TWI804391B - Gas sensing module - Google Patents

Gas sensing module Download PDF

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TWI804391B
TWI804391B TW111127508A TW111127508A TWI804391B TW I804391 B TWI804391 B TW I804391B TW 111127508 A TW111127508 A TW 111127508A TW 111127508 A TW111127508 A TW 111127508A TW I804391 B TWI804391 B TW I804391B
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gas
substrate
sensing module
accommodating space
light emitting
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TW111127508A
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TW202405421A (en
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王建評
翁榮懋
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國立臺北科技大學
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Abstract

A gas sensing module includes a base, a gas sensor, and a light emitting unit. The base comprises a receiving space and two openings which are on two opposite ends of the receiving space and in spatial communication with the receiving space. The gas sensor is deposited in the receiving space, and is applied for sensing the gas which passes through the openings and the receiving space. The gas sensor comprises a substrate and a sensor which is deposited on the substrate. The substrate is made of high thermally conductive material. The light emitting unit comprises a UV light emitting member which is deposited on the substrate near the gas sensor.

Description

氣體感測模組Gas Sensing Module

本發明是有關於一種感測模組,特別是指一種氣體感測模組。The present invention relates to a sensing module, in particular to a gas sensing module.

氣體感測模組的技術已廣泛應用在民生及工業領域。其感測原理包含電化學、紅外光、觸媒燃燒及半導體型感測機制,一種現有的氣體感測模組是採用半導體型感測機制,其接觸待測氣體時,待測氣體會因電子相互作用而進行選擇性吸附,感測器表面吸附氣體分子,作為電子的供體或受體,因此其感測機制包含電洞誘導傳導及電子誘導傳導,結果會造成感測元件輸出電阻訊號的改變,電阻的變化為氣體濃度的函數,利用此一關係來偵測氣體濃度。此種感測原理具有極佳的可靠性及再循環使用特性,然而感測器在使用後要達到氣體完全脫附需高達20~30分鐘,嚴重影響感測器之再啓動時間,因此尚有改良的空間。The technology of the gas sensing module has been widely used in the fields of people's livelihood and industry. Its sensing principle includes electrochemistry, infrared light, catalytic combustion and semiconductor-type sensing mechanism. An existing gas sensing module uses a semiconductor-type sensing mechanism. The surface of the sensor adsorbs gas molecules as electron donors or acceptors. Therefore, its sensing mechanism includes hole-induced conduction and electron-induced conduction, which will result in a change in the output resistance signal of the sensing element. Change, the change of resistance is a function of gas concentration, use this relationship to detect gas concentration. This sensing principle has excellent reliability and recycling characteristics. However, it takes up to 20-30 minutes for the sensor to completely desorb the gas after use, which seriously affects the restart time of the sensor, so there is still a problem. room for improvement.

因此,本發明之其中一目的,即在提供一種能解決上述至少一問題的氣體感測模組。Therefore, one object of the present invention is to provide a gas sensing module capable of solving at least one of the above problems.

於是,本發明氣體感測模組包含一基座,包括一容置空間及兩個位於相反兩端且連通該容置空間的開口;一氣體感測器,設置於該容置空間內,該氣體感測器包括一基板及一設置於該基板的感測件;及一發光單元,包括至少一設置於該基板且鄰近該感測件的UV發光件。Therefore, the gas sensing module of the present invention includes a base, including an accommodating space and two openings located at opposite ends and communicating with the accommodating space; a gas sensor is arranged in the accommodating space, the The gas sensor includes a substrate and a sensing element arranged on the substrate; and a light emitting unit including at least one UV light emitting element arranged on the substrate and adjacent to the sensing element.

在一些實施態樣中,該基座還包括一設置於該容置空間的反射板,該UV發光件發出的紫外光能透過該反射板聚集照射至該感測件。In some embodiments, the base further includes a reflective plate disposed in the accommodating space, and the ultraviolet light emitted by the UV light-emitting element can be concentrated and irradiated to the sensing element through the reflective plate.

在一些實施態樣中,該基座還包括一底板及一呈拱形的頂蓋,該底板及該頂蓋界定出該容置空間及該等開口。In some embodiments, the base further includes a bottom plate and an arched top cover, and the bottom plate and the top cover define the accommodating space and the openings.

在一些實施態樣中,該底板形呈一卡槽及兩個位於該卡槽兩側的溝槽,該卡槽供該氣體感測器的基板設置,該等溝槽供該反射板設置。In some embodiments, the bottom plate is shaped like a slot and two grooves on both sides of the slot, the slot is used for the substrate of the gas sensor, and the grooves are used for the reflection plate.

在一些實施態樣中,該反射板呈拱形並具有一朝向該發光單元的反射面,該反射面為曲面。In some implementation aspects, the reflective plate is arched and has a reflective surface facing the light emitting unit, and the reflective surface is a curved surface.

在一些實施態樣中,該基板上塗佈有導熱膠。In some implementation aspects, the substrate is coated with thermally conductive glue.

在一些實施態樣中,該UV發光件發出的紫外光波長介於200-400nm。In some embodiments, the wavelength of ultraviolet light emitted by the UV light-emitting element is between 200-400 nm.

在一些實施態樣中,該發光單元包括兩個UV發光件,分別設置於該感測件的兩旁。In some embodiments, the light emitting unit includes two UV light emitting elements, which are respectively arranged on two sides of the sensing element.

本發明至少具有以下功效:藉由該發光單元的該UV發光件設置於基板且鄰近該感測件,以及藉由該基板為高導熱材料製成,該UV發光件運作所產生的熱能用於加熱該感測件,提升該感測件的溫度以加速氣體從該感測件脫附的速率,進而縮短該感測件之回復時間而能夠再次使用,有效提升使用效率。而UV發光件的紫外光照射於該感測件同樣能夠加速氣體從該感測件脫附的速率,以縮短該感測件之回復時間。The present invention has at least the following effects: because the UV light-emitting element of the light-emitting unit is arranged on the substrate and adjacent to the sensing element, and the substrate is made of a high thermal conductivity material, the heat generated by the UV light-emitting element is used for The sensing element is heated to increase the temperature of the sensing element to accelerate the desorption rate of the gas from the sensing element, thereby shortening the recovery time of the sensing element so that it can be used again, effectively improving the use efficiency. The ultraviolet light of the UV light-emitting element irradiating the sensing element can also accelerate the desorption rate of the gas from the sensing element, so as to shorten the recovery time of the sensing element.

參閱圖1與圖2,本發明氣體感測模組10之一實施例,適用於家庭或工業廢氣之感測,例如CO、CO2、NO及NO2等。該氣體感測模組10包含一基座1、一氣體感測器2及一發光單元3。Referring to FIG. 1 and FIG. 2 , an embodiment of a gas sensing module 10 of the present invention is suitable for sensing household or industrial waste gases, such as CO, CO2, NO, and NO2. The gas sensing module 10 includes a base 1 , a gas sensor 2 and a light emitting unit 3 .

參閱圖1至圖3,基座1包括一底板11、一呈拱形的頂蓋12及一設置於該底板11的反射板15。該底板11及該頂蓋12界定出一容置空間13及兩個位於相反兩端且連通該容置空間13的開口14。該底板11形成一卡槽111及兩個位於該卡槽111兩側的溝槽112,該卡槽111供該氣體感測器2設置,該等溝槽112供該反射板15設置。該反射板15呈拱形且位於該容置空間13,並具有一朝向該底板11的反射面151,該反射面151為曲面。Referring to FIGS. 1 to 3 , the base 1 includes a bottom plate 11 , an arched top cover 12 and a reflector 15 disposed on the bottom plate 11 . The bottom plate 11 and the top cover 12 define an accommodating space 13 and two openings 14 located at opposite ends and communicating with the accommodating space 13 . The bottom plate 11 forms a slot 111 and two grooves 112 on both sides of the slot 111 , the slot 111 is used for the gas sensor 2 , and the grooves 112 are used for the reflection plate 15 . The reflecting plate 15 is arched and located in the accommodating space 13 , and has a reflecting surface 151 facing the bottom plate 11 , and the reflecting surface 151 is a curved surface.

參閱圖2至圖4,該氣體感測器2設置於該容置空間13內,用以檢測通過該等開口14及該容置空間13的氣體。該氣體感測器2包括一基板21及一設置於該基板21的感測件22,該基板21為高導熱材料製成,可例如為鋁金屬,但不以此為限制,感測件22是採用石墨烯,但同樣不以此為限制。該基板21上塗佈有導熱膠23,以進一步增加導熱性。本實施例所採用的氣體感測器2是採用半導體型感測機制,但不以此為限制,其工作原理如下:當待測氣體接觸氣體感測器2時,會因電子相互作用而進行選擇性吸附,感測件22表面吸附氣體分子,作為電子的供體或受體,因此其感測機制包含電洞誘導傳導及電子誘導傳導,結果會造成感測件22輸出電阻訊號的改變,電阻的變化為氣體濃度的函數,便可利用此一關係來偵測氣體濃度。發光單元3包括兩個設置於該基板21且鄰近該感測件22的UV發光件31,具體而言,該等UV發光件31分別設置於該感測件22的兩旁。每一UV發光件31是採用UV LED,其發出的紫外光波長介於200-400nm。UV發光件31運作所產生的熱能用於加熱該感測件22,提升該感測件22的溫度以加速氣體從該感測件22脫附的速率,進而縮短該感測件22之回復時間而能夠再次使用。而且UV發光件31能夠藉由反射板15呈拱型且位於UV發光件31上方,透過反射面151能將UV發光件31發出的紫外光反射後集中照射在該感測件22上,同樣能夠加速氣體從該感測件22脫附的速率,以縮短該感測件22之回復時間。其中,UV發光件31的數量並不以兩個為限制,在其他實施例中也可以為其他數量,只要至少一個且鄰近該感測件22即可。反射板15也不限於呈拱形,反射面151同樣不限於曲面,只要能夠將UV發光件31發出的紫外光反射後聚集於該感測件22之特性結構皆適用。Referring to FIGS. 2 to 4 , the gas sensor 2 is disposed in the accommodating space 13 for detecting the gas passing through the openings 14 and the accommodating space 13 . The gas sensor 2 includes a substrate 21 and a sensing element 22 disposed on the substrate 21. The substrate 21 is made of a material with high thermal conductivity, such as aluminum metal, but not limited thereto. The sensing element 22 Graphene is used, but it is not limited thereto. The substrate 21 is coated with a thermally conductive adhesive 23 to further increase thermal conductivity. The gas sensor 2 used in this embodiment adopts a semiconductor-type sensing mechanism, but it is not limited thereto. Selective adsorption, the surface of the sensing element 22 adsorbs gas molecules as electron donors or acceptors, so its sensing mechanism includes hole-induced conduction and electron-induced conduction, resulting in a change in the output resistance signal of the sensing element 22, The change in resistance is a function of gas concentration, and this relationship can be used to detect gas concentration. The light emitting unit 3 includes two UV light emitting elements 31 disposed on the substrate 21 and adjacent to the sensing element 22 , specifically, the UV light emitting elements 31 are respectively disposed on two sides of the sensing element 22 . Each UV light-emitting element 31 is a UV LED, which emits ultraviolet light with a wavelength of 200-400nm. The heat energy generated by the operation of the UV light emitting element 31 is used to heat the sensing element 22, increasing the temperature of the sensing element 22 to accelerate the rate of desorption of gas from the sensing element 22, thereby shortening the recovery time of the sensing element 22 and can be used again. Moreover, the UV luminous element 31 can be arched and positioned above the UV luminous element 31 by the reflecting plate 15, and the ultraviolet light emitted by the UV luminous element 31 can be reflected and concentrated on the sensing element 22 through the reflective surface 151. The desorption rate of the gas from the sensing element 22 is accelerated to shorten the recovery time of the sensing element 22 . Wherein, the number of UV light emitting elements 31 is not limited to two, and may be other numbers in other embodiments, as long as at least one is adjacent to the sensing element 22 . The reflecting plate 15 is not limited to being arched, and the reflecting surface 151 is also not limited to a curved surface, as long as the characteristic structure that can reflect the ultraviolet light emitted by the UV light emitting element 31 and gather it on the sensing element 22 is applicable.

參閱圖5,其說明了UV發光件31在不同操作功率下對該感測件22的溫度提升之效果,當UV發光件31的功率越大,該感測件22的溫度提升效果越好。接著參閱圖6,其說明了氣體感測器2在回復階段時(未加裝反射板15的條件),利用UV發光件31運作所產生的熱能對氣體感測器2進行加熱,由此觀察氣體感測器2溫度提升後對減少回復時間之影響,UV發光件31的功率愈高則代表氣體感測器2的溫度愈高。由實驗結果得知,氣體感測器2的溫度愈高,愈加速氣體之脫附速率,進而縮短感測器之回復時間。其中,NO ON代表開始通NO氣體讓氣體感測器2檢測,air代表檢測完成,到下一次的NO ON的時間間隔即代表回復時間。再參閱圖7,其說明是否設置該反射板15,對於氣體感測器2的回復時間之影響。由實驗結果比較得知,當UV發光件31功率由1.15W提升至3.6W時,在僅提升氣體感測器2溫度但未設置該反射板15的條件下,回復時間由896秒縮短至308秒,而當設置該反射板15後,回復時間則由896秒縮短至約110秒,縮短的幅度大幅增加。Referring to FIG. 5 , it illustrates the temperature raising effect of the UV light emitting element 31 on the sensing element 22 under different operating powers. The greater the power of the UV light emitting element 31 , the better the temperature raising effect of the sensing element 22 . Referring next to Fig. 6, it illustrates that the gas sensor 2 is in the recovery stage (the condition that the reflector 15 is not installed), and the heat energy generated by the operation of the UV light emitting element 31 is used to heat the gas sensor 2, thereby observing The temperature of the gas sensor 2 increases to reduce the recovery time. The higher the power of the UV light-emitting element 31 , the higher the temperature of the gas sensor 2 is. According to the experimental results, the higher the temperature of the gas sensor 2 is, the faster the desorption rate of the gas is, thereby shortening the recovery time of the sensor. Among them, NO ON means that the NO gas is started to be detected by the gas sensor 2, air means that the detection is completed, and the time interval until the next NO ON means the recovery time. Referring to FIG. 7 again, it illustrates the influence of whether the reflector 15 is provided on the recovery time of the gas sensor 2 . From the comparison of the experimental results, it is known that when the power of the UV light emitting element 31 is increased from 1.15W to 3.6W, the recovery time is shortened from 896 seconds to 308 seconds under the condition that the temperature of the gas sensor 2 is only increased but the reflector 15 is not installed. seconds, and when the reflecting plate 15 is installed, the recovery time is shortened from 896 seconds to about 110 seconds, and the shortening range is greatly increased.

綜上所述,本發明氣體感測模組10藉由該發光單元3的該UV發光件31設置於基板21且鄰近該感測件22,以及藉由該基板21為高導熱材料製成,該UV發光件31運作所產生的熱能用於加熱該感測件22,提升該感測件22的溫度以加速氣體從該感測件22脫附的速率,進而縮短該感測件22之回復時間而能夠再次使用,有效提升使用效率。而且UV發光件31能夠藉由反射板15呈拱型且位於UV發光件31上方,透過反射面151能將UV發光件31發出的紫外光反射後集中照射在該感測件22上,同樣能夠加速氣體從該感測件22脫附的速率,以縮短該感測件22之回復時間,故確實能達成本發明之目的。To sum up, the gas sensing module 10 of the present invention is provided with the UV light-emitting element 31 of the light-emitting unit 3 on the substrate 21 and adjacent to the sensing element 22, and the substrate 21 is made of a high thermal conductivity material, The heat energy generated by the operation of the UV light-emitting element 31 is used to heat the sensing element 22, increasing the temperature of the sensing element 22 to accelerate the desorption rate of the gas from the sensing element 22, thereby shortening the recovery of the sensing element 22 Time can be used again, effectively improving the efficiency of use. Moreover, the UV luminous element 31 can be arched and positioned above the UV luminous element 31 by the reflecting plate 15, and the ultraviolet light emitted by the UV luminous element 31 can be reflected and concentrated on the sensing element 22 through the reflective surface 151. The desorption rate of the gas from the sensing element 22 is accelerated to shorten the recovery time of the sensing element 22, so the purpose of the present invention can indeed be achieved.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。But what is described above is only an embodiment of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of the present invention.

10:氣體感測模組 1:基座 11:底板 111:卡槽 112:溝槽 12:頂蓋 13:容置空間 14:開口 15:反射板 151:反射面 2:氣體感測器 21:基板 22:感測件 23:導熱膠 3:發光單元 31:UV發光件 10: Gas sensing module 1: Base 11: Bottom plate 111: card slot 112: Groove 12: Top cover 13:Accommodating space 14: opening 15: reflector 151: reflective surface 2: Gas sensor 21: Substrate 22: Sensor 23: thermal adhesive 3: Lighting unit 31:UV light emitting parts

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是本發明氣體感測模組的一實施例的一立體圖; 圖2是該實施例的一立體分解圖; 圖3是該實施例的一前視圖; 圖4是該實施例的一部份俯視圖,其中一基座的一頂蓋及一反射板被省略; 圖5是一折線圖,說明UV發光件在不同操作功率下對該感測件的溫度提升之效果; 圖6是一折線圖,說明了氣體感測器在回復階段時(未加裝反射板的條件),利用UV 發光件運作所產生的熱能對感測器進行加熱,由此觀察氣體感測器溫度提升後對減少回復時間之影響;及 圖7是一折線圖,說明是否設置該反射板,對於氣體感測器的回復時間之影響。 Other features and effects of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a perspective view of an embodiment of the gas sensing module of the present invention; Fig. 2 is a three-dimensional exploded view of this embodiment; Fig. 3 is a front view of this embodiment; Fig. 4 is a part of the top view of this embodiment, wherein a top cover and a reflection plate of a base are omitted; Fig. 5 is a broken line diagram illustrating the effect of the UV light-emitting element on the temperature increase of the sensing element under different operating powers; Figure 6 is a broken line diagram illustrating that when the gas sensor is in the recovery stage (the condition without a reflector), the heat energy generated by the operation of the UV light-emitting element is used to heat the sensor, thereby observing the gas sensor The effect of increasing temperature on reducing recovery time; and FIG. 7 is a broken line diagram illustrating the influence of whether the reflector is provided on the recovery time of the gas sensor.

10:氣體感測模組 10: Gas sensing module

1:基座 1: Base

11:底板 11: Bottom plate

111:卡槽 111: card slot

112:溝槽 112: Groove

12:頂蓋 12: Top cover

13:容置空間 13:Accommodating space

14:開口 14: opening

15:反射板 15: reflector

2:氣體感測器 2: Gas sensor

Claims (7)

一種氣體感測模組,包含:一基座,包括一容置空間及兩個位於相反兩端且連通該容置空間的開口;一氣體感測器,設置於該容置空間內,用以檢測通過該等開口及該容置空間的氣體,該氣體感測器包括一基板及一設置於該基板的感測件,該基板為高導熱材料製成;及一發光單元,包括至少一設置於該基板且鄰近該感測件的UV發光件;其中,該基座還包括一設置於該容置空間的反射板,該UV發光件發出的紫外光能透過該反射板聚集照射至該感測件。 A gas sensing module, comprising: a base, including an accommodating space and two openings located at opposite ends and communicating with the accommodating space; a gas sensor, arranged in the accommodating space, for To detect the gas passing through the openings and the accommodating space, the gas sensor includes a substrate and a sensing element arranged on the substrate, the substrate is made of high thermal conductivity material; and a light emitting unit includes at least one The UV light-emitting element on the substrate and adjacent to the sensing element; wherein, the base also includes a reflective plate arranged in the accommodating space, and the ultraviolet light emitted by the UV light-emitting element can be concentrated and irradiated to the sensor through the reflective plate. test piece. 如請求項1所述的氣體感測模組,其中,該基座還包括一底板及一呈拱形的頂蓋,該底板及該頂蓋界定出該容置空間及該等開口。 The gas sensing module as claimed in claim 1, wherein the base further includes a bottom plate and an arched top cover, the bottom plate and the top cover define the accommodating space and the openings. 如請求項2所述的氣體感測模組,其中,該底板形成一卡槽及兩個位於該卡槽兩側的溝槽,該卡槽供該氣體感測器的基板設置,該等溝槽供該反射板設置。 The gas sensing module according to claim 2, wherein the base plate forms a slot and two grooves on both sides of the slot, the slots are used for the substrate of the gas sensor, and the grooves A groove is provided for the reflection plate. 如請求項2所述的氣體感測模組,其中,該反射板呈拱形並具有一朝向該發光單元的反射面,該反射面為曲面。 The gas sensing module as claimed in claim 2, wherein the reflection plate is arched and has a reflection surface facing the light emitting unit, and the reflection surface is a curved surface. 如請求項1所述的氣體感測模組,其中,該基板上塗佈有導熱膠。 The gas sensing module as claimed in item 1, wherein the substrate is coated with thermal conductive glue. 如請求項1所述的氣體感測模組,其中,該UV發光件發出的紫外光波長介於200-400nm。 The gas sensing module as claimed in item 1, wherein the ultraviolet light emitted by the UV light-emitting element has a wavelength of 200-400nm. 如請求項1所述的氣體感測模組,其中,該發光單元包括兩個UV發光件,分別設置於該感測件的兩旁。 The gas sensing module as claimed in item 1, wherein the light emitting unit includes two UV light emitting elements, which are respectively arranged on two sides of the sensing element.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109001283A (en) * 2018-09-27 2018-12-14 上海应用技术大学 A kind of self-constant temperature electrochemistry sheet-type gas sensor and preparation method thereof
TW202024604A (en) * 2018-12-27 2020-07-01 國立交通大學 Gas-sensing apparatus
CN113092545A (en) * 2021-04-13 2021-07-09 哈尔滨理工大学 Based on CuO/In2O3Preparation method of modified graphene MEMS gas sensor
CN113896901A (en) * 2021-10-25 2022-01-07 同济大学 Lead halide-based metal organic framework material, preparation and application thereof, ammonia gas sensor and intelligent sensing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109001283A (en) * 2018-09-27 2018-12-14 上海应用技术大学 A kind of self-constant temperature electrochemistry sheet-type gas sensor and preparation method thereof
TW202024604A (en) * 2018-12-27 2020-07-01 國立交通大學 Gas-sensing apparatus
CN113092545A (en) * 2021-04-13 2021-07-09 哈尔滨理工大学 Based on CuO/In2O3Preparation method of modified graphene MEMS gas sensor
CN113896901A (en) * 2021-10-25 2022-01-07 同济大学 Lead halide-based metal organic framework material, preparation and application thereof, ammonia gas sensor and intelligent sensing device

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