TWI804355B - Lens module and fabrication method thereof - Google Patents

Abstract

A lens module includes a circuit board, an image sensing chip, an isolated frame, an optical filter, an adhesive layer, and a holder. The circuit board includes a plurality of electronic components and at least one wire. The image sensing chip is disposed on the circuit board, and the wire connects the image sensing chip and the electronic components. The image sensing chip includes a sensing area. The isolated frame is attached to the image sensing chip. Further, the isolated frame has a lower edge and a upper edge opposite to each other, and the lower edge is disposed around the sensing area. The optical filter is attached to the upper edge of the isolated frame. The adhesive layer is coated on the electronic components and the wire. The holder has a bottom side. The bottom side is placed on the adhesive layer and corresponded to the electronic components. The holder and the circuit board are connected to each other by the adhesive layer.

Description

Lens module and manufacturing method thereof

The invention relates to a lens module and a manufacturing method thereof.

Generally speaking, many electronic products (such as electronic devices such as cameras, driving recorders, smart phones, tablet computers, or notebook computers) have lens modules to capture images outside the electronic products.

For the lens module, the most important thing is to capture clear images with correct focus. At present, the manufacturing process of the lens module mainly adopts the focusing method of Active Alignment (AA for short) for focusing. FIG. 1 is a schematic diagram of a conventional lens module 9 , please refer to FIG. 1 . The lens module 9 includes a lens group 91 , a holder 92 , a circuit board 93 , an image sensing chip 94 and a filter 95 . Wherein, the lens group 91 is placed in the base 92 , and the base 92 is disposed on the circuit board 93 , so that the lens group 91 corresponds to the image sensing chip 94 . Generally speaking, the method of active alignment and focusing is mainly to dispense glue on the circuit board 93 with an adhesive (such as a photocurable adhesive), and the bottom side of the base 92 is placed on the adhesive layer formed by the adhesive. Next, the base 92 is clamped by a jig, and the relative position of the lens group 91 and the base 92 is adjusted so that the object image falls on the image sensing chip 94 exactly. Finally, the relative positions of the lens group 91 , the base 92 and the image sensing chip 94 are fixed by gluing.

FIG. 2 is a top view of a conventional lens module, please refer to FIG. 2 . Due to the development of electronic products in the direction of thinner and smaller, the space for the lens module 9 to be set becomes smaller and smaller. For example, the circuit board 93 used in smart phones, tablet computers, or notebook computers has unlimited length in the X-axis direction, but its width in the Y-axis direction is limited by the housing of the electronic device. Likewise, the width of the base 92 in the Y-axis direction is subject to the same restriction. However, during the focusing step in the AA process, the position of the base 92 in the X-axis direction and the Z-axis direction (that is, the direction entering the paper) can only be adjusted, thereby reducing the focusing effect.

In addition, as shown in FIG. 1 , the filter 95 of the conventional lens module 9 is disposed in the base 92 and located between the lens group 91 and the image sensing chip 94 . There is a space between the filter 95 and the image sensing chip 94 , which may cause dust to fall onto the imaging surface of the image sensing chip 94 , thereby reducing the imaging effect.

In view of the above problems, the main purpose of the present invention is to provide a lens module and its manufacturing method, which can solve the focusing and imaging problems of the conventional lens module through the arrangement of a base and a filter .

To achieve the above object, the present invention provides a lens module, which includes a circuit board, an image sensing chip, an insulating frame, a filter, an adhesive layer and a base. The circuit board includes a plurality of electronic components and at least one wire. The image sensing chip is arranged on the circuit board, and the wires are connected to the image sensing chip and the electronic components. The image sensing chip includes a sensing area. The isolation frame is pasted on the image sensing chip, and the isolation frame has a lower edge and an upper edge opposite to each other, and the lower edge is arranged along the periphery of the sensing area. The optical filter is pasted on the upper edge of the insulating frame. The adhesive layer is coated on the electronic components and wires. The base has a bottom side. The bottom side is placed on the adhesive adhesive layer and corresponds to the electronic components. The base and the circuit board are connected to each other through an adhesive layer.

In order to achieve the above object, the present invention further provides a method for manufacturing a lens module, comprising the following steps: providing a circuit board, including a plurality of electronic components and at least one wire; providing an image sensing chip, which is arranged on the circuit board, and The wires are connected to the image sensing chip and the electronic components. The image sensing chip includes a sensing area; an insulating frame is pasted to the image sensing chip, and the insulating frame has opposite lower edges and an upper edge, and the lower edge is along the setting around the sensing area; sticking a filter to the upper edge of the insulating frame; coating an adhesive layer on the electronic components and wires; providing a base, and a bottom side of the base is placed on the adhesive layer, and corresponding to the electronic components; and the base and the circuit board are connected to each other through the adhesive layer.

According to an embodiment of the present invention, the adhesive layer is a light-cured adhesive layer, and after an inclination of the base is adjusted, the light-cured adhesive layer is cured to connect the base and the circuit board.

According to an embodiment of the present invention, the adhesive layer is a photocurable adhesive layer. The manufacturing method of the lens module further includes the following steps: clamping the base with a fixture, and adjusting an inclination of the base; and curing the light-cured adhesive layer to connect the base and the circuit board.

According to an embodiment of the present invention, the orthographic projection area of the base projected onto the circuit board partially overlaps with the electronic components.

According to an embodiment of the present invention, the base has two opposite side walls, a first distance exists between the two side walls, and a second distance exists between two of the electronic components located outside. The first distance is substantially equal to the second distance.

According to an embodiment of the present invention, a side length of the base along a Y-axis direction is smaller than a width of the circuit board.

According to an embodiment of the present invention, the insulating frame is made of plastic.

According to an embodiment of the present invention, the insulating frame is a dark plastic frame.

According to an embodiment of the present invention, the adhesive layer covers the insulating frame.

As mentioned above, according to the lens module and its manufacturing method of the present invention, the lens module includes a circuit board, an image sensor chip, an insulating frame, a filter, an adhesive layer and a base. Wherein, the insulating frame is pasted on the image sensing chip and arranged along the periphery of the sensing area of the image sensing chip, so as to prevent the sensing area from being polluted by the adhesive layer. In addition, the filter is pasted on the insulating frame, which can effectively prevent the dust in the base from falling to the sensing area of the image sensing chip, so as to improve the imaging effect. In addition, a bottom side of the base is placed on the adhesive layer and corresponds to the structure of the electronic component, so that the overall width of the base can be further reduced. Therefore, the inclination of the base in the Y-axis direction can still be adjusted to complete the focusing procedure and improve the resolution of the image.

In order to allow your review committee members to better understand the technical content of the present invention, the preferred specific embodiments are described as follows.

3A and 3B are schematic cross-sectional views of a lens module according to an embodiment of the present invention. FIG. 4 is a top view of the image sensing chip and the isolation frame shown in FIG. 3A . FIG. 5 is a lens module shown in FIG. 3A FIG. 6 is a flowchart of a method for manufacturing a lens module according to an embodiment of the present invention. It should be noted that FIG. 3A and FIG. 3B show the same component structure, and FIG. 3A is used to mark component symbols, while FIG. 3B is mainly used to illustrate the distribution positions of some components. Please refer to FIG. 3A , FIG. 4 , FIG. 5 and FIG. 6 . The lens module 1 of this embodiment includes a circuit board 10 , an image sensing chip 20 , an insulating frame 30 , a filter 40 , an adhesive layer 50 and a base 60 . The structure and connection relationship of each component will be further described below in combination with the steps of the manufacturing method of the lens module 1 shown in FIG. 6 .

Step S10 : providing a circuit board 10 .

The circuit board 10 of this embodiment includes a plurality of electronic components 11 and at least one wire 12 . Wherein, the electronic component 11 may be, for example but not limited to, passive components such as capacitors, resistors, diodes, triodes, and relays. The wire 12 can be a gold wire electrically connected to the electronic component 11 and/or the image sensing chip 20 .

Step S20 : providing an image sensor chip 20 disposed on the circuit board 10 .

In the present embodiment, the image sensing chip 20 can be disposed on the circuit board 10 by soldering or using surface mount technology (Surface Mount Technology, SMT for short). Next, the wires 12 are respectively connected to the image sensor chip 20 and the electronic element 11 by soldering. That is, the electronic component 11 and the image sensor chip 20 are electrically connected to each other through the wire 12 .

In this embodiment, the image sensing chip 20 may be, for example but not limited to, a Complementary Metal-Oxide-Semiconductor (CMOS) or a Charge-coupled Device (CCD) chip. Furthermore, the image sensing chip 20 includes a sensing region 21 . The sensing area 21 is located on a surface of the image sensing chip 20 opposite to the circuit board 10 , and can be used as an imaging surface, or called an imaging area.

Step S30 : Paste an insulating frame 30 to the image sensing chip 20 , and the lower edge 31 of the insulating frame 30 is arranged along the periphery of the sensing region 21 of the image sensing chip 20 .

In this embodiment, the insulating frame 30 has a lower edge 31 and an upper edge 32 opposite to each other. Wherein, the lower edge 31 of the isolation frame 30 corresponds to the periphery of the sensing area 21 of the image sensing chip 20, and the isolation frame 30 is pasted on the image sensing chip 20, as shown in FIG. 3A and FIG. 4 . Wherein, the isolation frame body 30 is arranged along the periphery of the sensing area 21, so that the isolation frame body 30 can surround the outside of the sensing area 21, thereby isolating the sensing area 21 to prevent the adhesive layer 50 from polluting the sensing area 21 ( Namely step S50).

Generally speaking, the sensing area 21 is a quadrangular area, so the isolation frame 30 may correspond to a quadrangular frame. However, the present embodiment does not limit the shape of the insulating frame 30, and may also be a circular, elliptical, other polygonal, or irregularly shaped frame, as long as the lower edge 31 of the insulating frame 30 is sufficient to surround the around the sensing area 21 , and the insulating frame 30 is located outside the sensing area 21 without covering the sensing area 21 .

In this embodiment, the material of the insulating frame 30 can be a plastic, which can be, for example but not limited to, polyvinyl chloride (Polyvinyl Chloride, PVC for short), or acrylonitrile-butadiene-styrene copolymer (Acrylonitrile Butadiene Styrene , abbreviated ABS). Preferably, the insulating frame 30 can also be a dark plastic frame, such as a black plastic frame. The dark plastic frame can achieve the effect of avoiding light scattering.

Before step S30, it is preferable to stick double-sided tape on the lower edge 31 of the insulating frame 30 in advance. In other words, one surface of the double-sided tape is pre-adhered to the lower edge 31 , and the other surface retains the release paper. In step S30 , the release paper of the double-sided adhesive tape is removed, and the insulating frame 30 is wrapped around the sensing region 21 and pasted to the image sensing chip 20 . When the sticking position of the insulating frame 30 deviates, or the sensing region 21 of the image sensing chip 20 needs to be cleaned, the insulating frame 30 using double-sided adhesive can be easily removed, so as to achieve a convenient effect in the manufacturing process. In addition, the feature of being easily disassembled enables the insulating frame 30 to be recycled and reused.

Step S40 : sticking a filter 40 to an upper edge 32 of the insulating frame 30 .

In step S30 , the insulating frame 30 is pasted to the image sensor chip 20 with the lower edge 31 so that the upper edge 32 faces upward. In step S40 , the filter 40 is directly pasted on the upper edge 32 of the insulating frame 30 , so as to prevent dust from falling into the sensing area 21 . This embodiment does not limit the pasting method between the filter 40 and the insulating frame 30 . For example, double-sided tape or other types of adhesive layers can be used to stick the optical filter 40 to the insulating frame 30 . Preferably, the area of the filter 40 may be larger than the area surrounded by the insulating frame 30 , so that the filter 40 completely covers the area of the insulating frame 30 in its vertical projection area.

In this embodiment, the filter 40 may be an infrared cut filter (IR-cut filter). Sticking the filter 40 directly to the upper edge 32 of the insulating frame 30 can effectively prevent the dust in the base 60 from falling to the sensing area 21 of the image sensing chip 20 to improve the imaging effect.

Step S50 : coating an adhesive layer 50 on the electronic components 11 and the wires 12 , and covering the insulating frame 30 with the adhesive layer 50 .

In this embodiment, the adhesive layer 50 is coated on the electronic components 11 and the wires 12 on the circuit board 10 . Specifically, the adhesive layer 50 of this embodiment may be a photocurable adhesive layer, for example, a photocurable adhesive layer formed of ultraviolet glue (ie, UV glue). Specifically, the adhesive layer 50 can be applied to the circuit board 10 by dispensing glue, covering the electronic components 11 and the wires 12 , and surrounding the image sensing chip 20 . After the adhesive layer 50 is cured (step S70 ), the adhesive layer 50 covers the structures of the electronic components 11 and the wires 12 , which can strengthen the ability of the wires 12 to resist bending. Since the size of the current lens device is becoming smaller and smaller, the lens device can be installed in various portable electronic products. Therefore, in many harsh environments with a lot of vibration and movement, the cured adhesive layer 50 can make the wire 12 difficult to detach from the electronic component 11 or It is the image sensing chip 20, which reduces the occurrence of electrical connection failures.

The adhesive layer 50 covers the insulating frame 30 . That is, the adhesive layer 50 can cover the upper surface of the image sensing chip 20 and the sidewall of the isolation frame 30 , as shown in FIG. 3A . As mentioned above, since the insulating frame 30 is disposed along the periphery of the sensing region 21 of the image sensing chip 20, even if the adhesive layer 50 surrounds the periphery of the image sensing chip 20, it will not overflow into the sensing region 21. The imaging of the image sensing chip 20 will not be affected.

Step S60 : providing a base 60 , and a bottom side 611 of the base 60 is placed on the adhesive layer 50 and corresponds to the electronic component 11 .

The base 60 includes a base 61 and a barrel portion 62 , and the base 61 has a bottom side 611 . In this embodiment, the size of the base 61 (ie the range of the bottom side 611 ) can just frame all the electronic components 11 . In step S60 , the base 61 is first matched to the electronic component 11 , and the bottom side 611 is placed on the adhesive layer 50 . At this time, the bottom side 611 may correspond to a part of the electronic component 11 , that is, the bottom side 611 is located above the part of the electronic component 11 . It should be noted that the circuit board 10 shown in FIG. 3A has two electronic components 11 , so the bottom side 611 is located above the two electronic components 11 . In other embodiments, if the circuit board 10 has more electronic components 11 , the bottom side 611 can be placed above the outer electronic components 11 , so that the orthographic projection area of the base 60 partially overlaps with the electronic components 11 .

Preferably, the area of the orthographic projection of the base 60 projected onto the circuit board 10 in this embodiment can cover all the electronic components 11 . As shown in Figure 3B, the base 61 of the base 60 has two opposite side walls 612, and the area of the orthographic projection of the base 60 on the circuit board 10 is the area included between the two side walls 612. The areas covered by elements 11 are the same (ie overlap). In other embodiments, the orthographic area of the base 60 projected onto the circuit board 10 partially overlaps with the outer electronic components 11, that is, the orthographic area of the base 60 is slightly smaller than the area covered by the two outer electronic components 11. area. In other words, as shown in FIG. 3B , there is a first distance D1 between the two sidewalls 612 of the base 61 (ie, the width of the base 61 of the base 60 ). In addition, there is a second distance D2 between two of the outer electronic components 11 . Preferably, the first distance D1 in this embodiment is substantially equal to the second distance D2. In other embodiments, the first distance D1 may be slightly greater than the second distance D2.

With the base 61 of the base 60 corresponding to the structure of the electronic component 11, compared with the base 92 of the conventional lens module 9 (as shown in FIG. 1 ), the overall area and width of the base 60 of this embodiment are smaller. for reduction. Specifically, according to the structure of the conventional lens module 9 , the orthographic area of the base 92 projected onto the circuit board 93 is significantly larger than the area covered by the electronic components. In other words, the second distance D2 between the two sidewalls of the base 92 is significantly greater than the first distance D1 between the two electronic components, as shown in FIG. 1 . As shown in FIG. 3B, the second distance D2 between the two side walls of the base 61 of this embodiment can be slightly greater than or substantially equal to the first distance D1 between the two electronic components 11, thereby achieving the effect of reducing the area and width .

As shown in FIG. 5 , since the base 60 in this embodiment is further reduced, the length L of one side of the base 60 in the Y-axis direction is smaller than a width W of the circuit board 10 . Therefore, there is still room for adjustment in the Y-axis direction of the base 60 (in step S62 ).

Furthermore, the lens module 1 further includes a lens group 70 disposed on the lens barrel portion 62 . In one embodiment, the lens group 70 may be disposed in the barrel portion 62 before the step S60. In step S60 , place the base 60 together with the inner lens group 70 on the adhesive layer 50 . In another embodiment, after step S60 , the lens group 70 can be disposed in the lens barrel portion 62 , and then enter step S62 to adjust the inclination of the base 60 .

It should be noted that the adhesive layer 50 in step S60 has not been cured, for example, it has not been pre-cured by light irradiation, nor has it been cured by baking. Therefore, the relative positions among the base 60 , the lens group 70 and the image sensor chip 20 can still be adjusted, as in step S62 .

Step S62 : Clamp the base 60 with a clamp, and adjust an inclination of the base 60 .

In this embodiment, the base 60 is clamped by a fixture (for example, a robot arm), thereby adjusting the inclination of the base 60, so that the lens group 70 is simultaneously adjusted to have its optical axis perpendicular to the image sensing chip 20. The position of the sensing area 21 is used to achieve the effect of focusing.

As mentioned above, since the side length L of the base 60 in this embodiment in the Y-axis direction is smaller than the width W of the circuit board 10 (as shown in FIG. 5 ), the inclination of the base 60 in the Y-axis direction can still be controlled. Adjust to fully focus the program and improve the resolution of the image. Specifically, the conventional lens module 9 can only adjust the inclination of the base 92 in the X-axis direction and the Z-axis direction (ie, the direction entering the paper) during the focusing procedure. However, in this embodiment, the inclination of the base 60 can be adjusted in the X-axis direction, the Y-axis direction, and the Z-axis direction, so that the focusing procedure can be improved and the resolution of the image can be improved.

Step S70 : the base 60 and the circuit board 10 are connected to each other through the adhesive layer 50 .

After the inclination of the base 60 is adjusted, the base 60 and the circuit board 10 can be connected to each other by curing the adhesive layer 50 . Specifically, the adhesive layer 50 of this embodiment is a photocurable adhesive layer, so the adhesive layer 50 can be pre-cured by irradiating ultraviolet light first. Then, for example, bake the adhesive layer 50 at 80° C. to heat-cure it to connect the base 60 and the circuit board 10, thereby fixing the relative positions of the image sensing chip 20, the base 60 and the lens group 70, and completing the lens. Fabrication of module 1.

To sum up, according to the lens module and its manufacturing method of the present invention, the lens module includes a circuit board, an image sensor chip, an insulating frame, a filter, an adhesive layer and a base. Wherein, the insulating frame is pasted on the image sensing chip and arranged along the periphery of the sensing area of the image sensing chip, so as to prevent the sensing area from being polluted by the adhesive layer. In addition, the filter is pasted on the insulating frame, which can effectively prevent the dust in the base from falling to the sensing area of the image sensing chip, so as to improve the imaging effect. In addition, a bottom side of the base is placed on the adhesive layer and corresponds to the structure of the electronic component, so that the overall width of the base can be further reduced. Therefore, the inclination of the base in the Y-axis direction can still be adjusted to complete the focusing procedure and improve the resolution of the image.

It should be noted that the above-mentioned embodiments are examples for the convenience of description, and the scope of rights claimed by the present invention should be determined by the scope of the patent application, rather than limited to the above-mentioned embodiments.

1, 9: Lens module

10, 93: circuit board

11: Electronic components

12: wire

20, 94: Image sensor chip

21: Sensing area

30: Insulation frame

31: lower edge

32: upper edge

40, 95: filter

50: Adhesive layer

60, 92: base

61: base

611: bottom side

612: side wall

62: barrel part

70, 91: lens group

D1: first distance

D2: second distance

L: side length

S10～S70: Steps

W: width

X: axis direction

Y: axis direction

Z: axis direction

FIG. 1 is a schematic diagram of a conventional lens module. FIG. 2 is a top view of a conventional lens module. 3A and 3B are schematic cross-sectional views of a lens module according to an embodiment of the present invention. FIG. 4 is a top view of the image sensing chip and the isolation frame shown in FIG. 3A . FIG. 5 is a top view of the lens module shown in FIG. 3A . FIG. 6 is a flowchart of a manufacturing method of a lens module according to an embodiment of the present invention.

1: Lens module

10: Circuit board

11: Electronic components

12: wire

20: Image sensor chip

21: Sensing area

30: Insulation frame

31: lower edge

32: upper edge

40: filter

50: Adhesive layer

60: base

61: base

611: bottom side

612: side wall

62: barrel part

70: Lens group

Claims (14)

A lens module, comprising: a circuit board, including a plurality of electronic components and at least one wire; an image sensor chip, arranged on the circuit board, and the wire is connected to the image sensor chip and these electronic components, the image sensor The detection chip includes a sensing area; an insulating frame body, which is pasted on the image sensing chip, and the insulating frame body has opposite lower edges and an upper edge, and the lower edge is arranged along the periphery of the sensing area; an optical filter, pasted on the upper edge of the insulating frame; an adhesive layer, coated on the electronic components and the wires, the adhesive layer is a light-cured adhesive layer; and a base, with a bottom side, the The bottom side is placed on the adhesive layer and corresponds to the electronic components. After an inclination of the base is adjusted, the photocurable adhesive layer is cured to connect the base and the circuit board, so that the base and the circuit board The plates are connected to each other by this adhesive layer. The lens module according to claim 1, wherein the orthographic projection area of the base projected onto the circuit board partially overlaps with the electronic components. The lens module as described in Claim 1, wherein the base has two opposite side walls, there is a first distance between the two side walls, and there is a second distance between the two electronic components located on the outside, and the first The distance is substantially equal to the second distance. The lens module according to claim 1, wherein a side length of the base in a Y-axis direction is smaller than a width of the circuit board. The lens module according to claim 1, wherein the insulating frame is made of plastic. The lens module according to claim 5, wherein the insulating frame is a dark plastic frame. The lens module according to claim 1, wherein the adhesive layer covers the insulating frame. A method of manufacturing a lens module, comprising the following steps: providing a circuit board, including a plurality of electronic components and at least one wire; providing an image sensing chip, which is arranged on the circuit board, and the wire is connected to the image sensing chip and For these electronic components, the image sensing chip includes a sensing region; an insulating frame is pasted to the image sensing chip, and the insulating frame has opposite lower edges and an upper edge, and the lower edge is along the sensing area. setting around the measuring area; affixing a filter to the upper edge of the insulating frame; coating an adhesive layer on the electronic components and the wires, the adhesive layer being a light-cured adhesive layer; providing a base, and A bottom side of the base is placed on the adhesive layer and corresponds to the electronic components; the base is clamped by a clamp, and an inclination of the base is adjusted; and curing the photocurable adhesive layer to connect the base and the circuit board, so that the base and the circuit board are connected to each other through the adhesive layer. The manufacturing method of the lens module according to claim 8, wherein the orthographic projection area of the base projected onto the circuit board partially overlaps with the electronic components. The manufacturing method of the lens module as described in Claim 8, wherein the base has two opposite side walls, there is a first distance between the two side walls, and there is a second distance between the two electronic components located outside, the The first distance is substantially equal to the second distance. The manufacturing method of the lens module according to claim 8, wherein a length of the base in a Y-axis direction is smaller than a width of the circuit board. The manufacturing method of the lens module as claimed in item 8, wherein the insulating frame is made of plastic. The method for manufacturing a lens module according to claim 12, wherein the insulating frame is a dark plastic frame. The manufacturing method of the lens module according to claim 8, wherein the adhesive layer covers the insulating frame.

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