TWI801144B - Electroplating apparatus and electroplating method - Google Patents

Electroplating apparatus and electroplating method Download PDF

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Publication number
TWI801144B
TWI801144B TW111106298A TW111106298A TWI801144B TW I801144 B TWI801144 B TW I801144B TW 111106298 A TW111106298 A TW 111106298A TW 111106298 A TW111106298 A TW 111106298A TW I801144 B TWI801144 B TW I801144B
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TW
Taiwan
Prior art keywords
electroplating
electroplating method
electroplating apparatus
Prior art date
Application number
TW111106298A
Other languages
Chinese (zh)
Other versions
TW202315987A (en
Inventor
粘恒銘
吳卓營
程石良
Original Assignee
欣興電子股份有限公司
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Application filed by 欣興電子股份有限公司 filed Critical 欣興電子股份有限公司
Priority to US17/700,531 priority Critical patent/US20230120741A1/en
Publication of TW202315987A publication Critical patent/TW202315987A/en
Application granted granted Critical
Publication of TWI801144B publication Critical patent/TWI801144B/en

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TW111106298A 2021-10-14 2022-02-22 Electroplating apparatus and electroplating method TWI801144B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/700,531 US20230120741A1 (en) 2021-10-14 2022-03-22 Electroplating apparatus and electroplating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163255438P 2021-10-14 2021-10-14
US63/255,438 2021-10-14

Publications (2)

Publication Number Publication Date
TW202315987A TW202315987A (en) 2023-04-16
TWI801144B true TWI801144B (en) 2023-05-01

Family

ID=85961140

Family Applications (3)

Application Number Title Priority Date Filing Date
TW111106298A TWI801144B (en) 2021-10-14 2022-02-22 Electroplating apparatus and electroplating method
TW111109527A TWI826956B (en) 2021-10-14 2022-03-16 Electroplating apparatus and electroplating method
TW111113003A TWI816352B (en) 2021-10-14 2022-04-06 Electroplating apparatus and electroplating method

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW111109527A TWI826956B (en) 2021-10-14 2022-03-16 Electroplating apparatus and electroplating method
TW111113003A TWI816352B (en) 2021-10-14 2022-04-06 Electroplating apparatus and electroplating method

Country Status (2)

Country Link
CN (3) CN115976614A (en)
TW (3) TWI801144B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551931A (en) * 2000-12-21 2004-12-01 ������Ŧ˹�ɷݹ�˾ Method and apparatus for controlling thickness uniformity of electroplated layers
TW202111166A (en) * 2019-07-09 2021-03-16 日商荏原製作所股份有限公司 Apparatus for plating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
JP2005023389A (en) * 2003-07-04 2005-01-27 Seiko Epson Corp Electroplating method, and electroplating apparatus
CN1831204A (en) * 2005-03-08 2006-09-13 上海艾比西材料科技有限公司 Method and equipment for electroplating superthick and multiple-hole metals
CN101275267B (en) * 2007-03-26 2011-05-25 旭明光电股份有限公司 Thickness evenness-improved electroplating apparatus and electroplating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551931A (en) * 2000-12-21 2004-12-01 ������Ŧ˹�ɷݹ�˾ Method and apparatus for controlling thickness uniformity of electroplated layers
TW202111166A (en) * 2019-07-09 2021-03-16 日商荏原製作所股份有限公司 Apparatus for plating

Also Published As

Publication number Publication date
TW202315988A (en) 2023-04-16
CN115976607A (en) 2023-04-18
CN115976614A (en) 2023-04-18
TW202315983A (en) 2023-04-16
TWI816352B (en) 2023-09-21
TW202315987A (en) 2023-04-16
TWI826956B (en) 2023-12-21
CN115976608A (en) 2023-04-18

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