape.

The first compartment 905 is configured to support the collection tray arrangement 900 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection tray. Although the first compartment 905 is shown to have a larger area than the second compartment 807, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 905 and 907 are not limited to those shown in the figures. Show. The second compartment 907 is defined by the outer wall 908 and the partition wall 903 , and the bottom of the second compartment 907 is defined by the bottom wall 906 . The outer wall 808 is parallel to the partition wall 803 . The second compartment 907 is also defined by a top wall portion 909 having a first leg extending toward the first compartment and a second leg parallel thereto between the outer wall and the partition wall 903 . The top wall portion 909 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 909 and the top edge of the partition wall 903, thus defining a channel from the first compartment One flow path to the second compartment. A second channel is defined between the second foot of the top wall portion 909 and the outer wall 908 and defines an exit or exit opening from the second compartment.

In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 910, a second collection tray 920, a third collection tray 930, And the fourth collection tray 940. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

Collection trays 910, 920, 930, and 940 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 910 , 920 , 930 , and 940 is generally annular and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection pan has a main area defining an annular collection track defined by an inner wall portion 950 and an outer wall portion 960 that meet each other to define a slot 955 . As shown in Figures 19A and 19B, the tank 955 has one or more drain ports that are fluidly connected to a drain and channel the collected fluid away from the collection pan.

The bottom of the groove 955 is bounded by point A, the inner top edge of the inner wall portion 950 is bounded by point B, and the outer top edge of the outer wall portion 960 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

As shown in the figure, the first collection tray 910 also includes an outer cover portion 915 covering the annular recessed fluid collection track defined between the inner wall portion 950 and the outer wall portion 960 . The outer cover part 915 thus has a downwardly extending protrusion, which is arranged within this annular recessed fluid collecting track of the first collecting pan 910 . The outer cover portion 915 thus effectively covers the slot 955 and prevents any fluid from flowing into the slot 955 .

Although not shown in cross-section in FIGS. 19A and 19B , each collection pan may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of collection pan 130 . The flange areas are preferably positioned opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, 180 degrees apart) formed therein. opening 134). Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

FIG. 19A shows first collection tray 910 and outer cover portion 915 in a raised position, and defined between raised first collection tray 910/outer cover portion 915 and lowered collection trays 920, 930, and 940 The first collection room. As in the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 907, and then exit through the second channel to the chemical exhaust port 1080 (FIG. 11).

Figure 19B shows all collection trays and outer cover portion 915 in the lowered position. Exhaust gases (air) can still flow over the outer cover portion 915, through the first channel into the second compartment 907, and then exit through the second channel to the chemical exhaust port 1080 (FIG. 11).

According to the present invention, the bottom (point A) of the groove 955 of the raised first collecting tray 910 is lower than the point B (the inner top edge of the inner wall portion 950) of the second collecting tray 920, and point A is preferably the same as point C. (the top edge of the outer wall portion 960) the same height or lower than it. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

As in the previous embodiments of FIGS. 1-10 , the second collection tray 920 is raised to contact the raised first collection tray 910 while the third and fourth collection trays 930 and 940 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). A third collection chamber may be defined between the raised trays 910 , 920 , and 930 and the lowered fourth collection tray 940 .

Can be individually and independently raised and lowered using one of the mechanisms described herein Collection trays 810, 820, 830, and 840.

It should also be appreciated that collection pans 910, 920, 930, and 940 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

Figures 14A to 19B thus illustrate various configurations of removable collection pans that include drainage features (openings or drains) for draining collected fluid and also have relationships between points A, B, and C, such as Indicated herein to prevent fluid from splashing out of the collection chamber defined between a raised collection pan and another collection pan directly below. In fact, by causing the innermost edge (point B) of the lowered collection pan to be higher than the lowest point A (in the area of the trough) of the raised collection pan, fluid entering the chamber laterally will impinge on the raised collection pan. A downwardly extending groove that blocks collected fluid from exiting the collection pan along the outer edge of the collection pan. The downwardly extending groove of the raised collection pan (point A) acts as a deflector or barrier for fluid entering the collection chamber and defines a circuitous flow path so that fluid entering the collection chamber cannot cross directly from the inlet to the outlet. As with the previous embodiments, multiple collection chambers of similar or identical configuration are provided to collect different fluids (different chemicals) used during wafer processing. The raising and lowering of the collection trays defining the individual collection chambers is performed in a controlled manner, such as the method described in connection with the embodiment of FIGS. 1-10. In particular, two pneumatic pistons may be provided for raising and lowering each collection pan, and the lower collection pan comprises openings (for example in the flange area) through which the pneumatic pistons acting on the upper collection pans pass.

In all embodiments, the top edge of the collection tray is lower than the chuck 110 when the collection tray is in the lowered position. Conversely, when the collection tray is in the raised position, the top edge of the collection tray will be higher than the chuck 110 . In addition, an exhaust gas channel is provided and remains unobstructed while forming the collection chamber.

Reference is now made to Figures 14A-12B and Figure 20, which illustrate another aspect of the present invention. Figure 20 shows a schematic diagram (top view) of a collection tray (410, 420, 430, 440). The collecting tray includes first and second drains D1 and D2 spaced apart from each other (for example, D1 and D2 are separated by 180 degrees). as above As described above, drains D1 and D2 are in fluid communication with grooves formed in the collection pan to drain collected fluid. As before, the collecting pan has an annular shape with a first annular area between the two drains D1 and D2 and an opposite second annular area between the two drains D1 and D2. Each of the first and second annular regions is configured to have a varying radius of curvature, in particular, the angle between the inner wall portion 443 and the outer wall portion 444 varies along the annular region in a direction toward one of the drains D1 and D2. For example, the largest radius (R1) can be located between (eg, equidistant from) drains D1 and D2 and the reduced radius (R2) is located in the area of largest radius (R1) in relation to a drain D1 and Between D2. Figure 18A shows the collection tray in the R1 region (larger angle between walls), while Figure 18B shows the collection tray in the R2 region (smaller angle between walls). By providing an area of reduced radius (R2) next to each drain D1 and D2, fluid will flow naturally from the area of maximum radius (R1) to drains D1 and D2 (due to the change in slope of the collection pan - its funnel direct the fluid to drains D1 and D2). This configuration thus ensures fluid flow within the grooves of the collection chamber to the drains D1 and D2.

An exemplary region of maximum radius (R1) is bounded by groove inner wall portions formed at an angle of about 70° and groove outer wall portions formed at an angle of about 60°. An exemplary region of reduced radius (R2) is bounded by groove inner wall portions formed at an angle of about 75° and groove outer wall portions formed at an angle of about 70°.

Figure 21 shows a collection tray (cup) configuration 1100 according to another alternative embodiment and reflects a hybrid design where at least two collection chambers (troughs) are stacked and at least one collection chamber is concentric with the others but not stacked, as follows Show. Configuration 1100 is similar to other configurations described herein. In particular, the catch pan configuration 1100 includes a movable splash guard 1102 that is movable between a fully raised position and a fully lowered position (and positions in between). Like the other embodiments, the splashback 1102 has a vertical outer wall 1104 and an inwardly sloping wall 1106 . The splashback 1102 also has a downwardly extending inner wall 1105 that is spaced from the outer wall 1104 to define a space therebetween.

A substantially Y-shaped movable first collecting tray (cup) 1120 is also provided. Should The first collection tray 1120 includes an outer wall 1122 configured to be received in the space between the inner wall 1105 and the outer wall 1104 . The first collection tray 1120 also has an inner wall 1123 spaced from the outer wall 1122 . The first groove area 1125 is formed between the outer wall 1122 and the inner wall 1123 . The inner wall 1123 has a bottom 1126 extending below the first groove area 1125 . Unlike some other embodiments, the first well 1125 does not have rounded corners or a substantially flat floor, but is rather V-shaped and includes sloped floor walls 1127 . As shown, an opening leading to the drain 260 may be formed in this sloped floor wall 1127 . The opening thus assumes an angular arrangement.

The movable second collecting tray (cup) 1130 is located radially inward of the first collecting tray 1120 . The movable second collecting tray 1130 includes a first upwardly extending outer wall 1132 and a middle wall 1134 , and a second tank area 1135 defined between the walls 1132 and 1134 . The tray 1130 includes a downwardly extending inner wall 1136 separated from the middle wall 1134 by an open space defined between the inner wall 1136 and the middle wall 1134 . The second tank area 1135 partially defines the second collection chamber.

As shown, the bottom 1126 of the first collection cup 1120 is disposed within the space of the second well 1135 .

The movable third collecting tray (cup) 1140 is disposed and located radially inside the second collecting tray 1130 . The movable third collecting tray 1140 includes an upwardly extending outer wall 1142 and an upwardly extending inner wall 1144 separated from the outer wall 1142 to define a third tank area 1145 . The third tank area 1145 partially defines a third collection chamber.

As shown, the inner wall 1136 of the second collection pan 1130 is disposed within the third well 1145 . Unlike the inclined trough 1125 of the first collecting tray 1120, the second trough 1135 and the third trough 1145 are more similar to the troughs of the previous embodiment, which are not arranged at an angle. The drain 260 is in fluid communication with the second tank area 1135 and the third tank area 1145 .

As with the previous embodiments, the surfaces of the individual cups and collection cover are designed to prevent leakage when the individual cups are open and collect fluid from the spinning wafer. In particular, inner wall 1105 and outer wall 1122 are oriented such that when outer cover 1102 is raised and fluid enters first groove 1125, the downward slope of inner wall 1105 The nature and its position relative to the outer wall 1122 effectively prevents leakage from this collection trough (cup). Likewise, the same relationship exists between inner wall 1126 and outer wall 1132 and between inner wall 1136 and outer wall 1142 . As previously mentioned, the configuration 1100 is a hybrid design in which the first collection tray 1120 and the second collection tray 1130 are stacked (nested within each other), which can be seen in the fact that the first collection tray 1120 is at a different height relative to the second collection tray 1130 and that the first The tank (first collection chamber) 1125 is located above the second tank (second collection chamber), thereby forming a stacked collection tray configuration. On the contrary, the third collection tray 1140 is arranged concentrically with respect to the second collection tray 1130 and the first collection tray 1120 in a non-stacked manner, so that the third groove (the third collection chamber) 1145 is not stacked relative to the other two collection chambers, which This is evidenced by the fact that the third collection chamber is not located below the second collection chamber 1135 but is concentric and radially offset therewith in the collection chamber closed position.

Reference is now made to Figures 22A to 22D, which illustrate a collection tray (cup) configuration 1200 according to another alternative embodiment and reflect a hybrid design in which at least two collection chambers (troughs) are stacked, and at least one collection chamber is integrated with the other collection chambers. The chambers are concentric but not stacked, as shown below. As with previous embodiments, the surfaces of the individual cups and collection caps are designed to prevent leakage when the individual cups are open and collect fluid from the spinning wafer.

As described below, the collection tray configuration 1200 has three separate collection chambers (fluid collection tanks), Figure 22A shows the closed position; Figure 22B shows the first collection chamber open while the second and third collection chambers are closed; Figure 22C shows the second collection chamber open while the first and third collection chambers are closed; and Figure 22D shows the third collection chamber open while the first and second collection chambers are closed.

The collection tray configuration 1200 is similar to the configuration 1100 described herein. In particular, collection tray arrangement 1200 includes a movable collection cover 1202 that is movable between a fully raised position and a fully lowered position (and positions in between). Like the other embodiments, the collection cap 1202 has a vertical outer wall 1204 and an inwardly inclined wall 1206 . Collection cap 1202 also has a downwardly extending inner wall 1205 that is spaced from outer wall 1204 to define a space therebetween.

A substantially Y-shaped movable first collecting tray (cup) 1220 is also provided. Should The first collection tray 1220 includes an outer wall 1222 configured to be received in the space between the inner wall 1205 and the outer wall 1204 . The first collection tray 1220 also has an inner wall 1223 spaced from the outer wall 1222 . The first groove area 1225 is formed between the outer wall 1222 and the inner wall 1223 . The inner wall 1223 has a bottom 1226 extending below the first groove area 1225 . As with other embodiments, the first tank area 1225 has at least one opening leading to a drain.

A movable multi-collection tray (cup) 1230 is arranged radially inside the first collection tray 1220 . The first collecting tray 1230 includes a first upwardly extending outer wall 1232 and a middle wall 1234 , and a second tank area 1235 defined between the walls 1232 and 1234 . The first collecting tray 1230 includes an inner wall 1236 extending upwards, separated from the middle wall 1234 by an open space, and a third tank area 1237 . Two tank areas (two collection chambers) are thus delimited by the same disc 1230, unlike the previous embodiment where one collection disc only includes one collection chamber (slot). The second and third tubs 1235 and 1237 are thus oriented side-by-side. As with other embodiments, each collection chamber includes at least one drain leading to a drain.

Inner ring 1240 is located radially inward of disc 1230 and represents an annular structure fixed and configured to close third groove 1237 as described below.

A drain, such as drain 260 , communicates with tanks 1225 , 1235 , and 1237 .

As previously mentioned, the collection tray configuration 1200 is a hybrid design in which the first collection tray 1220 and the trays 1230 are stacked (nested into each other), which can be seen in the fact that the first collection tray 1220 is at a different height relative to the collection tray 1230 and that the first slot ( The first collection chamber) 1225 is located above the second tank (second collection chamber) 1235, thereby forming a stacked collection tray configuration. At the same time, the third slot 1237 is oriented concentrically with respect to the second slot 1235 and may in fact be planar therewith. Slots 1235 and 1237 are thus not stacked on top of each other but are concentric and radially offset from each other.

Figure 22A shows the collection cover 1202, first collection tray 1220 and multi-chambered collection tray 1230 and ring 1240 in a closed position whereby none of the collection chambers (slots 1225, 1235, 1237) are open. Fig. 22B shows relative to the first collection tray 1220, the multi-chamber collection tray 1230 and the ring 1240, the collection The collection cover 1202 is raised, thereby opening the first collection chamber (first groove 1225), while the other collection chambers are closed. Fluid collects in the first tank 1225 and drains therefrom. It should be seen that the outer wall 1232 does not interfere with the drainage of the first slot 1225 . Figure 22C shows the collection cover 1202 and the first collection tray 1220 raised relative to the multi-chamber collection tray 1230 and ring 1240, thereby opening the second collection chamber (second slot 1235), while the other collection chambers are closed. Fluid collects in the second tank 1235 and drains therefrom. Figure 22D shows the collection cover 1202, the first collection tray 1220, and the multi-chamber collection tray 1230 raised relative to the ring 1240, thereby opening the third collection chamber (third groove 1237), while the other collection chambers are closed . Fluid collects in third tank 1237 and drains therefrom.

In the embodiment of FIGS. 22A-22D , the collection trays are configured in a stacked configuration and one difference between this embodiment and the other embodiments is that all fluid dislodged from the chucks is captured by the collection trays (cups). In particular, as shown in Figure 6, the cup above the open collection cup does not extend into the open cup. This is in contrast to the embodiment of Fig. 21, where features 1105, 1135, and 1136 prevent fluid from being driven away or as disclosed in other embodiments where the upper cup extends into the lower cup.

Figures 23A and 23B show an alternative exhaust system 1900 that includes only a single exhaust port as opposed to at least some of the previous embodiments (where two exhaust systems are shown). In particular, the single vent is similar to the chemical vent described above with respect to other embodiments. It should be understood that the collection cup configuration shown is merely exemplary in nature and that the single exhaust system 1900 may be used with any other collection cup configuration disclosed herein.

A single exhaust conduit is shown at 1910, and is likewise similar to the chemical exhaust configuration disclosed herein. Exhaust conduit 1910 may comprise any number of different structures, including channels or conduits as shown. Exhaust conduit 1910 receives exhaust gas and directs it away from the wafer processing apparatus, as described below.

A splashback 1920 is shown and is similar to that described herein. Splashback 1920 It has a top inclined wall 1922 and a vertical outer wall 1924 . The splash guard 1920 moves vertically between an open position shown in Figure 23A and a closed (lowered) position shown in Figure 23B.

As noted above, the splash guard 1920 is configured around a collection cup, which can take any number of different forms, including those described herein. For illustration only, a collection cup configuration is shown including a collection cap 1930 , a first collection cup 1940 , a second collection cup 1950 , and a third collection cup 1960 . These elements may have the characteristics disclosed herein for other collection cup configurations.

According to the invention, in the open position of the splash guard 1920 the exhaust channel 1970 is open. Exhaust gas can flow through it to the exhaust duct 1910 . Exhaust passage 1970 is in fluid communication with the interior of exhaust conduit 1910 so that when splash guard 1920 is in the open position, exhaust gases can pass through the splash guard, along outer wall 1924, then to passage 1970, and finally into the exhaust Catheter 1910. Exhaust gases can also pass through the open collection chamber created by the collection cup configuration and then flow into channel 1970 . In other words, when the splash guard 1920 is in the open position, air (exhaust) can flow through the splash guard and into the exhaust conduit 1910 through the passage 1970 .

Conversely, as shown in FIG. 23B , when the splash guard 1920 is in the closed position, the lowered splash guard 1920 closes the exhaust passage 1970 , thereby restricting the flow of exhaust gas into the exhaust conduit 1910 .

Those skilled in the art will therefore appreciate that the degree to which the splash guard 1920 is raised defines the amount of exhaust gas that can flow into the exhaust duct 1910 and be drawn away therefrom. Thus, the user can effectively "throttle" the extracted exhaust by positioning the splash guard 1920 at a desired position between the fully open position (FIG. 23A) and the fully open position (FIG. 23B). quantity. This allows control of the exhaust system of the invention.

Note that the above illustrations and examples are not intended to limit the scope of the invention to a single embodiment, and that other embodiments are possible by interchange of some or all of the elements described or illustrated. Furthermore, in cases where certain elements of the present invention can be partially or fully implemented using known components, it is only described as Those parts of such known components are necessary to understand the present invention, and detailed descriptions of other parts of such known components are omitted to avoid obscuring the present invention. In this specification, an embodiment showing a single component is not absolutely limited to other embodiments comprising a plurality of that same component, and vice versa, unless otherwise indicated herein. Furthermore, applicants do not intend for any term in the specification or claims to be ascribed an uncommon or special meaning unless otherwise indicated. Additionally, the present invention encompasses, by way of example, present and future known equivalents to known elements referred to herein.

The foregoing descriptions of specific embodiments so fully disclose the general nature of the invention that others using knowledge in the art of the relevant art (including the contents of the documents referenced and included herein) can be readily modified and adapted for various applications without undue experimentation. and/or adapt such specific embodiments without departing from the overarching concept of the invention. Such adaptations and changes are therefore intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the teaching and guidance presented herein. It should be understood that the terminology or terminology herein is only used for illustration rather than limitation, and therefore, the terminology or terminology in this specification should be interpreted by those skilled in the art in light of the teaching and guidance presented herein and in combination with the knowledge of those skilled in the art.

While various embodiments of the invention have been described above, it should be understood that these embodiments have been presented by way of example, and not limitation. It will be apparent to those skilled in the art that various changes in form and detail can be made without departing from the spirit and scope of the invention. Therefore, the present invention should not be limited to any of the above-mentioned exemplary embodiments, but should only be determined according to the following claims and their equivalents.

34‧‧‧Gap

110‧‧‧rotary chuck

112‧‧‧motor

115‧‧‧Wafer

120‧‧‧Distribution arm

130, 140‧‧‧collection plate

200‧‧‧manifold

300‧‧‧Pistons

Claims (22)

A wafer processing system comprising: a chamber housing; a rotatable wafer support for supporting a wafer; a plurality of independently movable collection trays disposed around a peripheral edge of the wafer support, The collection trays are arranged in a stacked configuration, each collection tray having a collection area for collecting fluid, wherein at least one of the collection trays has a collection area fluid with the collection area for draining the collected fluid a communicating drain; and a drive mechanism for selectively and independently moving one or more of the collection trays to a raised position above the wafer support to define a A collection chamber between a raised collection tray and a lowered collection tray, the collection chamber being configured to collect fluid drained from the wafer during wafer processing and directing the collected fluid through the lowered collection tray the drain of the collection pan; a chamber vent formed in the housing to discharge gas from the interior of the housing to outside the collection pans, wherein the chemical vent is from the plurality of collection pans radially outwardly disposed; and a chemical vent formed in the housing to discharge gas flowing through the collection chamber to the chemical vent; wherein the chemical vent is fluidly connected to the chamber vent isolated, and the plurality of collection pans define a plurality of chemical exhaust flow paths in fluid communication with the chemical exhaust port. The wafer processing system according to claim 1 of the scope of the patent application further includes: a splash guard, which is arranged around the peripheral edge of the wafer support and can move between a raised position and a lowered position; wherein the chemical vent will also be along the splash guard defined in the raised position Gas flowing in a flow path with the collection pans in the lowered position is exhausted. For example, the wafer processing system of claim 1, wherein the drive mechanism includes at least one first pair of pistons arranged under the collection trays, each piston can move between a retracted position and an extended position, in In the stowed position all the collection trays are in intimate contact with each other, and in the extended position at least one collection tray is moved to the raised position and forms the collection chamber therebetween. The wafer processing system according to claim 3 of the patent application, wherein the collection chamber is defined on the underside of one of the raised collection trays and one of the lowered collection trays directly below the raised collection trays between the upper surfaces. The wafer processing system according to claim 1, wherein the plurality of collection trays comprises at least three collection trays defining at least two different collection chambers separated from each other. The wafer processing system according to claim 1, wherein the plurality of collection trays comprises at least four collection trays defining at least three different collection chambers separated from each other. For example, the wafer processing system of item 1 of the scope of the patent application, wherein the main collection part of each collection plate has a V shape. Such as the wafer processing system of claim 1, wherein each collecting tray has an inner wall portion and an outer wall portion that converge to define a tank area for collecting fluid, and the inner wall portion is closer to the outer wall portion The wafer support, the collection tray has an outlet in fluid communication with the trough for discharging collected fluid, wherein a bottom edge (A) of the trough defines the lowest point of the collection tray, the inner wall portion has a top edge (B) and the outer wall portion has a top edge (C); wherein the bottom edge (A) of the raised collection tray is lower than the top edge of the inner wall portion of the lowered collection tray ( B) and the bottom edge (A) of the raised collecting tray is at a height equal to or lower than the top edge (C) of the outer wall. The wafer processing system according to claim 8 of the patent application, wherein the width of the inner wall is greater than the width of the outer wall. A wafer processing system comprising: a chamber housing; a rotatable wafer support for supporting a wafer; a plurality of independently movable collection trays disposed around a peripheral edge of the wafer support, The collection trays are arranged in a stacked configuration, each collection tray having a collection area for collecting fluid, wherein at least one of the collection trays has a collection area fluid with the collection area for draining the collected fluid a communicating drain; a drive mechanism for selectively and independently moving one or more of the collection trays to a raised position above the wafer support to define a A collection chamber between a raised collection tray and a lowered collection tray, the collection chamber configured to collect fluid drained from the wafer during wafer processing and direct the collected fluid through the lowered collection tray a drain of the collection tray; a chemical exhaust port formed in the housing to exhaust gases flowing through the collection chamber to the chemical exhaust port; and a collection tray housing surrounding the wafer support, and A plurality of collection pans are provided, and the collection pan housing defines an exhaust port in fluid communication with the chemical exhaust port to allow gas to be drawn through the collection chamber to the chemical exhaust port. Such as the wafer processing system of claim 10, wherein the collection tray housing includes an inner partition wall, which separates the collection tray housing into a first compartment in which the plurality of collection trays are arranged and from the first The compartment is disposed radially outwardly and includes a second compartment of the vent. A wafer processing system as claimed in claim 11, wherein a first channel is defined by the inner partition wall to allow gas to flow from the first compartment to the second channel because the collection chamber is open to the first channel compartment, and the second compartment includes a second passage leading to the exhaust port. Such as the wafer processing system of item 12 of the scope of the patent application, wherein when the plurality of collection trays are all falling In the down position, the gas system flows through the first channel through an uppermost collecting tray to the second compartment, and from there flows along the second channel to the discharge port. A wafer processing system comprising: a chamber housing; a rotatable wafer support for supporting a wafer; a plurality of independently movable collection trays disposed around a peripheral edge of the wafer support, The collection trays are arranged in a stacked configuration, each collection tray having a collection area for collecting fluid, wherein at least one of the collection trays has a collection area fluid with the collection area for draining the collected fluid a communicating drain; a drive mechanism for selectively and independently moving one or more of the collection trays to a raised position above the wafer support to define a A collection chamber between a raised collection tray and a lowered collection tray, the collection chamber configured to collect fluid drained from the wafer during wafer processing and direct the collected fluid through the lowered collection tray the drain of the collection pan; and a chemical vent formed in the housing to discharge the gas flowing through the collection chamber to the chemical vent; wherein each collection pan is annular and includes a first outlet ( D1) and a second outlet (D2) separated from the first outlet (D1), wherein a first arc portion (AR1) of the collection tray is defined between the first outlet (D1) and the second on one side between the outlets (D2), and a second arc portion (AR2) of the collecting tray is defined on the other side between the first outlet (D1) and the second outlet (D2), wherein the radius of curvature of the groove varies within each of the first and second arcs (AR1 and AR2) along its length; and wherein the first and second arcs (AR1 and AR2 ) has a greater curvature than the area near each of the first outlet (D1) and the second outlet (D2) radius to facilitate fluid flow in a direction toward one of the first outlet (D1) and the second outlet (D2). For the wafer processing system of claim 1, wherein the collection area includes a tank area defined by a flat chassis, and the outlet includes an opening in the flat chassis leading to the tank area A drain pipe is integrally formed and depends downwardly therefrom. A wafer processing system as claimed in claim 15, wherein each collection tray below an uppermost collection tray includes one or more openings formed in the trough to allow contact with one or more overlying The drain pipe associated with the collecting tray passes through. Such as the wafer processing system of claim 15 of the scope of the patent application, wherein each collection tray includes a first protrusion extending outward from the lower side of the tank area and surrounding the opening, and each of the collection trays below an uppermost collection tray The collection pan includes a second protrusion extending outwardly from a top surface of the trough and surrounding and defining the opening, wherein in the lowered position the second protrusion is received in an overlying collection pan between the first protrusions. Such as the wafer processing system of item 8 of the scope of the patent application, wherein the plurality of collection trays include a first collection tray and a second collection tray below the first collection tray, and the groove area of the first collection tray is The trough is offset laterally and radially outwardly from the second collection pan. The wafer processing system according to claim 18 of the scope of the patent application, wherein when the first and second collection trays are in the lowered position, the bottom edge (A) of the first collection tray is arranged on the outer wall of the second collection tray over and against it. A wafer processing system as claimed in claim 19, wherein the inner wall portion terminates at a top edge of the top edge (B) is curved, and the outer wall portion terminates at a top of the top edge (C) The edge is beveled. For example, the wafer processing system of claim 1, wherein the drive mechanism includes one of the following: (a) a plurality of stepping motors and (b) a plurality of pneumatic pistons. Such as the wafer processing system of item 1 of the scope of application, wherein the inner wall portion includes a first inclined wall, and the outer wall portion includes a second inclined wall, and the first and second inclined walls intersect at one point, the A trough is formed there.

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