TWI802314B - Server, water cooling assembly, water cooling plate assembly - Google Patents

Abstract

A water-cooling plate assembly is used for assembly by a pick-and-place tool. The water-cooling plate assembly includes a cold plate body and an auxiliary bracket. The auxiliary bracket is installed on the cold plate body, and has a combination hole, which is used for assembling the pick-and-place tool.

Description

Servers, water cooling components, water cooling plate components

The invention relates to a server, a water cooling assembly, and a water cooling plate assembly.

Generally speaking, a computer or server mainly includes a casing, a power supply, a motherboard, a central processing unit, a display card, and an expansion card. The power supply and the motherboard are installed in the casing, and the central processing unit, display card and expansion card are installed on the motherboard. When the computer is running, the central processing unit is responsible for data calculation, and the display card is responsible for image calculation, both of which will generate a lot of heat. Therefore, computer manufacturers generally install additional fans to dissipate heat from the central processing unit or graphics card.

However, the heat dissipation performance of the fan has been difficult to meet the heat dissipation requirements of the current computer or server. Therefore, how to further improve the heat dissipation efficiency of the computer or the server has become a major design issue.

The present invention provides a server, a water-cooling assembly, and a water-cooling plate assembly, so as to improve the heat dissipation efficiency of a computer or a server.

The water-cooled plate assembly disclosed in an embodiment of the present invention is used for assembly of a pick-and-place tool. The water cooling plate assembly includes a cold plate body and an auxiliary bracket. The auxiliary bracket is installed on the main body of the cold plate, and has a combination hole, which is used for assembly of pick-and-place tools.

The water-cooling assembly disclosed in another embodiment of the present invention includes a plurality of first cold plate bodies, a plurality of second cold plate bodies, a water separator, a first water inlet pipeline, a plurality of first communication pipelines, Multiple second water inlet pipelines, multiple second water outlet pipelines and multiple second communication pipelines. Each of the first cold plate bodies has a first water inlet and a first water outlet. Each of the second cold plate bodies has a second water inlet and a second water outlet. The water distributor has an external water inlet joint, an external water outlet joint, multiple internal water inlet joints and multiple internal water outlet joints. The internal water inlet joints communicate with the external water intake joints, and the internal water outlet joints communicate with the external water outlet joints. The first water inlet pipeline connects one of the inner water inlet joints with the first water inlet of one of the first cold plate bodies. The first water outlet pipeline connects one of the internal water outlet joints with the first water outlet of the other first cold plate body. The first communication pipes are respectively connected to the first water inlet and the first water outlet of the other two different first cold plate bodies. The second water inlet pipes are connected to the remaining inner water inlet joints and the second water inlets of the second cold plate bodies. The second water outlet pipes are connected to the remaining internal water outlet joints and the second water outlets of the second cold plate bodies. These second communication pipes are respectively connected to the second water inlet and the second water outlet of the other two different second cold plate bodies.

A server disclosed in another embodiment of the present invention includes a casing, a main board, multiple display chips, multiple bridge chips and a water-cooling component. The motherboard is arranged on the casing. These display chips are arranged on the motherboard. The bridging chips are arranged on the mainboard and bridge the display chips. The water cooling component is arranged on the casing. The water-cooling assembly includes a plurality of first cold plate bodies, a plurality of second cold plate bodies, a water separator, a first water inlet pipeline, a plurality of first communication pipelines, a plurality of second water inlet pipelines, a plurality of The second water outlet pipeline and multiple second communication pipelines. Each of the first cold plate bodies has a first water inlet and a first water outlet. Each of the second cold plate bodies has a second water inlet and a second water outlet. The water distributor has an external water inlet joint, an external water outlet joint, multiple internal water inlet joints and multiple internal water outlet joints. The internal water inlet joints communicate with the external water intake joints, and the internal water outlet joints communicate with the external water outlet joints. The first water inlet pipeline connects one of the inner water inlet joints with the first water inlet of one of the first cold plate bodies. The first water outlet pipeline connects one of the internal water outlet joints with the first water outlet of the other first cold plate body. The first communication pipes are respectively connected to the first water inlet and the first water outlet of the other two different first cold plate bodies. The second water inlet pipes are connected to the remaining inner water inlet joints and the second water inlets of the second cold plate bodies. The second water outlet pipes are connected to the remaining internal water outlet joints and the second water outlets of the second cold plate bodies. These second communication pipes are respectively connected to the second water inlet and the second water outlet of the other two different second cold plate bodies.

According to the server, water-cooling component, and water-cooling plate component of the above-mentioned embodiments, by adding a water-cooling component in the server, the configuration of the fan is reduced or the speed of the fan is reduced to reduce the noise of the server when the cooling requirement is met.

In addition, due to the large specific heat capacity and high thermal conductivity of the coolant, the heat transfer efficiency of the coolant is 1000-3000 times that of air. In this way, the water-cooling components are installed on the main heat source in the server, and the remaining heat sources can still be cooled by air cooling, so as to greatly improve the heat dissipation efficiency of the server.

In addition, because the heat dissipation efficiency per unit volume of water cooling is better than that of air cooling, under the same heat dissipation performance, the overall volume of water cooling components is smaller than that of air cooling components, making it less likely that water cooling components will interfere with the rest of the server. Disassembly and assembly of parts.

In addition, the first cold plate body and the second cold plate body are integrated in the same water separator. In addition to reducing the number of quick connectors used while satisfying the heat dissipation performance, the coolant can be preferentially passed through the high power consumption The second cold plate body corresponding to the chip is shown to improve the heat dissipation performance of the water cooling assembly.

In addition, an auxiliary bracket is added to the cold plate body to reduce the difficulty of assembling the cold plate body through pick-and-place tools.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

See Figures 1 through 4. FIG. 1 is a perspective view of a server 10 according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of the server 10 in FIG. 1 . FIG. 3 is a schematic perspective view of the water cooling assembly 500 in FIG. 2 . FIG. 4 is a three-dimensional schematic view of the water-cooled plate assembly in FIG. 2 .

The server 10 of this embodiment includes a casing 100 , a motherboard 200 , a plurality of display chips 300 , a plurality of bridge chips 400 and a water cooling component 500 .

The case 100 includes a casing 110 , a cover 120 , a carrier 130 and an assembly frame 140 . The casing 110 is used for accommodating parts such as the motherboard 200 . The cover 120 is detachably mounted on the casing 110 to cover the motherboard 200 and other components. The supporting frame 130 is detachably mounted on the casing 110 and is used for carrying part of the water-cooling assembly 500 . The assembly frame 140 is detachably mounted on the casing 110 and surrounds with the casing 110 a space for the pipelines of the water-cooling assembly 500 to pass through.

The motherboard 200 is disposed on the casing 110 of the casing 110 . Both the display chips 300 and the bridge chips 400 are disposed on the motherboard 200 , and the bridge chips 400 bridge the display chips 300 .

In this embodiment, eight display chips 300 are taken as an example, but it is not limited thereto. In other embodiments, the number of display chips can also be changed to six or other numbers. In addition, the number of bridge chips 400 is six as an example, but not limited thereto. In other embodiments, the number of bridge chips can also be changed to four or other numbers.

The water-cooling assembly 500 is disposed on the casing 100 and includes a plurality of first cold plate bodies 600, a plurality of second cold plate bodies 700, a water separator 800, a first water inlet pipeline 910, a first water outlet pipeline 920, A plurality of first communication pipelines 930 , a plurality of second water inlet pipelines 940 , a plurality of second water inlet pipelines 940 and a plurality of second communication pipelines 960 . The first cold plate bodies 600 are thermally coupled to the bridging chips 400 respectively. Each of the first cold plate bodies 600 has a first water inlet 610 and a first water outlet 620 . In addition, the number of the first cold plate bodies 600 matched with the number of the bridging chips 400 is, for example, six, and they are arranged in a straight line.

The second cold plate bodies 700 are thermally coupled to the display chips 300 respectively. Each of the second cold plate bodies 700 has a second water inlet 710 and a second water outlet 720 . In addition, the number of the second cold plate bodies 700 matches the number of the display chips 300 , for example eight, and they are arranged in a 2*4 array.

In this embodiment, the first cold plate body 600 and the second cold plate body 700 are integrated, which can achieve the effects of self-sealing and no dripping.

The water separator 800 is stacked on the supporting frame 130 and has an external water inlet joint 810 , an external water outlet joint 820 , a plurality of inner water inlet joints 830 and a plurality of inner water outlet joints 840 . The inner water inlet joints 830 communicate with the outer water inlet joints 810 , and the inner water outlet joints 840 communicate with the outer water outlet joints 820 .

The first water inlet pipe 910 connects one of the inner water inlet joints 830 with the first water inlet 610 of one of the first cold plate bodies 600 . The first water outlet pipeline 920 connects one of the internal water outlet joints 840 with the first water outlet 620 of the other first cold plate body 600 . The first communication pipes 930 are respectively connected to the first water inlet 610 and the first water outlet 620 of the other two different first cold plate bodies 600 . The second water inlet pipes 940 are connected to the remaining inner water inlet joints 830 and the second water inlets 710 of the second cold plate bodies 700 . The second water outlet pipes 950 are connected to the remaining internal water outlet joints 840 and the second water outlets 720 of the second cold plate bodies 700 . The second communication pipes 960 are respectively connected to the second water inlet 710 and the second water outlet 720 of the other two different second cold plate bodies 700 .

In this embodiment, the server 10 may further include a fan module 1100 . The fan module 1100 is installed in the casing 100 and is used to generate a cooling air flow to the motherboard 200 .

In this embodiment, the server 10 may further include a plurality of auxiliary racks 1000 . The auxiliary brackets 1000 are fixed to the first cold plate body 600 and the second cold plate body 700 by screws, for example, and have a combination hole 1010 . Each auxiliary bracket 1000 together with the cold plate body constitutes a water-cooled plate assembly.

See Figures 5 through 6. 5 and 6 are schematic diagrams of the assembly of the water-cooled plate assembly and the pick-and-place tool 20 of FIG. 4 .

As shown in FIG. 5 , the user prepares to assemble the pick-and-place tool 20 on the auxiliary bracket 1000 of the water-cooled plate assembly. The pick-and-place tool 20 includes a holding part 22 , an operating part 24 and a restoring part 26 . The handle 22 surrounds a portion of the operating member 24 . The operating member 24 is slidably disposed on the holding member 22 , and one end of the operating member 24 has a locking structure 25 . One end of the reset member 26 is fixed to the holding member 22 , and the other end of the reset member 26 is fixed to the operating member 24 , so that the locking structure 25 is normally located relatively close to the holding member 22 .

Next, as shown in FIG. 6 , the user presses down the operating member 24 relative to the holding member 22 along the direction A, and makes the locking structure 25 pass through the coupling hole 1010 of the auxiliary bracket 1000 . Next, the user turns the operating member 24 along the direction B, so that the locking structure 25 is hooked on the auxiliary bracket 1000 . In this way, the user can use the pick-and-place tool 20 to lift up the cold plate body and lower the cold plate body.

In this embodiment, the pick-and-place tool 20 is in the form of a single locking structure 25 , so that the pick-and-place tool 20 can pick and place a single cold plate body at a time, but it is not limited thereto. In other embodiments, the pick-and-place tool can also be in the form of a multi-lock structure, so that the pick-and-place tool can pick and place multiple cold plate bodies at one time.

According to the server, water-cooling component, and water-cooling plate component of the above-mentioned embodiments, by adding a water-cooling component in the server, the configuration of the fan is reduced or the speed of the fan is reduced to reduce the noise of the server when the cooling requirement is met.

In addition, due to the large specific heat capacity and high thermal conductivity of the coolant, the heat transfer efficiency of the coolant is 1000-3000 times that of air. In this way, the water-cooling components are installed on the main heat source in the server, and the remaining heat sources can still be cooled by air cooling, so as to greatly improve the heat dissipation efficiency of the server.

In addition, because the heat dissipation efficiency per unit volume of water cooling is better than that of air cooling, under the same heat dissipation performance, the overall volume of water cooling components is smaller than that of air cooling components, making it less likely that water cooling components will interfere with the rest of the server. Disassembly and assembly of parts.

In addition, the first cold plate body and the second cold plate body are integrated in the same water separator. In addition to reducing the number of quick connectors used while satisfying the heat dissipation performance, the coolant can be preferentially passed through the high power consumption The second cold plate body corresponding to the chip is shown to improve the heat dissipation performance of the water cooling assembly.

In addition, an auxiliary bracket is added to the cold plate body to reduce the difficulty of assembling the cold plate body through pick-and-place tools.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10:Server 20: Pick and place tools 22: Grip 24: Operating parts 25: Lock structure 26:Reset 100: Chassis 110: shell 111: slotting 120: cover body 130: carrying frame 140: assembly frame 200: Motherboard 300: display chip 400: bridge chip 500: water cooling components 600: The first cold plate body 610: the first water inlet 620: the first water outlet 700: The second cold plate body 710: Second water inlet 720: Second water outlet 800: water separator 810: external water connection 820: External water outlet connector 830: Internal water connection 840: Inner water outlet connector 910: The first water inlet pipeline 920: the first water outlet pipeline 930: the first connecting pipeline 940: The second water inlet pipeline 950: the second water outlet pipeline 960: the second connecting pipeline 1000: auxiliary bracket 1010: binding hole 1100: Fan module

FIG. 1 is a perspective view of a server according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of the server of FIG. 1 . FIG. 3 is a three-dimensional schematic diagram of the water cooling assembly in FIG. 2 . FIG. 4 is a three-dimensional schematic view of the water-cooled plate assembly in FIG. 2 . 5 and 6 are schematic diagrams of the assembly of the water-cooled plate assembly and the pick-and-place tool of FIG. 4 .

10:Server

110: shell

111: slotting

120: cover body

130: carrying frame

140: assembly frame

200: Motherboard

300: display chip

400: bridge chip

500: water cooling components

600: The first cold plate body

610: the first water inlet

620: the first water outlet

700: The second cold plate body

710: Second water inlet

720: Second water outlet

800: water separator

810: external water connection

820: External water outlet connector

830: Internal water connection

840: Inner water outlet connector

910: The first water inlet pipeline

920: the first water outlet pipeline

930: the first connecting pipeline

940: The second water inlet pipeline

950: the second water outlet pipeline

960: the second connecting pipeline

1100: Fan module

Claims (9)

A water-cooled plate assembly is used for assembly of a pick-and-place tool. The water-cooled plate assembly includes: a cold plate body; and an auxiliary bracket, which is installed on the cold plate body and has a combination hole. Used for assembly of the pick-and-place tool, the combining hole is in-line. The water-cooled plate assembly as described in Claim 1, wherein the cold plate body is integrated, and has an accommodating chamber, a water inlet and a water outlet, and the water inlet and the water outlet communicate with the accommodating chamber. A water cooling assembly, the water cooling assembly includes: a plurality of first cold plate bodies, each having a first water inlet and a first water outlet; a plurality of second cold plate bodies, each having a second water inlet and a second Water outlet; a water separator, which has an external water inlet joint, an external water outlet joint, a plurality of inner water inlet joints and a plurality of inner water outlet joints, and these inner water inlet joints are connected to the outer water inlet Connectors, and the inner water outlet joints are connected to the outer water outlet joints; a first water inlet pipeline connects one of the inner water inlet joints with the first water inlet of one of the first cold plate bodies; A water outlet pipeline connects one of the internal water outlet joints with the first water outlet of the other first cold plate body; a plurality of first communication pipelines connects the remaining two different first cold plate bodies respectively The first water inlet and the first water outlet; a plurality of second water inlet pipes, connecting the remaining inner water inlet joints and the second water inlets of the second cold plate bodies; A plurality of second water outlet pipes are connected to the remaining internal water outlet joints and the second water outlets of the second cold plate bodies; a plurality of second communication pipes are respectively connected to the remaining two different second cold plate bodies. The second water inlet and the second water outlet of the plate body; and at least one auxiliary bracket, the at least one auxiliary bracket is installed on the first cold plate body, and has a combination hole, which is used for a Put the tools to assemble, the combination hole is in-line. The water-cooling assembly according to claim 3, wherein the number of the first cold plate bodies is six and arranged in a straight line. The water-cooling assembly as described in Claim 4, wherein the number of the second cold plate bodies is eight and arranged in a 2*4 array. A server, comprising: a case; a main board disposed on the case; a plurality of display chips disposed on the main board; a plurality of bridge chips disposed on the main board and bridging the display chips; and A water-cooling assembly is arranged on the casing, and the water-cooling assembly includes: a plurality of first cold plate bodies, respectively thermally coupled to the bridging chips, and each having a first water inlet and a first water outlet; Two cold plate bodies are respectively thermally coupled to the display chips, and each has a second water inlet and a second water outlet; A water separator with an external water inlet joint, an external water outlet joint, a plurality of inner water inlet joints and a plurality of inner water outlet joints, the inner water inlet joints are connected to the outer water inlet joint, and The inner water outlet joints are connected to the outer water outlet joint; a first water inlet pipeline connects one of the inner water inlet joints with the first water inlet of one of the first cold plate bodies; a first water outlet pipe Road, connecting one of the internal water outlet joints with the first water outlet of the other first cold plate body; a plurality of first communication pipes, respectively connecting the second first cold plate bodies of the other two different first cold plate bodies A water inlet and the first water outlet; a plurality of second water inlet pipes, connecting the remaining inner water inlet joints and the second water inlets of the second cold plate bodies; a plurality of second water outlet pipes , to connect the rest of the internal water outlet joints with the second water outlets of the second cold plate bodies; a plurality of second communication pipes, respectively connected to the second inlets of the two different second cold plate bodies Water outlet and the second water outlet; and at least one auxiliary bracket, the at least one auxiliary bracket is installed on the first cold plate body, and has a combination hole, the combination hole is used for assembly of a pick-and-place tool, the combination hole For a font. The server according to claim 6, wherein the number of the first cold plate bodies is six and arranged in a straight line. The server according to claim 7, wherein the number of the second cold plate bodies is eight and arranged in a 2*4 array. The server as described in claim 6 further includes a fan module installed in the case and used to generate a cooling air flow blown to the main board.

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