TWI802139B - Adhesive member and electronic device including the same - Google Patents
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- TWI802139B TWI802139B TW110146117A TW110146117A TWI802139B TW I802139 B TWI802139 B TW I802139B TW 110146117 A TW110146117 A TW 110146117A TW 110146117 A TW110146117 A TW 110146117A TW I802139 B TWI802139 B TW I802139B
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本揭示是關於一種膠合件,特別是關於一種將兩殼體結合的膠合件及包含該膠合件的電子裝置。The disclosure relates to a glued part, in particular to a glued part combining two casings and an electronic device including the glued part.
隨著科技的進步,多數的電子產品皆朝輕薄化及美觀發展。因此,許多的原有設計必須因應受限的空間而進行改良。例如電子裝置的殼體將無法再使用螺絲或卡勾鎖固,而是以膠體來替代傳統的鎖固方式與加強結構。With the advancement of technology, most electronic products are becoming thinner and more beautiful. Therefore, many original designs have to be improved in response to the limited space. For example, the casing of an electronic device can no longer be locked with screws or hooks, but instead of the traditional locking method and reinforcement structure, glue is used.
然而,由於電子裝置在運送途中的溫度及濕度等環境因素不一致,容易導致量產機種產生開膠(即黏合不全而膠體剝離)的問題。However, due to the inconsistent environmental factors such as temperature and humidity during the transportation of electronic devices, it is easy to cause the problem of glue peeling (ie, glue peeling due to incomplete adhesion) in mass-produced models.
另外,若電子裝置具有顯示螢幕,更經常發生水氣滲入螢幕的問題。電子裝置的設計者雖嘗試以餘裕設計(over design)的方式,增加膠體的黏貼面積、或黏貼量,但僅能達到防潑水的效果,而無法將內部的水氣排出電子裝置的殼體外側,進而損害電子裝置內部的電子零件,或是因溼氣進入顯示器與玻璃蓋板之間,而使顯示螢幕產生水痕。In addition, if the electronic device has a display screen, the problem of water vapor infiltrating into the screen is more likely to occur. Although designers of electronic devices try to increase the sticking area or amount of glue by over design, they can only achieve the anti-splashing effect, but cannot discharge the internal water vapor out of the shell of the electronic device. , and then damage the electronic components inside the electronic device, or cause water marks on the display screen due to moisture entering between the display and the glass cover.
有鑑於上述課題,本揭示之主要目的係在提供一種膠合件及包含該膠合件之電子裝置,藉由膠合件的導引通道,以解決習知電子裝置的膠體結構無法將內部的水氣排出的問題。In view of the above problems, the main purpose of this disclosure is to provide a glued part and an electronic device including the glued part, through the guiding channel of the glued part, to solve the problem that the colloidal structure of the conventional electronic device cannot discharge the internal moisture The problem.
為達成上述之目的,本揭示提供一種膠合件。膠合件包括一本體及一導引通道,導引通道設置於本體。導引通道包括一第一通道及第二通道。第一通道與第二通道之間具有一第一夾角。To achieve the above purpose, the present disclosure provides a glued part. The glued part includes a body and a guide channel, and the guide channel is arranged on the body. The guiding channel includes a first channel and a second channel. There is a first angle between the first channel and the second channel.
為達成上述之目的,本揭示另提供一種電子裝置,其包括一第一殼體、一第二殼體以及一膠合件。第一殼體包括一安裝部。膠合件設置於安裝部並連接第一殼體與第二殼體。膠合件包括一本體及一導引通道,導引通道設置於本體。導引通道包括一第一通道及第二通道。第一通道與第二通道之間具有一第一夾角。To achieve the above purpose, the present disclosure further provides an electronic device, which includes a first casing, a second casing, and an adhesive member. The first casing includes a mounting portion. The glued part is arranged on the installation part and connects the first casing and the second casing. The glued part includes a body and a guide channel, and the guide channel is arranged on the body. The guiding channel includes a first channel and a second channel. There is a first angle between the first channel and the second channel.
承上所述,依據本揭示之膠合件及包含該膠合件之電子裝置,膠合件包括本體及導引通道。導引通道可排除累積在電子裝置內部的水氣,故可避免損害電子裝置內部的電子零件,亦可避免產生水痕。又,導引通道包括第一通道及第二通道,且第一通道及第二通道之間具有夾角,故可進一步避免外部水氣直接進入電子裝置的內部。Based on the above, according to the glued piece and the electronic device including the glued piece of the present disclosure, the glued piece includes a body and a guiding channel. The guide channel can remove the moisture accumulated inside the electronic device, so as to avoid damage to the electronic components inside the electronic device and avoid water marks. Moreover, the guiding channel includes a first channel and a second channel, and there is an angle between the first channel and the second channel, so that the external water vapor can be further prevented from entering the electronic device directly.
為能更瞭解本揭示之技術內容,特舉較佳具體實施例說明如下。以下結合附圖和實施例,對本揭示的具體實施方式作進一步描述。以下實施例僅用於更加清楚地說明本揭示的技術方案,而不能以此限制本揭示的保護範圍。In order to better understand the technical content of the present disclosure, preferred specific embodiments are given as follows. The specific implementation manners of the present disclosure will be further described below in conjunction with the drawings and embodiments. The following examples are only used to illustrate the technical solutions of the present disclosure more clearly, but not to limit the protection scope of the present disclosure.
在各個實施例的說明中,所謂的「第一」、「第二」係用以描述不同的元件,這些元件並不因為此類謂辭而受到限制。此外,為了說明上的便利和明確,圖式中各元件的最大寬度或尺寸,係以誇張或省略或概略的方式表示,以供熟悉此技藝之人士之瞭解與閱讀,且每個元件的尺寸並未完全為其實際的尺寸,並非用以限定本揭示可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本揭示所能產生之功效及所能達成之目的下,均仍應落在本揭示所揭示之技術內容涵蓋之範圍內。在所有圖式中相同的標號將用於表示相同或相似的元件。In the description of various embodiments, so-called "first" and "second" are used to describe different elements, and these elements are not limited by such predicates. In addition, for the convenience and clarity of description, the maximum width or size of each element in the drawings is exaggerated or omitted or approximated for the understanding and reading of those skilled in the art, and the size of each element It is not entirely its actual size, and it is not used to limit the conditions for the implementation of this disclosure, so it has no technical significance. Any modification of the structure, change of proportional relationship or adjustment of size will not affect the performance of this disclosure. The effects produced and the goals that can be achieved should still fall within the scope covered by the technical content disclosed in this disclosure. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.
圖1為本揭示之一實施例之電子裝置的分解示意圖,圖2為圖1所示之電子裝置組合後的部分剖面圖,圖3為圖1所示之膠合件的示意圖,請參考圖1、圖2及圖3所示。在本實施例中,電子裝置1包括一第一殼體10、一第二殼體20以及一膠合件30。電子裝置1可以為具有顯示螢幕的電子裝置,第一殼體10可以為塑料殼體,而第二殼體20可以為顯示螢幕的玻璃面板。另外,電子裝置1還包括電子零件40,電子零件40設置於第一殼體10內。FIG. 1 is an exploded view of an electronic device according to an embodiment of the present disclosure. FIG. 2 is a partial cross-sectional view of the assembled electronic device shown in FIG. 1 . FIG. 3 is a schematic view of the glued part shown in FIG. 1 . , Figure 2 and Figure 3. In this embodiment, the
第一殼體10包括一安裝部11,其位於第一殼體10的周緣,以供第二殼體20置放及組裝。第二殼體20部分設置於安裝部11,意即,第二殼體20的周緣設置於安裝部11。又,膠合件30同樣設置於安裝部11,以連接第一殼體10與第二殼體20。具體而言,先於安裝部11形成膠合件30後,再將第二殼體20置於膠合件30的另一側,使膠合件30可連接第一殼體10及第二殼體20。The
如圖3所示,膠合件30包括一本體31及導引通道33。在本實施例中,第一殼體10與第二殼體20為四邊形,對應的,安裝部11與膠合件30的本體31亦為四邊形的結構。在本實施例中,依據本體31的構型而將本體31定義為長形部311及隅角312。換言之,本體31包括四個長形部311及四個隅角312。四個長形部311為本體31的四邊,而四個隅角312即為本體31的四個扇形角。As shown in FIG. 3 , the
圖4為圖3所示之本體的長形部的放大示意圖,圖5為圖3所示之本體的隅角的放大示意圖,請參考圖2、圖3圖4、及圖5所示。在本實施例中,隅角312包括二側邊3121及一弧形邊3122。二側邊3121相連接,且弧形邊3122位於二側邊3121之間,以形成一扇形結構,如圖5所示。又,二側邊3121的交點為隅角312的一圓心C。FIG. 4 is an enlarged schematic view of the elongated part of the body shown in FIG. 3 , and FIG. 5 is an enlarged schematic view of a corner of the body shown in FIG. 3 . Please refer to FIG. 2 , FIG. 3 , FIG. 4 , and FIG. 5 . In this embodiment, the
如圖4所示,本實施例之導引通道33位於本體31的長形部311,用以排除累積在電子裝置1內部的水氣。另須說明的是,為求圖面簡潔,圖4所示的長形部311省略表示膠合件30材料的網點圖案,且圖4僅顯示隅角312的其中一側邊3121。導引通道33包括一第一通道331及一第二通道332,第一通道331靠近本體31的內側,而第二通道332靠近本體31的外側。其中,第一通道331及第二通道332為線性通道,其可包含直線通道或曲線通道,本發明並不限制。As shown in FIG. 4 , the guiding
又,第一通道331與第二通道332之間具有一第一夾角θ1。其中,第一夾角θ1小於90度。較佳的,第一夾角θ1介於50度至80度之間。電子裝置1內部的水氣可依序經由第一通道331、第二通道332往外側排除。因此,導引通道33的設計可避免水氣累積在電子裝置1的內部,故可避免損害電子裝置1內部的電子零件40,亦可避免產生水痕。Moreover, there is a first angle θ1 between the
較佳的,導引通道33位於靠近隅角312處,故每一長形部311可設置二個導引通道33,如圖3所示。在本實施例中,隅角312與導引通道33的一最短距離D1介於10毫米至20毫米之間。意即,隅角312的一側邊3121與導引通道33(例如第二通道332位於本體之外側壁的開口處)之間的最短距離D1介於10毫米至20毫米之間。Preferably, the guiding
較佳的,本體31具有一內側壁313,內側壁313靠近於第一通道331,即靠近於本體31的內側,如圖3所示。又,內側壁313自隅角312朝向導引通道33漸縮。具體而言,本體31的寬度並非均一的寬度,靠近導引通道33之第一通道331的部分較小。在本實施例中,內側壁313與隅角312的其中一側邊3121之間具有一第二夾角θ2。第二夾角θ2小於90度,以形成在本體31的內側壁313削薄的結構,並藉此將水氣導引至第一通道331。較佳的,第二夾角θ2可介於75度至87度之間。對應的,本體31於內側壁313被削薄的寬度T2介於0.25毫米至1.0毫米之間。另外,第一通道331之開口的內徑D2可較佳介於0.25毫米至1.0毫米之間。Preferably, the
又,第一通道331及第二通道332為彎折的設計,即第一通道331及第二通道332具有第一夾角θ1,故可同時避免電子裝置1外側的水氣進入電子裝置1內。較佳的,導引通道33更包括一防水凹槽333,設置於第一通道331及第二通道332之間,且位於相反於第一夾角θ1的一側。換言之,防水凹槽333位於導引通道33的鈍角側。因此,即便電子裝置1外側的水氣經由第二通道332進入導引通道33內,亦可直接流入防水凹槽333中,以避免水氣進入電子裝置1的內部。In addition, the
在本實施例中,防水凹槽333靠近於內側壁313的一側具有一平面3331,而相反的一側可以為第二通道332的延伸面。較佳的,平面3331的寬度D3可介於0.5毫米至2.0毫米之間。較佳的,第二通道332與本體31的外側壁之間具有一第三夾角θ3,且第三夾角θ3可介於18度至33度。另外,平面3331的二側可以為弧面,使導引通道33的整體形成類似傾斜的字母「R」,以達到較佳的排除內部水氣及避免外部水氣進入的雙重效果。也就是說,若有水氣經由第二通道332進入電子裝置1,水氣可先累積在防水凹槽333中,電子裝置在產生熱能的同時,可將累積在防水凹槽333中的水氣予以蒸發,再由第二通道332排出,進一步達到緩衝水氣進入電子裝置的顯示區域之功效。在其他實施例中,防水凹槽333亦可以為圓形、橢圓形、多邊形、或線性通道等結構,其同可達到避免水氣進入電子裝置1的內部的效果。In this embodiment, a side of the
如圖3及圖5所示,本實施例之膠合件30更包括至少一緩衝槽32。緩衝槽32設置於隅角312,且緩衝槽32具有一第一側壁321。第一側壁321靠近於隅角312之弧形邊3122,意即,第一側壁321靠近外側。又,第一側壁321與弧形邊3122之間具有一第一間距S1,第一間距S1小於本體31的最大寬度T1。其中,側邊3121的長度即為本體31的最大寬度T1。換言之,緩衝槽32設置於隅角312的內部。較佳的,第一間距S1之於最大寬度T1的比值可介於0.3至0.6之間。在本實施例中,本體31的最大寬度T1可以介於3毫米(mm)至20毫米之間。對應的,第一側壁321與弧形邊3122之間的第一間距S1可介於0.9毫米至12毫米之間。As shown in FIGS. 3 and 5 , the glued
較佳的,第一側壁321可以為一弧形,並平行於隅角312的弧形邊3122。緩衝槽32具有一第二側壁322。第二側壁322靠近於隅角312的圓心C,且第二側壁322與圓心C之間具有一第二間距S2。同樣的,第二間距S2小於本體31的最大寬度T1(即側邊3121的長度)。較佳的,第二間距S2之於最大寬度T1的比值介於0.15至0.3之間。如前述,本實施例之最大寬度T1介於3毫米至20毫米之間,對應的,第二側壁322與圓心C之間的第二間距S2可介於0.45毫米至6毫米之間。較佳的,第二側壁322同樣為一弧形,且平行於第一側壁321及隅角312的弧形邊3122。Preferably, the
於本體31之隅角312的內部設置緩衝槽32,可有效降低電子裝置1之四角的剝離率,意即無須更換黏性高的膠款即可消散角落落下(corner drop)時的衝擊能量。具體而言,電子裝置1組裝完成後會進行摔落測試。當以電子裝置1的四角進行摔落時,緩衝槽32可吸收撞擊力,以降低膠合件30與第二殼體20(或第一殼體10)剝離的機率。經測試,具有緩衝槽32的設計,可使電子裝置1之四角的剝離率降低至少3%以上。在本實施例中,第一側壁321與第二側壁322皆為弧形的設計,更可使電子裝置1之四角的剝離率降低約29%。在其他實施例中,緩衝槽32亦可以為梯形結構,即第一側壁321與第二側壁322為直線的設計,其可使電子裝置1之四角的剝離率降低約10%。在其他實施例中,緩衝槽32為菱形、三角形、或是圓形,其剝離率分別可降低6%、5%、或3%。The
綜上所述,依據本揭示之電子裝置及其膠合件,膠合件包括本體及導引通道。導引通道可排除累積在電子裝置內部的水氣,故可避免損害電子裝置內部的電子零件,亦可避免產生水痕。又,導引通道包括第一通道及第二通道,可進一步避免外部水氣直接進入電子裝置的內部。To sum up, according to the electronic device and its glued part of the present disclosure, the glued part includes a main body and a guiding channel. The guide channel can remove the moisture accumulated inside the electronic device, so as to avoid damage to the electronic components inside the electronic device and avoid water marks. In addition, the guiding channel includes a first channel and a second channel, which can further prevent external moisture from directly entering into the electronic device.
應注意的是,上述諸多實施例係為了便於說明而舉例,本揭示所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。It should be noted that the above-mentioned embodiments are examples for convenience of description, and the scope of rights claimed in the present disclosure should be based on the scope of the patent application, rather than limited to the above-mentioned embodiments.
1:電子裝置1: Electronic device
10:第一殼體10: The first shell
11:安裝部11: Installation department
20:第二殼體20: Second shell
30:膠合件30: glued parts
31:本體31: Ontology
311:長形部311: long part
312:隅角312: Corner
3121:側邊3121: side
3122:弧形邊3122: Arc edge
313:內側壁313: inner wall
32:緩衝槽32: buffer tank
321:第一側壁321: first side wall
322:第二側壁322: second side wall
33:導引通道33: Guidance channel
331:第一通道331: first channel
332:第二通道332:Second channel
333:防水凹槽333: waterproof groove
3331:平面3331: Plane
40:電子零件40:Electronic parts
C:圓心C: center of circle
D1:最短距離D1: shortest distance
D2:內徑D2: inner diameter
D3、T2:寬度D3, T2: Width
S1:第一間距S1: first spacing
S2:第二間距S2: second spacing
T1:最大寬度T1: maximum width
θ1:第一夾角θ1: the first included angle
θ2:第二夾角θ2: second included angle
θ3:第三夾角θ3: The third included angle
圖1為本揭示之一實施例之電子裝置的分解示意圖。 圖2為圖1所示之電子裝置組合後的部分剖面圖。 圖3為圖1所示之膠合件的示意圖。 圖4為圖3所示之本體的長形部的放大示意圖。 圖5為圖3所示之本體的隅角的放大示意圖。 FIG. 1 is an exploded schematic diagram of an electronic device according to an embodiment of the present disclosure. FIG. 2 is a partial cross-sectional view of the assembled electronic device shown in FIG. 1 . Fig. 3 is a schematic diagram of the glued part shown in Fig. 1 . FIG. 4 is an enlarged schematic view of the elongated portion of the body shown in FIG. 3 . FIG. 5 is an enlarged schematic view of a corner of the body shown in FIG. 3 .
30:膠合件 30: glued parts
31:本體 31: Ontology
311:長形部 311: long part
312:隅角 312: Corner
313:內側壁 313: inner wall
32:緩衝槽 32: buffer tank
33:導引通道 33: Guidance channel
333:防水凹槽 333: waterproof groove
Claims (12)
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TW110146117A TWI802139B (en) | 2021-12-09 | 2021-12-09 | Adhesive member and electronic device including the same |
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TW110146117A TWI802139B (en) | 2021-12-09 | 2021-12-09 | Adhesive member and electronic device including the same |
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TWI802139B true TWI802139B (en) | 2023-05-11 |
TW202323685A TW202323685A (en) | 2023-06-16 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009037182A (en) * | 2007-04-27 | 2009-02-19 | Mitsubishi Electric Corp | Display module |
US20110193789A1 (en) * | 2010-02-11 | 2011-08-11 | Teh-Zheng Lin | Air pressure balance structure for touch panel |
TWM442932U (en) * | 2012-07-25 | 2012-12-11 | shun-cheng Xie | Improved protection device of touch screen |
TW201327305A (en) * | 2011-12-16 | 2013-07-01 | Htc Corp | Touch control device |
US20130214656A1 (en) * | 2012-02-17 | 2013-08-22 | Wistron Corporation | Waterproofing backing adhesive structure |
CN203633009U (en) * | 2013-12-09 | 2014-06-04 | 南京逐月电子科技有限公司 | Waterproof board |
TW201913690A (en) * | 2017-08-21 | 2019-04-01 | 研能科技股份有限公司 | Actuating sensor device and case using the same |
CN113382569A (en) * | 2021-06-04 | 2021-09-10 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
-
2021
- 2021-12-09 TW TW110146117A patent/TWI802139B/en active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009037182A (en) * | 2007-04-27 | 2009-02-19 | Mitsubishi Electric Corp | Display module |
US20110193789A1 (en) * | 2010-02-11 | 2011-08-11 | Teh-Zheng Lin | Air pressure balance structure for touch panel |
TW201327305A (en) * | 2011-12-16 | 2013-07-01 | Htc Corp | Touch control device |
US20130214656A1 (en) * | 2012-02-17 | 2013-08-22 | Wistron Corporation | Waterproofing backing adhesive structure |
TWM442932U (en) * | 2012-07-25 | 2012-12-11 | shun-cheng Xie | Improved protection device of touch screen |
CN203633009U (en) * | 2013-12-09 | 2014-06-04 | 南京逐月电子科技有限公司 | Waterproof board |
TW201913690A (en) * | 2017-08-21 | 2019-04-01 | 研能科技股份有限公司 | Actuating sensor device and case using the same |
CN113382569A (en) * | 2021-06-04 | 2021-09-10 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
Also Published As
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TW202323685A (en) | 2023-06-16 |
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