TWI804711B - Three dimensional printing apparatus and manufacturing method thereof - Google Patents

Abstract

A three dimensional printing apparatus includes an accommodating cavity, a light transmitting plate, a printing platform, a projector and a heat dissipation assembly. The accommodating cavity contains a photocurable material, and the light transmitting plate is disposed adjacent to the accommodating cavity. The printing platform and projector are respectively disposed on opposite sides of the light transmitting plate. The heat dissipation assembly is disposed adjacent to the accommodating cavity.

Description

Three-dimensional printing device and manufacturing method thereof

The present invention relates to a printing device and its manufacturing method, and in particular to a 3D printing device and its manufacturing method.

The current 3D printing technology has developed a bottom-up Stereo Lithography Apparatus (bottom-up SLA), which can produce fine finished products. When the pull-up 3D lithography device is printing, the printing platform will be lowered and completely immersed in the photo-curable material. Afterwards, the photo-curable material is irradiated and cured, and the printing platform will slowly rise to form a multi-layered solid pattern on the bottom surface of the printing platform, thereby completing the printed product. However, the aforementioned light-curing materials are usually soft materials, and the printed matter is deformed or broken due to insufficient structural rigidity and strength, which further affects the fineness and success rate of the finished product.

The present invention provides a three-dimensional printing device and a manufacturing method thereof, which can directly or indirectly reduce the temperature of printed matter, so that the printed matter can temporarily obtain higher structural rigidity and strength, thereby improving the success rate and fineness of the product .

A three-dimensional printing device according to an embodiment of the present invention includes a receiving tank, a light-transmitting plate, a printing platform, a projector, and a heat dissipation component. The accommodating groove accommodates a light-curing material, and the light-transmitting plate is arranged adjacent to the accommodating groove. The printing platform is arranged on one side of the light-transmitting plate, and the projector is arranged on the other side of the light-transmitting plate. The heat dissipation component is disposed adjacent to the accommodating slot.

A 3D printing device according to another embodiment of the present invention includes an accommodating tank, a light-transmitting plate, a printing platform, a projector, and a heat dissipation component. The accommodating groove accommodates a light-curing material, and the light-transmitting plate is arranged adjacent to the accommodating groove. The printing platform is arranged on one side of the light-transmitting plate, and the projector is arranged on the other side of the light-transmitting plate. The heat dissipation component is assembled on the printing platform.

A manufacturing method of a 3D printing device according to another embodiment of the present invention includes the following steps. An accommodating groove is provided for accommodating a photocurable material. Assemble a light-transmitting plate adjacent to the containing groove. Assemble a printing platform on one side of the transparent plate. Assemble a projector on the other side of the transparent plate. A heat dissipation component is assembled to be disposed adjacent to the accommodating slot.

Based on the above, in the design of the 3D printing device of the embodiment of the present invention, the heat dissipation component is adjacent to the accommodating tank, which can directly or indirectly reduce the temperature of the printed matter, thereby temporarily increasing the structural rigidity and strength of the printed matter , to resist the stress generated during the printing process, thereby improving the success rate and fineness of the product.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

FIG. 1 is a schematic diagram of a 3D printing device according to an embodiment of the present invention. Please refer to FIG. 1 , in this embodiment, the 3D printing device 100 a includes a receiving tank 110 , a light-transmitting plate 150 , a printing platform 120 , a heat dissipation component 130 a and a projector 140 . The accommodating groove 110 accommodates a light-curable material 10 , and the light-transmitting plate 150 is disposed in the accommodating groove 110 . In one embodiment, the light-transmitting plate 150 is disposed adjacent to the accommodating groove 110 but outside the accommodating groove 110 . In one embodiment, the accommodating groove 110 directly takes the transparent plate 150 as the bottom. The printing platform 120 is disposed on one side of the light-transmitting plate 150 and moves away from or close to the receiving tank 110 . The projector 140 is disposed on the other side of the light-transmitting plate 150, and is suitable for providing a curing light beam L to irradiate the light-curable material 10, so that the light-curable material 10 is cured into a printed matter 20 on a working surface 122 of the printing platform 120 superior. The heat dissipation component 130 a is disposed adjacent to the containing tank 110 to reduce the temperature of the printed matter 20 .

More specifically, the accommodating tank 110 of this embodiment is used for accommodating different types of photocurable materials 10 such as liquid, colloidal, fluid or powder, but not limited thereto. Due to the material properties, the photo-curable material 10 can be formed layer by layer on the working surface 122 of the printing platform 120 to form the printed matter 20 after being cured by light. In particular, the heat dissipation component 130a of this embodiment is, for example, an air duct, which can directly provide a cooling fluid F to the printed matter 20 to reduce the temperature of the printed matter 20, so that the soft printed matter 20 can be temporarily obtained. High mechanical strength to resist the stress generated during the printing process. Here, the cooling fluid F is, for example, cold air, but not limited thereto.

Furthermore, the printing platform 120 and the projector 140 of this embodiment are located on the upper and lower sides of the accommodating tank 110 respectively, wherein the projector 140 is, for example, a digital light processing (DLP) projection element, a silicon-based liquid crystal (liquid crystal on silicon, LCOS) projection element, liquid crystal projection element or scanning laser projection element, etc., and the light emitting element used can be light emitting diode (light emitting diode, LED), laser (laser) or Other suitable lighting elements. It is worth mentioning that the wavelength range of the light provided by the light-emitting element needs to match with the photo-curable material 10 .

In addition, the transparent plate 150 of this embodiment is located between the photo-curable material 10 and the projector 140 . Here, the light-transmitting plate 150 is a plate that allows specific light to pass through and has sufficient structural strength. In this embodiment, the light-transmitting plate 150 is, for example, made of a glass material with a high ultraviolet light transmittance, that is, the light-transmitting plate 150 is a glass plate in this embodiment, but the material of the light-transmitting plate 150 Not limited to glass, it can also be made of transparent polymer materials such as resin or plastic.

Since the heat dissipation assembly 130a of this embodiment is disposed adjacent to the storage tank 110, the cooling fluid F provided by the heat dissipation assembly 130a can be directly blown to the printed matter 20 in the storage tank 110, so as to directly reduce the temperature of the printed matter 20. temperature, thereby temporarily increasing the structural rigidity and strength of the printed matter 20 . In short, the 3D printing device 100a of this embodiment can improve the printing success rate, and the product can have better fineness.

The manufacturing method of the 3D printing device 100a includes the following steps. Firstly, an accommodating groove 110 is provided for accommodating the light-curable material 10 . Next, assemble the light-transmitting plate 150 adjacent to the accommodating groove 110 . Assemble the printing platform 120 on one side of the transparent plate 150 . The projector 140 is assembled on the other side of the light-transmitting plate 150 . Afterwards, the heat dissipating component 130a is assembled to be disposed adjacent to the accommodating slot 110, and the manufacture of the three-dimensional printing device 100a is completed.

It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 2A is a schematic diagram of another 3D printing device according to an embodiment of the present invention. FIG. 2B is a schematic diagram of the photo-cured material after printing by the three-dimensional printing device in FIG. 2A . FIG. 2C is a schematic diagram of backfilling the uncured photocurable material in FIG. 2B with a spatula. Please refer to FIG. 1 and FIG. 2A at the same time. The 3D printing device 100b of this embodiment is similar to the 3D printing device 100a of FIG. to lower the temperature of the printing platform 120 .

In detail, the heat dissipation component 130b of this embodiment includes a cooling chip 132b, a heat dissipation fin 134b and a cover plate 136b. The cooling chip 132b has a cold surface S1 and a hot surface S2 opposite to each other. The cooling fins 134b are assembled on the hot surface S2 of the cooling chip 132b. The cover plate 136b is assembled on a supporting frame 124 of the printing platform 120, and the cooling chip 132b is assembled on the cover plate 136b. In particular, the cover plate 136b is adapted to define a closed cooling chamber C with the accommodating groove 110 , and a carrying plate 126 connected to the supporting frame 124 of the printing platform 120 is located in the cooling chamber C. The cold surface S1 of the cooling chip 132 b faces the carrier plate 126 of the printing platform 120 , thereby controlling the temperature in the cooling chamber C to reduce the temperature of the printed matter 20 on the working surface 122 of the carrier plate 126 . That is to say, the temperature in the cooling chamber C can be reduced through the cold surface S1 of the cooling chip 132b and the cooling fins 134b disposed on the cooling chip 132b, thereby indirectly reducing the temperature of the columns attached to the working surface 122. Print 20 temperature.

Please refer to FIG. 2B and FIG. 2C at the same time. Since the temperature in the cooling chamber C is lowered through the control of the cooling chip 132b, the uncured (ie unreacted) photo-curable material 12 becomes viscous and difficult to refill. Therefore, the 3D printing device 100b of this embodiment further includes a scraper 160 for backfilling the uncured photo-curable material 12 so that the photo-curable material 10 has a flat surface S for subsequent printing procedures.

Since the heat dissipation assembly 130b of this embodiment is assembled on the printing platform 120, the heat dissipation assembly 130b can control the temperature in the cooling chamber C to indirectly reduce the temperature of the printed matter 20, thereby temporarily increasing the temperature of the printed matter. 20 structural rigidity and strength to resist the stress generated during the printing process. The 3D printing device 100b of this embodiment can improve the printing success rate, and the product can have better fineness.

FIG. 3 is a schematic diagram of another 3D printing device according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 3 at the same time. The 3D printing device 100c of this embodiment is similar to the 3D printing device 100a of FIG. to lower the temperature of the printing platform 120 .

In detail, the heat dissipation component 130c of this embodiment includes a cooling chip 132c, a heat dissipation fin 134c, a heat pipe 136c and a heat conduction plate 138c. The cooling chip 132c has a cold surface S1 and a hot surface S2 opposite to each other. The cold surface S1 of the cooling chip 132 c is directed towards the carrier plate 126 of the printing platform 120 to reduce the temperature of the printed matter 20 on the working surface 122 of the carrier plate 126 . The cooling fins 134c are assembled on the hot surface S2 of the cooling chip 132c. The heat pipe 136c is disposed on the supporting board 126 of the printing platform 120 , wherein the supporting board 126 has an upper surface 123 and a working surface 122 opposite to each other and a side surface 125 connecting the upper surface 123 and the working surface 122 . The heat pipe 136c directly covers part of the upper surface 123 , part of the working surface 122 and part of the side surface 125 . The heat conduction plate 138c is disposed on the supporting plate 126 of the printing platform 120 , wherein part of the heat pipe 136c is located between the working surface 122 and the heat conduction plate 138c. That is to say, the temperature of the printed matter 20 can be lowered through the heat conduction plate 138c, the heat pipe 136c, the cooling chip 132c and the cooling fins 134c arranged on the printing platform 120 in sequence.

Since the heat dissipation assembly 130c of this embodiment is assembled on the printing platform 120, the heat dissipation assembly 130c can indirectly reduce the temperature of the printed matter 20, thereby temporarily increasing the structural rigidity and strength of the printed matter 20 to resist printing. Stress generated during the printing process. The 3D printing device 100c of this embodiment can improve the printing success rate, and the product can have better fineness.

To sum up, in the design of the 3D printing device of the embodiment of the present invention, the heat dissipation component is set or assembled on the printing platform corresponding to the printed matter, which can directly or indirectly reduce the temperature of the printed matter, thereby temporarily Increase the structural rigidity and strength of the printed matter to resist the stress generated during the printing process, thereby improving the success rate and fineness of the product.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10, 12: Photocurable materials 20:Prints 100a, 100b, 100c: three-dimensional printing device 110: storage tank 120:Print platform 122: work surface 123: upper surface 124: support frame 125: side surface 126: Loading board 130a, 130b, 130c: cooling components 132b, 132c: cooling chip 134b, 134c: cooling fins 136b: cover plate 136c: heat pipe 138c: heat conduction plate 140:Projector 150: Translucent panel 160: scraper C: cooling chamber F: cooling fluid L: curing beam S: flat surface S1: cold noodles S2: hot side

FIG. 1 is a schematic diagram of a 3D printing device according to an embodiment of the present invention. FIG. 2A is a schematic diagram of another 3D printing device according to an embodiment of the present invention. FIG. 2B is a schematic diagram of the photo-cured material after printing by the three-dimensional printing device in FIG. 2A . FIG. 2C is a schematic diagram of backfilling the uncured photocurable material in FIG. 2B with a spatula. FIG. 3 is a schematic diagram of another 3D printing device according to an embodiment of the present invention.

10: Light curing material

20:Prints

100a: 3D printing device

110: storage tank

120:Print platform

122: work surface

130a: cooling assembly

140:Projector

150: translucent panel

F: cooling fluid

L: curing beam

Claims (10)

A three-dimensional printing device, comprising: an accommodating tank for accommodating a light-curing material; a light-transmitting plate disposed adjacent to the accommodating tank; a printing platform disposed on one side of the light-transmitting plate; The projector is configured on the other side of the light-transmitting plate; and a heat dissipation component is arranged adjacent to the accommodating groove and includes a unique opening, wherein the heat dissipation component can provide a cooling fluid through the unique opening for directly cooling the A three-dimensional printed matter formed by photocurable materials. The three-dimensional printing device as described in Claim 1, wherein the projector is used to provide a curing light beam, which can irradiate the light-curable material, so that the light-curable material can be cured into the three-dimensional printed matter on the printing platform on a work surface. A three-dimensional printing device, comprising: an accommodating tank for accommodating a light-curing material; a light-transmitting plate disposed adjacent to the accommodating tank; a printing platform disposed on one side of the light-transmitting plate; The projector is configured on the other side of the light-transmitting plate; and a heat dissipation component is used to assemble on the printing platform, wherein the heat dissipation component is used to cool a three-dimensional printed matter formed by the light-curing material, and is used for To increase the forming strength of the three-dimensional printed matter. The three-dimensional printing device as claimed in claim 3, wherein the projection unit is used to provide a curing light beam to irradiate the light-curable material, so that the light-curable material can be cured into a work of the three-dimensional printed matter on the printing platform On the surface. The three-dimensional printing device as described in claim 4, wherein the heat dissipation component includes: a cooling chip, a cold surface of the cooling chip can face a carrier plate of the printing platform, for lowering the carrier plate located on the carrier plate The temperature of the 3D print on the work surface. The three-dimensional printing device as described in claim 5, wherein the heat dissipation assembly further includes: a cover plate configured to be assembled on a support frame of the printing platform, and the cooling chip is configured to be assembled on the cover plate , wherein the cover plate is used to define a cooling chamber with the accommodating groove, and the carrier plate of the printing platform is located in the cooling chamber, and the temperature in the cooling chamber passes through the cold surface of the cooling chip And lower. The three-dimensional printing device as claimed in claim 6 further includes: a scraper for backfilling the uncured photo-curable material so that the photo-curable material has a flat surface. The three-dimensional printing device as described in claim 5, wherein the heat dissipation assembly further includes: a heat pipe disposed on the carrier plate of the printing platform, wherein the carrier plate has an upper surface opposite to the working surface and connect the upper surface with the working one side surface of the surface, the heat pipe covers part of the upper surface, part of the working surface and part of the side surface; between the thermal plates. The three-dimensional printing device as claimed in claim 6 or claim 8, wherein the heat dissipation component further includes: a heat dissipation fin configured to be assembled on a heat surface of the cooling chip. A method for manufacturing a three-dimensional printing device, comprising: providing an accommodating groove for accommodating a light-curing material; assembling a light-transmitting plate adjacent to the accommodating groove; assembling a printing platform on one side of the light-transmitting plate ; assemble a projector on the other side of the light-transmitting plate; and assemble a heat dissipation component to be disposed adjacent to the accommodating groove, wherein the heat dissipation component includes a unique opening, wherein the heat dissipation component can provide a cooling fluid through the unique opening, It is used to directly cool a three-dimensional printed matter formed by the light-cured material.

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