TWI802809B - Light waveguide connecting assembly and optical module including light waveguide connecting assembly - Google Patents

Abstract

A light waveguide connecting assembly is provided. The light waveguide connecting assembly includes a holding element, an optical fiber, a connecting element and an optical index matching element. The holding element includes a first portion and a second portion. The first portion is located at one side of a optical device. The second portion is located above the optical device. The optical fiber is fixed in the first portion. The connecting element is disposed between the second portion and the optical device. The optical index matching element is disposed between the optical fiber and the optical device. A light is transmittable between the optical fiber and the optical element through the optical index matching element. The light waveguide connecting assembly is fixed on the optical device through the connecting element and the optical index matching element. An optical module including light waveguide connecting assembly is also provided.

Description

Optical waveguide connection components and optical modules including optical waveguide connection components

The present disclosure relates to an optical waveguide connection component and an optical module including the optical waveguide connection component. Further, the present disclosure relates to a suspended optical waveguide connection component and an optical module having the suspended optical waveguide connection component.

FIG. 1 is a side view of a conventional optical module 1 . As shown in FIG. 1 , the optical module 1 has an optical waveguide connection assembly 10 and an optical element 20 . The optical waveguide connection assembly 10 has a holder 11 and an optical fiber 12 , and the holder 11 is used to fix the optical fiber 12 . The optical waveguide connection assembly 10 is connected to the optical element 20 and arranged on the circuit board 60, the optical coefficient adjustment member 40 is arranged between the optical fiber 12 and the optical element 20, and the light can pass through the optical fiber 12 of the optical waveguide connection assembly 10, the optical coefficient adjustment member 40 and optical element 20.

In the conventional optical module 1, in order to fix the relative position of the optical waveguide connection assembly 10 and the optical element 20, so that the optical fiber 12 of the optical waveguide connection assembly 10 is aligned with the optical waveguide structure (not shown) of the optical element 20, A carrier 30 must be provided to carry the optical waveguide connection assembly 10 and the optical element 20 .

However, since the carrier 30 and the circuit board 60 carrying the optical waveguide connection assembly 10 and the optical element 20 are different components, the connection between the optical waveguide connection assembly 10 and the optical element 20 is easily warped by the carrier 30 or the circuit board 60 Influenced by curvature, or by the connection state of the optical waveguide connection assembly 10 and the carrier 30 .

In other words, the difference in the coefficient of thermal expansion (CTE) of the carrier 30 and the circuit board 60 may cause the carrier 30 and the circuit board 60 to warp in different degrees due to the thermal influence in the manufacturing process, thereby causing the optical waveguide connection components An error occurs in the connection between the optical fiber 12 of 10 and the optical waveguide structure of the optical element 20 . Or, the connection between the optical waveguide connection assembly 10 and the carrier 30 is, for example, made of a resin 50, and the amount, position or distribution of the resin 50 may cause errors in the manufacturing process, affecting the connection state of the optical waveguide connection assembly 10 and the carrier 30. , thereby causing errors in the connection between the optical fiber 12 of the optical waveguide connection assembly 10 and the optical waveguide structure of the optical element 20 .

The above "prior art" description is only to provide background technology, and does not acknowledge that the above "prior art" description discloses the subject of this disclosure, and does not constitute the prior art of this disclosure, and any description of the above "prior art" shall not form any part of this case.

Embodiments of the disclosure provide an optical waveguide connecting component connected to an optical element. The optical waveguide connection assembly includes: a holding element, an optical fiber, a connecting element and an optical coefficient adjusting element. The holder has a first part and a second part. The first part is located on one side of the optical element, and the second part is located on the optical element. The optical fiber is fixed to the first part. The connecting piece is arranged between the second part and the optical element. The optical coefficient adjustment piece is arranged between the optical fiber and the optical element, so that light can be transmitted between the optical fiber and the optical element through the optical coefficient adjustment piece. Wherein, the optical waveguide connecting component is fixed to the optical element through the connecting piece and the optical coefficient adjusting piece.

In some embodiments, the connecting element is spaced apart from the optical coefficient adjusting element.

In some embodiments, the holding member further has a first groove disposed on the second portion for preventing the connecting member from contacting the optical coefficient adjusting member.

In some embodiments, the holder further has a second groove disposed on the second portion and spaced from the first groove, the first groove is close to the connecting component, and the second groove is close to the optical coefficient adjustment component.

In some embodiments, the optical element is a non-flip-chip photonic integrated circuit or a flip-chip photonic integrated circuit.

In some embodiments, the first portion of the holder has a first side and a second side opposite to the first side, the second side facing the optical element.

In some embodiments, the optical fiber has a protrusion protruding from the second side.

In some embodiments, the optical coefficient adjustment member is disposed between the protrusion and the optical element.

In some embodiments, the thermal expansion coefficients of the holder and the optical element are substantially the same or close.

In some embodiments, the coefficient of thermal expansion of the holder ranges between 0.5 ppm/°C and 10 ppm/°C, and the coefficient of thermal expansion of the optical element ranges between 0.5 ppm/°C and 10 ppm/°C.

In some embodiments, the connecting part is epoxy, and the optical coefficient adjusting part is index matching fluid.

Embodiments of the present disclosure provide an optical module including: a substrate, an optical element, and the optical waveguide connection assembly as in the above embodiments. Optical components are on top of the substrate. The optical waveguide connection component is on the substrate and connected with the optical element.

In the present disclosure, the holder of the optical waveguide connection component has a first part and a second part, the first part is located on one side of the optical element, and the second part is located on the optical element. By directly connecting the optical waveguide connection component to the optical element, there is no need to additionally arrange a carrier to carry the optical waveguide connection component, thereby reducing material costs and simplifying the manufacturing process of the optical module.

In addition, by connecting the optical waveguide connection component to the optical element, it is also possible to avoid warping of the carrier and the circuit board in the conventional structure due to the heat in the manufacturing process, which causes the optical waveguide connection component and the optical The problem of the docking error of components and the change of temperature-related characteristics. Specifically, the present disclosure can avoid structural docking errors caused by redundant components that vary with temperature by reducing required components.

The technical features and advantages of the present disclosure have been broadly summarized above, so that the following detailed description of the present disclosure can be better understood. Other technical features and advantages constituting the subject matter of the claims of the present disclosure will be described below. Those skilled in the art of the present disclosure should understand that the concepts and specific embodiments disclosed below can be easily used to modify or design other structures or processes to achieve the same purpose as the present disclosure. Those with ordinary knowledge in the technical field to which the disclosure belongs should also understand that such equivalent constructions cannot depart from the spirit and scope of the disclosure defined by the appended claims.

Embodiments or examples of the disclosure shown in the drawings are described in specific language. It should be understood that no limitation of the scope of the present disclosure is intended. Any variation or modification of the described embodiments and any further application of the principles described herein would normally occur to those of ordinary skill in the art relevant to the present disclosure. Reference numerals may be repeated in each embodiment, but even if they have the same reference numerals, features in one embodiment are not necessarily used in another embodiment.

It should be understood that although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited to these term. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Therefore, a first element, component, region, layer or section described below may be referred to as a second element, component, region, layer or section without departing from the teaching content of the disclosed inventive concepts.

The terms used in this disclosure are for the purpose of describing specific exemplary embodiments only, and are not intended to limit the concept of the present invention. As used herein, the singular forms "a" and "the" are also intended to include the plural unless the context clearly dictates otherwise. It should be understood that the word "comprising" used in the specification refers specifically to the presence of stated features, integers, steps, operations, elements or components, but does not exclude the presence of one or more other features, integers, steps, operations, elements, components or components. the existence of its group.

FIG. 2 is a side view of an optical module 2 of the present disclosure. In some embodiments, the optical module 2 has, for example, an optical waveguide connection assembly 200 and an optical element 210 . The optical waveguide connection assembly 200 is connected to an optical element 210 . The optical element 210 is, for example, a photonic integrated circuit (PIC) with an optical waveguide structure (not shown), and its structure is not limited. The light generated by the light source can pass through the optical waveguide structure, exit from the periphery of the optical element 210 (for example, but not limited to, the side connected to the optical fiber 202 of the optical waveguide connection component 200) or receive an externally input light source, and enter through the optical fiber 202 to optical element 210. It should be noted that the optical element 210 can be, for example, a flip-chip package or a non-flip-chip package structure. Herein, the optical element 210 is illustrated by taking the flip-chip package structure as an example, but it is not intended to limit the present invention. The optical waveguide structure (not shown) of the optical element 210 may be located at a relatively lower side of the optical element 210 .

In some embodiments, the optical module 2 may further have a substrate (Substrate) 230 and a circuit board 220 , for example, the optical element 210 is disposed on the substrate 230 and then electrically connected to the circuit board 220 . The materials of the substrate 230 and the circuit board 220 may be the same or different. The substrate 230 may be a carrier without a circuit, or an interposer with a circuit structure, or a circuit board.

In some embodiments, the optical waveguide connection assembly 200 has a holding member 201 , an optical fiber 202 , a connecting member 203 and an optical coefficient adjusting member 204 .

The holder 201 has a first portion 201a and a second portion 201b. The first portion 201 a is located on one side of the optical element 210 (for example, the side connected to the optical waveguide structure of the optical element 210 ), and the second portion 201 b is located on the optical element 210 . In some embodiments, the first part 201a may further have a cover (for example, located on the lower side of the first part 201a) and a slot structure (not shown), the cover and the slot structure are combined to form the first part 201a, and by By opening and closing the cover, the optical fiber 202 can be installed and detached in the slot structure. It is worth mentioning that the shape of the holder 201 is not limiting, but the principle is that the first portion 201 a of the holder 201 can make the optical fiber 202 connect with the optical waveguide structure (not shown) of the optical element 210 . Certainly, considering the stability requirement of the structure of the holder 201 , the volume ratio of the first part 201 a and the second part 201 b of the holder 201 can be designed in different ways. In addition, in some embodiments, the holder 201 can use a material whose thermal expansion coefficient is substantially the same or similar to that of the optical element 210 , so as to further reduce structural errors caused by heat effects during manufacturing or product use. In some embodiments, the coefficient of thermal expansion of the holder 201 may range between 0.5 ppm/°C and 10 ppm/°C. In some embodiments, the coefficient of thermal expansion of optical element 210 may range between 0.5 ppm and 10 ppm. In some embodiments, the coefficient of thermal expansion of the holder 201 may be in the range of greater than 0.5 ppm/°C and less than 10 ppm/°C. In some embodiments, the coefficient of thermal expansion of the optical element 210 may be in the range of greater than 0.5 ppm/°C and less than 10 ppm/°C. In other words, the holder 201 and the optical element 210 can use materials with the same thermal expansion coefficient (for example, both use a thermal expansion coefficient of 3 ppm/°C), or the holder 201 and the optical element 210 can use materials with close thermal expansion coefficients (for example, the holder 201 A material with a thermal expansion coefficient of 3.25 ppm/°C is used, and the optical element 210 uses a material with a thermal expansion coefficient of 2.6 ppm/°C). In some embodiments, the entire or partial material of the holder 201 may be glass, plastic or other suitable materials. In some embodiments, the first part 201a and the second part 201b can be integrally formed of the same material. In some other embodiments, the material of the main structure of the holder 201 may be plastic, and the material of the above-mentioned cover part of the first part 201a may be glass.

The optical fiber 202 is fixed on the first part 201 a of the holder 201 , one end 202 a is exposed from the first part 201 a, and the other end 202 b is connected to the optical element 210 through the optical coefficient adjustment part 204 . Here, one optical fiber 202 is taken as an example for illustration, but it is not limiting. In some embodiments, the optical waveguide connection assembly 200 may have a plurality of optical fibers 202 to form an optical fiber array.

The connecting piece 203 is disposed between the second portion 201 b of the holder 201 and the optical element 210 , and the connecting piece 203 is used for fixing and overhanging the optical waveguide connection assembly 200 on the optical element 210 . In some embodiments, the optical waveguide connection assembly 200 or the second portion 201b of the optical waveguide connection assembly 200 is directly adhered to the optical element 210 through the connection member 203 . The material of the connecting member 203 can be, for example, epoxy, solder or other suitable connection or adhesive materials. It is worth mentioning that the optical waveguide connection assembly 200 is connected to the optical element 210 through the connector 203 and is located on the periphery of the optical element 210, for example, the first part 201a is located on one side of the optical element 210, and the second part 201b is located on the side of the optical element 210 superior. On the other hand, the optical waveguide connection assembly 200 is not in contact with the substrate 230 and the circuit board 220 .

The optical coefficient adjustment member 204 is disposed between the optical fiber 202 and the optical element 210 , and the optical coefficient adjustment member 204 is used for fixing the optical waveguide connection assembly 200 to the optical element 210 . In some embodiments, the optical waveguide connection assembly 200 or the first portion 201 a of the optical waveguide connection assembly 200 is directly adhered to one side of the optical element 210 through the optical coefficient adjustment member 204 . The optical coefficient adjustment member 204 is, for example, an index matching fluid. The light is transmitted between the optical fiber 202 and the optical element 210 through the optical coefficient adjustment member 204 . In other words, the light emitted from the optical element 210 first passes through the optical coefficient adjustment element 204 and then enters the optical fiber 202 , or the light incident from the optical fiber 202 first passes through the optical coefficient adjustment element 204 and then enters the optical element 210 . The refractive index of the optical fiber 202 and the optical waveguide structure of the optical element 210 can be matched by the optical coefficient adjustment member 204 , thereby reducing the loss of light and improving the performance of signal transmission. Furthermore, the optical coefficient (for example, the refractive index) of the optical coefficient adjustment member 204 is determined by the optical coefficient of the optical fiber 202 and the optical coefficient of the optical waveguide structure (not shown) of the optical element 210 .

To sum up, compared with the conventional optical module 1 as shown in FIG. 1 , in the optical module 2 of the present disclosure, the holder 201 of the optical waveguide connection component 200 has a first portion 201a located on the side of the optical element 210 and the second portion 201b located on the optical element 210 . In this way, since the optical waveguide connection assembly 200 is directly connected to the optical element 210 (for example, suspended above the optical element 210), the disclosed optical module 2 does not need an additional carrier to carry the optical waveguide connection assembly 200, thereby reducing The material cost can simplify the manufacturing process of the optical module 2 .

In addition, the optical module 2 of the present disclosure can also avoid the thermal influence of the different carriers and substrates (as shown in FIG. 1 ) in the conventional structure by connecting the optical waveguide connection component 200 and the optical element 210 , Different degrees of warpage are generated, resulting in the problem of docking errors between the optical waveguide connection assembly 200 and the optical element 210 . Specifically, the optical module 2 of the present disclosure can avoid structural docking errors caused by redundant components that vary with temperature by reducing required components (for example, carriers).

FIG. 3 is a side view of another optical module 3 of the present disclosure. The optical module 3 has, for example, an optical waveguide connection assembly 300 and an optical element 310 . The optical waveguide connection assembly 300 has a holder 301 , an optical fiber 302 , a connector 303 and an optical coefficient adjustment member 304 . Wherein, the optical element 310, the optical fiber 302, the connector 303 and the optical coefficient adjustment member 304 are similar in structure to the optical element 210, the optical fiber 202, the connector 203 and the optical coefficient adjustment member 204 of the optical module 2 in FIG. Let me repeat.

The difference between the optical module 3 and the optical module 2 in FIG. 2 is that the holder 301 further has a first groove 301c disposed on the second part 301b, and the first groove 301c is used to prevent the connecting member 303 from contacting the optical coefficient adjustment member 304 . The shape of the first groove 301c is not limited, and its cross-sectional shape can be square, triangular, circular or other shapes.

Therefore, in addition to the above-mentioned various functions of the optical module 3 , the connecting member 303 can only be disposed in a predetermined area through the first groove 301c of the holding member 301 . In other words, the first groove 301c can be used as a stop structure for the connector 303. When the connector 303 is a fluid epoxy or solder, the first groove 301c of the holder 301 can prevent the connector 303 from overflowing the second groove. A groove 301c is in contact with the optical coefficient adjustment member 304 to cause contamination of the optical coefficient adjustment member 304 .

FIG. 4 is a side view of another optical module 4 of the present disclosure. The optical module 4 has, for example, an optical waveguide connection assembly 400 and an optical element 410 . The optical waveguide connection assembly 400 has a holder 401 , an optical fiber 402 , a connector 403 and an optical coefficient adjustment member 404 . The structures of the optical element 410 , the connecting element 403 and the optical coefficient adjusting element 404 are similar to those of the optical element 210 , the connecting element 203 and the optical coefficient adjusting element 204 of the optical module 2 shown in FIG. 2 , and will not be repeated here.

The difference between the optical module 4 and the optical module 2 in FIG. 2 is that both ends 402a, 402b of the optical fiber 402 are exposed by the first part 401a. In other words, the end 402 b (or called the protrusion) of the optical fiber 402 connected to the optical coefficient adjustment member 404 is exposed from the first portion 401 a of the holder 401 and can be covered by the optical coefficient adjustment member 404 . That is, the first part 401a of the holder 401 has a first side and a second side opposite to the first side, the second side is facing the optical element 410, and the protrusion (ie, the end 402b) that the optical fiber 402 has is extended from the second side. Two sides protrude, and the optical coefficient adjustment member 404 is disposed between the protruding part and the optical element 410 .

Therefore, in addition to the above-mentioned various functions of the optical module 4, the optical fiber 402 is exposed on one side of the first part 401a of the holder 401, which can reduce the docking process of the optical waveguide connection assembly 400 and the optical element 410. difficulty, and can increase the accuracy of the connection between the optical waveguide connection assembly 400 and the optical element 410 . That is, since the optical fiber 402 has a protruding portion (i.e., the end 402b) exposed on one side of the first part 401a, the position of the optical fiber 402 is visible, and the docking process with the optical waveguide structure (not shown) of the optical element 410 is difficult It can be reduced while increasing the docking accuracy.

FIG. 5 is a side view of another optical module 5 of the present disclosure. The optical module 5 includes, for example, an optical waveguide connection assembly 500 and an optical element 510 . The optical waveguide connection assembly 500 has a holder 501 , an optical fiber 502 , a connector 503 and an optical coefficient adjustment member 504 . Wherein, the structures of the optical element 510 , the connecting element 503 and the optical coefficient adjusting element 504 are similar to those of the optical element 210 , the connecting element 203 and the optical coefficient adjusting element 204 of the optical module 2 in FIG. 2 , and will not be repeated here.

The difference between the optical module 5 and the optical module 2 in FIG. 2 is that the holder 501 further has a first groove 501c disposed on the second part 501b, and both ends 502a, 502b of the optical fiber 502 are exposed from the first part 501a. In other words, the end 502 b of the optical fiber 502 connected to the optical coefficient adjustment member 504 is exposed from the first portion 501 a of the optical waveguide connection assembly 500 and can be covered by the optical coefficient adjustment member 504 . In addition, the shape of the first groove 501c is not limited, and its cross-sectional shape may be square, triangular, circular or other shapes.

Therefore, in addition to having the above-mentioned various functions of the optical module 2, the optical module 5 can also have the functions of the optical modules 3 and 4, that is, the first groove 501c is used as the stop structure of the connecting piece 503, when When the connecting piece 503 is a fluid epoxy resin or solder, the first groove 501c can prevent the connecting piece 503 from overflowing the first groove 501c and contacting the optical coefficient adjusting member 504, thus causing contamination of the optical coefficient adjusting member 504 . Furthermore, since the optical fiber 502 has a protruding portion (ie, the end 502b) exposed on one side of the first part 501a, the position of the optical fiber 502 is visible, and the process of connecting it with the optical waveguide structure (not shown) of the optical element 510 The difficulty can be reduced while increasing the docking accuracy.

FIG. 6 is a side view of another optical module 6 of the present disclosure. The optical module 6 has, for example, an optical waveguide connection assembly 600 and an optical element 610 . The optical waveguide connection assembly 600 has a holder 601 , an optical fiber 602 , a connector 603 and an optical coefficient adjustment member 604 . Wherein, the optical fiber 602 and the connector 603 are similar in structure to the optical fiber 202 and the connector 203 of the optical module 2 in FIG. 2 , and will not be repeated here.

The difference between the optical module 6 and the optical module 2 in FIG. 2 is that the optical element 610 is, for example, a non-flip-chip package structure. Therefore, the optical waveguide structure (not shown) of the optical element 610 may be located at a relatively upper position, and the volume of the first portion 601a of the optical waveguide connection component 600 located on the side of the optical element 610 can be reduced. Furthermore, the connecting member 603 is spaced apart from the optical coefficient adjusting member 604 , and a part of the optical coefficient adjusting member 604 may extend to the upper surface of the optical element 610 , that is, the same surface as the connecting member 603 .

Therefore, the optical module 6 of the present disclosure can be applied not only to the flip-chip package structure, but also to the non-flip-chip package structure, and can also have the above-mentioned various functions as the optical module 2 .

FIG. 7 is a side view of another optical module 7 of the present disclosure. The optical module 7 has, for example, an optical waveguide connection assembly 700 and an optical element 710 . The optical waveguide connection assembly 700 has a holder 701 , an optical fiber 702 , a connector 703 and an optical coefficient adjustment member 704 . Wherein, the structure of the optical element 710, the optical fiber 702, the connector 703 and the optical coefficient adjustment member 704 is similar to that of the optical element 610, the optical fiber 602, the connector 603 and the optical coefficient adjustment member 604 of the optical module 6 in FIG. Let me repeat.

The difference between the optical module 7 and the optical module 6 in FIG. 6 is that: the holder 701 further has a first groove 701c disposed on the second portion 701b. The shape of the first groove 701c is not limited, and its cross-sectional shape can be square, triangular, circular or other shapes.

Therefore, in addition to having various functions as the optical module 6 , the connecting member 703 can only be disposed in a predetermined area through the first groove 701 c of the holding member 701 . In other words, the first groove 701c can be used as a stop structure for the connector 703. When the connector 703 is a fluid epoxy or solder, the first groove 701c of the holder 701 can prevent the connector 703 from overflowing the second groove. A groove 701c is in contact with the optical coefficient adjustment member 704 , causing contamination of the optical coefficient adjustment member 704 .

FIG. 8 is a side view of another optical module 8 of the present disclosure. The optical module 8 has, for example, an optical waveguide connection assembly 800 and an optical element 810 . The optical waveguide connection assembly 800 has a holder 801 , an optical fiber 802 , a connector 803 and an optical coefficient adjustment member 804 . Wherein, the optical element 810, the optical fiber 802, the connector 803 and the optical coefficient adjustment member 804 are similar in structure to the optical element 710, the optical fiber 702, the connector 703 and the optical coefficient adjustment member 704 of the optical module 7 in FIG. Let me repeat.

The difference between the optical module 8 and the optical module 7 in FIG. 7 is that the holder 801 further has a second groove 801d disposed on the second portion 801b, and the second groove 801d is spaced apart from the first groove 801c. The first groove 801c is close to the connecting member 803 , and the second groove 801d is close to the optical coefficient adjusting member 804 . The shape of the second groove 801d is not limited, and it may be the same as or different from the shape of the first groove 801c, and the cross-sectional shape may be square, triangular, circular or other shapes. The second groove 801d is used to prevent the optical coefficient adjusting member 804 from contacting the connecting member 803 .

Therefore, in addition to the various functions of the optical module 8 , the optical coefficient adjustment member 804 can only be disposed in a predetermined area through the second groove 801 d of the holder 801 . In other words, the first groove 801c can be used as a stop structure for the connecting part 803, and the second groove 801d can be used as a stopping structure for the optical coefficient adjustment part 804. When the connecting part 803 is a fluid epoxy or solder, by holding The first groove 801c of the member 801 can prevent the connecting member 803 from overflowing the first groove 801c, and at the same time, the second groove 801d of the holder 801 can prevent the optical coefficient adjustment member 804 from overflowing the second groove 801d, thereby enabling It is ensured that the connecting piece 803 does not come into contact with the optical coefficient adjusting member 804 , so as to prevent the connecting piece 803 and the optical coefficient adjusting member 804 from being in contact with each other to cause pollution.

FIG. 9 is a side view of another optical module 9 of the present disclosure. The optical module 9 has, for example, an optical waveguide connection assembly 900 and an optical element 910 . The optical waveguide connection assembly 900 has a holder 901 , an optical fiber 902 , a connector 903 and an optical coefficient adjustment member 904 . Wherein, the holder 901, the optical element 910, the connector 903 and the optical coefficient adjustment member 904 are similar in structure to the holder 801, the optical element 810, the connector 803 and the optical coefficient adjustment member 804 of the optical module 8 in FIG. This will not be repeated here.

The difference between the optical module 9 and the optical module 8 in FIG. 8 is that both ends 802a, 802b of the optical fiber 802 are exposed by the first part 801a. In other words, the end 902 b of the optical fiber 802 connected to the optical coefficient adjustment member 904 is exposed from the first portion 901 a of the holder 901 and can be covered by the optical coefficient adjustment member 904 . That is, the first portion 901a of the holder 901 has a first side and a second side opposite to the first side, the second side faces the optical element 910, and the optical fiber 902 has a protruding portion (i.e., the end 902b) extending from the second side. Two sides protrude, and the optical coefficient adjustment member 904 is disposed between the protruding part and the optical element 910 .

Therefore, in addition to the above-mentioned various functions of the optical module 9, the optical fiber 902 is exposed to the first part 901a of the holder 901, which can reduce the difficulty of the docking process between the optical waveguide connection assembly 900 and the optical element 910, And it can increase the docking accuracy of the optical waveguide connection assembly 900 and the optical element 910 . That is, since the optical fiber 902 has a protrusion (i.e., the end 902b) exposed on one side of the first part 901a, the position of the optical fiber 902 is visible, and the docking process with the optical waveguide structure (not shown) of the optical element 910 is difficult It can be reduced while increasing the docking accuracy.

Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and substitutions can be made without departing from the spirit and scope of the present disclosure as defined by the claims. For example, many of the processes described above can be performed in different ways and replaced by other processes or combinations thereof.

Furthermore, the scope of the present application is not limited to the specific embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. Those skilled in the art can understand from the disclosure content of this disclosure that existing or future-developed processes, machinery, manufacturing, and materials that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used according to this disclosure composition, means, method, or steps. Accordingly, such processes, machines, manufacturing, material compositions, means, methods, or steps are included in the patent scope of this application.

1,2,3,4,5,6,7,8,9: optical modules 10,200,300,400,500,600,700,800,900: Optical waveguide connection components 11,201,301,401,501,601,701,801,901: holding parts 12,202,302,402,502,602,702,802,902: optical fiber 20,210,310,410,510,610,710,810,910: optical components 30: carrier 50: Resin 60: circuit board 201a, 301a, 401a, 501a, 601a, 701a, 801a, 901a: Part I 201b, 301b, 401b, 501b, 601b, 701b, 801b, 901b: Part II 202a, 202b, 402a, 402b, 502a, 502b, 902a, 902b: terminal 203,303,403,503,603,703,803,903: connectors 204,304,404,504,604,704,804,904: optical coefficient adjustment parts 220: circuit board 230: Substrate 301c, 501c, 701c, 801c, 901c: the first ditch 801d, 901d: the second ditch

When referring to the detailed description and considering the drawings in combination with the patent scope of the application, the disclosure content of the application can be more fully understood, and the same component symbols in the drawings refer to the same components. FIG. 1 is a side view of a conventional optical module. FIG. 2 is a side view of an optical module of the present disclosure. FIG. 3 is a side view of another optical module of the present disclosure. FIG. 4 is a side view of another optical module of the present disclosure. FIG. 5 is a side view of another optical module of the present disclosure. FIG. 6 is a side view of another optical module of the present disclosure. FIG. 7 is a side view of another optical module of the present disclosure. FIG. 8 is a side view of another optical module of the present disclosure. FIG. 9 is a side view of another optical module of the present disclosure.

2: Optical module

200: Optical waveguide connection components

201: Holder

202: optical fiber

202a, 202b: terminal

203: connector

204: Optical coefficient adjustment piece

210: Optical components

201a: Part I

201b: Part II

220: circuit board

230: Substrate

Claims (12)

An optical waveguide connection assembly, which is connected to an optical element, includes: a holder, which has a first part and a second part, the first part is located on one side of the optical element, and the second part is located on the side of the optical element An optical fiber, which is fixed to the first part; a connector, connected to the second part and the optical element; and an optical coefficient adjustment element, which is arranged between the optical fiber and the optical element, so that light can pass through The optical coefficient adjustment part is transmitted between the optical fiber and the optical element, wherein the optical waveguide connection component is fixed and suspended on the optical element through the connection part and the optical coefficient adjustment part. The optical waveguide connection assembly as claimed in claim 1, wherein the connection part is spaced apart from the optical coefficient adjustment part. The optical waveguide connection assembly as claimed in claim 1, wherein the holding member further has a first groove disposed on the second portion for preventing the connecting member from contacting the optical coefficient adjustment member. The optical waveguide connection assembly as described in claim 3, wherein the holding member further has a second groove, which is arranged on the second portion and spaced apart from the first groove, the first groove is close to the connecting member, and the second groove is arranged at a distance from the first groove. The second groove is close to the optical coefficient adjustment member. The optical waveguide connection assembly as claimed in item 1, wherein the optical element is a non-flip-chip photon Integrated circuits or flip-chip photonic integrated circuits. The optical waveguide connection assembly as claimed in claim 1, wherein the first portion of the holder has a first side and a second side opposite to the first side, and the second side faces the optical element. The optical waveguide connection assembly as claimed in claim 6, wherein the optical fiber has a protrusion protruding from the second side. The optical waveguide connection assembly as claimed in claim 7, wherein the optical coefficient adjustment member is disposed between the protruding portion and the optical element. The optical waveguide connection assembly as claimed in claim 1, wherein the thermal expansion coefficients of the holder and the optical element are substantially the same or close to each other. The optical waveguide connection assembly as claimed in claim 1, wherein the thermal expansion coefficient of the holder is in the range between 0.5ppm/°C and 10ppm/°C, and the thermal expansion coefficient of the optical element is between 0.5ppm/°C and 10ppm/°C range. The optical waveguide connection assembly as claimed in claim 1, wherein the connection member is epoxy, and the optical coefficient adjustment member is index matching fluid. An optical module, comprising: a substrate; An optical component on the substrate; the optical waveguide connection assembly according to any one of Claims 1 to 11, which is on the substrate and connected to the optical component.

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