TWI801179B - 顯示裝置 - Google Patents

顯示裝置 Download PDF

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Publication number
TWI801179B
TWI801179B TW111110819A TW111110819A TWI801179B TW I801179 B TWI801179 B TW I801179B TW 111110819 A TW111110819 A TW 111110819A TW 111110819 A TW111110819 A TW 111110819A TW I801179 B TWI801179 B TW I801179B
Authority
TW
Taiwan
Prior art keywords
display apparatus
display
Prior art date
Application number
TW111110819A
Other languages
English (en)
Other versions
TW202339242A (zh
Inventor
王致凱
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW111110819A priority Critical patent/TWI801179B/zh
Priority to US17/945,098 priority patent/US20230307425A1/en
Priority to CN202211226571.8A priority patent/CN115440719A/zh
Application granted granted Critical
Publication of TWI801179B publication Critical patent/TWI801179B/zh
Publication of TW202339242A publication Critical patent/TW202339242A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Control Of El Displays (AREA)
TW111110819A 2022-03-23 2022-03-23 顯示裝置 TWI801179B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW111110819A TWI801179B (zh) 2022-03-23 2022-03-23 顯示裝置
US17/945,098 US20230307425A1 (en) 2022-03-23 2022-09-15 Display apparatus
CN202211226571.8A CN115440719A (zh) 2022-03-23 2022-10-09 显示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111110819A TWI801179B (zh) 2022-03-23 2022-03-23 顯示裝置

Publications (2)

Publication Number Publication Date
TWI801179B true TWI801179B (zh) 2023-05-01
TW202339242A TW202339242A (zh) 2023-10-01

Family

ID=84251874

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110819A TWI801179B (zh) 2022-03-23 2022-03-23 顯示裝置

Country Status (3)

Country Link
US (1) US20230307425A1 (zh)
CN (1) CN115440719A (zh)
TW (1) TWI801179B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105242436A (zh) * 2015-11-06 2016-01-13 上海天马有机发光显示技术有限公司 一种阵列基板、显示面板及显示装置
CN106856075A (zh) * 2016-12-08 2017-06-16 武汉华星光电技术有限公司 像素结构
TW201728979A (zh) * 2015-11-30 2017-08-16 Ｌｇ顯示器股份有限公司 液晶顯示裝置
CN111025722A (zh) * 2019-12-23 2020-04-17 厦门天马微电子有限公司 显示面板和显示装置
US20210242295A1 (en) * 2020-12-30 2021-08-05 Xiamen Tianma Micro-Electronics Co., Ltd Display panel and display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105242436A (zh) * 2015-11-06 2016-01-13 上海天马有机发光显示技术有限公司 一种阵列基板、显示面板及显示装置
TW201728979A (zh) * 2015-11-30 2017-08-16 Ｌｇ顯示器股份有限公司 液晶顯示裝置
CN106856075A (zh) * 2016-12-08 2017-06-16 武汉华星光电技术有限公司 像素结构
CN111025722A (zh) * 2019-12-23 2020-04-17 厦门天马微电子有限公司 显示面板和显示装置
US20210242295A1 (en) * 2020-12-30 2021-08-05 Xiamen Tianma Micro-Electronics Co., Ltd Display panel and display device

Also Published As

Publication number Publication date
TW202339242A (zh) 2023-10-01
US20230307425A1 (en) 2023-09-28
CN115440719A (zh) 2022-12-06

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