TWI800331B - 具壓力檢知單元之壓接機構及作業機 - Google Patents

具壓力檢知單元之壓接機構及作業機 Download PDF

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Publication number
TWI800331B
TWI800331B TW111111415A TW111111415A TWI800331B TW I800331 B TWI800331 B TW I800331B TW 111111415 A TW111111415 A TW 111111415A TW 111111415 A TW111111415 A TW 111111415A TW I800331 B TWI800331 B TW I800331B
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TW
Taiwan
Prior art keywords
handler
detecting unit
pressing mechanism
pressure detecting
pressing
Prior art date
Application number
TW111111415A
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English (en)
Other versions
TW202338356A (zh
Inventor
陳振元
Original Assignee
鴻勁精密股份有限公司
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Application filed by 鴻勁精密股份有限公司 filed Critical 鴻勁精密股份有限公司
Priority to TW111111415A priority Critical patent/TWI800331B/zh
Application granted granted Critical
Publication of TWI800331B publication Critical patent/TWI800331B/zh
Publication of TW202338356A publication Critical patent/TW202338356A/zh

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TW111111415A 2022-03-25 2022-03-25 具壓力檢知單元之壓接機構及作業機 TWI800331B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111111415A TWI800331B (zh) 2022-03-25 2022-03-25 具壓力檢知單元之壓接機構及作業機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111111415A TWI800331B (zh) 2022-03-25 2022-03-25 具壓力檢知單元之壓接機構及作業機

Publications (2)

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TWI800331B true TWI800331B (zh) 2023-04-21
TW202338356A TW202338356A (zh) 2023-10-01

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TW111111415A TWI800331B (zh) 2022-03-25 2022-03-25 具壓力檢知單元之壓接機構及作業機

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130229196A1 (en) * 2012-03-01 2013-09-05 Kla-Tencor Corporation Variable pressure four-point coated probe pin device and method
TW201339588A (zh) * 2012-03-23 2013-10-01 Hon Tech Inc 浮動裝置及其應用測試設備
US20180292452A1 (en) * 2017-04-06 2018-10-11 Chroma Ate Inc. Device for pressing electronic component with different downward forces
US20190172740A1 (en) * 2017-12-04 2019-06-06 Chroma Ate Inc. Modular pressing device capable of generating stage downward forces and electronic device testing apparatus comprising the same
TW202134616A (zh) * 2020-03-13 2021-09-16 致茂電子股份有限公司 自適應性調整施力角度之壓力產生裝置
TWI748577B (zh) * 2020-07-24 2021-12-01 鴻勁精密股份有限公司 接合器檢知單元及其應用之作業設備
US20220034955A1 (en) * 2019-01-14 2022-02-03 Rainer Gaggl Device for testing components under elevated gas pressure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130229196A1 (en) * 2012-03-01 2013-09-05 Kla-Tencor Corporation Variable pressure four-point coated probe pin device and method
TW201339588A (zh) * 2012-03-23 2013-10-01 Hon Tech Inc 浮動裝置及其應用測試設備
US20180292452A1 (en) * 2017-04-06 2018-10-11 Chroma Ate Inc. Device for pressing electronic component with different downward forces
US20190172740A1 (en) * 2017-12-04 2019-06-06 Chroma Ate Inc. Modular pressing device capable of generating stage downward forces and electronic device testing apparatus comprising the same
US20220034955A1 (en) * 2019-01-14 2022-02-03 Rainer Gaggl Device for testing components under elevated gas pressure
TW202134616A (zh) * 2020-03-13 2021-09-16 致茂電子股份有限公司 自適應性調整施力角度之壓力產生裝置
TWI748577B (zh) * 2020-07-24 2021-12-01 鴻勁精密股份有限公司 接合器檢知單元及其應用之作業設備

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Publication number Publication date
TW202338356A (zh) 2023-10-01

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