TWI800530B - 用於評估物件的方法與非暫態電腦程式產品 - Google Patents

用於評估物件的方法與非暫態電腦程式產品 Download PDF

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Publication number
TWI800530B
TWI800530B TW107132802A TW107132802A TWI800530B TW I800530 B TWI800530 B TW I800530B TW 107132802 A TW107132802 A TW 107132802A TW 107132802 A TW107132802 A TW 107132802A TW I800530 B TWI800530 B TW I800530B
Authority
TW
Taiwan
Prior art keywords
evaluating
computer program
program product
nontransitory computer
nontransitory
Prior art date
Application number
TW107132802A
Other languages
English (en)
Other versions
TW201933415A (zh
Inventor
謝 亞塔爾
沙爾 柯恩
蓋 摩茲
諾雅姆 薩茲
摩爾 巴拉姆
李 摩爾度凡
伊夏 薛瓦爾茲班德
隆恩 卡特茲爾
克菲爾 班及克里
多倫 吉爾莫斯基
Original Assignee
以色列商應用材料以色列公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 以色列商應用材料以色列公司 filed Critical 以色列商應用材料以色列公司
Publication of TW201933415A publication Critical patent/TW201933415A/zh
Application granted granted Critical
Publication of TWI800530B publication Critical patent/TWI800530B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical or photographic arrangements associated with the tube
    • H01J37/222Image processing arrangements associated with the tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/29Reflection microscopes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244Detection characterized by the detecting means
    • H01J2237/24475Scattered electron detectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24571Measurements of non-electric or non-magnetic variables
    • H01J2237/24578Spatial variables, e.g. position, distance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24592Inspection and quality control of devices

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW107132802A 2017-09-18 2018-09-18 用於評估物件的方法與非暫態電腦程式產品 TWI800530B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762560050P 2017-09-18 2017-09-18
US62/560,050 2017-09-18
US16/131,289 US10504693B2 (en) 2017-09-18 2018-09-14 Evaluating an object
US16/131,289 2018-09-14

Publications (2)

Publication Number Publication Date
TW201933415A TW201933415A (zh) 2019-08-16
TWI800530B true TWI800530B (zh) 2023-05-01

Family

ID=65720614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107132802A TWI800530B (zh) 2017-09-18 2018-09-18 用於評估物件的方法與非暫態電腦程式產品

Country Status (2)

Country Link
US (1) US10504693B2 (zh)
TW (1) TWI800530B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220123303A (ko) * 2020-01-07 2022-09-06 노바 엘티디. Ocd 계측 머신 학습에 대한 이상치 및 이상 검출 시스템 및 방법
JP7441809B2 (ja) 2021-02-01 2024-03-01 株式会社日立ハイテク 荷電粒子ビーム装置および荷電粒子ビーム装置のキャリブレーション方法
US11525791B1 (en) * 2021-06-14 2022-12-13 Applied Materials Israel Ltd. SNR for x-ray detectors in SEM systems by using polarization filter
US11887272B2 (en) * 2022-02-16 2024-01-30 GM Global Technology Operations LLC Method and system for determining a spatial transformation employing partial dimension iterative closest point

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232787B1 (en) * 1999-01-08 2001-05-15 Schlumberger Technologies, Inc. Microstructure defect detection
US20040228515A1 (en) * 2003-03-28 2004-11-18 Takafumi Okabe Method of inspecting defects
TW201342420A (zh) * 2012-02-20 2013-10-16 Integrated Circuit Testing 具有動態焦點的帶電粒子束裝置及其操作方法
CN107004553A (zh) * 2014-06-25 2017-08-01 Fei埃法有限公司 用于电子器件的纳米探测的装置以及方法
CN108745422A (zh) * 2018-05-16 2018-11-06 西安交通大学 一种表面酸碱性可调控的1,4-丁二醇脱水催化剂及制备方法和应用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232787B1 (en) * 1999-01-08 2001-05-15 Schlumberger Technologies, Inc. Microstructure defect detection
US20040228515A1 (en) * 2003-03-28 2004-11-18 Takafumi Okabe Method of inspecting defects
TW201342420A (zh) * 2012-02-20 2013-10-16 Integrated Circuit Testing 具有動態焦點的帶電粒子束裝置及其操作方法
CN107004553A (zh) * 2014-06-25 2017-08-01 Fei埃法有限公司 用于电子器件的纳米探测的装置以及方法
CN108745422A (zh) * 2018-05-16 2018-11-06 西安交通大学 一种表面酸碱性可调控的1,4-丁二醇脱水催化剂及制备方法和应用

Also Published As

Publication number Publication date
US20190088444A1 (en) 2019-03-21
TW201933415A (zh) 2019-08-16
US10504693B2 (en) 2019-12-10

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