TWI800530B - 用於評估物件的方法與非暫態電腦程式產品 - Google Patents
用於評估物件的方法與非暫態電腦程式產品 Download PDFInfo
- Publication number
- TWI800530B TWI800530B TW107132802A TW107132802A TWI800530B TW I800530 B TWI800530 B TW I800530B TW 107132802 A TW107132802 A TW 107132802A TW 107132802 A TW107132802 A TW 107132802A TW I800530 B TWI800530 B TW I800530B
- Authority
- TW
- Taiwan
- Prior art keywords
- evaluating
- computer program
- program product
- nontransitory computer
- nontransitory
- Prior art date
Links
- 238000004590 computer program Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/29—Reflection microscopes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24475—Scattered electron detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24571—Measurements of non-electric or non-magnetic variables
- H01J2237/24578—Spatial variables, e.g. position, distance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762560050P | 2017-09-18 | 2017-09-18 | |
US62/560,050 | 2017-09-18 | ||
US16/131,289 US10504693B2 (en) | 2017-09-18 | 2018-09-14 | Evaluating an object |
US16/131,289 | 2018-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201933415A TW201933415A (zh) | 2019-08-16 |
TWI800530B true TWI800530B (zh) | 2023-05-01 |
Family
ID=65720614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107132802A TWI800530B (zh) | 2017-09-18 | 2018-09-18 | 用於評估物件的方法與非暫態電腦程式產品 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10504693B2 (zh) |
TW (1) | TWI800530B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI777357B (zh) * | 2020-01-07 | 2022-09-11 | 以色列商諾威量測設備股份有限公司 | 用於光學關鍵尺寸計量的方法和系統及機器可存取的儲存介質 |
JP7441809B2 (ja) | 2021-02-01 | 2024-03-01 | 株式会社日立ハイテク | 荷電粒子ビーム装置および荷電粒子ビーム装置のキャリブレーション方法 |
US11525791B1 (en) * | 2021-06-14 | 2022-12-13 | Applied Materials Israel Ltd. | SNR for x-ray detectors in SEM systems by using polarization filter |
US11887272B2 (en) * | 2022-02-16 | 2024-01-30 | GM Global Technology Operations LLC | Method and system for determining a spatial transformation employing partial dimension iterative closest point |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6232787B1 (en) * | 1999-01-08 | 2001-05-15 | Schlumberger Technologies, Inc. | Microstructure defect detection |
US20040228515A1 (en) * | 2003-03-28 | 2004-11-18 | Takafumi Okabe | Method of inspecting defects |
TW201342420A (zh) * | 2012-02-20 | 2013-10-16 | Integrated Circuit Testing | 具有動態焦點的帶電粒子束裝置及其操作方法 |
CN107004553A (zh) * | 2014-06-25 | 2017-08-01 | Fei埃法有限公司 | 用于电子器件的纳米探测的装置以及方法 |
CN108745422A (zh) * | 2018-05-16 | 2018-11-06 | 西安交通大学 | 一种表面酸碱性可调控的1,4-丁二醇脱水催化剂及制备方法和应用 |
-
2018
- 2018-09-14 US US16/131,289 patent/US10504693B2/en active Active
- 2018-09-18 TW TW107132802A patent/TWI800530B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6232787B1 (en) * | 1999-01-08 | 2001-05-15 | Schlumberger Technologies, Inc. | Microstructure defect detection |
US20040228515A1 (en) * | 2003-03-28 | 2004-11-18 | Takafumi Okabe | Method of inspecting defects |
TW201342420A (zh) * | 2012-02-20 | 2013-10-16 | Integrated Circuit Testing | 具有動態焦點的帶電粒子束裝置及其操作方法 |
CN107004553A (zh) * | 2014-06-25 | 2017-08-01 | Fei埃法有限公司 | 用于电子器件的纳米探测的装置以及方法 |
CN108745422A (zh) * | 2018-05-16 | 2018-11-06 | 西安交通大学 | 一种表面酸碱性可调控的1,4-丁二醇脱水催化剂及制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
TW201933415A (zh) | 2019-08-16 |
US20190088444A1 (en) | 2019-03-21 |
US10504693B2 (en) | 2019-12-10 |
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